KR20110013897A - Substrate supporting member, substrate polishing apparatus having the same and method for processing thereof - Google Patents

Abstract

PURPOSE: A substrate supporting unit, a substrate polishing apparatus including the same, and a method for processing the same are provided to verify the slip state of the substrate in real time by including a plurality of sensors detecting the edge part of the substrate. CONSTITUTION: A substrate(W) is fixed on the upper side of a spin head(122). A plurality of through holes is arranged on the edge part of the spin head. The spin head includes a plurality of supporting pins supporting the substrate. A rotary shaft rotates the spin head. A plurality of sensors(128) is installed at the lower side of the through holes and detects the edge part(WE) of the substrate through a through hole(126).

Description

SUBSTRATE SUPPORTING MEMBER, SUBSTRATE POLISHING APPARATUS HAVING THE SAME AND METHOD FOR PROCESSING THEREOF

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate support member for sensing a slip state of a substrate, a substrate polishing apparatus having the same, and a processing method thereof.

In general, a semiconductor device manufacturing process must repeatedly perform a plurality of unit processes such as a deposition process, a photo process, and an etching process to form and stack thin films. These processes are repeated until the required circuit pattern is formed on the substrate, and after the circuit pattern is formed, many curvatures are generated on the surface of the substrate. In recent years, as semiconductor devices become highly integrated, their structures are multilayered, and the number of bends on the surface of the substrate and the step between them are increasing. Unplanarization of the substrate surface causes problems such as defocus in the photolithography process, so the substrate surface should be polished periodically to planarize the surface of the substrate.

Various surface planarization techniques are used to planarize the surface of the substrate, but chemical mechanical polishing (CMP) apparatuses, which can obtain excellent flatness not only for narrow areas but also for wide areas, are mainly used. A chemical mechanical polishing apparatus is an apparatus for polishing a surface of a substrate by mechanical friction and at the same time by a chemical abrasive, and very fine polishing is possible.

A typical chemical mechanical polishing apparatus polishes a substrate surface by contacting and rotating a substrate seated on a spin head with a polishing pad. At this time, the chemical mechanical polishing apparatus supplies a processing liquid (abrasive material) such as a slurry to a portion where the polishing pad and the substrate are in contact with each other. However, such a chemical mechanical polishing apparatus has a problem in that a process accident occurs such that the substrate slips from the spin head and the substrate is broken during the polishing process.

It is an object of the present invention to provide a substrate support member for sensing a substrate slip.

Another object of the present invention is to provide a substrate polishing apparatus and a processing method thereof for detecting a substrate slip.

Still another object of the present invention is to provide a substrate polishing apparatus and a processing method thereof for preventing a process accident.

In order to achieve the above objects, the substrate support member of the present invention is provided with a plurality of sensors for sensing the substrate slip. Such a substrate support member can detect the edge portion of the substrate to check the slip state of the substrate.

The substrate support member of the present invention according to this aspect, the spin head for fixing the substrate on the upper surface; A rotating shaft disposed below the center of the spin head and configured to rotate the spin head; It is installed below the upper surface, includes a plurality of sensors for detecting the edge portion of the substrate.

In one embodiment, the spin head provides a plurality of through-holes through which the upper and lower portions pass through the edge portion of the upper surface. Here, each of the sensors is fixed and installed under the through hole, and detects an edge portion of the substrate through the through hole.

In another embodiment, the spin head provides a plurality of insertion grooves in which an upper portion of an edge portion of the upper surface is opened. Here, each of the sensors is inserted into and installed in the insertion groove.

In another embodiment, the spin head; At least one pair of the through holes or the insertion grooves is provided to face an edge of the upper surface.

In another embodiment, the through hole penetrates downwardly from the edge portion of the upper surface toward the center of the spin head. The insertion groove is formed to be inclined downward from the edge portion of the upper surface toward the center.

In yet another embodiment, the sensors are installed below the spin head and outside the edge of the spin head.

According to another feature of the invention, a substrate polishing apparatus for sensing a slip state of a substrate is provided. Such a substrate polishing apparatus of the present invention can determine whether the substrate slips in real time while polishing the substrate.

