KR20110024816A - A phosensitive resin composition - Google Patents

Abstract

PURPOSE: A photosensitive resin composition is provided to improve the chemical-resistivity and the heat-resistivity by introducing a multifunctional acrylic monomer in a specific structure with a carboxylic group and a multifunctional acrylic compound in a specific structure without the carboxylic group. CONSTITUTION: A photosensitive resin composition includes an alkaline soluble copolymer, a photo-polymerization compound, a photo-polymerization initiator, a compound represented by chemical formula 1, and a solvent. In chemical formula 1, A represents a group represented by chemical formula 2, Y represents a group represented by chemical formula 2 or chemical formula 3, and R represents C1-C4 alkylene group, benzylene group, or cyclohexylene group.

Description

Photosensitive resin composition {A PHOSENSITIVE RESIN COMPOSITION}

The present invention relates to a photosensitive resin composition.

Silicon substrates and glass substrates are used in the manufacturing process of flat panel display devices and semiconductor devices. Such a substrate is deposited with a metal film, a nonmetal film, an insulating film and the like depending on the use. Deposition of such films may use methods such as CVD, sputtering, vacuum deposition, and the like. The photoresist composition is applied onto this film to form a pattern. The formed photoresist pattern is used, for example, as an etch protective film (mask), and a fine concavo-convex pattern is formed on the substrate having the photoresist pattern by dry etching or wet etching.

In the etching method, adhesion between the photoresist composition to be applied and the substrate is important. This is because, if these adhesiveness is not good, the pattern collapses or peels off. When such a phenomenon occurs, problems such as cutting or shorting of the wiring occur in the wiring formed by etching, which causes a decrease in product yield in the mass production process.

In order to improve the adhesiveness of such a photoresist composition and a board | substrate, it is known to add the conventional adhesive improvement agent to a photoresist composition. However, the storage stability and adhesion of the photoresist composition still need to be improved.

On the other hand, TFT-LCD (Thin Film Transistor Liquid Crystal Display), one of the flat panel display devices, is formed by bonding a glass substrate on which a TFT-array is formed and a glass substrate on which a color filter is formed. It refers to displaying by injecting an electric signal after forming a panel by injecting a liquid crystal between the glass substrate of the chapter. Since the LCD panel does not actively emit light, a separate light source capable of emitting light is required. This is called back-light.

It is particularly important for TFT-LCDs to achieve low power consumption and high brightness. The low power consumption can be divided into driving circuit technology, back light source technology and panel technology. Panel related techniques require an increase in the transmission efficiency of the polarizing plate, an improvement in the transmittance of the color filter, an opening ratio of the TFT-array, that is, an increase in the area through which light passes. Opening ratio refers to the ratio of open or transparent portions to the total surface area.

The recent results for TFT-LCD are focused on the improvement of optical reagent angle and pixel aperture ratio, and the high aperture ratio realizes high brightness to reduce power consumption of the back light source. To date, research has been carried out to obtain an aperture ratio of 80% or more, and most of them are based on the black matrix on TFT-array concept.

Currently, various designs and process developments have been made to achieve low power consumption and high brightness through increasing aperture ratio. To this end, the first generation technology required expensive vacuum equipment such as plasma enhanced chemical vapor deposition (PECVD) and dry etching equipment (Dry etcher) to form a silicon nitride film (SiNx) as a protective layer. However, from the second generation technology using the organic insulating layer as a protective layer, the process can be performed without vacuum equipment, which reduces equipment investment costs, reduces the number of process steps, and decreases the clean room area. It became possible.

However, the adhesion between the organic insulating film and the source / drain electrodes of the thin film transistor is not excellent, resulting in a phenomenon that the organic insulating film is peeled off.

An object of the present invention is to provide a photosensitive resin composition for remarkably improving adhesion with a substrate on which a metal is deposited.

An object of the present invention is to provide a photosensitive resin composition for a photoreactive organic insulating film by improving the sensitivity, heat resistance, chemical resistance, adhesion, and the like and improving electrical properties.

