KR20110050194A - Robot for transferring wafer - Google Patents

Robot for transferring wafer Download PDF

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Publication number
KR20110050194A
KR20110050194A KR1020090107071A KR20090107071A KR20110050194A KR 20110050194 A KR20110050194 A KR 20110050194A KR 1020090107071 A KR1020090107071 A KR 1020090107071A KR 20090107071 A KR20090107071 A KR 20090107071A KR 20110050194 A KR20110050194 A KR 20110050194A
Authority
KR
South Korea
Prior art keywords
wafer
robot arm
contact
pusher
unit
Prior art date
Application number
KR1020090107071A
Other languages
Korean (ko)
Inventor
김진우
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020090107071A priority Critical patent/KR20110050194A/en
Publication of KR20110050194A publication Critical patent/KR20110050194A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • B25J9/1015—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A robot for transferring a wafer is provided to improve the transfer speed of the wafer by fixing the wafer mounted in a mounting unit by a certain force to transfer the wafer. CONSTITUTION: In a robot for transferring a wafer, a mounting unit(150) comprises a guide groove(155) settling the wafer. The wafer transfer unit transfers the mounting unit. The wafer transfer unit comprises a power unit(110), a first robot arm(120a) and a second robot arm(120b). A wafer fixing unit makes the wafer closely contact to the one side of a guide groove. The wafer fixing unit includes an elastic unit maintaining the contact between a disc and a pusher.

Description

Wafer Transfer Device {Robot for transferring wafer}

The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus for transferring wafers in a semiconductor manufacturing process.

Recently, with the development of semiconductor manufacturing technology, a circuit line width of micro or nanometer has been developed, and thus, a semiconductor device having a higher integration rate per unit area and a faster processing speed has been developed.

In the process of manufacturing such a semiconductor substrate (hereinafter referred to as a wafer), a wafer transfer robot for transferring the wafer during the process is used.

1 is a plan view illustrating a conventional wafer transfer apparatus, FIG. 2 is a view illustrating a state in which a wafer seated on a substrate seating portion is removed in FIG. 1, and FIG. 3 is a wafer seating portion in a conventional wafer transfer apparatus. It is a conceptual diagram showing how a wafer is seated.

Conventional wafer transfer robot may include a wafer transfer portion for mounting the wafer (W), a multi-joint arm 20 and a wafer transfer portion for moving the wafer seating portion (50). As illustrated in FIG. 2, the guide seat 55 is formed in the wafer seating part 50 to guide the position where the wafer W is seated. The wafer W is guided by the guide groove 55 when the wafer W is seated on the wafer seating portion 50 from a cassette (not shown) on which the wafer W is loaded. At this time, the guide groove (W) is formed to have a marginal tolerance with respect to the area of the wafer (W) so that the wafer (W) can be easily seated on the wafer seating portion 50, so as shown in FIG. ) And a gap between the wafer (W).

At this time, in the case of the wafer transfer robot for the vacuum chamber, there is no separate fixing device for fixing the wafer (W) except for the guide groove (55). Therefore, when moving the wafer W seated on the wafer seating portion 50 by the wafer transfer portion, the transfer speed is limited to prevent the wafer W from being separated. This is a factor that delays the process speed.

In addition, the position where the wafer W is placed on the wafer seating portion 50 is different due to the above-described clearance tolerance, and thus there is a problem in that a precision of a teaching operation is required in a subsequent process.

The present invention has been devised to improve the above problems, and an object of the present invention is to provide a wafer transfer apparatus for fixing a wafer with a constant force to improve the transfer speed of the wafer.

It is still another object of the present invention to provide a wafer transfer device which improves the efficiency of teaching by allowing the wafer to always be seated at a predetermined position in the wafer transfer device.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a wafer transport apparatus according to an embodiment of the present invention is a wafer seating portion formed with a guide groove so that the wafer is seated, a wafer transporter for transporting the wafer seating portion and the edge of the wafer seated on the wafer seating portion. And a wafer fixing part which presses one side to closely adhere the wafer to one side of the guide groove.

According to the wafer transfer apparatus of the present invention as described above has one or more of the following effects.

First, since the wafer is transported by fixing the wafer seated on the shock-wafer seating part with a constant force, there is an advantage that the transfer speed of the wafer can be improved.

