KR20110027991A

KR20110027991A - Led lighting module

Info

Publication number: KR20110027991A
Application number: KR1020090085868A
Authority: KR
Inventors: 김성남
Original assignee: (주)아스트로닉
Priority date: 2009-09-11
Filing date: 2009-09-11
Publication date: 2011-03-17

Abstract

In the present invention, unlike the LED lighting module manufactured by the conventional lead frame method, the LED die chip is connected to the circuit of the ceramic substrate by performing die bonding and wire bonding, and the thermosetting in the state filled with the liquid epoxy mixture on the wire bonding The present invention relates to an LED integrated lighting module which is mounted on a heat sink after processing packaging.

LED, lighting, street lamp

Description

LED integrated lighting module {LED LIGHTING MODULE}

The present invention, unlike the LED lighting module manufactured by the conventional lead frame method, after the LED die chip is integrated and die-bonded, the wire bonding work, and the LED integrated lighting module made by molding in a liquid epoxy mixture filled state It is about.

Other lighting products such as street lamps and factories that use LED lighting modules are a part of the semiconductor component industry, and are solid surface emitting light sources differentiated from conventional glass bulb filament-type lighting sources. As a small surface light source using LED chip, the LED light source can be used for a long time, so it can be trusted up to 80,000 hours without changing environment and artificial physical impact. It is the best advantage that can be greatly reduced.

In addition, the LED lighting module is a natural environment-friendly lighting product because it does not use mercury and discharge harmful gases such as fluorescent lamps and sodium lamps, and is separated when mercury, high power factor, CO2 generation, and product life ends. In addition to the advantages that can be recycled through collection, high-efficiency light output is possible, so the world is focusing on technology development as a next-generation light source.

The present invention can smoothly dissipate heat generated from the LED die chip to minimize damage of the LED element, minimize the short circuit of the wire due to overcurrent, and furthermore, LED integration module even if any wire is shorted by the overcurrent The purpose is to provide an LED integrated lighting module having a structure that can be driven as well as miniaturized.

LED integrated lighting module of the present invention for achieving the object of the present invention comprises a ceramic substrate with a circuit for supplying electricity; An integrated array and a plurality of die-bonded LED die chips are connected in series with each other by two wires, and the LED die chips at the ends of the series connection (s) and the circuit of the ceramic substrate are connected by two wires to establish electrical connection. Wire bonding to enable; A molding resin layer formed by curing liquid epoxy on the wire bonding to form chip packing; And a metal substrate bonded to the bottom of the ceramic substrate to dissipate heat generated by light emission of the LED die chip.

LED integrated lighting module of the present invention for achieving the object of the present invention comprises a ceramic substrate with a circuit for supplying electricity; An integrated array and die-bonded LED die chip and each of the integrated array and die-bonded die pad are serially connected, and an LED die chip or die pad at the end of the serial connection (s) and a circuit of the ceramic substrate are wired. Wire bonding to enable electrical connection; A molding resin layer formed by curing liquid epoxy on the wire bonding and forming chip packing; And a metal substrate bonded to a bottom surface of the ceramic substrate to perform heat dissipation, and a wire bonding connection is made by two wires between the one LED die chip and the one die pad, respectively. A linear contact point corresponding to a predetermined distance from each other is formed on the LED die chip upper surface.

LED integrated lighting module of the present invention can smoothly discharge the heat generated from the LED element to minimize the damage of the LED element, minimize the short circuit of the wire due to overcurrent, and even if any wire is shorted by the overcurrent Not only can the LED element be driven, but also it can be miniaturized.

Hereinafter, the LED integrated illumination module of the present invention will be described in more detail with reference to Examples. The scope of the present invention is not limited to the following Examples.

1 is a view showing the LED integrated lighting module of the first embodiment of the present invention, Figure 2 is a view showing the LED integrated lighting module is removed the heat sink of the first embodiment, Figure 3 is a die bonding of the first embodiment LED die chips are shown in a wire bonded state.

In the LED integrated illumination module 10 of the present invention, as shown in Figs. 1 to 3, the ceramic substrate 20 with a circuit for supplying electricity and a plurality of integrated die and die-bonded LED die chip 30, respectively The LED die chip at the end of the serial connection (s) forms a series connection by a pair of wires 80 and includes wire bonding which is electrically connected to the ceramic substrate circuits 20a and 20b by a pair of wires. In the embodiment shown in FIG. 3, the LED die chip 30 has two pairs of linear contacts (a pair of linear contacts are spaced apart from each other at regular intervals and interdigitated corrugated linear contacts) to form each pair (+ ) And (-) contact wire. A molding resin layer 50 is formed on the wire bonding by molding and curing the liquid by epoxy injection and hardening to form chip packing. The LED die chip 30 emits light on the bottom surface of the ceramic substrate 20. A metal substrate 70 is bonded to dissipate heat generated by the metal substrate 70, and the metal substrate 70 is bonded to the heat sink 90, and the heat sink is externally heat-exchanged by heat and heat from the light emitted from the lighting module. To emit.