According to an aspect of the present invention, there is provided a substrate polishing apparatus comprising: a substrate support member including a spin head for fixing a substrate on an upper surface thereof, and a rotation shaft disposed below the center of the spin head, the rotation shaft rotating the spin head; A polishing pad having a smaller size than the substrate, positioned on top of the spin head to contact the substrate, and locally polishing the surface of the substrate while swinging and rotating between an edge portion and a central region of the substrate; A polishing head; It is provided below the upper surface, and includes a plurality of sensors for detecting the edge portion of the substrate to detect whether the substrate slips from the spin head when the polishing head is polishing the substrate.

In one embodiment, the spin head; The substrate is vacuum sucked through a plurality of vacuum holes provided therein and fixed to the upper surface.

In another embodiment, the spin head provides a plurality of through holes penetrating downward from the edge portion of the upper surface toward the center of the spin head. Here, each of the sensors is fixed and installed under the through hole, and detects an edge portion of the substrate through the through hole.

In another embodiment, the spin head may be provided with a plurality of insertion grooves in which an upper portion of an edge portion of the upper surface is opened and is inclined downward in a direction of the center of the spin head from an edge portion of the upper surface. Here, each of the sensors is inserted into and installed in the insertion groove.

In another embodiment, the sensors are installed under the spin head to sense the edge portion of the substrate in the direction of the upper surface of the spin head from the outer lower end of the spin head.

According to still another aspect of the present invention, there is provided a processing method of a substrate polishing apparatus that provides a plurality of sensors for sensing an edge portion of a substrate fixed to a spin head during a polishing process.

According to this method, the seated substrate of the spin head is sucked and fixed by vacuum. The polishing head of the substrate polishing apparatus is moved on and in contact with the substrate. The substrate is polished by rotating the substrate. And while the substrate is polished, the sensors detect whether the substrate slips from the spin head. Here, whether or not the substrate is slipped is detected as if the edge portion of the substrate is not detected from at least one of the sensors.

As described above, the substrate support member of the present invention and the substrate polishing apparatus having the same include a plurality of sensors for detecting an edge portion of the substrate fixed to the upper surface of the spin head by vacuum suction, thereby realizing the substrate in real time during the process. The slip can be determined.

In addition, the substrate polishing apparatus of the present invention can detect the slip state of the substrate in real time and control the rotation of the spin head and the polishing head, thereby preventing process accidents such as substrate damage.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 8.

1 is a view showing a schematic configuration of a substrate polishing apparatus according to the present invention.

Referring to FIG. 1, the substrate polishing apparatus 100 is a chemical mechanical polishing (CMP) apparatus for treating a substrate (for example, a substrate) by a single sheet, and has a loading / unloading unit 10 and an index. The robot includes an index robot 20, a buffer unit 30, a main transfer robot 50, a plurality of substrate polishing units 110, and a controller 102.

The loading / unloading unit 10 includes a plurality of load ports 11a to 11d. In this embodiment, the loading / unloading unit 10 has four load ports 11a to 11d, but the number of load ports 11a to 11d is the process efficiency and footprint of the substrate polishing apparatus 100. It may increase or decrease depending on the footprint.

Each of the load ports 11a to 11d is mounted with a carrier for receiving substrates, for example, a front open unified pod (FOUP) 12a to 12d. Each fulcrum 12a-12d accommodates the boards in a state where the substrates are arranged horizontally with respect to the ground. In the pools 12a to 12d, the substrates processed in the substrate polishing units 110 or the substrates to be injected into the substrate polishing units 110 are stored.

A first transfer passage 40 is formed between the loading / unloading portion 11 and the buffer portion 30, and a first transfer rail 42 is installed in the first transfer passage 40. The index robot 20 transfers the substrates between the loading / unloading unit 10 and the buffer unit 30 while moving along the first transfer rail 42.

The buffer unit 30 is installed at one side of the first transfer passage 40. The buffer unit 30 accommodates the substrates transferred by the index robot 20 and accommodates the substrates processed by the substrate polishing units 110.

The main transfer robot 50 is installed in the second transfer passage 60. A second transfer rail 62 is provided in the second transfer passage 60, and a main transfer robot 50 is installed in the second transfer rail 62. The main transfer robot 50 moves along the second transfer rail 62 to transfer the substrate between the buffer unit 30 and the substrate polishing unit 110.

