KR20110049553A - Transparent conductive subtrate for touch panel and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A transparent conductive material for a touch panel and manufacturing method thereof are provided to supply very good outer tube by not visually showing a boundary of a pattern unit and a non pattern unit. CONSTITUTION: A transparent conductive substrate is comprised by successively laminating a transparent substrate layer(10), a middle reflection undercoating layer(20), a low reflection undercoating layer(30), and a transparent conductive layer(40). Difference of an average reflection rate of a visible light between the pattern unit which removed the transparent conductive layer and a non pattern which did not removed the transparent conductive layer is under 0.1%.

Description

Transparent conductive base material for touch panel and manufacturing method therefor {TRANSPARENT CONDUCTIVE SUBTRATE FOR TOUCH PANEL AND MANUFACTURING METHOD THEREOF}

The present invention relates to a transparent conductive substrate for a touch panel and a method of manufacturing the same, and more particularly, to a touch panel transparent conductive substrate that greatly improves visual appearance performance by minimizing the difference in reflectance between the pattern portion and the non-pattern portion of the transparent conductive substrate. And to a method for producing the same.

As computers using digital technology are developed, auxiliary devices are also being developed. Among them, a keyboard and a mouse are used to input external data into a computer. The keyboard is used to input data by typing keys, and a mouse is an input device used to move a cursor or other object on the screen. However, a more effective and convenient way is to input data to a computer as a user touches the screen of a monitor connected to the computer to issue a command.

For example, when using a computer to process graphics, it is much easier for a user to process graphics using a computer because it is much easier for a user to draw graphics on paper using a pen directly than to work with a keyboard or mouse. There is a lot of inconvenience. However, if you use the touch pen to process graphics directly on the screen of the touch panel, you can handle graphics work very easily and precisely because it is like drawing a picture directly on paper. Accordingly, in recent years, a lot of portable devices with a touch panel have been widely used.

The touch panel may include a resistive film type, a capacitive type, an ultrasonic type, an infrared type, and the like according to a position detection method.

In the resistive film method, the two substrates on which the transparent electrode layer (ITO film) is coated are bonded to each other so that the transparent electrode layers face each other with a dot spacer interposed therebetween. When the upper substrate is contacted by a finger or a pen, a signal for position detection is applied. When the upper substrate is in contact with the transparent electrode layer of the lower substrate, an electrical signal is detected to determine a position. While this method has high response speed and economical efficiency, it has a disadvantage of low durability and high risk of breakage.

In the capacitive method, a conductive metal material is coated on one surface of the base film constituting the touch screen sensor to form a transparent electrode, and a certain amount of current flows on the glass surface. When the user touches the screen, it recognizes the part where the amount of current is changed by using the capacitance in the human body and calculates the size to determine the position. While excellent durability and transmittance, there is a disadvantage that the operation is difficult by a hand wearing a pen or glove because it uses the capacitance of the human body.

The ultrasonic method uses a piezoelectric element to which the piezoelectric effect is applied to generate surface waves generated at the touch panel contact in the X and Y directions to calculate the distance to each input point to determine the position. Although the resolution and light transmittance are high, it has the disadvantage of being vulnerable to contamination of the sensor and liquid.

In the infrared method, a plurality of light emitting devices and light receiving devices are arranged around a panel to form a matrix structure. When the ray is blocked by the user, the input coordinate is determined by obtaining X and Y coordinates of the blocked portion. While high light transmittance and strong durability against external impact or scratches, there is a disadvantage that the bulky, inaccurate touch for inaccurate touch and low response speed.

Among these, the most commonly used are the resistive film type and the capacitive type. In these methods, a glass or polymer film substrate coated with a transparent conductive thin film such as indium tin oxide (ITO) is used as the material. At this time, since the reflectance of visible light is high between an ITO thin film and a board | substrate, recognition as a display element falls. Therefore, an anti-reflection (AR) coating function is added to increase the transmittance of visible light between the ITO thin film and the substrate. Known AR coatings are a method of alternately coating a high refractive index inorganic layer and a low refractive index inorganic layer on a transparent substrate made of glass or a polymer film. Low refractive index undercoat layer is used a lot of SiO _x , MgF ₂ and the like around 1.45 refractive index, high refractive index undercoat layer is used a lot of materials such as TiO ₂ , Nb ₂ O ₅ and around the refractive index 2.3.

Therefore, the physical properties of the substrate expressed by the transparent substrate layer, the inorganic undercoat layer for the AR coating, the transparent conductor layer, and the like have a great influence on the final quality of the touch panel. Is that the pattern part of the transparent conductor layer is visually revealed and the appearance is damaged.

The transparent conductive base material for touch panels may pattern a transparent conductor layer in order to raise the discrimination of the touched position. Patterning the transparent conductor layer is a regular removal of a portion of the transparent conductor layer, thereby forming a continuous pattern in which portions in which the transparent conductor layer is removed and portions not removed are repeated in a constant shape. In addition, when recognizing a touch, identification may be improved by recognizing the entirety of one pattern region to which the touched point belongs.