SUMMARY OF THE INVENTION An object of the present invention is to provide a photosensitive resin composition for a photosensitive organic insulating film which is highly sensitive in a photolithography process and has a high developing residual film ratio and excellent pattern formation and is excellent in etching property and light transmittance.

The present invention (A) an alkali-soluble copolymer; (B) photopolymerizable compounds; (C) photoinitiator; (D) a compound represented by the following formula (1); And (E) a solvent, to provide a photosensitive resin composition.

<Formula 1>

In Chemical Formula 1,

A is a group represented by the following formula (2),

Y is a group represented by the following formula (2) or (3),

R is a C ₁ to C ₄ alkylene group, benzylene group or cyclohexylene group.

<Formula 2>

<Formula 3>

The photosensitive resin composition of this invention introduce | transduces the polyfunctional acryl monomer of the specific structure which has a carboxyl group, or the polyfunctional acryl compound of the specific structure which does not have a carboxyl group, and improves high sensitivity, heat resistance, chemical resistance, adhesiveness, etc. In addition, the present invention can be widely applied to H, G, I-ray photoresists, resists for liquid crystal display devices, and the like.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

1. Photosensitive Resin Composition

The (A) alkali-soluble copolymer contained in the photosensitive resin composition of the present invention is preferably included in 20 to 60% by weight, more preferably 30 to 50% by weight based on the total weight of the composition. When included in the above-mentioned range, there is an advantage that the permeability is excellent and has a moderate solubility in aqueous alkali solution. In addition, there is an advantage of having an excellent residual film ratio and easy pattern formation.

It is preferable that the said (A) alkali-soluble copolymer is a copolymer containing the monomer ii) the monomer containing a carboxyl group and (iii) the monomer containing an oxetane group iv) in the main chain. X) mole fraction of the monomer represented by the following formula (4), ii) mole fraction of the monomer containing a carboxyl group y and iv) mole fraction of the monomer containing an oxetane group is z, x + y + z = 1 x is preferably 25 to 45%, y is 20 to 40%, and z is 35 to 55%.

Iii) The monomer represented by the following formula (4) serves to improve the heat resistance of the photoresist composition of the present invention.

<Formula 4>

In Chemical Formula 4,

R ₆ represents hydrogen or a C ₃ to C ₁₀ ring compound.

Although the monomer which has said ii) carboxyl group is not specifically limited, It is preferable that it is 1 type, or 2 or more types chosen from the group which consists of unsaturated monocarboxylic acid and unsaturated polycarboxylic acid which are unsaturated carboxylic acid containing 1 or more carboxyl group in a molecule | numerator. Do. Specific examples of the unsaturated monocarboxylic acid and unsaturated dicarboxylic acid include (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, and the like. Such monomers are compounds having a carbon-carbon unsaturated bond, of which (meth) acrylic acid monomers are preferably used. In the present invention, "(meth) acryl" means "methacryl" or "acryl".

It is preferable that the monomer which has said ii) carboxyl group is a monomer represented by following formula (5).

<Formula 5>

In Formula 5,

R ₇ is hydrogen or a methyl group.

Although the monomer which has said iii) oxetane group is not specifically limited, It is preferable that it is an unsaturated oxetane carboxylate monomer. The unsaturated oxetane carboxylate monomers are 3-methyl-3acryloxy methyl oxetane, 3-methyl-3-methacryloxy methyl oxetane, 3-ethyl-3-acryloxy methyl oxetane, 3-ethyl-3 -Methacryloxy methyl oxetane, 3-methyl-3-acryloxy ethyl oxetane, 3-methyl-3-methacryloxy ethyl oxetane, 3-methyl-3-acryloxy ethyl oxetane and 3-methyl- It may be one or two or more selected from the group consisting of 3-methacryloxy ethyl oxetane.

It is preferable that the monomer which has said (iii) oxetane group is a monomer represented by General formula (6).

<Formula 6>

In Formula 6,

R ₈ is an alkyl group of C ₁ to group the indoor cetyl (oxetyl) substituted or unsubstituted C ₅ to a C ₁ to C _5, R ₉ is hydrogen or a methyl group.

