KR20110041920A - 엘이디 제조용 서셉터 및 그 제조방법 - Google Patents
엘이디 제조용 서셉터 및 그 제조방법 Download PDFInfo
- Publication number
- KR20110041920A KR20110041920A KR1020090098954A KR20090098954A KR20110041920A KR 20110041920 A KR20110041920 A KR 20110041920A KR 1020090098954 A KR1020090098954 A KR 1020090098954A KR 20090098954 A KR20090098954 A KR 20090098954A KR 20110041920 A KR20110041920 A KR 20110041920A
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- South Korea
- Prior art keywords
- manufacturing
- susceptor
- led
- inorganic polymer
- base plate
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (11)
- 내부 관로를 포함하는 베이스판과, 그 베이스판의 전면에 코팅된 SiC 코팅층을 포함하는 엘이디 제조용 서셉터에 있어서,상기 내부 관로에 코팅된 세라믹층을 더 포함하는 엘이디 제조용 서셉터.
- 제1항에 있어서,상기 세라믹층은,액상의 무기고분자를 도포한 후, 그 액상의 무기고분자를 세라믹으로 전환하여 된 것을 특징으로 하는 엘이디 제조용 서셉터.
- 제2항에 있어서,상기 액상의 무기고분자는 용매에 용해된 규소계 무기고분자인 것을 특징으로 하는 엘이디 제조용 서셉터.
- 제3항에 있어서,상기 규소계 무기고분자는,Polycarbosilane, polysilane, polysiloxane과 같은 SiC로 전환 가능한 규소계 무기고분자 중 선택된 하나 또는 둘 이상이 혼합된 것을 특징으로 하는 엘이디 제조용 서셉터.
- 제1항 내지 제4항 중 어느 한 항에 있어서,상기 베이스판은,그라파이트 또는 소결 SiC 재질인 것을 특징으로 하는 엘이디 제조용 서셉터.
- a) 내부 관로를 포함하는 베이스판을 준비하는 단계;b) 상기 베이스판에 SiC를 증착하여 SiC 코팅층을 형성하는 단계;c) 상기 b) 단계의 결과물에서 상기 내부 관로에 액상의 무기고분자를 주입하여 상기 내부 관로를 이루는 상기 베이스판에 도포하는 단계; 및d) 상기 도포된 액상의 무기고분자를 열처리하여 세라믹층으로 전환시키는 단계를 포함하는 엘이디 제조용 서셉터 제조방법.
- 제6항에 있어서,상기 b) 단계는,상기 a), c), d) 단계를 수행한 후에 실시될 수 있는 것을 특징으로 하는 엘이디 제조용 서셉터 제조방법.
- 제6항 또는 제7항에 있어서,상기 베이스판은 그라파이트 또는 소결 SiC인 것을 특징으로 하는 엘이디 제조용 서셉터 제조방법.
- 제6항 또는 제7항에 있어서,상기 액상의 무기고분자는 용매에 용해된 규소계 무기고분자이며, 상기 세라믹층은 SiC 재질인 것을 특징으로 하는 엘이디 제조용 서셉터 제조방법.
- 제9항에 있어서,상기 규소계 무기고분자는,Polycarbosilane, polysilane, polysiloxane과 같은 SiC로 전환 가능한 무기고분자 중 선택된 하나 또는 둘 이상이 혼합된 것을 특징으로 하는 엘이디 제조용 서셉터 제조방법.
- 제6항 또는 제7항에 있어서,상기 d) 단계는,승온속도를 5~30℃/hr로 하여, 상온에서부터 700~1500℃까지 가열하여, 상기 무기고분자를 상기 SiC 재질의 세라믹층으로 전환시키는 것을 특징으로 하는 엘이디 제조용 서셉터 제조방법.
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KR1020090098954A KR101100042B1 (ko) | 2009-10-16 | 2009-10-16 | 엘이디 제조용 서셉터 |
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KR1020090098954A KR101100042B1 (ko) | 2009-10-16 | 2009-10-16 | 엘이디 제조용 서셉터 |
Publications (2)
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KR20110041920A true KR20110041920A (ko) | 2011-04-22 |
KR101100042B1 KR101100042B1 (ko) | 2011-12-29 |
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KR1020090098954A KR101100042B1 (ko) | 2009-10-16 | 2009-10-16 | 엘이디 제조용 서셉터 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190109912A (ko) | 2018-03-19 | 2019-09-27 | 주식회사 카보넥스 | 하이브리드 코팅법을 이용한 그라파이트 모재의 코팅방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5004436B2 (ja) * | 2005-05-23 | 2012-08-22 | 東京エレクトロン株式会社 | 静電吸着電極および処理装置 |
KR100824273B1 (ko) * | 2006-11-17 | 2008-04-24 | 주식회사 티씨케이 | 표면에 세라믹이 코팅된 금속 및 그 제조방법 |
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- 2009-10-16 KR KR1020090098954A patent/KR101100042B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20190109912A (ko) | 2018-03-19 | 2019-09-27 | 주식회사 카보넥스 | 하이브리드 코팅법을 이용한 그라파이트 모재의 코팅방법 |
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