However, in patterning the transparent conductor layer, when the difference between the average reflectances of the pattern portion and the non-pattern portion increases, the shape of the pattern is visually revealed and the appearance as a display element is deteriorated. In particular, in the capacitive touch panel, since the transparent conductor layer is used as the incident surface layer, it is required to have a good appearance when the transparent conductor layer is patterned. Accordingly, various research and development have been made to solve the problem of deterioration in appearance due to the patterning of the transparent conductive substrate for a touch panel.

The present invention was developed to solve the problem of appearance damage caused by the patterning of the transparent conductive substrate described above, by optimizing the refractive index and thickness of the inorganic undercoat layer coated on the transparent substrate layer and the pattern portion in all wavelength bands of visible light By minimizing the difference in reflectance of the non-pattern portion, a main purpose is to provide a transparent conductive substrate for a touch panel and a method of manufacturing the same, which prevent the appearance of the pattern portion and damage of the appearance of the touch panel.

The transparent conductive substrate for a touch panel of the present invention for achieving the above object is a transparent substrate layer, a medium refractive index undercoat layer formed so that the refractive index is 1.75 ~ 2.1 and the thickness is 10 ~ 22nm on one surface of the transparent substrate layer, A low refractive index undercoat having a refractive index of 1.4 to 1.5 and a thickness of 70 to 80 nm on the medium refractive undercoat layer, and a transparent conductor layer formed to have a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm on the low refractive index undercoat layer. and; The difference in average reflectance of visible light is less than 0.1% and the difference in reflectance at 450 nm wavelength of visible light is less than 2.0% for the pattern portion from which the transparent conductor layer is removed and the non-pattern portion from which the transparent conductor layer is not removed. The difference in reflectance at 650 nm wavelength in visible light is made less than 1.0%.

On the other hand, in the method for manufacturing a transparent conductive substrate for a touch panel according to the present invention, a medium refractive undercoat layer having a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm by sputtering or vacuum deposition on one surface of a transparent substrate layer made of glass Coating a low refractive index undercoat layer having a refractive index of 1.4 to 1.5 and a thickness of 70 to 80 nm, and a transparent conductor layer having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm; Forming a pattern portion from which the transparent conductor layer has been removed and a non-pattern portion from which the transparent conductor layer has not been removed; And annealing annealing at a temperature of 250 to 350 ° C. to crystallize the transparent conductor layer.

In another method of manufacturing a transparent conductive substrate for a touch panel according to the present invention, one surface of a transparent substrate layer made of PET film has a refractive index of 1.75 to 2.1 and a refractive index of 10 to 22 nm by sputtering or vacuum deposition. Coating a coating layer, a low refractive index undercoat having a refractive index of 1.4 to 1.5 and a thickness of 70 to 80 nm, and a transparent conductor layer having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm; Forming a pattern portion from which the transparent conductor layer has been removed and a non-pattern portion from which the transparent conductor layer has not been removed; And annealing annealing at a temperature of 100 to 150 ° C. to crystallize the transparent conductor layer.

According to the transparent conductive substrate for a touch panel and the manufacturing method thereof according to the present invention configured as described above, when the transparent conductive substrate for a touch panel is visually observed, the ratio between the pattern portion from which the transparent conductor layer is removed and the transparent conductor layer are not removed. It provides a very good appearance in which the boundary of the pattern portion is not visually revealed.

Furthermore, according to the present invention, by reducing the difference in reflectance uniformly in all visible light wavelength bands, that is, in both the blue band and the red band, not only the color as a display element is improved but also the antireflection effect is added. Higher transmittance improves the quality of the touch panel.

In addition, the present invention uses a high-strength chemically strengthened glass can be used in a display unit requiring impact resistance.

As described above, the transparent conductive substrate used for the resistive touch panel or the capacitive touch panel is configured to have a regular pattern by partially removing the uppermost transparent conductor layer in order to improve the identification of the touch. At this time, when the pattern shape is visually recognized, the appearance is considered to be poor. The pattern shape is visually recognized because a difference in visible light reflectance (refractive index) is revealed between the pattern portion from which the transparent conductor layer is removed and the non-pattern portion from which the transparent conductor layer is not removed.

That is, when AR coating is applied to increase the transmittance of visible light, the [transparent conductor layer + low refractive index under coating layer + high refractive index under coating layer + transparent substrate layer] portion and the pattern portion [low refractive index under coating layer + high refractive index under coating layer + transparent part] Substrate layer] The pattern shape is visually recognized due to the difference in refractive index of the portion. Therefore, it is important for the transparent conductive substrate coated with AR to adjust the refractive index and the thickness of the transparent conductor layer, the low refractive index undercoat and the high refractive index undercoat so that the pattern shape is not recognized. Furthermore, AR coatings can contribute to enhancing color reproduction and color of the display device only by uniformly adjusting all wavelength bands of visible light, that is, blue reflectance near 450 nm wavelength and red reflectance near 650 nm wavelength.