The alkyl group of the substituted or unsubstituted C ₁ to jade cetyl ring with an alkyl group of C ₅ (oxetyl) C ₁ to C ₅ is (3-methyl-oxetane-3-yl) methyl, (3-ethyl oxetane-3 1) methyl, (3-methyloxetan-3-yl) propyl, and the like.

The (A) alkali-soluble copolymer may include various iii) other monomers in addition to the monomers described above. In particular, a monomer having a carbon-carbon unsaturated bond and copolymerizable with the monomer having the carboxyl group is preferable. Iii) the other monomer is selected from the group consisting of aromatic vinyl compounds, unsaturated carboxylate compounds, unsaturated aminoalkyl carboxylate compounds, unsaturated glycidyl carboxylate compounds, vinyl carboxylate compounds and vinyl cyanide compounds It is preferable that it is a species or 2 or more types.

Specific examples of the vinyl compound include styrene, α-methylstyrene, vinyltoluene, and the like. Specific examples of the unsaturated carboxylate compound include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl Methacrylate, benzyl acrylate, benzyl methacrylate, and the like. Specific examples of the unsaturated aminoalkyl carboxylate compound include aminoethyl acrylate and the like. Specific examples of the unsaturated glycidyl carboxylate compound include glycidyl methacrylate. Specific examples of the vinyl carboxylate compound include vinyl acetate, vinyl propionate, and the like. Specific examples of the vinyl cyanide compound include acrylonitrile, methacrylonitrile, α-chloroacrylonitrile and the like.

In the present invention, the (A) alkali-soluble copolymer is preferably a copolymer represented by the following Structural Formula 1. At this time, each monomer of the following structural formula 1 is not limited to the following structural formula 1 may be located at random. In addition, all the variables described in Structural Formula 1 are the same as the variables of Chemical Formulas 4 to 6.

<Structure 1>

The photopolymerizable compound (B) contained in the photosensitive resin composition of this invention produces | generates a radical by a photoinitiator, and is activated by light. The photopolymerizable compound (B) acts as a crosslinking agent so as to work together with the acrylic polymer so that the coating film can be hardened by forming a net structure. Such compounds may be monofunctional photopolymerizable compounds, bifunctional photopolymerizable compounds, or multifunctional photopolymerizable compounds that are trifunctional or higher.

The photopolymerizable compound (B) is preferably included in 2 to 10% by weight based on the total weight of the composition. If it is contained in the above-mentioned range, there exists an advantage that the hardening degree and the resolution of the coating film formed from the photosensitive resin composition of this invention are excellent.

Although the (B) photopolymerizable compound is not particularly limited, tris-2-hydroxyethylisocyanate, trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate ( ditrimethylolpropanetetraacrylate), trimethylolpropane trimethacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate selected from the group consisting of one or two or more selected from the group consisting of: desirable.

(C) The photoinitiator contained in the photosensitive resin composition of this invention has preferable 0.5-3 weight% with respect to the total weight of a composition. When included in the above range, the tearing of the pattern does not occur, it is possible to form an excellent pattern.

The (C) photopolymerization initiators include acetophenone photopolymerization initiators, benzoin photopolymerization initiators, benzophenone photopolymerization initiators, thioxanthone photopolymerization initiators, triazine photopolymerization initiators, and the like. It is preferable that these photoinitiators are respectively independent or 2 types or more.

The acetophenone photopolymerization initiator is, for example, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-2-methyl-1- [2 -(2-hydroxyethoxy) phenyl] propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholino-1- (4-methylthiophenyl) propan-1-one , 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one and 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propane- 1-one oligomer, 2-methyl-1- (4-methylthiophenyl) -2-monopolynopropanol-1, 2-benzyl-2-dimethylamine-1- (4-monopolynophenyl) -butanol-1 , 2- (dimethylamine) -2-[(4-methylphenyl) methyl]]-1- [4- (4-monoholinyl) phenyl] -1-butanol, and the like. Examples of the benzoin-based photopolymerization initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and the like. Examples of the benzophenone-based photopolymerization initiator are benzophenone, methyl o-benzoyl benzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3 ', 4,4'-tetra (t -Butyl peroxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like. Examples of the thioxanthone photopolymerization initiator include 2-isopropyl thioxanthone, 4-isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-dichloro thioxanthone, 1-chloro-4- Propoxythioxanthone and the like. Examples of the triazine photoinitiator include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6 -(4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4-bis (Trichloromethyl) -6- (4-methoxystyryl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (5-methylfuran-2- Yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine , 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl ) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine and the like.