A plurality of substrate polishing units 110 are disposed at both sides of the second transfer passage 60, and each of the substrate polishing units 110 processes a substrate for polishing and cleaning. The substrate polishing units 110 are disposed such that at least two substrate polishing units 110 face each other with the second transfer passage 60 interposed therebetween. In addition, the substrate polishing units 110 may be arranged in multiple layers. In this embodiment, the substrate polishing units 110 are arranged in parallel along the second transfer passage 60, two on each side of the second transfer passage 60 in plan view. In addition, the substrate polishing units 110 are stacked in two layers, two in one layer. Of course, the number and arrangement of the substrate polishing units 110 may be variously modified according to the process efficiency and the footprint of the substrate polishing apparatus 100.

The substrate polishing apparatus 100 of the present invention sequentially processes a polishing process for polishing the upper surface of the substrate W and a cleaning process for cleaning the surface of the substrate W after the polishing process in one substrate polishing unit 110. do. Accordingly, the substrate polishing apparatus 100 may polish and clean a plurality of substrates simultaneously because the substrate polishing units 110 are arranged in a plurality of layers and a plurality of rows.

On the other hand, each substrate polishing unit 110 is electrically connected to the control unit 102 that controls the overall operation of the substrate polishing apparatus 100, and polish and clean the substrate under the control of the control unit 102. That is, the controller 102 controls the substrate polishing unit 110 so that the polishing amount of the substrate by the substrate polishing unit 110 is locally controlled to improve polishing uniformity.

Specifically, the configuration of the substrate polishing unit 110 and the substrate support member 120 will be described in detail with reference to FIGS. 2 to 7.

2 is a perspective view showing the configuration of the substrate polishing unit shown in FIG. 1, FIGS. 3 to 5B are views showing the configuration of the substrate supporting member shown in FIG. 2, and FIG. 6 is a substrate polishing shown in FIG. A partial cross-sectional perspective view showing a state of processing a negative polishing step.

Referring to FIG. 2, the substrate polishing unit 110 may include a container unit 112, a substrate support member 120, a polishing unit 130, and first and second processing liquid supply units 140 and 150. , A brush unit 160, an aerosol unit 170, a pad conditioning unit 180, and the like.

The substrate support member 120 is accommodated in the container unit 112. The substrate supporting member 120 is mounted with the substrate W transferred from the main transfer robot 50. The substrate support member 120 supports and fixes the substrate W during the polishing process and the cleaning process of the substrate W. The substrate support member 120 is fixed to the spin head 122 on which the substrate W is seated, the rotation shaft 124 coupled to the spin head 122 to rotate the spin head 122, and the spin head 122. And a plurality of sensors (128 in FIG. 5A, 128B in FIG. 5B, or 128B in FIG. 7) for detecting an edge portion of the substrate W. FIG. The sensors 128, 128a, and 128b are provided, for example, as proximity sensors, light sensors, or the like. The sensors 128, 128a or 128b are fixedly installed inside or outside the spin head 122.

In addition, the substrate support member 120 includes a driver (not shown) for rotating the rotation shaft 124. The rotating shaft 124 is coupled to the bottom center of the spin head 122. The rotating shaft 124 has a generally cylindrical shape, and rotates the spin head 122 during the polishing process and the cleaning process. When the substrate W is seated, the substrate support member 120 fixes the substrate W to the upper surface of the spin head 122 by vacuum suction. The configuration of the substrate support member 120 will be described in detail later with reference to FIGS. 3 to 5B.

The container unit 112 surrounds the substrate support member 120 and provides a process space in which a polishing process and a cleaning process of the substrate W are performed. The container unit 112 is open at the top and the spin head 120 is exposed through the open top. For example, the container unit 112 includes first and second processing bowls 112a and 112b in FIG. 6 for processing the polishing and cleaning processes, respectively. The container unit 112 includes a first and a second recovery container (not shown) for recovering the processing liquid used in the polishing and cleaning process corresponding to the first and second processing containers 112a and 112b, respectively, and In the cleaning process, a lifting member (not shown) for moving the first and second processing containers 112a and 112b up and down so that the vertical position between the spin head 120 and the container unit 112 is adjusted according to each process. It includes.

