KR100959111B1 - Apparatus and method for fabricating Organic Light Emitting Diodes - Google Patents

Abstract

An apparatus and a method of manufacturing an organic light emitting display device are provided. The apparatus for manufacturing an organic light emitting display device includes: a chamber, a substrate stage installed inside the chamber, on which an acceptor substrate and a donor film to be bonded to the acceptor substrate are seated, grounded to the chamber, and the acceptor substrate and the substrate. It includes a grounding electrode disposed between the donor film.

Therefore, according to the manufacturing apparatus of the organic light emitting device provided, the process is performed after electrically connecting the grounding electrode grounded in the chamber to the edge of the acceptor substrate when forming the organic film by the laser transfer method, Static electricity generated during the process can flow to the chamber through this grounding electrode. As a result, all problems caused by static electricity are solved in advance.

Organic, substrate

Description

Apparatus and method for fabricating Organic Light Emitting Diodes

The present invention relates to an apparatus and a manufacturing method of an organic light emitting device, and more particularly, to an apparatus and a manufacturing method of an organic light emitting device that can control the static electricity generated during the manufacturing of the organic light emitting device.

The organic light emitting display device is capable of displaying high-quality video by low voltage driving, high luminous efficiency, wide viewing angle, fast response speed, and the like.

Such an organic light emitting diode is composed of an organic film including an organic light emitting layer between an anode and a cathode. The LCD is a self-luminous type in which electrons and holes are recombined in the organic light emitting layer to generate light by applying voltage to the two electrodes. No backlight, such as Liquid Crystal Display, is required, making it lightweight and thin, and simplifying the process.

The organic light emitting device as described above is classified into low molecular type organic light emitting device and high molecular type organic light emitting device according to the material of the organic film, in particular the organic light emitting layer.

The low molecular type organic light emitting display device is formed of a multilayer organic film having different functions such as a hole injection layer, a hole transport layer, a light emitting layer, a hole suppression layer, and an electron injection layer between an anode and a cathode, so that charges do not occur. This can be controlled by doping or by substituting a material with an appropriate energy level. However, since such an organic film is mainly formed by vacuum deposition, it is difficult to implement a large display.

On the other hand, the polymer type organic electroluminescent device may have a single layer structure consisting of an organic light emitting layer between an anode and a cathode or a double structure including a hole transport layer, and thus an organic light emitting device having a thin thickness can be manufactured. There is this. In addition, since the organic film of the polymer organic electroluminescent device is formed by wet coating, the organic film can be manufactured under normal pressure, thereby reducing the cost of the production process and making it easy to achieve a large area.

On the other hand, in the case of manufacturing a monochromatic device, the organic electroluminescent device using a polymer can be simply manufactured by using a spin coating process, but the efficiency and life is lower than that of a low molecular organic electroluminescent device. have. In the case of a full color device, a full color can be realized by patterning a light emitting layer having three primary colors of R, G, and B on the organic light emitting device.

Here, the organic film patterning of the low molecular weight organic electroluminescent device may be patterned by deposition using a shadow mask, and the organic film patterning of the polymer organic light emitting device may be inkjet printing or laser. It can be made by a laser induced thermal imaging (LITI).

Among them, the laser transfer method (LITI) can use the spin coating properties as it is, and when the large area is achieved, the pixel internal uniformity is excellent. In addition, the laser transfer method is not a wet process, but a dry process, and thus may solve the problem of deterioration of life due to a solvent, and may finely pattern the organic layer.

In order to apply the laser transfer method, a light source, an organic light emitting diode substrate (hereinafter, referred to as an "acceptor substrate"), and a donor film are basically required, and the donor film includes a base layer, a light- It consists of a heat conversion layer and a transfer layer.

The laser transfer method is a method in which light is emitted from a light source and absorbed by a light-to-heat conversion layer of a donor film to convert light into thermal energy, and the organic material formed on the transfer layer is transferred to the acceptor substrate by the converted thermal energy. .

A method of forming a pattern of an organic light emitting device by the laser transfer method has been disclosed in Korean Patent Nos. 10-0342653 and 5,998,085 and 6,214,520 and 6,114,085.

1A to 1C are diagrams for explaining an organic film pattern process by a laser transfer method.