(D) The compound represented by following formula (1) contained in the photosensitive resin composition of this invention contains the polyfunctional acryl monomer of the specific structure which has a carboxyl group, or the polyfunctional acryl monomer of the specific structure which does not have a carboxyl group.

<Formula 1>

In Chemical Formula 1,

A is a group represented by the following formula (2),

Y is a group represented by the following formula (2) or (3),

R is a C ₁ to C ₄ alkylene group, benzylene group or cyclohexylene group.

<Formula 2>

<Formula 3>

When the photosensitive resin composition of the present invention forms a pattern, the compound represented by Formula (D) 1 has high resolution, high sensitivity, and wide margin, and has good adhesiveness and few residues. This property appears because the carboxyl group added to the compound represented by the formula (D) 1 increases the solubility in the alkaline developer.

The compound represented by Formula (D) 1 is preferably included in 1 to 20% by weight based on the total weight of the composition. If the above-mentioned range is satisfied, the scum decreases but the sagging problem does not occur, thereby obtaining an excellent pattern.

The solvent (E) contained in the photosensitive resin composition of this invention can be adjusted according to the thickness of a desired coating film. The balance is included so that the total weight of the composition is 100% by weight.

The solvent (E) is not limited as long as it can dissolve the above-mentioned components into a solution form. The solvent (E) is preferably evaporated at an appropriate drying rate to provide a uniform, flat coating film.

The solvent (E) may be a known solvent used for the photosensitive resin composition, and may include a ketone solvent, a cellosolve solvent, an ether solvent, an ester solvent, a propylene glycol monoalkyl ether acetate solvent, and a lactic acid ester solvent. And it is preferable that it is 1 type, or 2 or more types chosen from the group which consists of aromatic hydrocarbons solvent.

Specific examples of the ketone solvents include acetone, methyl ethyl ketone, cyclopentanone, cyclohexanone, and the like. Specific examples of the cellosolve solvents include methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, and the like. Specific examples of the ether solvent include tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, ethylene glycol monomethyl ether, and the like. Specific examples of the ester solvent include ethylene glycol monoethyl ester, acetate ethylene glycol monoethyl ester, and the like. Specific examples of the propylene glycol monoalkyl ether acetate solvents include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and the like. Specific examples of the lactic acid ester solvent include methyl lactate, ethyl lactate, and the like. Specific examples of the aromatic hydrocarbon solvent include toluene, xylene and the like.

The photosensitive resin composition of this invention can further contain the (F) additive. As said additive, surfactant, an adhesion promoter, etc. are mentioned, for example.

As the surfactant, a silicone surfactant, a fluorine-based surfactant, a silicon surfactant containing a fluorine atom, and the like may be used. It is more preferable to use a silicone surfactant among these.

The silicone surfactant is preferably used at 0.01 to 0.5% by weight based on the total weight of the composition.

Specific examples of the silicone surfactant include Gido Toshiba Silicone Co., Ltd., product names TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, TSF4460; Shin-Etsu Silicone Co., Ltd. make, brand names KP321, KP322, KP323, KP324, KP326, Kp340, and KP341; Manufactured by Tresilicon Co., Ltd., trade name SH-8400; And BYK-Chemie, trade names BYK-333, 358N and UV3500, 390, 306, 340, and the like.

Examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N -(2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltri Methoxysilane, etc. are mentioned.

2. Pattern Forming Method Using Photosensitive Resin Composition

The photosensitive resin composition of this invention is apply | coated on a board | substrate, and a coating film is formed. The coating method can be carried out by conventional methods including dipping, spraying, spinning and spin coating.