On the other hand, the outer side of the container unit 112, the polishing unit 130, the first and second processing liquid supply unit (140, 150), the brush unit 160, the aerosol unit 170 and the pad conditioning unit 180 This is installed.

The polishing unit 130 chemically and mechanically polishes the surface of the substrate W fixed to the substrate support member 120 to planarize the surface of the substrate W. FIG. Specifically, as illustrated in FIG. 6, the polishing unit 130 includes a polishing head 131, a fluid supply part 133, a swing part 132, and a driving part 134.

The polishing head 131 is provided with a polishing pad that contacts the substrate W to polish the surface, and is disposed above the substrate W fixed to the spin head 122 during the polishing process. The polishing head 131 rotates while the polishing pad presses the surface of the substrate W to polish the surface of the substrate W. FIG. The polishing head 131 is horizontally reciprocated in the upper portion of the substrate W by the swinging operation of the rotating part 132, and is rotated clockwise or counterclockwise by the driving part 134. That is, during the polishing process, the polishing head 131 may rotate in the same direction as the substrate W or may rotate in different directions.

During the polishing process, the polishing head 131 is rotated while the lower surface of the polishing pad is in contact with the upper surface of the substrate W to polish the substrate W. FIG. The polishing pad has a plate shape and has a generally circular ring shape. The polishing pad has a diameter smaller than that of the substrate W, and polishes the substrate W while swinging by the driving unit 134 during the polishing process. Since the polishing pad has a size smaller than that of the substrate W, the polishing pad can be locally polished to prevent overpolishing in a specific region.

The polishing head 131 is rotated in contact with the substrate W while polishing the processing liquid CL for polishing the substrate W to polish the substrate W. As shown in FIG. At this time, the polishing head 131 is swing-moved between the edge and the center region of the substrate W fixed to the spin head 122. The fluid supply part 133 is provided on the top of the polishing head 131. The fluid supply unit 133 provides the processing liquid CL to the polishing head 131, and receives the rotational force from the driving unit 134 through the rotating unit 132 to rotate together with the polishing head 131. For example, the fluid supply part 133 supplies the processing liquid CL, such as a slurry for grinding the substrate W, to the polishing head 131. The rotating part 132 is installed above the fluid supply part 133.

The rotating part 132 is installed in the rod-shaped case and transmits the rotational force provided from the driving part 134 to the fluid supply part 133 and the polishing head 131. Rotating portion 132 is one side is coupled to the fluid supply unit 133, the other side is coupled to the drive unit 134.

In addition, the driving unit 134 is coupled to the rotating unit 132 and provides a rotating force to the rotating unit 132. The drive unit 134 includes a rotating unit 132, a fluid supply unit 133, and at least one drive motor (not shown) for rotating the polishing head 131. For example, the drive motor includes a plurality of drive motors for rotating the fluid supply 133 and the polishing head 131, swinging the rotation part 132, and adjusting the vertical position of the polishing head 131. can do. Therefore, the driving unit 134 provides a rotational force to the rotating unit 132, the rotating unit 132 provides the rotational force to the fluid supply unit 133 and the polishing head 131. The driving unit 134 repeatedly provides rotational force in a clockwise direction and a counterclockwise direction alternately. Accordingly, the rotating unit 132 swings by the driving unit 134 with the portion coupled to the driving unit 134 as a central axis. Therefore, during the polishing process, the polishing head 131 may horizontally reciprocate in an arc shape on the upper portion of the substrate W by the swinging operation of the rotating part 132.

In addition, the driving unit 134 moves up and down the rotating part 132 disposed in the upper direction according to the clockwise and counterclockwise rotational force, and thus the fluid supply part 133 and the polishing head 131 move up and down.

Referring to FIG. 2 again, the first and second processing liquid supply units 140 and 150 may include a substrate W having a processing liquid necessary for the polishing and cleaning processes of the substrate W fixed to the substrate supporting member 120. Spray on.

The first processing liquid supply unit 140 is installed to face the polishing unit 130 with the container unit 112 interposed therebetween, and is fixedly installed on an outer wall of the container unit 112. In the polishing process or the cleaning process, the first processing liquid supply unit 140 cleans the substrate W by spraying the processing liquid on the substrate W fixed to the spin head 122. The first processing liquid supply unit 140 includes a plurality of spray nozzles fixed on the upper sidewall of the container unit 112 to spray the processing liquid onto the substrate W. The processing liquid sprayed from the spray nozzles may be a processing liquid for cleaning or drying the substrate W, or may be a drying gas for drying.

