KR20110041014A

KR20110041014A - The method of manufacturing the heat sink with synthetic resin

Info

Publication number: KR20110041014A
Application number: KR1020090097997A
Authority: KR
Inventors: 이재오
Original assignee: 이재오
Priority date: 2009-10-15
Filing date: 2009-10-15
Publication date: 2011-04-21

Abstract

PURPOSE: A method for manufacturing a heat sink using a synthetic resin is provided to plate an injection-molded object by copper to form a small heat sink, thereby inexpensively manufacturing a small heat sink. CONSTITUTION: A synthetic resin uses a thermosetting resin. A plurality of through holes is punched on a frame which is injection-molded by a synthetic resin. A corrugation with a lot of convex-concave structures is formed on a fin or a partial plane. The surface of an injection-molded object is washed and dried. The injection-molded object is plated by copper. The thickness of the copper film gets thicker by an electroplating method.

Description

Heat sink manufacturing method using synthetic resin {The Method of Manufacturing the Heat Sink with Synthetic Resin}

The present invention relates to the manufacture of a heat sink for lowering the temperature of a heating element such as a semiconductor.

The production of heat sinks of a general type, which can be completed by extrusion molding, can be simply made at a relatively low price based on aluminum.

However, as illustrated in Fig. A, when a substantial part of the molding is removed by cutting or lathe work, such as a small heat sink having a special structure, the heat sink may not be manufactured at a low price. It can be almost impossible to work because the difficulty of the fin is very high due to breakage or deformation.

In consideration of such a case, the present invention relates to a method of manufacturing a heat sink having a special structure at a relatively low price at a relatively low price by plating copper with excellent thermal conductivity on an injection molded structure based on a synthetic resin.

The present invention has a large number of through holes on the heat sink, and each through hole is connected to the heat conduction disconnected portion due to the characteristics of the synthetic resin injected by plating the inside with copper, so as to be a path for heat conduction, and the uneven portion is designated. It has a feature of improving the heat dissipation efficiency by expanding the surface area as compared to the plane by configuring the call gate of the state.

Until now, there has been no heat sink manufactured by injection molding a synthetic resin as a base and plating copper or a thermally conductive metal on the surface thereof.

The present invention provides a method of utilizing the excellent thermal conductivity of copper in the manufacture of a heat sink.

More specifically, in the manufacture of heat sinks, which cannot be made only by metals such as aluminum, in the manufacture of heat sinks, a method of manufacturing a heat sink at a simple and low cost by injection molding a synthetic resin based on a substrate and then plating it with copper having excellent thermal conductivity. It is about.

The present invention is to manufacture a small heat sink with a special structure that is impossible in an extremely simple work process, such as to produce a heat sink by extruding and cutting aluminum, copper plated on the structure injected by the synthetic resin as a base material at a low price It is to provide a method of manufacturing.

The present invention provides a method of manufacturing a heat sink at a low cost by plating copper on a structure manufactured by injection molding a small heat sink having a special structure, which has been almost impossible to manufacture. The purpose is to enable free use.

The present invention manufactures a skeleton by injection molding a structure having a large number of through holes and a colloid with a large number of irregularities per fin based on a synthetic resin for the production of a special small heat sink having a complicated structure. , And its surface is plated with copper, and through-holes are plated with copper in the plating process to form a heat conduction path disconnected with synthetic resin, thereby providing a method of manufacturing a heat sink maximizing the thermal conductivity of copper. .

The present invention is a compact with a special structure at a low price through a very simple process of plating a small heat sink with a special structure that was almost impossible to manufacture at a simple operation process and low price by plating with copper on the injection molding based on synthetic resin Allows the manufacture of heat sinks.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

Fig. A shows an example of a small heat sink having a special structure and shows a top view and a longitudinal section, respectively.

In order to manufacture a small heat sink having a special structure by the conventional method, aluminum having a structure as shown in Fig.-B must be extruded, but the difficulty of the extrusion pin is extremely high and the extrusion mold is difficult to withstand because the fin is thin and long. It is almost impossible because it becomes a problem.

In addition, an extrusion molded product such as FIG.-B was manufactured. In order to process a hard-work like FIG.-A, as shown in FIG. In addition, extremely high working difficulty is a serious problem, such as accompanied by breakage and deformation in the lathe work process, and the work becomes almost impossible.

The present invention will be described with reference to the drawings a method for manufacturing a heat sink in an extremely simple process by avoiding such a nearly impossible manufacturing process.

