KR20110046852A - Transcripting device in using thermal transfer process - Google Patents

Abstract

PURPOSE: A transfer device used in a thermal transfer process is provided to obtain a uniform surface contact between a device electrode and a common electrode, thereby preventing arc discharge between the device electrode and the common electrode. CONSTITUTION: A transfer substrate(101) and a substrate to be transferred are mounted in a vacuum chamber(100). The transfer substrate includes device electrode and a common electrode and common electrodes connected to the metal heat emitting pattern. Device electrodes are mounted on the common electrode. A pressurizing device(200) applies pressure to the device electrode and the common electrode. The pressurizing device includes a pressurizing pin(210).

Description

TRANSCRIPTING DEVICE IN USING THERMAL TRANSFER PROCESS}

The present invention relates to a transfer apparatus used in the thermal transfer process. In particular, the present invention relates to an electrode connecting device for applying electrical energy in a joule heat transfer device for depositing organic materials.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (LCDs), field emission displays (FEDs), plasma display panels (PDPs), and electroluminescence devices.

PDP is attracting attention as the most advantageous display device for light and small size and large screen because of its simple structure and manufacturing process. TFT LCD (Thin Film Transistor LCD) is the most widely used flat panel display device, but has a narrow viewing angle and low response speed. Electroluminescent devices are roughly classified into inorganic light emitting diode display devices and organic light emitting diode display devices according to the material of the light emitting layer. Among them, organic light emitting diode display devices are self-luminous light emitting devices which emit light by themselves. There is a big advantage.

The organic light emitting diode display has an organic light emitting diode (OLED) as shown in FIG. 1.

The OLED includes an electroluminescent organic compound layer and a cathode electrode and an anode electrode facing each other with the organic compound layer interposed therebetween. The organic compound layer includes an electron injection layer (EIL), an electron transport layer (ETL), an emission layer (EML), a hole transport layer (HTL), and a hole injection layer (Hole Injection Layer). HIL), including a stacked structure in multiple layers. When a driving voltage is applied to the anode electrode and the cathode electrode, holes passing through the hole transport layer HTL and electrons passing through the electron transport layer ETL move to the emission layer EML to form excitons, and as a result, the emission layer EML becomes It emits visible light.

The organic light emitting diode display forms an emission layer (EML) at positions where OLEDs are to be disposed in each of R (red), G (green), and B (blue) pixels in order to implement full color. The emission layer EML is patterned for each pixel. As a method of forming an emission layer (EML), 1) FMM (Fine Metal Mask) method, 2) laser thermal transfer method, 3) ink spraying method and the like are known. However, these methods are not suitable for large area substrates that require high precision pattern formation in a short time.

In recent years, in order to form a high-precision pattern within a short time, a thermal transfer method using Joule heating (or "joule thermal transfer method") has emerged. It is sectional drawing which shows the outline | summary of the transfer apparatus by the joule thermal transfer method. 2B is an exploded perspective view showing a schematic structure of the transfer apparatus. In the Joule thermal transfer method, the transfer substrate 1 having the organic light emitting material 13 formed thereon is aligned in the vacuum chamber 10 with the transfer substrate 11 and the spacer 9 interposed therebetween to face at a predetermined interval. After the arrangement, electrical energy is applied to the transfer substrate 1 to transfer the organic light emitting material 13 to the transfer substrate 11.

A plurality of metal heating patterns 5 are formed in the transfer substrate 1 so as to correspond to the pixel areas of the transfer substrate 11 on which the organic light emitting material 13 is to be transferred. First and second common electrodes 3a and 3b connecting the metal heating patterns 5 are formed at one end and the other end of the metal heating pattern 5, respectively. On the metal heating patterns 5, an organic light emitting material 13 to be transferred to the transfer substrate 11 is formed in a thin film form. The transfer substrate 11 may be positioned on the organic light emitting material 13. The first device electrode 7a and the second device electrode 7b are aligned on the first and second common electrodes 3a and 3b, respectively, so that the common electrodes 3a and 3b and the device electrodes 7a and 7b are aligned. It is configured to be connected and separated from each other. A power source 15 for supplying electrical energy is connected between the first device electrode 7a and the second device electrode 7b. The power source 15 can generate a direct current power source or an alternating current power source, depending on the transfer device configured.