The second processing liquid supply unit 150 is installed to face the polishing unit 130 with the container unit 112 and the first processing liquid supply unit 140 interposed therebetween. The second processing liquid supply unit 150 includes a chemical liquid nozzle for spraying the processing liquid, and in the cleaning process, the processing liquid is sprayed onto the substrate W fixed to the spin head 122 to clean the substrate W. The second processing liquid supply unit 150 is swingable, and injects the processing liquid in a state in which the chemical liquid nozzle is disposed on the upper portion of the spin head 122 through a swing operation during the cleaning process.

The brush unit 160 physically removes foreign substances on the surface of the substrate W after the polishing process. The brush unit 160 includes a brush pad that contacts the surface of the substrate W to physically wipe off the foreign matter on the surface of the substrate W, and may swing. In the cleaning process, the brush unit 160 rotates the brush pad in a state in which the brush pad is disposed on the upper portion of the spin head 122 through a swing operation to clean the substrate W fixed to the spin head 122. An aerosol unit 170 is disposed at one side of the brush unit 160.

The aerosol unit 170 removes foreign substances on the surface of the substrate W by spraying the processing liquid in the form of fine particles on the substrate W fixed to the spin head 122. For example, the aerosol unit 170 sprays the treatment liquid into fine particles using ultrasonic waves. Therefore, the brush unit 160 is used to remove foreign matter of relatively large particles, and the aerosol unit 170 is used to remove foreign matter of relatively small particles compared to the brush unit 160.

The pad conditioning unit 180 cleans and regenerates the polishing unit 130 when the polishing unit 130 is waiting at the home port.

As described above, in the substrate polishing apparatus 100 of the present invention, since both the polishing process and the cleaning process of the substrate W are performed in each substrate polishing unit 110, the substrate polishing apparatus 100 may transfer the substrate to the cleaning process chamber after the polishing process. There is no need and a separate cleaning process chamber does not need to be provided. Accordingly, the substrate polishing system 100 can shorten the transfer time and the process time of the substrate W, improve productivity, and reduce the footprint.

Hereinafter, the configuration and operation of the substrate support member of the present invention will be described in detail with reference to FIGS. 3 to 8.

3 and 4, the spin head 122 fixes the substrate W to an upper surface thereof. At this time, the spin head 122 applies a vacuum pressure to the plurality of vacuum holes 121 provided therein, and sucks the substrate W under vacuum. In addition, the spin head 122 includes a plurality of support pins 123 that support the substrate W in order to load and unload the substrate W on the top surface. The spin head 122 has a diameter whose upper surface is smaller than that of the substrate (W). Therefore, when the substrate W is loaded and fixed on the upper surface of the spin head 122, the edge portion WE of the substrate W is evenly projected outward along the edge of the upper surface.

The spin head 122 opposes the edge portion WE of the substrate W protruding outward from the top surface of the spin head 122 to sense the edge portion WE of the substrate W fixed to the top surface. A plurality of sensors (128 in FIG. 5A or 128a in FIG. 5B) is installed at the position, that is, the upper edge portion of the spin head 122. To this end, the spin head 122 includes a plurality of through holes 128 penetrating in an upward direction facing the edge portion WE of the substrate W, or a plurality of sensors 128a inserted and installed therein. Inserting grooves 128a are provided. These through holes 128 or insertion grooves 128a are provided to face at least one pair of upper edge portions of the spin head 122. For example, the through holes 128 or the insertion grooves 128a are provided at the edges of the spin head 122 so as to face each other, two pairs. At this time, each of the through holes 128 or the insertion grooves 128a is disposed at positions of 90 °, 180 °, 270 °, and 360 ° from the center of the upper surface of the spin head 122, so that they are perpendicular to each other. Is placed.

