KR20110005005A - Metal base circuit board - Google Patents

Abstract

PURPOSE: A metal base circuit board is provided to improve heat dissipation efficiency by forming flow holes of various shapes. CONSTITUTION: A heating element is installed on the top and bottom of a metal circuit board. At least flow holes(11) are formed between the top and bottom of the metal circuit board. A plurality of heat exchange protrusions are formed in the inner surface of the flow hole. The heat exchange protrusion has a polygon, a circular or an oval cross section. A heat dissipation material is filled into the flow holes and contains fresh water, ethyl alcohol, and a minute graphite powder.

Description

Metal Circuit Boards {Metal base circuit board}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal circuit board, and more particularly, to improve heat dissipation characteristics of a metal circuit board using heat-generating components such as LEDs, in which heat dissipation and temperature reliability are important, and improve heat dissipation, temperature reliability, and light efficiency of mounting components. The present invention relates to a metal circuit board.

Generally The brightness of the light emitting diode is proportional to the current applied to the light emitting chip, and the heat emitted by the light emitting chip is proportional to the current applied to the light emitting chip. In order to brighten the brightness of the light emitting diode, a high current must be applied, but a light emitting chip generated in proportion to this is damaged by heat emitted by itself, which causes a problem that an infinitely high current cannot be applied.

In particular, the LED package is composed of chips, adhesives, encapsulants, phosphors, and heat dissipation accessories. The LED semiconductor device has a PN junction structure, and as the current flows, extra electrons and holes are emitted by luminescent recombination. Is generated.

In this process, 30% is light and the remaining 70% is generated as heat, and a high thermal conductivity metal circuit board is used to dissipate this heat.

However, in the case of high power LED, heat dissipation is essential to solve the heat generated due to high power consumption. If the heat is not sufficiently generated, the temperature of the device rises, which hinders the efficient light emission. The life of the device is drastically reduced.

In the related art, a method of performing forced cooling by using a separate heat sink or fan has been used for cooling, but such a separate heat sink or fan is less durable due to its own life, and in order to install separate parts The overall size is larger, there is a problem that the configuration is complicated.

The present invention is to solve the above problems, an object of the present invention is to improve the heat dissipation characteristics of a metal circuit board using a heat-generating component such as an LED lamp, the heat dissipation and temperature reliability is important, the heat dissipation and temperature of the mounting component It is to provide a metal circuit board that can increase the reliability and light efficiency.

In order to achieve the above object of the present invention,

According to an aspect of the invention, the metal having a top surface and a bottom surface on which the heating element is mounted, wherein at least one flow hole for the flow of fluid therein is formed between the top surface and the bottom surface in the longitudinal direction; A circuit board is provided.

Here, a plurality of heat exchange protrusions are formed on an inner surface of the flow hole, and the heat exchange protrusions are preferably polygonal, circular or elliptical in cross section.

In addition, it is preferable that the flow hole has a narrow flow cross section from the inlet to the outlet of the fluid.

In addition, the metal circuit board according to an aspect of the present invention further comprises a heat dissipation material filled in the flow hole, the heat dissipation material includes fresh water, ethyl alcohol and fine graphite powder, both open ends of the flow hole is sealed Is preferred.

In addition, the flow hole is preferably formed with a horizontal through portion spaced apart at equal intervals and having a vertical through portion having the same width and adjacent two vertical through portions.

As described above, the metal circuit board according to the present invention can improve the heat dissipation characteristics of the metal circuit board using heat-generating components such as LEDs, in which heat dissipation and temperature reliability are important, and improve heat dissipation, temperature reliability, and light efficiency of mounting components. It can increase.

Hereinafter, a metal circuit board according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings show exemplary forms of the present invention, which are provided to explain the present invention in more detail, and the technical scope of the present invention is not limited thereto.

1 and 2 are cross-sectional views showing a metal circuit board according to an embodiment of the present invention, Figures 3 to 5 are cross-sectional views showing a metal circuit board according to another embodiment of the present invention.

The metal circuit board 10 according to an embodiment of the present invention has a top surface and a bottom surface on which the heating element 12 (for example, LED) is mounted, and a fluid therein along the longitudinal direction between the top surface and the bottom surface. One or more flow holes 11 for the flow of are formed.

The metal circuit board 10 may be formed of various metals having excellent thermal conductivity, but is not limited thereto. For example, the metal circuit board 10 may be formed of metal such as aluminum or copper.

In addition, the gap (thickness) between the upper surface and the lower surface may be formed, for example, 1 to 20mm, the flow hole may be formed by a die casting method.