The substrate is a silicon or glass substrate; A substrate on which aluminum, tantalum, copper or bilayers thereof are formed; A substrate on which an insulating film such as a silicon nitride film or a silicon oxide film is formed; It may be a substrate on which an amorphous silicon layer or polycrystalline silicon is formed, or a substrate on which a thin film transistor is formed. Here, when the substrate is a substrate on which a thin film transistor is formed, that is, in the active flat panel display device, the photoresist composition of the present invention may be used as an organic insulating layer.

The coating film may be roasted at a temperature of 20 ° C to 100 ° C. The roasting is performed to evaporate the solvent without pyrolyzing the solid component in the photosensitive resin composition. In general, it is preferable to minimize the concentration of the solvent through the roasting process, and thus, the treatment is performed until most of the solvent is evaporated so that a thin coating film of the photosensitive resin composition remains on the substrate.

Subsequently, the substrate on which the coating film is formed is selectively exposed to light, particularly ultraviolet rays, using a suitable mask or template.

The substrate including the exposed coating film is sufficiently immersed in the alkaline developing aqueous solution, and then left until all or almost all of the photoresist film in the portion exposed to light or the non-exposed portion is dissolved. Although it does not specifically limit as said alkaline developing aqueous solution, The aqueous solution containing alkaline hydroxide, ammonium hydroxide, or tetramethylammonium hydroxide (TMAH) can be used.

After the exposed or unexposed portions are dissolved and removed, the substrate on which the pattern is formed is taken out of the developer, and a post-bending process may be performed to enhance adhesion and chemical resistance of the coating film. The baking process is preferably performed at a temperature below the softening point of the coating film, and may be preferably performed at a temperature of about 100 to 150 ° C.

Subsequently, the substrate on which the pattern is formed is etched using wet etching using an etching solution or dry etching using a gas plasma. At this time, the substrate located below the pattern is protected. After the substrate is treated in this manner, the pattern is completed on the substrate by removing the photosensitive resin pattern with an appropriate stripper.

Next, Examples and Comparative Examples of the present invention are described. However, these examples are only for illustrating the present invention in more detail, the present invention is not limited to these examples.

Examples 1 to 4 and Comparative Example 1: Preparation of Photosensitive Resin Composition

A photosensitive resin composition was prepared at the composition ratios shown in Table 1. The prepared composition was filtered using a 0.2 μm pore size filter.

Copolymer
(weight%) Photopolymerization
compound
(weight%) Photopolymerization initiator
(weight%) menstruum
(weight%) Compound represented by formula (1)
(weight%) Adhesion Promoter
(weight%) Example 1 A-1 40 B-1 3 C-1 0.75 D-1 / D-2 = 80/20 Balance E-1 0.5 F-1 0.1 Example 2 A-1 40 B-1 3 C-1 0.75 D-1 / D-2 = 80/20 Balance E-1 One F-1 0.1 Example 3 A-1 40 B-1 3 C-1 0.75 D-1 / D-2 = 80/20 Balance E-1 1.5 F-1 0.1 Example 4 A-1 40 B-1 3 C-1 0.75 D-1 / D-2 = 80/20 Balance E-1 2.5 F-1 0.1 Comparative Example 1 A-1 40 B-1 3 C-1 0.75 D-1 / D-2 = 80/20 Balance E-1 - F-1 0.1

A-1: copolymer of methacrylic acid, 1-cyclohexyl-1H-pyrrole-2,5-dione, and (3-ethyloxetan-3-yl) methyl methacrylate

B-1: tris-2-hydroxyethyl isocyanate triacrylate

C-1: 2- (dimethylamine) -2-[(4-methylphenyl) methyl] -1- [4- (4-monholinyl) phenyl] -1-butanol (trade name: IRGACURE 379, manufacturer: CIBA)

D-1: diethylene glycol methyl ethyl ether

D-2: ethyl lactate

E-1: Acid-modified dipentaerythritol hexaacrylate (trade name: TO-2348, manufacturer: Dong-A Synthesis, Japan)

F-1: Silane Coupling Agent (Brand Name: KBE-9007)

Test Example: Performance Evaluation of Photosensitive Resin Composition

The photosensitive resin compositions of Examples 1 to 4 and Comparative Example 1 were spin coated onto a wafer. The wafer to which the composition was applied was prebaked at 100 ° C. for 120 seconds on a hot plate to form a coating film having a thickness of 2.50 μm. The wafer on which the coating film was formed was exposed using the i-line stepper. The wafer on which the exposed coating film was formed was developed for 70 seconds in a 0.4 wt% tetramethyl ammonium hydroxide (TMAH) aqueous solution. Top view and cross section of the formed pattern were observed by scanning electron microscope. The results are shown in Table 2. In Table 2, the effective sensitivity refers to an exposure dose of which the line width size is matched in a line pattern of 3.0 µm.