Nb ₂ O ₅ thin films can reduce the reflectance in all wavelength bands of visible light and are widely used as a high refractive index undercoat material for AR coatings. However, since the Nb ₂ O ₅ thin film had a high self refractive index (about 2.3), it was difficult to control the refractive index between the adjacent low refractive undercoat layer and the transparent conductor layer, and this physical property greatly increased the difference in reflectance between the pattern portion and the non-pattern portion. It caused the making.

The present invention solves the problems of the conventional transparent conductive substrate by introducing a medium refractive undercoat layer, and will be described in detail with reference to the accompanying drawings in detail.

1 shows the most basic laminated structure of the transparent conductive base material which concerns on this invention.

The transparent conductive substrate according to the present invention includes a transparent base layer 10, a medium refractive undercoat layer 20, a low refractive index undercoat layer 30, and a transparent conductor layer 40.

The transparent substrate layer 10 functions as a base substrate, and is composed of glass, chemically strengthened glass, or polyethylene terephthalate (PET) film. Glass is used to construct rigid display units such as ATM devices, computer monitors, mobile phones, etc., and PET films are used to construct flexible display units and the like. Since the PET film is the polymer film which is most used for the touch panel at present, it will be possible to use other polymer film having the same physical properties.

Glass typically has a thickness of 1 mm or less, and uses a high soda-lime or alkali-free aluminoslicate material. When glass is used, the plastic material has physical properties that solve problems such as transmittance, long-term durability, and touch, but it is weak in impact. The touch panel is attached to the display unit of various devices, especially when it is attached to a small sized, thin cell phone, etc., it should have a strength that can ensure durability against external impact. Soda-lime glass is generally lower in strength than alkali-free glass, but can be increased through a chemical treatment of replacing sodium (Na) with potassium (K) in its components. This is called chemically strengthened glass, and is widely used as a base substrate for touch panels.

The medium refractive undercoat layer 20 is coated on one surface of the transparent substrate layer 10 to have a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm. The medium refractive index undercoat layer 20 includes indium tin oxide (ITO, refractive index of about 1.5) or yttrium oxide (Y ₂ O ₃ having a SnO ₂ content of 3 to 15% by weight in a material having a refractive index higher than about 1.5. , Refractive index of about 1.79) is preferably used. The medium refractive undercoat layer 20 is used in place of the high refractive undercoat layer of the conventional Nb ₂ O ₅ or the like according to the present invention, the shape of the pattern portion together with the low refractive index undercoat 30, transparent conductor layer 40 Not only does this make it invisible, but it also makes it possible to have a uniform reflectance difference in all wavelength bands of visible light.

The low refractive index undercoat 3 is coated on the medium refractive index undercoat 20 so that the refractive index is 1.4 to 1.5 and the thickness is 70 to 80 nm. As the low refractive undercoat layer 30, silicon oxide (SiO _x , SiO ₂ ) or magnesium fluoride (MgF ₂ ) is preferably used. The low refractive index undercoat 3 is one of two inorganic layers for AR coating, which reduces the reflectance of visible light between the transparent base layer 10 and the transparent conductor layer 40 to improve the recognition as a display element. give.

The transparent conductor layer 40 is coated on the low refractive index undercoat 30 so that the refractive index is 1.9 to 2.1 and the thickness is 10 to 30 nm. As the transparent conductor layer 10, indium tin oxide (ITO) having a content of SnO ₂ of 3 to 15 wt% is preferably used. The transparent conductor layer 40 is one having a surface resistance of 500 mW / cm 2 or less, and in order to reduce the change in surface resistance and optical properties according to the film thickness, the film thickness is more preferably within 10 to 20 nm.

As described above, the method of coating and forming the medium refractive undercoat layer 20, the low refractive index undercoat layer 30 and the transparent conductor layer 30 on the transparent base layer 10 is carried out by a known sputtering method or vacuum deposition method. Can be.

The coated transparent conductor layer 40 forms a predetermined pattern through an etching process. First, the dry film photoresist is laminated on the transparent conductor layer 40, and then a pattern film in which a predetermined pattern is continuously crossed is placed. Thereafter, ultraviolet rays are irradiated to develop the dry film photoresist region and patterned by peeling only the dry film photoresist region irradiated with ultraviolet rays using an acidic or alkaline etching solution. As a result, as shown in FIG. 1, the pattern portion a from which the transparent conductor layer 40 is removed and the non-pattern portion b from which the transparent conductor layer 40 is not removed are formed.

After the pattern formation is completed, the transparent conductor layer 40 is crystallized by annealing heat treatment at a predetermined temperature, thereby further improving the transmittance and durability. The crystallization step is performed at 250 to 350 ° C. when glass is used as the transparent base layer 10, and is preferably at 100 to 150 ° C. because the heat resistance is weak when a polymer film such as PET film is used. In addition, although the order of the patterning process and the annealing heat treatment process may be changed according to operating conditions, etching may be difficult when the transparent conductor layer 40 is crystallized, so it is preferable to perform the annealing heat treatment after the patterning process. .