After the transfer substrate 11 is mounted on the metal heating pattern 5 on which the organic light emitting material 13 is formed at a predetermined interval, the common electrodes 3a, which face the device electrodes 7a and 7b, respectively, are disposed. After contacting with 3b), a predetermined electric energy is applied from the power source 15 connected between the first device electrode 7a and the second device electrode 7b. Then, electrical energy is transferred to the first common electrode 3a and the second common electrode 3b, and Joule heat is generated in the metal heating pattern 5 disposed therebetween. Joule heat generated in the metal heating pattern 5 is transferred to the organic light emitting material 13 positioned on the metal heating pattern 5, and as a result, the organic light emitting material 13 is evaporated and transferred to the transfer substrate 11. Transferred to form an organic light emitting layer in the pixel region.

At this time, the common electrodes 3a and 3b and the device electrodes 7a and 7b make surface contact. When the surface contact state is not good, the common electrodes 3a and 3b are connected between the common electrodes 3a and 3b and the device electrodes 7a and 7b. Arc discharge may occur.

In order to sufficiently heat the organic light emitting material 13 to be transferred in a short time, a considerably high heat energy is required per unit time, and in order to supply sufficient heat energy, the electric energy applied per unit time to the metal heating pattern 5 should be large. In order to obtain a large electric energy, the power applied between the first device electrode 7a and the second device electrode 7b should be a power source generating high voltage and high current. That is, in order to deposit organic materials within a predetermined process time by design to satisfy a predetermined yield, a considerable amount of electric energy per unit time is required.

In other words, electrical energy having a high voltage and a large amount of current is applied to the device electrodes 7a and 7b, and the electrical energy is transferred to the common electrodes 3a and 3b. Therefore, if the device electrodes 7a and 7b do not have complete surface contact with the common electrodes 3a and 3b, an arc discharge occurs between the device electrodes 7a and 7b and the common electrodes 3a and 3b. The arc discharge has an instantaneous dense energy, and the device electrodes 7a and 7b and the common electrodes 3a and 3b may be welded and fused due to this energy. Alternatively, the energy may be excessively transferred to the metal heating pattern 5 to damage the metal heating pattern 5, or may damage the organic light emitting material 13.

Therefore, in the transfer device used in the thermal transfer process, it is of paramount importance to ensure a sufficient and complete adhesion state between the device electrodes 7a and 7b and the common electrodes 3a and 3b.

SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer apparatus in which a transfer apparatus for depositing organic materials by a thermal transfer technique, which is capable of bringing a common electrode connecting metal wirings generating Joule heat into contact with a device electrode plate for applying a voltage. There is. Another object of the present invention is to provide a transfer device for ensuring the maximum contact area between the common electrode and the device electrode. Another object of the present invention is to provide a transfer device for uniformly pressing a contact pressure between a common electrode and a device electrode over the entire area of the electrode. It is still another object of the present invention to provide a transfer device in which arc discharge does not occur due to a poor contact between a common electrode and a device electrode.

In order to achieve the above object, the transfer device according to the present invention comprises a metal heating pattern; A transfer substrate including a common electrode connected to the metal heating pattern; A device electrode mounted on the common electrode; A power supply unit electrically connected to the device electrode; And a pressurizer configured to press the device electrode toward the common electrode on the upper surface of the device electrode and apply pressure to make surface contact between the device electrode and the common electrode.

The pressurizer includes a press plate corresponding to the device electrode; And a pressing pin mounted to protrude from the surface of the pressing plate toward the surface of the device electrode.