That is, the spin head 122 according to the exemplary embodiment may include a plurality of through holes 126 in the upper edge portion, as illustrated in FIGS. 5A and 6, to detect that the substrate W is slipped. . Each of the through holes 126 opens a portion of the upper edge portion of the spin head 122 opposite to the edge portion WE of the substrate W. As shown in FIG. The through hole 126 penetrates downwardly toward the center of the spin head 122 from an edge portion of the open upper surface of the spin head 122 along the inside of the side wall of the spin head 122. The sensor 128 is fixed and installed under the through hole 126.

The sensor 128 is provided with a proximity sensor, an optical sensor, or the like, for example. The sensor 128 detects the edge portion WE of the substrate W in the upward direction opened through the through hole 126. To this end, the sensor 128 is fixed to the lower portion of the spin head 122 is rotated together when the spin head 122 is rotated. The sensor 128 detects the edge portion WE of the substrate W through the through hole 126.

Therefore, if the edge portion WE of the substrate W is not detected from at least one of the sensors 128, the controller 102 determines that the substrate W has slipped from the top surface of the spin head 122. .

In another embodiment, the spin head 122a is provided with a plurality of insertion grooves 126a in the upper edge portion, as shown in FIG. 5B. Each of the insertion grooves 126a opens a part of the upper edge portion of the spin head 122a opposite to the edge portion WE of the substrate W. As shown in FIG. The insertion groove 126a is formed to be inclined downward from the open upper surface of the spin head 122a along the inside of the sidewall of the spin head 122a toward the center of the spin head 122a. The sensor 128a is inserted and installed in the insertion groove 126a.

The sensor 128a is provided with, for example, a proximity sensor and an optical sensor. The sensor 128a detects the edge portion WE of the substrate W in an open direction through the insertion groove 126a. To this end, the sensor 128a is fixedly installed at the lower portion of the spin head 122a and rotates together when the spin head 122a is rotated. The sensor 128a detects the edge portion WE of the substrate W through the open upper portion of the insertion groove 126a.

These sensors 128a are also electrically connected to the controller 102 to determine whether the substrate W is slipped. That is, if the edge portion WE of the substrate W is not detected from at least one of the sensors 128a, the controller 102 determines that the substrate W has slipped, and thus the spin head 122a and the polishing head ( The interlock is controlled such as stopping the rotation of 131 and generating an alarm to the outside.

In another modification, referring to FIG. 7, the substrate polishing apparatus 100 is provided with a plurality of sensors 128b fixed to the lower outer side of the spin head 122b. At this time, the sensors 128b are fixed to the outside of the spin head 122b by using a separate fixing device (not shown).

The sensors 128b detect the edge portion WE of the substrate W from the outer lower end of the spin head 122b in the direction of the top surface of the spin head 122. These sensors 128b are also electrically connected to the controller 102 to determine whether the substrate W is slipped. At this time, the sensors 128b do not rotate together with the spin head 122b. Accordingly, the sensors 128b may provide different signals to the controller 102 depending on whether the edge portion WE of the substrate W is detected or not detected.

8 is a flowchart showing the processing procedure of the substrate polishing apparatus according to the present invention.

Referring to FIG. 8, when the substrate W is loaded onto the spin head 122 in step S200, the substrate W is vacuum chucked on the top surface of the spin head 122 in step S210. That is, a vacuum pressure is applied to the plurality of vacuum holes 121 provided in the spin head 122, thereby fixing the substrate W to the upper surface of the spin head 122. In operation S220, the polishing head 131 is moved to an upper portion of the substrate W fixed to the spin head 122, and the surface of the substrate W is polished by rotating the spin head 122 and the polishing head 131.

In operation S230, the edge portion WE of the substrate W is sensed in real time using the plurality of sensors 128, 128a, or 128b. In step S240, it is determined whether the substrate W has slipped during the polishing process. That is, it is determined whether the edge portion WE of the substrate W is detected from at least one of the plurality of sensors 128, 128a, or 128b. If the edge portion WE of the substrate W is not detected from at least one of the sensors 128, 128a or 128b then this procedure proceeds to step S250 to stop the rotation of the spin head 122 and to polish the substrate. Interlock control of the device 100. At this time, it is obvious that the polishing head 131 also stops rotation along with the spin head 122.

In the above, although the configuration and operation of the substrate support member and the substrate polishing apparatus having the same according to the present invention have been shown in accordance with the detailed description and the drawings, these are merely described by way of example and do not depart from the spirit of the present invention. Various changes and modifications are possible within the scope.