In the transparent conductive substrate manufactured by the above-described process, the difference in the average reflectance of visible light with respect to the pattern portion (a) from which the transparent conductor layer 40 is removed and the non-pattern portion (b) from which the transparent conductor layer 40 is not removed Is less than 0.1%, the difference in reflectance at 450 nm wavelength in visible light is less than 2.0%, and the difference in reflectance at 650 nm wavelength in visible light is less than 1.0%.

As described above, the inventors have determined the refractive index and thickness of the medium refractive undercoat layer 20, the low refractive index undercoat layer 30, and the transparent conductor layer 40 coated on the transparent substrate layer 10 as a base substrate through several experiments. As described above, the difference between the visible light reflectance between the pattern portion a and the non-pattern portion b is minimized. As a result of the experiment, it was found that the case where the refractive indexes of the transparent conductor layer 40 and the medium refractive undercoat layer 20 are similar or the same shows excellent optical performance. It is preferable that the refractive index difference between the transparent conductor layer 40 and the medium refractive undercoat layer 20 is 0.3 or less, and the refractive index of the low refractive index undercoat layer 30 differs by at least 0.3 to about 0.5. Naturally, the refractive indices of the transparent conductor layer 40 and the medium refractive undercoat layer 20 should be higher than the low refractive index undercoat layer 30.

As an example, when the thickness of the transparent conductor layer 40 is less than 50 nm, the thickness of the low refractive index undercoat layer 30, in which the difference in refractive index with the transparent conductor layer 40 becomes 0.5 or more, is set to 50 to 200 nm or less, and transparent If the thickness of the medium refractive coating layer 20 having a difference from the refractive index with the conductor layer 40 is less than 0.3 is less than 50 nm, then the transparent conductor layer 40 is patterned to form the pattern portion a and the non-pattern portion b. An average visible light reflectance difference of less than 0.1% indicates that it is difficult to recognize the pattern shape.

As such, when the difference between the average visible reflectances of the pattern portion a and the non-pattern portion b is less than 0.1%, the shape of the pattern cannot be visually distinguished. Accordingly, it is possible to solve the complaint that the pattern shape is revealed by sensitive consumers, which has conventionally been caused by managing the difference in the average reflectance of visible light to less than 2.0%.

On the other hand, the average difference in reflectance between the pattern portion (a) and the non-pattern portion (b) is also important, but in order to increase the color of the display element, the difference in reflectance for each wavelength of visible light is also important. According to the present invention, it is preferable that the difference in blue reflectance at 450 nm wavelength in visible light is less than 2.0%, and the difference in red reflectance at 650 nm wavelength is less than 1.0%. When the difference in the reflectance of the blue wavelength band is increased, the color of the blue color is increased, so that the intrinsic color is not expressed. When the difference in the reflectance of the red wavelength band is increased, the sensitivity to red is increased to increase eye fatigue.

As the conventional Nb ₂ O ₅ thin film is used as a high refractive index undercoat material for AR coating, the difference in red reflectance at 650 nm wavelength of visible light increases, which is a major cause of deterioration of touch panel quality. Detailed description will be described later with reference to FIGS. 7 to 10.

1 to 6, various stacked structures according to the present invention will be briefly described.

As described above, Figure 1 is a basic structure according to the present invention, the refractive index is 1.75 ~ 2.1 on one surface of the transparent substrate layer 10, the medium refractive undercoat layer 20 having a thickness of 10 ~ 22nm, the refractive index is 1.4 ~ A low refractive index undercoat layer 30 having a thickness of 1.5 to 70 nm and a transparent conductor layer 40 having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm are sequentially stacked, and the medium refractive undercoat layer 20 ) Shows an example using indium tin oxide (ITO) having a SnO ₂ content of 3 to 15% by weight. FIG. 2 shows an example in which yttrium oxide (Y ₂ O ₃ ) is used as the medium refractive undercoat layer 20 in the same cross-sectional structure as in FIG. 1.

FIG. 3 is a stack of a medium refractive undercoat 20, a low refractive undercoat 30, and a transparent conductor layer 40 sequentially stacked on the opposite side of the transparent substrate layer 10 in the basic structure of FIG. 1. An example of a double-sided structure is shown. 4 is coated on the opposite surface of the transparent substrate layer 10 in the basic structure of FIG. 2 in the same manner as in FIG. 1, the medium refractive undercoat 20, the low refractive index undercoat 30, and the transparent conductor layer 40 are sequentially coated. An example of a double-sided structure is shown.

FIG. 5 illustrates an example of a laminated structure in which a medium refractive undercoat layer 20 and a low refractive index undercoat layer 30 are sequentially coated on opposite surfaces of the transparent substrate layer 10 in the basic structure of FIG. 1. FIG. 6 illustrates an example of a laminated structure in which a medium refractive undercoat layer 20 and a low refractive index undercoat layer 30 are sequentially coated on opposite surfaces of the transparent substrate layer 10 in the basic structure of FIG. 2.

In order to find out the technical effect of the transparent conductive substrate according to the present invention was carried out the following experiment.