The pressure pins are arranged in a plurality of evenly distributed over the entire surface of the pressure plate surface.

It further comprises a plurality of elastic pressing pins are evenly distributed over the entire surface of the transfer substrate lower surface.

In addition, the transfer apparatus according to the present invention includes a metal heating pattern; A transfer substrate including a common electrode connected to the metal heating pattern; An organic film made of a light emitting organic material on the metal heating pattern; A transfer substrate disposed on the organic layer; A spacer for keeping the transfer substrate and the transfer substrate facing each other at a predetermined interval; A device electrode mounted on the common electrode; A power supply unit electrically connected to the device electrode; And a pressurizer configured to press the device electrode toward the common electrode on the upper surface of the device electrode and apply pressure to make surface contact between the device electrode and the common electrode.

The pressurizer may be configured to press the transfer substrate toward the transfer substrate on an upper surface of the transfer substrate to apply pressure to maintain a predetermined distance between the transfer substrate and the transfer substrate.

The pressurizer includes a pressurizing plate corresponding to the device electrode and the transfer substrate; And a pressing pin mounted to protrude from the surface of the pressing plate toward the surface of the transfer substrate and the device electrode.

The pressing pin is an elastic body with a plurality of evenly distributed over the entire surface of the pressing plate surface.

It further comprises a plurality of elastic pressing pins are evenly distributed over the entire surface of the transfer substrate lower surface.

In the transfer apparatus for manufacturing an organic light emitting display device according to the present invention, since the device electrode is pressed toward the common electrode with pressure pins evenly distributed on the device electrode at the top of the device electrode, the device electrode and the common electrode are Make uniform face contact. In particular, since the pressing pin is made of an elastic body, the pressing force applied between the device electrode and the common electrode may be applied evenly and uniformly without being concentrated only on a specific portion. As a result, uniform and complete surface contact is secured between the device electrode and the common electrode, and an arc discharge does not occur between the device electrode and the common electrode even when a high voltage is applied to the device electrode. In particular, in a device for manufacturing a large area organic light emitting display device requiring a high voltage and a high current amount, arc discharge is not generated between the device electrode and the common electrode.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 15. 3 is a cross-sectional view showing a transfer device according to a first embodiment of the present invention.

The transfer apparatus according to the first embodiment of the present invention includes a vacuum chamber 100 for performing a thermal transfer method. The transfer substrate 101 may be mounted and detached at the bottom of the vacuum chamber 100 by an automatic or manual method. In the transfer substrate 101, a plurality of metal heating patterns 105 are formed on the transfer substrate 101. The shape in which the metal heating pattern 105 is formed may be a shape in which wires are arranged in one direction or may have various shapes corresponding to the shape of the designed pixel. The first common electrode 103a and the second common electrode 103b to which the metal heating patterns 105 are commonly connected are formed at one end and the other end of the metal heating pattern 105. The organic light emitting material 113 is disposed in the form of a thin film on the metal heating patterns 105.

After the transfer substrate 101 having the above configuration is mounted in the vacuum chamber 100, the transfer substrate 111 is installed on the transfer substrate 101 at a predetermined distance from the organic light emitting material 113. Spacers 109 may be formed on the transfer substrate 101 to keep the gap constant. The first device electrode 107a and the second device electrode 107b are in contact with each other on the first common electrode 103a and the second common electrode 103b. At this time, in order to ensure the surface contact between the device electrodes 107a and 107b and the common electrodes 103a and 103b, the upper surface of the device electrodes 107a and 107b is moved from top to bottom using the pressurizer 200. Pressurize. Then, when an electric force is applied between the first device electrode 107a and the second device electrode 107b, electric energy is applied between the common electrodes 103a and 103b through the device electrodes 107a and 107b. do. As a result, the metal heating pattern 105 connected between the common electrodes 103a and 103b generates Joule heat. Joule heat generated in the metal heating pattern 105 is transferred to the organic light emitting material 113 located on the metal heating pattern 105, as a result of which the organic light emitting material 113 evaporates, the transfer substrate 111 Transferred to form an organic light emitting film in the pixel region.