Referring to FIG. 1A, an acceptor substrate 10 is provided and a donor film 20 made of a substrate layer 21, a light-to-heat conversion layer 22, and an organic layer 23 on the acceptor substrate 10. ).

Subsequently, as shown in FIG. 1B, the laser beam is irradiated to the first region a of the base layer 21 of the donor film 20. Therefore, light passing through the first region a of the base layer 21 is converted into heat in the light-to-heat conversion layer 22, and the organic film 23 of the first region a is formed by the generated heat. ) And the light-to-heat conversion layer 22 is weakened so that the organic layer 23 of the first region a is transferred onto the acceptor substrate 10 opposite thereto.

Subsequently, as shown in FIG. 1C, the organic layer 23 having weak adhesive strength, that is, the organic layer 23a of the first region a is transferred to the acceptor substrate 10, and then the acceptor substrate 10 is removed. When the donor film 20 is separated from the donor film 20, the transferred organic film 23a is formed on the acceptor substrate 10, and the organic film 23b of the second region, that is, the region b not irradiated with light, is formed. ) May be separated at the same time as the donor film 20 when the donor film 20 is separated, thereby forming the patterned organic layer 23a.

However, in forming the organic film 23a patterned by the laser transfer method as described above, the donor film 20 and the acceptor substrate 10 are bonded to and separated from each other. Static electricity may be generated due to factors.

In this case, since the generated voltage of the static electricity can reach thousands to tens of thousands of volts, a short phenomenon may occur in the device due to the static electricity or the temperature may rise in the device, such that the metal may melt or the junction line may fall. Device defects of a shape can be caused, which eventually affects the internal circuits of the device, which can greatly deteriorate the device's characteristics.

Accordingly, the present invention has been made in view of the above problems, and the problem to be solved by the present invention is an apparatus for manufacturing an organic light emitting device capable of controlling static electricity generated when forming an organic film by a laser transfer method. And to provide a manufacturing method.

In addition, another object of the present invention is to provide an apparatus and a method for manufacturing an organic light emitting device that can control static electricity that may be generated in the process of bonding and separating the donor film and the acceptor substrate.

According to a first aspect of the present invention for solving the above problems, a chamber, a substrate stage that is installed inside the chamber, the donor film to be bonded to the acceptor substrate and the acceptor substrate is seated, and the ground to the chamber The present invention provides an apparatus for manufacturing an organic light emitting display device, including an electrode for grounding disposed between the acceptor substrate and the donor film.

In another embodiment, the grounding electrode may be installed inside the chamber but grounded to the inner wall of the chamber through a line through which static electricity may flow.

In another embodiment, the grounding electrode may be arranged to flow the static electricity generated in the bonding process of the acceptor substrate and the donor film or the process of separating from the bonding to the chamber.

In another embodiment, the grounding electrode may be electrically connected to the acceptor substrate.

In another embodiment, the acceptor substrate may include a display unit provided at the center portion, a circuit portion provided at the edge portion of the display unit, and a margin portion provided at the edge of the acceptor substrate, such as the circuit portion, and the ground The dragon electrode may be electrically connected to a margin provided at an edge of the acceptor substrate.

On the other hand, according to the second aspect of the present invention for solving the above problems, positioning the acceptor substrate on the substrate stage inside the chamber, positioning the grounding electrode grounded in the chamber on the acceptor substrate The method may include: placing a donor film including at least a base layer, a light-to-heat conversion layer, and a transfer layer on an upper surface of the grounding electrode and an upper surface of the acceptor substrate; irradiating a laser beam on the donor film to transfer A method of manufacturing an organic light emitting display device comprising transferring at least a portion of a layer onto the acceptor substrate and separating the donor film from the acceptor substrate.

In another embodiment, positioning the grounding electrode grounded in the chamber on the acceptor substrate may include electrically connecting the grounding electrode to an edge of the acceptor substrate.

In another embodiment, the acceptor substrate may include a display unit provided at a center portion, a circuit unit provided at an edge portion of the display unit, and a margin portion provided at an edge of the acceptor substrate, such as the circuit unit. Positioning the grounding electrode grounded in the chamber on a acceptor substrate may include electrically connecting the grounding electrode to a margin provided at an edge of the acceptor substrate.