In FIG. 1 and FIG. 2, 1W-class SMD LEDs were used as the plurality of LED die chips 30, and were densified and arranged by die bonding in three columns of 10 columns. The plurality of LED die chips 30 were wires 80. And form a series connection, and are electrically connected to the ceramic substrate 20 in which the circuit is embedded. Also, as shown in FIG. 2 (or FIG. 5), the LED die chips of the serially connected ends are connected to circuits exposed to the inner edge of the ceramic substrate (in the FIG. 2, the "A" or "B" of the inner edge of the ceramic substrate) 20a and 20b. Are connected by wires.

In addition, the molding resin layer 50 is formed on the wire bonding in a state in which the plurality of LED die chips 30 are integrated and wire-bonded, thereby waterproofing and lightening the product.

The molding resin forming the molding resin layer 50 is a liquid epoxy resin is cured, the molding resin is a mixture of a curing agent and a light emitting material.

The metal substrate 70 is for smoothly transferring heat generated by the driving of the plurality of LED die chips 30 to the heat sink 90, and preferably made of a metal having excellent thermal conductivity such as aluminum. The ceramic substrate 20 is adhered to an upper surface.

A groove (not shown) is provided on an upper surface of the heat sink 90, and the metal substrate 70 is inserted into and adhered to the groove. Therefore, as the heat generated by the driving of the plurality of LED die chips 30 is transferred to the heat sink 90 through the metal substrate 70, heat exchange with the outside air is smoothly performed, so that the plurality of LED die chips 30 is formed. Damage to the LED die chip 30 may be minimized due to the heat generated by the light emission.

4 is a diagram illustrating an LED integrated illumination module according to a second embodiment of the present invention, illustrating a state in which a plurality of LED die chips and die pads formed between each LED die chip are electrically connected by two wires, respectively. 5 is an enlarged view of a portion of FIG. 4.

As shown in FIG. 4, the LED integrated illumination module 100 of the second embodiment includes two wires each having one LED die chip and one die pad for the integrated array and die-bonded LED die chip and the die pad 310. 4 are connected in series by wire bonding, and as shown in FIG. 4, an LED die chip or a die pad of each STRING end is wire-connected to a circuit contact exposed in a letter or b shape at the inner edge of the ceramic substrate. The entire LED die chip and die pad are energized.

Of the two pairs of spaced apart electrical contacts (refer to FIG. 3) formed on the surface of the one LED die chip 300, two wires 800 having two wires having the same polarity and one die pad 310 adjacent thereto are connected to two wires 800. By electrically connecting the wires by wire bonding, the short circuit of the wire 800 due to overcurrent can be minimized (single wire current can be reduced), and even if one wire 800 is shorted by the overcurrent, the other wire 800 can be shorted. Thereby, there is an advantage that the integrated LED die chip 300 can still be driven as it is electrically connected to the die pad.

The LED integrated illumination module of the present invention can be densely integrated with a plurality of LED die chips, and can effectively dissipate heat generated from light emission of the plurality of LED die chips, thereby minimizing damage to the LED die chips. It can be miniaturized and can be widely used for street lights, factories, and the like.

1 is a view showing an LED integrated lighting module which is an embodiment of the present invention.

2 is a view showing the LED integrated illumination module with the heat sink removed.

3 is a diagram illustrating a state in which wires are bonded between an integrated array and a die-bonded LED die chip.

4 is a diagram showing an integrated arrangement and a die-bonded LED die chip and one die pad formed therebetween are electrically connected by two wires.

5 is an enlarged view of a portion of FIG. 4;

Claims

A ceramic substrate having a circuit for supplying electricity;

An integrated array and a plurality of die-bonded LED die chips are connected in series with each other by two wires, and the LED die chips at the ends of the series connection (s) and the circuit of the ceramic substrate are connected by two wires to establish electrical connection. Wire bonding to enable;

A molding resin layer formed by curing liquid epoxy on the wire bonding to form chip packing; And

And a metal substrate bonded to the bottom surface of the ceramic substrate to dissipate heat generated by light emission of the LED die chip.

A ceramic substrate having a circuit for supplying electricity;

An integrated array and die-bonded LED die chip and each of the integrated array and die-bonded die pad are serially connected, and an LED die chip or die pad at the end of the serial connection (s) and a circuit of the ceramic substrate are connected by wire. Wire bonding to enable electrical connection;

A molding resin layer formed by curing liquid epoxy on the wire bonding and forming chip packing;

And a metal substrate bonded to a bottom surface of the ceramic substrate to perform heat dissipation, and an LED integrated lighting device comprising wire bonding connection between two LED die chips and one die pad by two wires, respectively. module.

The LED integrated lighting module according to claim 1 or 2, wherein linear contact points corresponding to predetermined intervals are formed on the upper surface of the LED die chip.