[ Example  One]

1. Transparent substrate layer forming step

The chemically tempered glass substrate is a 0.7 mm thick soda lime glass in which potassium (K) molten salt is soaked and the surface sodium (Na) component is replaced by an ion exchange reaction. The substrate size is 370 mm x 470 mm x 0.7 mm.

2. Medium refractive undercoat layer forming step

Using a target material of 90% by weight of indium oxide and 10% by weight of tin oxide, 99% of argon and 1% of oxygen were introduced to form a 15 nm thick ITO film (refractive index 2.05) by magnetron sputtering at a process pressure of 3 mTorr. A thin film with an undercoat layer was prepared.

3. Low refractive undercoat layer forming step

By using a silicon (Si) target material doped with boron (B) of 0.01 Ω / cm or less, 60% of argon and 40% of oxygen were introduced, and at a process pressure of 3 mTorr, SiO _{2 having a} thickness of 80 nm by reactive sputtering method A membrane (refractive index of 1.46) was prepared.

4. Transparent conductor layer forming step

In the same manner as for forming the medium refractive undercoat, an ITO film having a thickness of 15 nm was introduced at a process pressure of 3 mTorr by introducing 99% of argon and 1% of oxygen using a target material of 90% by weight of indium oxide and 10% by weight of tin oxide. Refractive index 2.05) was formed to manufacture a transparent conductive glass.

5. Patterning Step of Transparent Conductor Layer

After laminating a so-called dry film on the transparent conductive glass, it was exposed using a pattern mask film, and after etching at 40 ° C. using an etching solution of 18.3% hydrochloric acid and 4.5% nitric acid, the dry film was removed with sodium hydroxide. Is a stripe shape with a line width of a constant interval (50 mu m).

6. Crystallization Step of Transparent Conductor Layer

After continuous coating of ITO (medium refractive index layer), SiO ₂ (low refractive index layer), and ITO (transparent conductor layer) at room temperature, 300 ℃, 60 minutes in a vacuum oven in order to improve the durability and crystallization of the ITO film Annealing heat treatment was performed to crystallize the ITO film.

[ Example  2]

In comparison with Example 1, Y ₂ O ₃ target material was used instead of ITO as the material of the medium refractive undercoat layer. That is, a 99% argon and less than 1% oxygen were introduced to form a Y ₂ O ₃ film (refractive index of 1.79) having a thickness of 25 nm by a magnetron sputtering method at a process pressure of 5 mTorr to produce a transparent conductive glass having a medium refractive undercoat layer. It was. Each layer was formed in the same structure on both surfaces of the glass which is a transparent base material, and the transparent conductive glass which patterned the ITO film | membrane (transparent conductor layer) in one side similarly was manufactured.

[ Example  3]

Except that the PET film which is a polymer film was used as the transparent substrate layer is the same as in Example 1. Since the polymer film was used, annealing heat treatment for crystallization was performed at 150 ° C.

[ Comparative example  One]

A transparent in which the ITO film (transparent conductor layer) was patterned by the same method as in Example 1 except that the film thickness of the SiO ₂ layer, which is the low refractive undercoat layer, was formed at 30 nm without forming the medium refractive undercoat layer. Conductive glass was produced.

[ Comparative example  2]

A patterned ITO film (transparent conductor layer) was formed in the same manner as in Example 1 except that a high refractive index material Nb ₂ O ₅ film (refractive index 2.3) was formed at a thickness of 18 nm in the medium refractive undercoat layer. Conductive glass was produced.

[ Comparative example  3]

A patterned ITO film (transparent conductor layer) was formed in the same manner as in Example 2 except that a high refractive index material Nb ₂ O ₅ film (refractive index 2.3) was formed at a thickness of 18 nm in the medium refractive undercoat layer. Conductive glass was produced.

[ Comparative example  4]

Except that a high refractive index material Nb ₂ O ₅ film (refractive index 2.3) was formed at a film thickness of 18 nm in the medium refractive undercoat layer, the transparent method was performed in the same manner as in Example 3 to pattern the ITO film (transparent conductor layer). Conductive glass was produced.

[Comparative Example 5]

A transparent conductive glass in which an ITO film (transparent conductor layer) was patterned was prepared in the same manner as in Example 1, except that general soda lime glass without chemically strengthening treatment was used for the transparent substrate layer.

The configuration and thickness of the transparent conductive substrates of the Examples and Comparative Examples prepared by the above-described method are summarized in the following [Table 1].