In another embodiment, the grounding electrode may be installed inside the chamber but grounded to the inner wall of the chamber through a line through which static electricity may flow.

In another embodiment, the method may further include attaching the donor film on the acceptor substrate after placing the donor film on the upper surface of the grounding electrode and the upper surface of the acceptor substrate.

According to the manufacturing apparatus and manufacturing method of the organic light emitting device according to the present invention, when the organic film is formed by a laser transfer method, the process of connecting the grounding electrode grounded in the chamber to the edge of the acceptor substrate and then proceed with the process Therefore, the static electricity generated during the process, for example, the static electricity generated in the process of bonding and separating the donor film and the acceptor substrate can flow into the chamber through this grounding electrode.

As a result, according to the manufacturing apparatus and the manufacturing method of the organic electroluminescent device of the present invention, it is possible to solve all the problems caused by static electricity in advance.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments disclosed herein are being provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like numbers refer to like elements throughout.

2 is a cross-sectional view showing a preferred embodiment of the apparatus for manufacturing an organic light emitting device according to the present invention, Figure 3 is a plan view showing an embodiment of a substrate used in the manufacturing apparatus of the organic light emitting device according to the present invention.

2 and 3, an apparatus for manufacturing an organic light emitting display device according to a preferred embodiment of the present invention includes a chamber 110 in which a process of patterning an organic film by a laser transfer method is performed. The chamber 110 is formed of a conductive material and is installed to be grounded on the ground or the like. In addition, a process progress space 112 through which the process proceeds is provided in the chamber 110. Accordingly, the process, that is, the process of patterning the organic film by the laser transfer method, is performed in the process progress space 112.

In addition, the substrate stage 120 is installed below the process progress space 112 provided in the chamber 110. An acceptor substrate (90 in FIG. 4A, etc.) and a donor film (80 in FIG. 4C, etc.) to be bonded to the acceptor substrate 90 are mounted on the substrate stage 120.

In other words, a substrate seating portion 121 on which the acceptor substrate 90 is to be seated is provided at a central portion of the substrate stage 120, and an outer portion of the substrate seating portion 121, that is, of the substrate stage 120 is provided. An edge portion is provided with a film seating portion 122 on which the donor film 80 is to be seated. In this case, the substrate seating portion 121 is formed somewhat lower than the film seating portion 122. That is, the substrate stage 120 has a central portion and an edge portion formed stepwise, and both sides thereof are formed to be symmetrical with respect to the center thereof.

Outside the chamber 110, pumps for adsorbing the acceptor substrate 90 and the donor film 80 seated on the substrate stage 120 are installed on the substrate stage 120. In other words, the pumps may include a first vacuum pump 132 for adsorbing the acceptor substrate 90 seated on the substrate seating part 121 of the substrate stage 120 to the surface of the substrate seating part 121. The second vacuum pump 142 is configured to adsorb the donor film 80 mounted on the film seating part 122 of the substrate stage 120 to the surface of the film seating part 122.

Therefore, when the first vacuum pump 132 provides a vacuum to the substrate seating part 121 of the substrate stage 120 through the first pumping line 131 connected to the first vacuum pump 132, The acceptor substrate 90 seated on the substrate seating portion 121 is adsorbed onto the surface of the substrate seating portion 121 by the provided vacuum.

In addition, when the second vacuum pump 142 provides a vacuum to the film seating part 122 of the substrate stage 120 through the second pumping line 141 connected to the second vacuum pump 142, The donor film 80 seated on the film seating part 122 is adsorbed onto the surface of the film seating part 122 by the provided vacuum.

In addition, a laser oscillator 150 is installed above the chamber 110, that is, above the substrate stage 120. When the acceptor substrate 90 is seated on the substrate stage 120 and the donor film 80 is positioned on the acceptor substrate 90, the donor film 80 may be disposed. Serves to irradiate a laser beam onto the donor film 80 so that at least a portion of the is transferred onto the acceptor substrate 90. In an embodiment, when the donor film 80 includes a base layer, a light-to-heat conversion layer, and a transfer layer, the laser oscillator 150 may include at least a portion of the transfer layer provided in the donor film 80. Serves to irradiate a laser beam onto the donor film 80 so that the transfer is performed on the acceptor substrate 90 by heat generated by the laser beam.