Here, the pressurizer 200 is a plurality of pressing pins 210, the device electrodes (107a, 107b) in order to maintain a uniform surface contact force between the device electrodes (107a, 107b) and the common electrodes (103a, 103b). It may have a structure for pressing the upper surface of the bottom down. 4 is an enlarged view showing the configuration of a preferred pressurizer 200 provided in this embodiment and a state in which device electrodes 107a and 107b are pressed using the pressurizer 200. Hereinafter, the pressurizer of this embodiment will be described in detail with reference to FIG. 4.

The pressurizer support member 220 is connected to the base of the vacuum chamber 100 in which the transfer substrate 101 is mounted. The pressurizer support member 220 includes a lower support member 221 and an upper support member 225. The lower support member 221 may be fixed to the base of the vacuum chamber 100. The lower support member 221 and the upper support member 225 may be connected by the variable connection part 223, so that the upper support member 225 may be extended-contracted up-down. In addition, the upper support member 225 and the lower support member 221 may be completely separated and recombined. This is to facilitate the operation when the transfer substrate 101 and the transfer substrate 111 is detached-mounted. The upper surface of the upper support member 225 is provided with a pressing plate 230 extending toward the mounting substrate 101 is mounted. The pressing plate 230 is equipped with a pin support 211 for mounting the pressing pin 210. The pressing pin 210 is composed of a body 213 and the head 215. One end of the body 213 is connected to the pin support 211, and the other end is connected to the head 215.

Although only one press pin 210 may be present on the press plate 230, since the device electrodes 107a and 107b have an elongated rectangular shape, a plurality of press pins may extend along the length direction of the device electrodes 107a and 107b. It is preferable to have a structure in which the 210 is arranged. 5A is a diagram illustrating a pressing plate 230 in which a plurality of pressing pins 210 are installed in a longitudinal direction. More preferably, the pressing pins 210 may be arranged in an M x N structure having two rows or a plurality of rows. FIG. 5B is a diagram illustrating a pressure plate 230 in which a plurality of pressure pins 210 are installed in two rows.

The transfer substrate 101 and the transfer substrate 111 are mounted in the vacuum chamber 100, the device electrodes 107a and 107b are positioned on the common electrodes 103a and 103b, and then the variable connection unit 223 is adjusted. Thereby lowering the upper support member 225. As the upper support member 225 descends, the pressure plate 230 and the pressure pin 210 also descend toward the transfer substrate 101. As a result, the head 215 of the pressing pin 210 comes into contact with the surfaces of the device electrodes 107a and 107b. After that, the variable connecting portion 223 is continuously adjusted to lower the upper support member 235. The pin 210 pushes the device electrodes 107a and 107b down.

At this time, since a plurality of pressing pins 210 are provided, the pressing force of the pressing plate 230 is distributed to the plurality of pressing pins 210 to press the device electrodes 107a and 107b. Therefore, the pressing force applied to the device electrodes 107a and 107b is evenly distributed over the entire surface area of the device electrodes 107a and 107b, and the device electrodes 107a and 107b and the common electrodes 103a and 103b are uniformly applied. Make surface contact. Thereafter, when the Joule thermal transfer method is performed by applying electric force from a power source connected to the first device electrode 107a and the second device electrode 107b, the device electrodes 107a and 107b and the common electrode 103a and 103b. Arc discharge does not occur at.

Arc discharge is more likely to occur when the voltage of the power supply used is large. For example, when the device electrode and the common electrode operate at 500V without sufficient surface contact, an arc discharge may occur even when operating at a voltage of 1000V in a transfer device in which arc discharge does not occur. However, in the transfer apparatus according to the first embodiment of the present invention, by maintaining the surface contact at a uniform pressure between the device electrode and the common electrode, arc discharge does not occur even at a higher voltage of 1000V or more.