Referring to FIG. 1, the flow holes 11 may be formed in various patterns to have a large heat dissipation area, but are not limited thereto. For example, the flow holes 11 may be spaced apart at equal intervals and have the same width. And a horizontal through portion connecting two vertical through portions adjacent to the vertical through portions.

Accordingly, air may flow along the flow hole 11, thereby effectively dissipating heat remaining in the metal circuit board 10.

Alternatively, the metal circuit board 10 according to an embodiment of the present invention may further include a heat dissipation material filled in the flow hole, the heat dissipation material may include fresh water, ethyl alcohol and fine graphite powder. Both open ends of the flow holes may be sealed.

Here, the heat dissipating material may include 90 parts by weight of fresh water and 10 parts by weight of ethyl alcohol, and may further include an antifreeze, and the heat dissipating material configured as described above may include graphite at a boiling point of 100 ° C. of water and 78.4 ° C. of ethyl alcohol. Since the fine powder is added, the actual boiling point is almost 98 ° C., which is close to the boiling point of water, and the thermal properties of the alcohol and the heat transfer properties of the graphite are 1.8 times better than those of the conventionally used antifreeze.

3 and 4, a plurality of heat exchange protrusions 22 and 32 may be formed on the inner surface of the flow holes 21 and 31 formed in the metal circuit boards 20 and 30. It may be formed in various shapes to increase the heat dissipation area, but the cross-section may be polygonal (triangular, square, rhombus or trapezoidal), circular or oval. 3, the cross section of the heat exchange protrusion 22 is illustrated as a quadrangle, and the cross section of the heat exchange protrusion 32 is illustrated to be circular, but the cross-sectional shape of the heat exchange protrusion 32 is not limited thereto.

In addition, the metal circuit board and the heat exchange protrusions may use the same material or different materials.

In addition, as described with reference to FIGS. 1 and 2, the heat radiation material may be filled in the flow holes 21 and 31.

Referring to FIG. 5, the metal circuit board 40 according to another embodiment of the present invention has an upper surface and a lower surface on which a heating element (not shown, see FIG. 2) is mounted, between the upper surface and the lower surface. At least one flow hole 41 for the flow of the fluid is formed therein along the longitudinal direction, the flow hole 41 may have a narrow flow cross-sectional area from the inlet (d1) of the fluid toward the outlet (d2) .

The flow hole 41 having such a structure performs a function of a nozzle and increases the flow rate of the fluid (for example, air) flowing through the internal space to efficiently radiate the metal circuit board.

The metal circuit boards 10, 20, 30, and 40 having such a structure have an internal flow structure for improving heat dissipation characteristics of the substrate, and may have a heat dissipation efficiency three times or more compared to the surface area by forming flow holes in various shapes. .

In addition, the internal shape structure (flow hole) can be easily formed by using the die casting method, and the heat dissipation effect can be maximized by mounting a ceramic package equipped with LED needle or LED chip on the upper surface of the metal circuit board. A heat fighter, heat sink, or slug may be attached to the bottom surface of the circuit board to increase the heat dissipation effect.

Therefore, the heat dissipation characteristic of the metal circuit board using heat generating parts, such as LED which is important for heat dissipation and temperature reliability, can be improved, and the heat dissipation, temperature reliability, and light efficiency of a mounting component can be improved.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having various ordinary knowledge of the present invention may make various modifications, changes, and additions within the spirit and scope of the present invention. And additions should be considered to be within the scope of the following claims.

1 and 2 are cross-sectional views showing a metal circuit board according to an embodiment of the present invention.

3 to 5 are cross-sectional views showing a metal circuit board according to another embodiment of the present invention.

Claims (5)

A metal circuit board having an upper surface and a lower surface on which a heat generating element is mounted, and at least one flow hole is formed therein between the upper surface and the lower surface in a longitudinal direction. The method of claim 1, A plurality of heat exchange protrusions are formed on the inner surface of the flow hole, The heat exchange protrusion is a metal circuit board, characterized in that the cross section is polygonal, circular or elliptical. The method of claim 1, The flow hole is a metal circuit board, characterized in that the flow cross-sectional area is narrowed from the inlet to the outlet of the fluid. The method of claim 1, Further comprising a heat radiation material filled in the flow hole, The heat radiation material includes fresh water, ethyl alcohol and fine graphite powder, A metal circuit board, characterized in that both open ends of the flow holes are closed. The method of claim 1, The flow hole is a metal circuit board, characterized in that formed in the same interval spaced apart through the vertical through portion having the same width and the horizontal through portion connecting the two adjacent through portions.

Images