Second, there is an advantage that the wafer is always seated at a predetermined position in the wafer transfer device, thereby improving the efficiency of the teaching operation in a subsequent process.

Details of the embodiments are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for describing a wafer transfer apparatus according to embodiments of the present invention.

Figure 4 is a plan view of a wafer transfer apparatus according to an embodiment of the present invention, Figure 5 is a view showing a disk according to an embodiment of the present invention, Figures 6 and 7 according to an embodiment of the present invention 8 is a view illustrating an enlarged view of a wafer seating portion and a wafer fixing portion in a wafer transfer apparatus to explain an operation of a wafer transfer apparatus according to an embodiment of the present invention, and FIG. 8 is a wafer according to an embodiment of the present invention. A diagram illustrating a semiconductor manufacturing facility having a plurality of process chambers in which a transfer device is used.

The wafer transfer apparatus according to the exemplary embodiment of the present invention may include a wafer seating unit 155, a wafer transfer unit, and a wafer fixing unit.

The wafer seating part 155 serves to seat the wafer (W). A guide groove 155 may be formed at the wafer seating portion to guide the position at which the wafer W is seated. The guide groove 155 may be formed as a groove which is dug inward so as to have a step size of a predetermined size in the wafer seating portion 150. At this time, the guide groove 155 may be formed to have a tolerance slightly larger than the size of the wafer W by guiding a position where the wafer W is seated.

The wafer transfer part transfers the wafer seating part 150 to transfer the wafer W seated on the wafer seating part 150. The wafer transfer part transfers the wafer W loaded on a cassette (not shown) to the wafer seating part 150 to be transferred to the process chamber 200, or transfers the wafer W that has been processed in the process chamber 200. The wafer may be mounted on the wafer seating unit 150 to be transferred to another process chamber 150 or the wafer W may be transferred to a cassette (not shown).

The wafer transfer unit includes the power unit 110, the first robot arm 120a, the second robot arm 120b, the third robot arm 120c, the fourth robot arm 120d, and the rotary gears 130a and 130b. It can be configured to include.

The power unit 110 generates power from a motor or the like to provide power for moving the robot arms 120. The first robot arm 120a and the second robot arm 120b are connected to the power unit 110, thereby generating power for moving the first robot arm 120a and the second robot arm 120b.

As illustrated in FIG. 4, the first robot arm 120a and the second robot arm 120b may move horizontally by receiving power from the power unit 110. In this case, the first robot arm 120a and the second robot arm 120b may be formed in the power unit 110 with respect to the same axis, and symmetrically open about the power unit 110.

One end of the third robot arm 120c and the fourth robot arm 120d is connected to the ends of the first robot arm 120a and the second robot arm 120b to form a joint, and the other end is a wafer seating portion. It can be formed in connection with 150. In this case, as shown in FIG. 4, the third robot arm 120c and the fourth robot arm 120d may be formed to be symmetrically spread around the wafer seating part 150. The wafer seating part 150 may be different depending on the angle of separation between the symmetrical first robot arm 120a and the second robot arm 120b and the symmetrical third robot arm 120c and the fourth robot arm 120d. To the position. Of course, the robot arms 120 connected to the power unit 110 may be rotated about the power unit 120 and may move vertically. In this regard, various well-known methods may be used, and thus detailed description thereof will be omitted.

The third robot arm 120c and the fourth robot arm 120d are connected to the wafer seating part 150. As shown in FIG. 4, the third robot arm 120c and the fourth robot arm 120d are connected to each other. Rotating gears 130a and 130b are formed at the ends, respectively, and each of the rotating gears 130a and 130b may be geared to each other. The center of the rotary gears 130a and 130b is connected to the wafer seat 150. Therefore, the joint connecting the first robot arm 120a and the third robot arm 120c when the first robot arm 120a and the second robot arm 120b received power from the power unit 110 moves. The joints connecting the second robot arm 120b and the fourth robot arm 120d and the gear coupling of the rotary gears 130a and 30b described above allow the robot arms 120 to always move symmetrically, and thus the wafer seating part. 150 can be conveyed.