The transfer apparatus provided in the first embodiment of the present invention evenly distributes contact pressures between the device electrodes 107a and 107b and the common electrodes 103a and 103b to maintain uniform surface contact. However, when the state of the surface where the device electrodes 107a and 107b and the common electrodes 103a and 103b are in contact with each other is enlarged and examined, it may not be a perfect plane. In other words, it has to have a certain surface roughness, and does not form a perfect plane. 6 is an enlarged cross-sectional view illustrating a state in which a device electrode and a common electrode are in contact with each other. As shown in FIG. 6, even when the pressing force is distributed between the device electrodes 107a and 107b and the common electrodes 103a and 103b by the plurality of pressure pins 210, the contact parts are concentrated at the protruding portion A. In the recessed part (B), it may occur that the contact state cannot be maintained.

The second embodiment of the present invention will be described as a more preferable method for keeping all the faces facing each other evenly between two faces having such a non-uniform surface evenly. The difference between the first embodiment and the second embodiment is different in the configuration of the pressing pin. It is characterized by having an elastic force in order to more evenly distribute the pressing pin pressing force of the second embodiment. 7 is a view showing an elastic pressing pin according to a second embodiment of the present invention. 8A and 8B show another elastic pressing pin. 9 is a cross-sectional view showing a transfer device having an elastic pressing pin according to a second embodiment of the present invention.

As shown in FIG. 7, the elastic pressing pin 310 is composed of an elastic body 313 and a head 215. A representative example of the elastic body 313 can be considered a spring. Hereinafter, the elastic body 313 in the present embodiment will be described as the same spring. One end of the elastic body 313 is connected to the pin support 211, the other end is connected to the head 215. In addition, when pressure is applied to the head 215, the spring, which is the elastic body 313, may not only move in the vertical direction but also may be twisted left and right.

To prevent this, it may have a structure as shown in Figures 8a and 8b. That is, the shaft 315 may be further provided between the head 215 and the pin support part 211 in the spring 313. In this case, the groove 227 is formed inside the pin support 211 so that the shaft 315 does not interfere with the expansion and contraction of the spring 313 so that the shaft 315 can flow inside the groove 227. do.

The operation of the transfer device having the elastic pressing pin 310 will be described. As in the second embodiment, the pressing plate including the elastic pressing pin 310 is named as the elastic pressing plate 330 to distinguish from the first embodiment. 9 is a cross-sectional view showing a transfer device having an elastic pressing pin according to a second embodiment of the present invention.

Referring to FIG. 9, the transfer substrate 101 and the transfer substrate 111 are mounted in the vacuum chamber 100, and the device electrodes 107a and 107b are positioned on the common electrodes 103a and 103b and then changed. The upper support member 225 is lowered by adjusting the connecting portion 223. As the upper support member 225 descends, the elastic pressing plate 330 including the plurality of elastic pressing pins 310 also descends toward the transfer substrate 101. As a result, the head 215 of the elastic pressing pin 310 comes into contact with the surfaces of the device electrodes 107a and 107b. After that, by continuously adjusting the variable connecting portion 223 and lowering the upper support member 225, the spring 313 contracts and the head 215 moves the device electrodes 107a and 107b downward with the elastic force of the spring 313. Press

As such, the plurality of elastic pressing pins 310 press the upper surfaces of the device electrodes 107a and 107b to maintain uniform surface contact between the device electrodes 107a and 107b and the common electrodes 103a and 103b. Since the respective elastic pressing pins 310 press the device electrodes 107a and 107b by the respective springs 315 constituting each of the elastic pressure pins 310, the device electrodes 107a and 107b are further spread over the upper surface. Even pressure In particular, even when the surfaces of the device electrodes 107a and 107b and the common electrodes 103a and 103b which make surface contact are uneven, different pressures are applied to the portions recessed and protruded by the plurality of elastic pressing pins. The overall surface contact can be maintained. As a result, the contact electrodes of the device electrodes 107a and 107b and the common electrodes 103a and 103b are not in contact with each other in intensive contact with each other but without contact with each other. Keep contact with