Composition thickness (nm) Non-pattern Pattern part Example 1 ITO (15nm) / SiO ₂ (80nm) / ITO (15nm) / Chemical Tempered Glass SiO ₂ (80nm) / ITO (15nm) / Chemical Tempered Glass Example 2 ITO (15nm) / SiO ₂ (80nm) / Y ₂ O ₃ (25nm) / Chemical Tempered Glass / Y ₂ O ₃ (25nm) / SiO ₂ (80nm) / ITO (15nm) SiO ₂ (80nm) / Y ₂ O ₃ (25nm) / chemical tempered glass / Y ₂ O ₃ (25nm) / SiO ₂ (80nm) / ITO (15nm) Example 3 ITO (15nm) / SiO ₂ (80nm) / ITO (15nm) / PET SiO ₂ (80nm) / ITO (15nm) / PET Comparative Example 1 ITO (15nm) / SiO ₂ (30nm) / Chemical Tempered Glass SiO ₂ (30nm) / Chemical Tempered Glass Comparative Example 2 ITO (15nm) / SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / Chemical Tempered Glass SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / Chemical Tempered Glass Comparative Example 3 ITO (15nm) / SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / Chemical Tempered Glass / Nb ₂ O ₅ (18nm) / SiO ₂ (80nm) / ITO (15nm) SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / chemical tempered glass / Nb ₂ O ₅ (18nm) / SiO ₂ (80nm) / ITO (15nm) Comparative Example 4 ITO (15nm) / SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / PET SiO ₂ (80nm) / Nb ₂ O ₅ (18nm) / PET Comparative Example 5 ITO (15nm) / SiO ₂ (80nm) / ITO (15nm) / General Glass SiO ₂ (80nm) / ITO (15nm) / General Glass

After evaluating the transparent conductive substrates prepared in each of Examples and Comparative Examples by the following method, the results are shown in [Table 2] to [Table 5].

<450-650 nm Average transmission and average reflection

Using a spectrophotometer CM-3600D manufactured by Minolta Co., Ltd., the average transmittance and average reflectance were measured over the 450-650 nm wavelength band of visible light, and the reflectances at the 450, 550, and 650 nm wavelength bands were measured separately. Measured with respect to each of the non-pattern portion and the pattern portion, the optical properties of the non-pattern portion, the optical properties of the pattern portion, and the difference in the optical properties of the non-pattern portion and the pattern portion are shown in Tables 2 to 4, respectively.

<Appearance Evaluation>

Appearance evaluation was evaluated by the following criteria to determine whether the non-pattern portion and the pattern portion can be identified by visually transparent conductor layer on a flat black plate, and the results are shown in [Table 4].

(Double-circle): It is difficult to distinguish a non-pattern part and a pattern part.

(Circle): A non-pattern part and a pattern part can be distinguished slightly.

X: A non-pattern part and a pattern part can be distinguished clearly.

Optical Properties of Unpatterned Parts 450 ~ 650nm
Average transmittance (%) 450 ~ 650nm
Average reflectance (%) At 450nm
reflectivity(%) At 550nm
reflectivity(%) At 650nm
reflectivity(%) Example 1 91.48 7.74 8.57 7.54 7.84 Example 2 92.42 5.84 6.32 5.28 5.48 Example 3 90.35 8.15 9.25 7.90 8.22 Comparative Example 1 89.48 9.94 11.74 9.77 8.77 Comparative Example 2 92.58 6.29 5.39 6.15 8.09 Comparative Example 3 93.87 5.54 3.95 4.38 6.04 Comparative Example 4 91.50 6.70 6.07 6.51 8.47

Optical property of pattern part 450 ~ 650nm
Average transmittance (%) 450 ~ 650nm
Average reflectance (%) At 450nm
reflectivity(%) At 550nm
reflectivity(%) At 650nm
reflectivity(%) Example 1 91.59 7.76 6.73 7.95 8.07 Example 2 92.94 5.66 4.40 4.75 5.14 Example 3 90.51 8.17 7.41 8.31 8.45 Comparative Example 1 91.63 7.92 8.03 7.91 7.85 Comparative Example 2 90.41 8.87 6.67 9.17 10.1 Comparative Example 3 90.45 8.66 9.18 9.69 9.96 Comparative Example 4 89.33 9.27 7.35 9.53 10.48

Difference in Optical Properties of Unpatterned and Patterned Parts 450 ~ 650nm
△ Average transmittance
(%) 450 ~ 650nm
△ Average reflectance
(%) At 450nm
△ Reflectance (%) At 550nm
△ Reflectance (%) At 650nm
△ Reflectance (%) Appearance Evaluation Example 1 0.16 0.02 1.84 0.41 0.23 ◎ Example 2 0.52 0.08 1.92 0.53 0.34 ○ Example 3 0.16 0.02 1.84 0.41 0.23 ◎ Comparative Example 1 2.16 2.02 3.71 1.86 0.92 × Comparative Example 2 2.17 2.58 1.28 3.02 2.01 × Comparative Example 3 3.42 3.12 2.51 5.32 3.92 × Comparative Example 4 2.17 2.58 1.28 3.02 2.01 ×

As shown in Table 4, in Examples 1 to 3 according to the present invention, since the average reflectance difference is 0.02, 0.08, and 0.02 in all wavelength bands of visible light, all are less than 0.1%. In addition, since the reflectance difference in the blue wavelength band of 450 nm of visible light has 1.84, 1.92, 1.84, all were less than 2%. In addition, since the reflectance difference in the red wavelength band which is 650 nm of visible light has 0.23, 0.34, 0.23, all were less than 1%. As a result, the non-pattern portion and the pattern portion were not identified, and a good appearance evaluation result was obtained.