FIG. 1 is a top view of an extruded heat sink based on aluminum, and FIG. 2 is a cross-sectional view of a heat sink having an extremely simple structure. FIG. The same method cannot be used.

3 and 4 are injection molded skeletons based on the synthetic resin according to the present invention, and illustrate top and cross-sectional views, respectively.

Synthetic resins used in this work process are basically suitable for thermosetting resins such as ABS, and thermoplastic resins such as polyethylene are not suitable because they can be deformed by heat.

A large number of through holes (a) is perforated in the skeleton that is injection molded based on the synthetic resin, and a fin (b) and a colloid (c) having a large number of uneven structures in part of the flat portion are formed. have. Through-hole (a) is to fill the copper with copper in the process of plating the heat conduction disconnected by the synthetic resin to have a passage function of the heat conduction, the uneven structure of the corrugation (c) is to expand the surface area to increase the heat dissipation area will be.

5 and 6 illustrate plating of copper with the injection molding illustrated in FIGS. 3 and 4 as skeletons, respectively, showing top and cross-sectional views, respectively.

The copper plating work process involves washing and drying the surface of the injection molding based on the synthetic resin as illustrated in Figs. 3 and 4, and then depositing copper foil (g) by first depositing it on chemical copper (liquid copper). The copper plating is further performed by electroplating to increase the thickness of the copper foil g. The work of copper foil is divided into primary and secondary because synthetic resin cannot be electroplated directly.

In this work process, the call gage (c) of the copper foil (g) is made according to the call gage (c) formed in the injection molding, and the heat conduction path connecting the upper and lower surfaces by plating the through hole (f). Since it is formed, it is necessary to check whether the copper foil is coated in the through hole f during the operation of the primary copper foil.

It should be noted that the larger size of the through hole (a) is smaller than that of the small one, so that the copper foil (g) is easily coated during the operation of the primary copper foil, and the smaller the size of the through hole (a), the smaller the primary copper foil Attention should be paid to the possibility of defects in the work of

7 and 8 illustrate partially enlarged views of FIGS. 5 and 6, and FIG. 7 illustrates a case in which there is no through hole a, and FIG. 8 illustrates a case where there is a through hole f. to be.

In Fig. 7, the heating element h is attached to the upper copper foil d so that the heat of the heating element h is conducted to the upper copper foil d, but when the synthetic resin conducts heat conduction, it blocks in the direction of the copper foil e. In e), since the heat of the heating element h cannot be conducted, it can be seen that the heat dissipation effect by the lower surface copper foil e cannot be expected at all.

In Fig. 8, the heat of the heating element h attached to the upper surface copper foil d is transferred to the upper surface copper foil d and is also transmitted to the lower surface copper foil e through the through hole f filled with copper. e) also contributes to the heat dissipation effect.

Since a large number of collegations (c) formed in each fin (b) and a part of the lower surface copper (e) expand the surface area relative to the plane, the heat dissipation effect is increased as much as it is expanded.

Fig. A-A illustration of a small heat sink having a special shape

Fig. -B Extruded aluminum structure of a small heat sink having a special shape

Fig. C-Example of cutting of small heat sink with special shape

Fig. 1: Front view of the aluminum heat sink

Figure 2: Cross-sectional view of the aluminum heat sink

Figure 3: Illustrative diagram of a structure injection molded on the basis of the synthetic resin of the present invention

4 is a cross-sectional view of a structure injection molded on the basis of the synthetic resin of the present invention

Figure 5: Illustrative diagram of plating the injection-molded structure based on the synthetic resin of the present invention with copper

6 is a cross-sectional view of a structure in which a synthetic resin of the present invention is injection molded and plated with copper

7 is an exemplary view of the case where there is no through hole in a structure coated with a copper-plated structure by injection molding the synthetic resin of the present invention.

8 is an exemplary view of a case where a through-hole is present in a structure which is injection molded and plated with copper based on the synthetic resin of the present invention.

a: through hole

b: fin

c: callagation

d: top copper foil of heat sink (heating element attachment surface)

e: copper foil of lower surface of heat sink

f: Through hole filled with copper foil

g: copper foil

h: heating element

Claims

Method for producing a heat sink plate coated with a copper foil (g) with chemical copper (liquid copper) on a structure molded by injection molding on the basis of synthetic resin as in the present invention, or with a thermally conductive metal including copper

Method for producing a heat sink with a through hole (f) using both sides of the heat sink as a heat transfer path filled with a thermal conductive metal by plating to increase the heat dissipation effect as in the present invention