As described in Embodiments 1 and 2 above, the most important concept of the present invention is a means for securing surface contact between the device electrode and the common electrode, and is a pressing pin disposed on the device electrode surface to press the device electrode toward the common electrode. It includes. In addition, the pressing pin is characterized in that it comprises an elastic member such as a spring to uniformly distribute the pressing force over the entire surface of the device electrode.

The third embodiment according to the present invention describes an example in which the pressing force is applied on the device electrode side, but is provided on the transfer substrate side to uniformly distribute the pressing force. FIG. 10 is a cross-sectional view of a transfer apparatus including an elastic hydraulic plate and an elastic hydraulic pin disposed under the transfer substrate to evenly distribute the pressing force applied from the upper portion of the transfer substrate according to the third embodiment of the present invention.

An elastic hydraulic plate 430 is provided at the base of the vacuum chamber 100, particularly at the portion where the transfer substrate 101 is to be located. A plurality of elastic hydraulic pins 410 are disposed on the elastic hydraulic plate 430. Each elastic hydraulic pin 410 may be installed in the hydraulic pin support 411. The detailed configuration of the elastic hydraulic pin 410 may be the same as the structure of the elastic pressing pin described in the second embodiment, and will be omitted here. The transfer substrate 101 may be mounted and detached on the elastic hydraulic pin 410.

In addition, a pressurizer 200 is provided at the base of the vacuum chamber 430, particularly at the side of the transfer substrate 101, as in the first embodiment. Since the detailed structure of the pressurizer 200 is the same as that of Example 1, detailed description is abbreviate | omitted. Reference numerals not described are the same as those in FIG. 4 for describing the first embodiment.

In the structure of the transfer apparatus according to the third embodiment, after the transfer substrate 101 is mounted on the plurality of elastic hydraulic pins 410, the device electrodes 107a and 107b are placed on the common electrodes 103a and 103b. The variable connecting portion 210 is operated to lower the upper support member 225. Then, the pressure plate 230 including the plurality of pressure pins 210 is lowered toward the device electrode 101. While the pressing pin 210 pushes down the surfaces of the device electrodes 107a and 107b, the device electrodes 107a and 107b and the common electrodes 103a and 103b make surface contact. At this time, the pressure for pressing the device electrodes 107a and 107b by the plurality of elastic hydraulic pins 410 located below the transfer substrate 101 is controlled by the device electrodes 107a and 107b and the common electrodes 103a and 103b. It is evenly distributed throughout the contact surface. As a result, the device electrodes 107a and 107b and the common electrodes 103a and 103b ensure uniform surface contact.

In addition, in the fourth embodiment, in the transfer device having the elastic pressing pin 310 according to the second embodiment, the elastic hydraulic plate 430 and the elastic hydraulic pin disposed below the transfer substrate 101 as in the third embodiment 410 may be further included. 11 is a view showing a transfer device having an elastic pressing pin 310, an elastic hydraulic plate 430 and an elastic hydraulic pin 410 according to the fourth embodiment of the present invention. Detailed descriptions of the reference numerals which have not been described are described in Embodiment 2 and Embodiment 3, and thus descriptions thereof will be omitted.

As a fifth embodiment, a transfer apparatus having a configuration in which a pressing force is applied not only to the device electrodes but also to the transfer substrate is described. 12 is a cross-sectional view illustrating a transfer device including a pressing plate 210 and a pressing pin 210 and a pressing plate 230 provided on the device electrode. In constructing the transfer apparatus, it may be necessary to configure the apparatus in consideration of the entire process of forming the organic thin film. The present invention is to provide a device for maintaining a surface contact with the common electrode by applying pressure to the device electrode, but in the construction of the transfer device, the transfer substrate also needs to be installed on the organic light emitting material, In particular, it is important to maintain a uniform gap between the transfer substrate and the transfer substrate.