On the other hand, the manufacturing apparatus of the organic light emitting device is grounded in the chamber 110, in the lamination process of the acceptor substrate 90 and the donor film 80 to be described later or in the process of separating from the bonding A grounding electrode 160 for flowing the generated static electricity to the chamber 110 is further provided. In this case, the grounding electrode 160 may be installed in the chamber 110 but grounded to the inner wall of the chamber 110 through a line 162 through which the static electricity may flow. In addition, the grounding electrode 160 may allow the static electricity generated in the bonding process of the acceptor substrate 90 and the donor film 80 to be separated from the bonding process to the chamber 110. It may be disposed between the acceptor substrate 90 and the donor film 80.

In addition, the grounding electrode 160 may be electrically connected to an edge of the acceptor substrate 90. In other words, as shown in FIG. 3, the acceptor substrate 90 used in the apparatus for manufacturing the organic light emitting display device includes a display unit 91 provided at the center portion, and both sides, edges, of the display unit 91. The circuit part 92 provided at the part and the margin part 93 provided at the edge of the substrate 90 like the circuit part 92, the grounding electrode 160 is formed of the substrate 90. It may be electrically connected to the margin 93 provided at the edge.

Hereinafter, a preferred embodiment of a method of manufacturing an organic light emitting display device according to the present invention will be described in detail with reference to FIGS. 4A to 5.

4A to 4F are views for explaining a method of manufacturing an organic light emitting diode using the apparatus for manufacturing an organic light emitting diode shown in FIG. 2, and FIG. 5 is a method of manufacturing an organic light emitting diode according to the present invention. A cross-sectional view showing a preferred embodiment of the.

4A to 5, in the method of manufacturing an organic light emitting display device according to the preferred embodiment of the present invention, as shown in FIG. 4A, the acceptor substrate 90 is disposed on the substrate stage 120 inside the chamber 110. Positioning step (S51). In this case, the acceptor substrate 90 may be seated on the substrate mounting part 121 provided on the substrate stage 120. In this case, the first vacuum pump 132 may provide a vacuum to the substrate seating part 121 through the first pumping line 131 connected thereto. Therefore, the acceptor substrate 90 may be adsorbed to the substrate seating portion 121 by a vacuum provided as described above.

Next, when the acceptor substrate 90 is positioned on the substrate stage 120, an operator or the like may use a robot arm (not shown) or the like as shown in FIG. 4B to form the chamber on the acceptor substrate 90. The grounding electrode 160 grounded at 110 is positioned (S52). In this case, a worker or the like may position the grounding electrode 160 on the acceptor substrate 90, and electrically connect the grounding electrode 160 to an edge of the acceptor substrate 90.

Next, when the grounding electrode 160 is positioned on the acceptor substrate 90, at least a base layer is disposed on the upper surface of the grounding electrode 160 and the upper surface of the acceptor substrate 90 as shown in FIG. 4C. , A donor film 80 having a light-to-heat conversion layer and a transfer layer is positioned (S53), and the positioned donor film 80 is rolled by a roller 70 or the like, as shown in FIG. 4D, thereby accepting the acceptor. It is laminated on the substrate 90 (S54).

Subsequently, when the donor film 80 is bonded onto the acceptor substrate 90, the laser oscillator 150 irradiates a laser beam onto the donor film 80 as illustrated in FIG. 4E to provide the donor film ( At least a portion of the transfer layer provided on the 80 is transferred onto the acceptor substrate 90 (S55).

Thereafter, when at least a portion of the transfer layer is transferred onto the acceptor substrate 90, an operator or the like may hold the donor film 80 using the hand or a donor substrate separation tool (not shown) as shown in FIG. 4F. When the donor film 80 is separated from the acceptor substrate 90 (S56), the acceptor substrate 90 is unloaded.

On the other hand, during the process of manufacturing the organic light emitting device through the above steps, the static electricity is generated between the donor film 80 and the acceptor substrate 90 or one side of the acceptor substrate 90, and the like. For example, in the process of bonding the donor film 80 on the acceptor substrate 90 using the roller 70 or the like, or in the process of separating the bonded donor film 80 from the acceptor substrate 90, or the like. Will generate static electricity.