Chemical resistance evaluation was performed by immersion methods for chemical liquids such as alkali resistance (5% sodium hydroxide aqueous solution), solvent resistance (NMP), and peeling resistance (PRS-2000). In the above chemical resistance evaluation, the protective film damage and the film thickness change before and after the evaluation were confirmed. The change in the film thickness was confirmed by the difference in the film thickness measurement before and after, and evaluated at the rate of decreasing the film thickness, but the following conditions were followed, and the results are shown in Table 2.

※ Change of film thickness (%) = [film thickness after heating / film thickness before heating] * 100

Adhesive evaluation performed the tape peeling test using JISK5400, and investigated the grade of the tearing of a grating | lattice.

Effectiveness
(mJ / cm ² ) Scum Pattern
Linearity Pattern
weeping Chemical resistance Adhesion
Example 1 62 ○ ○ ○ ○ ○ Example 2 58 ○ ◎ ◎ ○ ○○ Example 3 55 ◎ ◎ ◎ ○ ○○ Example 4 51 ◎ ○ ◎ ○ ○ Comparative Example 1 70 △ △ △ △ △

[Scum, pattern linearity & sagging]

◎: very good, ○: good, △: normal, ×: poor

[Chemical resistance]

○: 0 to 2%, Δ: 2 to 10%, ×: 10 to 100%

[Adhesiveness]

○ ○: 100% dot pattern

○: 70% or more and 85% or less dot pattern

(Triangle | delta): More than 50% and 70% or less of dot patterns exist

×: 50% or less dot pattern

From the results in Table 2, it can be seen that the physical properties of the pattern formed using the photosensitive resin composition into which the polyfunctional acrylic monomer having a specific structure having a carboxyl group or the polyfunctional acrylic compound having no carboxyl group were introduced.

Claims (5)

(A) an alkali soluble copolymer; (B) photopolymerizable compounds; (C) photoinitiator; (D) a compound represented by the following formula (1); And (E) A solvent containing the photosensitive resin composition characterized by the above-mentioned: <Formula 1>

In Chemical Formula 1, A is a group represented by the following formula (2), Y is a group represented by the following formula (2) or (3), R is a C ₁ to C ₄ alkylene group, benzylene group or cyclohexylene group. <Formula 2>

<Formula 3>

The method according to claim 1, Regarding the total weight of the composition, 20 to 60% by weight of the (A) copolymer; (B) 2 to 10% by weight of the photopolymerizable compound; 0.5 to 3% by weight of the photopolymerization initiator (C); 1 to 20% by weight of the compound represented by Formula (D) 1; And The (E) solvent residual amount is contained, The photosensitive resin composition characterized by the above-mentioned. The method according to claim 1, The photosensitive resin composition (A) is a copolymer containing a monomer represented by the following formula (4) in the main chain, ii) a monomer containing a carboxyl group, and iii) a monomer containing an oxetane group: <Formula 4>

In Chemical Formula 4, R ₆ represents hydrogen or a C ₃ to C ₁₀ ring compound. The method of claim 3, The monomer containing the ii) carboxyl group is represented by the following formula (5) photosensitive resin composition: <Formula 5>

In Formula 5, R ₇ is hydrogen or a methyl group. The method of claim 3, (Iii) The monomer containing an oxetane group is represented by the following general formula (6): <Formula 6>

In Formula 6, R ₈ is an alkyl group of C ₁ to group the indoor cetyl (oxetyl) substituted or unsubstituted C ₅ to a C ₁ to C _5, R ₉ is hydrogen or a methyl group.