Therefore, if the concept of a device for uniformly pressing the device electrodes 107a and 107b is extended and applied to a device on which the transfer substrate 111 is mounted, the device electrodes 107a and 107b can be pressed evenly and at the same time. The 111 can be pressed to maintain a uniform distance from the transfer substrate 101. That is, as shown in FIG. 12, the pressing pins 210 described in Embodiment 1 of the present invention may also be applied to the transfer substrate 111. In this case, the pressing plate 230 may be configured to cover the entire transfer substrate 101 and the transfer substrate 111. Detailed descriptions of the reference numerals which have not been described are described in the above embodiments, and thus will be omitted herein.

In addition, as shown in FIG. 13, the elastic pressing pins 310 described in Embodiment 2 of the present invention may be further applied to the transfer substrate 111. FIG. 13 is a cross-sectional view showing a transfer device including an elastic pressing pin 310 and an elastic pressing plate 330 provided on the transfer substrate 111 and the device electrodes 107a and 107b according to the sixth embodiment of the present invention. All. Detailed descriptions of the reference numerals which have not been described are described in the above embodiments, and thus will be omitted herein.

And, as described in the third embodiment, in the structure in which the elastic hydraulic pins 410 are installed below the transfer substrate 101, the pressing pins 210 may be further applied on the transfer substrate 111 as shown in FIG. . Alternatively, as shown in FIG. 15, the elastic pressing pins 310 may be further applied on the transfer substrate 111. FIG. 14 includes an elastic hydraulic pin 410 and an elastic hydraulic plate 430 under the transfer substrate 101 according to the seventh embodiment of the present invention, wherein the transfer substrate 111 and the device electrodes 107a and 107b are provided. It is sectional drawing which shows the transcription | transfer apparatus containing the pressing pin 210 and the pressing plate 230 installed in the upper part. 15 includes an elastic hydraulic pin 410 and an elastic hydraulic plate 430 under the transfer substrate 101 according to the eighth embodiment of the present invention, wherein the transfer substrate 111 and the device electrode 197a, It is sectional drawing which shows the transfer device containing the elastic pressing pin 310 and the elastic pressing plate 330 which were provided in the upper part of 107b. Detailed descriptions of the reference numerals which have not been described are described in the above embodiments, and thus will be omitted herein.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 shows the structure of an OLED.

Fig. 2A is a sectional view showing an outline of a transfer device by the joule thermal transfer method.

Figure 2b is an exploded perspective view showing a schematic structure of the transfer device.

3 is a cross-sectional view showing a transfer device having a pressurizer according to the first embodiment of the present invention.

Figure 4 is an enlarged view showing a state in which the device electrode is pressed using a preferred pressurizer provided in this embodiment.

5A is a view showing a pressure plate in which a plurality of pressure pins are installed in a longitudinal direction.

5B is a view illustrating a pressure plate in which a plurality of pressure pins are installed in two rows.

6 is an enlarged cross-sectional view illustrating a state in which a device electrode and a common electrode contact each other.

7 is a view showing an elastic pressing pin according to a second embodiment of the present invention.

8A and 8B show yet another elastic pressing pin.

9 is a cross-sectional view showing a transfer device having an elastic pressing pin according to a second embodiment of the present invention.

FIG. 10 is a cross-sectional view of a transfer device further including a pressure pin and a pressure plate disposed on a device electrode, and an elastic pressure plate and an elastic pressure pin disposed under the transfer substrate according to a third embodiment of the present invention.

FIG. 11 is a cross-sectional view of a transfer apparatus further including an elastic pressing pin and an elastic pressing plate disposed on a device electrode, and an elastic hydraulic plate and an elastic hydraulic pin disposed under the transfer substrate according to a fourth embodiment of the present invention.