At this time, in the conventional case, since there is no means for flowing the generated static electricity to the outside, various problems are caused, such as a short phenomenon occurring inside the device due to the generated static electricity. The grounding electrode 160 grounded in the chamber 110 is provided to flow static electricity generated in this way to the outside, and the grounding electrode 160 grounded in the chamber 110 is accepted on the acceptor substrate 90. Since the process is performed after being electrically connected to the edges, the static electricity generated during the process, for example, the donor film 80 and the acceptor substrate 90 are bonded to and separated from the ground. It can flow to the outside through the dragon electrode 160. As a result, according to the manufacturing apparatus and the manufacturing method of the organic electroluminescent device of the present invention, it is possible to solve all the problems caused by static electricity in advance.

In the above, the present invention has been described with reference to the illustrated exemplary embodiments, which are merely exemplary and will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. . Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

1A to 1C are diagrams for explaining an organic film pattern process by a laser transfer method.

2 is a cross-sectional view showing a preferred embodiment of the apparatus for manufacturing an organic light emitting display device according to the present invention.

3 is a plan view showing an embodiment of a substrate used in the apparatus for manufacturing an organic light emitting display device according to the present invention.

4A to 4F are diagrams for explaining a method of manufacturing an organic light emitting display device using the apparatus for manufacturing an organic light emitting display device shown in FIG. 2.

5 is a cross-sectional view showing a preferred embodiment of a method of manufacturing an organic light emitting display device according to the present invention.

Claims (10)

chamber; A substrate stage installed inside the chamber, the substrate stage having a donor film to be bonded to the acceptor substrate; And, And a grounding electrode which is grounded in the chamber and disposed between the acceptor substrate and the donor film. The method of claim 1, The grounding electrode is installed in the chamber, the manufacturing apparatus of the organic light emitting device, characterized in that grounded on the inner wall of the chamber through a line through which static electricity can flow. 3. The method of claim 2, And the grounding electrode is disposed to flow the static electricity generated in the process of bonding the acceptor substrate and the donor film or the process of separating from the bonding to the chamber. The method of claim 1, The grounding electrode is an apparatus for manufacturing an organic light emitting display device, characterized in that electrically connected to the acceptor substrate. The method of claim 1, The acceptor substrate includes a display unit provided at a center portion, a circuit unit provided at an edge portion of the display unit, and a margin portion provided at an edge of the acceptor substrate, such as the circuit unit. The grounding electrode is an apparatus for manufacturing an organic light emitting display device, characterized in that it is electrically connected to the margin provided on the edge of the acceptor substrate. Positioning the acceptor substrate on a substrate stage within the chamber; Positioning a grounding electrode grounded in the chamber on the acceptor substrate; Placing a donor film including at least a base layer, a light-to-heat conversion layer, and a transfer layer on an upper surface of the grounding electrode and an upper surface of the acceptor substrate; Irradiating a laser beam onto the donor film to transfer at least a portion of the transfer layer onto the acceptor substrate; And, The method of manufacturing an organic light emitting display device comprising the step of separating the donor film from the acceptor substrate. The method of claim 6, Positioning a grounding electrode grounded in the chamber on the acceptor substrate comprises electrically connecting the grounding electrode to an edge of the acceptor substrate. The method of claim 6, The acceptor substrate includes a display unit provided at a center portion, a circuit unit provided at an edge portion of the display unit, and a margin portion provided at an edge of the acceptor substrate, such as the circuit unit. The positioning of the grounding electrode grounded in the chamber on the acceptor substrate may include electrically connecting the grounding electrode to a margin provided at an edge of the acceptor substrate. Manufacturing method. The method of claim 6, The grounding electrode is installed in the chamber, but the manufacturing method of the organic light emitting device, characterized in that grounded on the inner wall of the chamber through a line through which static electricity can flow. The method of claim 6, And manufacturing the donor film on the upper surface of the grounding electrode and the upper surface of the acceptor substrate, and then bonding the donor film to the acceptor substrate. Way.

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