At this time, although it will be described later, the disk 160 as shown in Figure 5 is formed on the rotary shaft of the rotary gear 130, the disk 160 rotates together in accordance with the rotation of the rotary gear 130. In FIG. 4, the rotating gear 130 is shown and the disk 160 is not shown. However, in FIG. 6 and FIG. 7, the rotating gear 130 is omitted and the disk 160 is on the same axis.

The wafer fixing unit according to the exemplary embodiment of the present invention may include a disk 160, a pusher 140, and an elastic unit.

The disk 160 rotates in accordance with the rotation of the rotary gear 130 on the same axis as the rotary gear 130 as described above. As shown in FIG. 5, the disc 160 may have a groove 165 formed at one side of the edge. In FIG. 5, one groove 165 is formed at one side of the edge, and a plurality of grooves may be formed at predetermined angles with respect to the rotation center. The side of the disk 160 is in contact with the pusher.

The pusher 140 is formed of a disk contact 142 in contact with the disk 160 and a wafer contact 144 in contact with the wafer W, as shown in FIG. 6. The disk contact portion 142 may move the pusher 140 while being in contact with the side surface of the disk 160 while having a curved shape. As described above, the grooves 165 are formed in the disc 160. When the disc contacts 142 are positioned in the grooves 165 by the rotation of the disc 160 while contacting the non-groove portion 162. The pusher 140 moves to the left.

In this case, an elastic part may be formed in the pusher 140 so that the pusher 140 is always in contact with the disk 160. As illustrated, an elastic member such as a spring 147 may be mounted in the pusher 140, and a stop 152 may be formed in the wafer seating part 150 to fix the position of the spring 147. Accordingly, the spring 147 is positioned between the stopper 152 and the pusher 140 so that the disc contact portion 142 of the pusher 140 is always in contact with the disc 160 by the elastic force of the spring 147. The disk contact portion 142 of the pusher 140 and the disk 160 are in contact with the disk 160 in contact with the disk contact portion 142 of the pusher 140 while maintaining contact with the pusher 140. It is possible to move from side to side.

FIG. 6 shows the position of the pusher 140 when the disc contact portion 142 of the pusher 140 contacts the non-groove portion 162 of the disc 160, and FIG. 7 shows the groove of the disc 160. The position of the pusher 140 is shown when the disk contact portion 142 of the pusher 140 contacts 165. In FIG. 7, the position of the pusher 140 may be relatively moved to the left side in comparison with FIG. 6.

When the non-groove portion 162 of the disc 160 and the disc contact portion 142 of the pusher 140 come into contact with each other, as shown in FIG. In addition, the wafer contact portion 144 formed on the pusher 140 presses one edge of the wafer (W). Therefore, the wafer W is brought into close contact between one side of the guide groove 155 formed in the wafer seating portion 150 and the wafer contact portion 144 of the pusher 140. Therefore, the wafer W can be fixed to prevent the wafer W from being separated.

In addition, when the disk contact portion 142 of the pusher 140 is located in the groove 165 formed in the disk 160 as shown in FIG. 7, the pusher 140 moves to the left in comparison with FIG. 6. do. At this time, the wafer contact portion 144 of the pusher 140, which has been in contact with the wafer W, is no longer in contact with the wafer W, and thus, the force that pressurizes the wafer W is removed, so that the wafer seating portion ( The wafer W seated on 150 can be transferred to another place.

8 illustrates a semiconductor manufacturing facility in which a wafer transfer device 100 according to an embodiment of the present invention is used. The wafer transfer device 100 according to an embodiment of the present invention is positioned at the center thereof, and a plurality of processor chambers 200 may be provided around the wafer transfer device 100. In this case, the chamber 300 and each process chamber 200 in which the wafer transfer device 100 is located may be a vacuum chamber. 6 shows that six process chambers 200 are formed, but is not limited thereto. In this case, as shown in the drawing, the power unit 110, which is the operating center of the wafer transfer device 100, and a position for transferring the wafer W in the process chamber 200 may have a predetermined distance. Therefore, when the wafer seating portion 150 reaches the position where the wafer W is transferred within the processor chamber 200 by the wafer transfer portion as shown in FIG. 8, the groove 165 and the pusher 140 of the disk are formed. By bringing the disc contact portion 142 into contact with each other, the state of Fig. 7 can be achieved. Therefore, when the wafer seating unit 150 reaches the position for transferring the wafer W in the processor chamber 200, the force for pressing the wafer W is removed and the wafer W seated on the wafer seating unit 150. Can be easily transferred to a predetermined position in the process chamber 200.