12 is a cross-sectional view illustrating a transfer device including a pressurized pin and a press plate installed on an upper portion of a transfer substrate and a device electrode according to a fifth embodiment of the present invention.

FIG. 13 is a cross-sectional view of a transfer device including an elastic pressing pin and an elastic pressing plate on an upper portion of a transfer substrate and a device electrode according to a sixth embodiment of the present invention; FIG.

FIG. 14 is a cross-sectional view of a transfer device including an elastic hydraulic pin at a lower portion of a transfer substrate and a pressing pin and a pressure plate installed at an upper portion of a transfer substrate and a device electrode according to a seventh embodiment of the present invention.

FIG. 15 is a cross-sectional view illustrating a transfer device including an elastic hydraulic pin at a lower portion of a transfer substrate and an elastic pressing pin and an elastic press plate installed at an upper portion of a transfer substrate and a device electrode according to an eighth embodiment of the present invention.

Description of the Related Art

1, 101: transfer substrate 3: common electrode

7: device electrode 5, 105: metal heating pattern

3a and 103a: first common electrode 3b and 103b: second common electrode

7a, 107a: first device electrode 7b, 107b: second device electrode

9, 109: spacer 11, 111: transfer substrate

13, 113: organic light emitting material 10, 100: vacuum chamber

200: pressurizer 210: pressurizing pin

211: pin support portion 227: groove portion

213: body 215: head

220: pressurizer support member 221: lower support member

223: variable connection portion 225: upper support member

230: pressure plate

310: elastic pressing pin 313: elastic body

315: shaft

410: elastic hydraulic pin 430: elastic hydraulic plate

Claims (12)

A metal heating pattern; A transfer substrate including a common electrode connected to the metal heating pattern; A device electrode mounted on the common electrode; A power supply unit electrically connected to the device electrode; And a pressurizer which presses the device electrode toward the common electrode on the upper surface of the device electrode and applies a pressure to make surface contact between the device electrode and the common electrode. The method of claim 1, The pressurizer includes a press plate corresponding to the device electrode; And a pressing pin mounted to protrude from the surface of the pressing plate toward the surface of the device electrode. The method of claim 2, The pressing pin is a transfer device, characterized in that the plurality is evenly distributed over the entire surface of the pressing plate surface. The method of claim 2, The pressing pin is a transfer device, characterized in that it comprises an elastic body. The method of claim 1, The common electrode includes a first common electrode connected to one end of the metal heating pattern, and a second common electrode connected to the other end of the metal heating pattern; The device electrode includes a first device electrode mounted on the first common electrode and a second device electrode mounted on the second common electrode; And the power supply unit is connected between the first device electrode and the second device electrode to supply electrical energy. The method of claim 1, And a plurality of elastic pressing pins disposed evenly distributed over the entire surface of the lower surface of the transfer substrate. The method of claim 1, An organic film made of a light emitting organic material on the metal heating pattern; A transfer substrate disposed on the organic layer; And a spacer for keeping the transfer substrate and the transfer substrate facing each other at a predetermined interval. The method of claim 7, wherein And the pressurizer presses the transfer substrate toward the transfer substrate on an upper surface of the transfer substrate to apply pressure to maintain a predetermined distance between the transfer substrate and the transfer substrate. The method of claim 8, The pressurizer includes a pressurizing plate corresponding to the device electrode and the transfer substrate; And a pressing pin mounted to protrude from the surface of the pressing plate toward the surface of the transfer substrate and the device electrode. The method of claim 9, The pressing pin is a transfer device, characterized in that the plurality is evenly distributed over the entire surface of the pressing plate surface. The method of claim 9, The pressing pin is a transfer device, characterized in that it comprises an elastic body. The method of claim 8, And a plurality of elastic pressing pins disposed evenly distributed over the entire surface of the lower surface of the transfer substrate.

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