On the contrary, in Comparative Example 1, not only the difference in average reflectance was high at 2.02% in all wavelength bands of visible light, but also very high at 3.71% in blue wavelength band of 450 nm. In Comparative Example 2, not only the difference in average reflectance was 2.58% in all wavelength bands of visible light but also the reflectance difference in the red wavelength band of 650 nm was very high at 2.01%. In Comparative Example 3, the difference in average reflectance was 3.12% in all wavelength bands of visible light, and the reflectance difference was 2.51% in the blue wavelength band of 450 nm and 3.92% in the red wavelength band of 650 nm. Both were very high. In Comparative Example 4, not only the difference in average reflectance was high at 2.58% in all wavelength bands of visible light, but also very high at 2.01% in red wavelength band of 650 nm. As such, all the comparative examples did not satisfy at least one or more reflectance difference conditions according to the present invention.

<Bending Strength>

The bending strength was compared by measuring the load at which the transparent conductive glasses of Example 1 and Comparative Example 5 were destroyed in a three-point bending measuring tester, and the results are shown in the following [Table 5]. The test conditions were 75mm between the tester, 50mm width of the specimen, 5mm diameter of the supporting anvil, and 10mm / min strain rate.

Example 1 Comparative Example 5 Breaking load 11.8kgf ± 3.0% 4.5kgf ± 3.5%

As shown in [Table 5], when the chemically strengthened glass is used, the breaking load is more than twice as high as that of the general soda lime glass, so that the transparent conductive glass for touch panels such as mobile phones requiring high impact resistance is required. Suitable for use as

Finally, FIGS. 7 to 10 show reflectance values of the non-pattern portion and the pattern portion for each wavelength band of visible light in Examples 1, 3, Comparative Example 2, and Comparative Example 4 described in Table 4 above. Show the graph.

According to the transparent conductive substrate according to the present invention, as shown in Figures 7 and 8, the one made of chemically strengthened glass (Example 1) and the one made of PET film (Example 3) in the blue wavelength band of 450nm (reflectance difference 1.84 In all wavelength bands except%), the non-pattern portion and the pattern portion exhibit almost the same reflectance. As a result, the difference in average reflectance between the non-pantone portion and the pattern portion is less than 0.1%, which has good appearance performance.

According to the transparent conductive substrate, not the present invention, as shown in Figs. 9 and 10, even though it is made of chemically strengthened glass (Comparative Example 2) and PET film (Comparative Example 4) reflectance in the blue wavelength band of 450nm The difference was 1.28%, which was lower than that of Examples 1 and 3, but the difference between the non-pattern portion and the pattern portion was increased in the remaining wavelength bands, and the difference in average reflectance was very high as 2.58%.

While the invention has been shown and described with respect to particular embodiments, it will be appreciated that various changes and modifications can be made in the art without departing from the spirit of the invention provided by the following claims. It will be self-evident for those of ordinary knowledge.

1 is a view showing a first laminated structure of a transparent conductive substrate according to the present invention

2 is a view showing a second laminated structure of a transparent conductive substrate according to the present invention;

3 is a view showing a third laminated structure of the transparent conductive substrate according to the present invention;

4 is a view showing a fourth laminated structure of the transparent conductive substrate according to the present invention;

5 is a view showing a fifth laminated structure of the transparent conductive substrate according to the present invention;

6 is a view showing a sixth laminated structure of the transparent conductive substrate according to the present invention;

7 is a graph showing the difference in reflectance for each wavelength of Example 1 according to the present invention

8 is a graph showing the difference in reflectance for each wavelength of Example 3 according to the present invention

9 is a graph showing the difference in reflectance for each wavelength of the conventional Comparative Example 2

10 is a graph showing the difference in reflectance for each wavelength of the conventional Comparative Example 4

[Description of Reference Numerals]

1: transparent substrate layer 2: ITO layer (medium refractive coating layer)

2 ': Y2O3 layer (medium refractive coating layer) 3: low refractive coating layer

4: transparent conductor layer a: pattern portion

b: non-pattern

Claims (15)