1 shows a schematic configuration of a substrate polishing apparatus according to the present invention;

FIG. 2 is a perspective view showing the structure of the substrate polishing part shown in FIG. 1; FIG.

3 is a perspective view showing the configuration of a substrate support member according to an embodiment of the present invention shown in FIG.

4 is a plan view of the substrate support member shown in FIG. 3;

FIG. 5A is a sectional view showing one embodiment of the substrate support member shown in FIG. 3; FIG.

FIG. 5B is a sectional view showing another embodiment of the substrate support member shown in FIG. 3; FIG.

FIG. 6 is a partial perspective cross-sectional view of the substrate polishing apparatus shown in FIG. 2; FIG.

7 is a view showing the configuration of a substrate support member according to another embodiment of the present invention; And

8 is a flowchart showing a processing procedure for sensing a substrate slip of the substrate polishing apparatus according to the present invention.

Explanation of symbols on the main parts of the drawings

100: substrate polishing apparatus

110: substrate polishing unit

120: substrate support member

122: spin head

128: sensor

Claims (12)

In the substrate support member: A spin head fixing the substrate to the upper surface; A rotating shaft disposed below the center of the spin head and configured to rotate the spin head; The substrate supporting member is installed below the upper surface, comprising a plurality of sensors for detecting the edge portion of the substrate. The method of claim 1, The spin head provides a plurality of through holes through which an upper portion and a lower portion pass through an edge portion of the upper surface; Each of the sensors is fixed and installed at a lower portion of the through hole to detect an edge portion of the substrate through the through hole. The method of claim 1, The spin head provides a plurality of insertion grooves in which an upper portion of an edge portion of the upper surface is opened; Each of the sensors is inserted into the insertion groove, the substrate supporting member, characterized in that installed. The method according to claim 2 or 3, The spin head; At least one pair of the through-holes or the insertion grooves is provided to face an edge of the upper surface. The method of claim 4, wherein The through hole penetrates downwardly from an edge portion of the upper surface toward the center of the spin head; The insertion groove is a substrate supporting member, characterized in that formed inclined downward from the edge portion of the upper surface toward the center. The method of claim 1, And the sensors are provided below the spin head and outside the edge portion of the spin head. In substrate polishing apparatus: A substrate support member including a spin head for fixing a substrate on an upper surface thereof, and a rotation shaft disposed below the center of the spin head and rotating the spin head; A polishing pad having a smaller size than the substrate, positioned over the spin head to contact the substrate, and locally polishing the surface of the substrate while swinging and rotating between an edge portion and a central region of the substrate; A polishing head; A substrate disposed below the upper surface, the substrate comprising a plurality of sensors for sensing an edge portion of the substrate to detect whether the substrate slips from the spin head when the polishing head polishes the substrate Polishing device. The method of claim 7, wherein The spin head; And a substrate is vacuum sucked through the plurality of vacuum holes provided therein to fix the substrate to the upper surface. 9. The method according to claim 7 or 8, The spin head provides a plurality of through holes penetrating downward from an edge portion of the upper surface toward the center of the spin head; Each of the sensors is fixed and installed under the through hole to detect an edge portion of the substrate through the through hole. 9. The method according to claim 7 or 8, The spin head has a plurality of insertion grooves formed at an upper portion of an edge portion of the upper surface, and downwardly inclined downward from an edge portion of the upper surface toward a center of the spin head; Each of the sensors is inserted into the insertion groove, the substrate polishing apparatus, characterized in that installed. 9. The method according to claim 7 or 8, And the sensors are provided below the spin head to sense an edge portion of the substrate from the outer lower end of the spin head toward the upper surface of the spin head. In the processing method of the substrate polishing apparatus: Vacuum suction and fix the seated substrate of the spin head of the substrate polishing apparatus, provide a plurality of sensors for sensing an edge portion of the substrate, move the polishing head onto the substrate to contact the substrate, and the substrate Rotate the to polish the substrate, and detect whether the substrate slips from the spin head by the sensors while polishing the substrate; And whether the substrate is slipped or not, when the edge portion of the substrate is not detected from at least one of the sensors.

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