Although not shown, the pusher 140 may be formed in the groove 165 formed in the disk 160 even when the wafer W is seated on the wafer seating portion 150 from a cassette (not shown) on which the wafer W is loaded. By making the disk contact portion 142 contact, the wafer W loaded on the cassette (not shown) can be easily seated on the wafer seating portion.

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.

1 is a plan view showing a conventional wafer transfer apparatus.

FIG. 2 is a view illustrating a state in which a wafer seated in a substrate seating part of FIG. 1 is removed. It is a figure which shows a wafer transfer apparatus.

3 is a conceptual view illustrating a state in which a wafer is seated on a wafer seating portion in a conventional wafer transfer apparatus.

4 is a plan view of a wafer transfer apparatus according to an embodiment of the present invention.

5 illustrates a disk according to an embodiment of the present invention.

6 and 7 are enlarged views illustrating a wafer seating portion and a wafer fixing portion in the wafer transfer apparatus according to an embodiment of the present invention. FIG. 6 is a view for explaining the operation of the wafer transfer apparatus according to an embodiment of the present invention. to be.

8 is a diagram illustrating a semiconductor manufacturing facility having a plurality of process chambers in which a wafer transfer device according to an embodiment of the present invention is used.

<Explanation of symbols for the main parts of the drawings>

110: power unit 120: robot arm

130: rotary gear 140: pusher

150: wafer seating portion 160: disk

Claims (6)

A wafer seating portion in which a guide groove is formed to seat the wafer; A wafer transfer part transferring the wafer seating part; And And a wafer fixing part for pressing one side of the edge of the wafer seated on the wafer seating part to adhere the wafer to one side of the guide groove. The method of claim 1, The wafer transfer unit A power unit providing power; A first robot arm and a second robot arm each formed to move with power received from the power unit and symmetrically open about the power unit; A third robot arm and a fourth robot arm each formed to be symmetrically spread around the wafer seating part and connected to one ends of the first robot arm and the second robot arm, respectively; And A rotation gear formed at an end connected to the wafer seating portion of the third robot arm and the fourth robot arm, The rotary gears respectively formed on the third robot arm and the fourth robot arm are gear-coupled with each other, and the center of each rotary gear is connected to the wafer seating portion. The method of claim 2, The wafer holding part Disks each formed on a rotation shaft of the rotary gear and rotating according to the rotation of the rotary gear, and grooves are formed at one side of an edge thereof; A pusher having a wafer contact portion formed at one side thereof in contact with the disc and having a wafer contact portion in contact with the wafer at one side of the guide groove; And And an elastic portion for maintaining contact between the disk and the pusher. The method of claim 3, wherein The elastic portion A spring fixed to the inside of the pusher; And And a stop portion formed on the wafer seating portion to fix the position of the spring. The method of claim 3, wherein And the disc contact portion of the fuser comes into contact with a groove formed in the disc when the wafer seating portion is in a position where it is not necessary to fix the wafer by the pusher. The method of claim 1, The wafer transfer apparatus is a wafer transfer apparatus for a vacuum chamber.
KR1020090107071A 2009-11-06 2009-11-06 Robot for transferring wafer KR20110050194A (en)

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KR1020090107071A KR20110050194A (en) 2009-11-06 2009-11-06 Robot for transferring wafer

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112838037A (en) * 2021-01-05 2021-05-25 长江存储科技有限责任公司 Wafer transfer apparatus and wafer transfer method
WO2022094988A1 (en) * 2020-11-07 2022-05-12 唐山圣因海洋科技有限公司 Clamping means of warehouse transport device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022094988A1 (en) * 2020-11-07 2022-05-12 唐山圣因海洋科技有限公司 Clamping means of warehouse transport device
CN112838037A (en) * 2021-01-05 2021-05-25 长江存储科技有限责任公司 Wafer transfer apparatus and wafer transfer method
CN112838037B (en) * 2021-01-05 2022-03-22 长江存储科技有限责任公司 Wafer transfer apparatus and wafer transfer method

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