The transparent base layer 10, the refractive index on the surface of the transparent substrate layer 10 is 1.75 ~ 2.1 and the refractive index on the medium refractive undercoat layer 20 formed so that the thickness is 10 ~ 22nm, the refractive index on the medium refractive undercoat layer 20 Of the low refractive index undercoat 30 and the low refractive index undercoat 30 and the refractive index of 1.9 to 2.1 and the thickness of 10 to 30 nm. ); The difference in the average reflectance of visible light is less than 0.1% for the pattern portion (a) from which the transparent conductor layer 40 has been removed and the non-pattern portion (b) from which the transparent conductor layer 40 has not been removed. A difference in reflectance at a nm wavelength is less than 2.0%, and a difference in reflectance at a wavelength of 650 nm in visible light is less than 1.0%. A transparent conductive substrate for a touch panel. The method according to claim 1, On the opposite side of the transparent substrate layer 10 has a refractive index of 1.75 ~ 2.1 and a thickness of 10 ~ 22nm on the medium refractive undercoat layer 20, the refractive index is 1.4 ~ 1.5 on the medium refractive undercoat layer 20 Further comprises a low refractive index undercoat 30 formed to be 70 to 80 nm and a transparent conductor layer 40 formed to have a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm on the low refractive index undercoat 30. The transparent conductive base material for touch panels characterized by the above-mentioned. The method according to claim 1, On the opposite side of the transparent substrate layer 10 has a refractive index of 1.75 ~ 2.1 and a thickness of 10 ~ 22nm on the medium refractive undercoat layer 20, the refractive index is 1.4 ~ 1.5 on the medium refractive undercoat layer 20 The low refractive index undercoat layer 30 formed so that it is 70-80 nm, The transparent conductive base material for touch panels characterized by the above-mentioned. The method according to any one of claims 1 to 3, The transparent base layer 10 is a transparent conductive substrate for a touch panel, characterized in that made of any one of glass, chemically strengthened glass, PET film. The method according to any one of claims 1 to 3, The medium refractive undercoat layer 20 is a transparent conductive substrate for a touch panel, characterized in that the content of SnO ₂ 3 to 15% by weight of indium tin oxide (ITO) or yttrium oxide (Y ₂ O ₃ ). The method according to any one of claims 1 to 3, The low refractive index undercoat layer 30 is a transparent conductive substrate for a touch panel, characterized in that made of silicon oxide (SiO _x ) or magnesium fluoride (MgF ₂ ). The method according to any one of claims 1 to 3, The transparent conductor layer 40 is a transparent conductive substrate for a touch panel, characterized in that the content of SnO ₂ is made of indium tin oxide (ITO) of 3 to 15% by weight. A touch panel made of a transparent conductive substrate according to any one of claims 1 to 3 and used in a capacitive manner. The medium refractive undercoat layer 20 having a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm by a sputtering method or a vacuum deposition method on one surface of the transparent substrate layer 10 made of glass, having a refractive index of 1.4 to 1.5 and a thickness of 70 to Coating a low refractive index undercoat layer 30 having a thickness of 80 nm and a transparent conductor layer 40 having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm; Forming a pattern portion (a) from which the transparent conductor layer (40) has been removed and a non-pattern portion (b) from which the transparent conductor layer (40) has not been removed; And Method of manufacturing a transparent conductive substrate for a touch panel comprising the step of crystallizing the transparent conductor layer 40 by annealing heat treatment at a temperature of 250 ~ 350 ℃. The medium refractive index undercoat layer 20 having a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm by a sputtering method or a vacuum deposition method on one surface of the transparent substrate layer 10 made of PET film, having a refractive index of 1.4 to 1.5 and a thickness of 70 Coating a low refractive index undercoat layer 30 having a thickness of ˜80 nm and a transparent conductor layer 40 having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm; Forming a pattern portion (a) from which the transparent conductor layer (40) has been removed and a non-pattern portion (b) from which the transparent conductor layer (40) has not been removed; And Method of manufacturing a transparent conductive substrate for a touch panel comprising the step of annealing heat treatment at a temperature of 100 ~ 150 ℃ crystallizing the transparent conductor layer (40). The method according to claim 9 or 10, In the coating step, the medium refractive index undercoat layer 20 having a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm on the opposite surface of the transparent substrate layer 10, a low refractive index of 1.4 to 1.5 and a thickness of 70 to 80 nm. A method of manufacturing a transparent conductive substrate for a touch panel, further comprising the step of coating the refractive undercoat layer 30 and the transparent conductor layer 40 having a refractive index of 1.9 to 2.1 and a thickness of 10 to 30 nm. The method according to claim 9 or 10, In the coating step, the medium refractive index undercoat layer 20 having a refractive index of 1.75 to 2.1 and a thickness of 10 to 22 nm on the opposite surface of the transparent substrate layer 10, a low refractive index of 1.4 to 1.5 and a thickness of 70 to 80 nm. Method for producing a transparent conductive substrate for a touch panel, characterized in that it further comprises the step of coating the refractive undercoat layer 30 in sequence. The method according to claim 9 or 10, The medium refractive undercoat layer 20 is a method of manufacturing a transparent conductive substrate for a touch panel, characterized in that the content of SnO ₂ is made of indium tin oxide (ITO) or yttrium oxide (Y ₂ O ₃ ) of 3 to 15% by weight. . The method according to claim 9 or 10, The low refractive index undercoat layer 30 is a method of manufacturing a transparent conductive substrate for a touch panel, characterized in that consisting of silicon oxide (SiO _x ) or magnesium fluoride (MgF ₂ ). The method according to claim 9 or 10, The transparent conductor layer 40 is a method of manufacturing a transparent conductive substrate for a touch panel, characterized in that the content of SnO ₂ is made of indium tin oxide (ITO) of 3 to 15% by weight.

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