KR20110004514A - Power module assembly - Google Patents
Power module assembly Download PDFInfo
- Publication number
- KR20110004514A KR20110004514A KR1020090061967A KR20090061967A KR20110004514A KR 20110004514 A KR20110004514 A KR 20110004514A KR 1020090061967 A KR1020090061967 A KR 1020090061967A KR 20090061967 A KR20090061967 A KR 20090061967A KR 20110004514 A KR20110004514 A KR 20110004514A
- Authority
- KR
- South Korea
- Prior art keywords
- power
- heat
- power device
- pcb core
- power module
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention is a power module that can reduce the material cost and improve the production efficiency by shortening the manufacturing process by excluding the configuration of the aluminum PCB layer used to dissipate the heat of the elements in the module and constituting the thermal conductive sheet as an insulating layer Start the structure. The configuration of the present invention comprises a lead frame; An element unit including a plurality of circuit elements; A power device electrically connected to the lead frame; A double-sided PCB core on which the device unit and the power device are mounted; A sealing layer protecting the device portion and the power device mounted on the lower portion of the PCB core; An insulation layer formed on an upper surface of the PCB core; And a heat sink bonded to the insulating layer to dissipate heat generated in the device unit and the power device to the outside.
Description
The present invention relates to a power module structure, and more particularly, by excluding the configuration of the aluminum PCB used to dissipate the heat of the elements in the module, and by configuring a thermally conductive sheet with an insulating layer to reduce the material cost and shorten the manufacturing process Due to the power module structure that can improve the production efficiency.
In general, a semiconductor package is mounted on a lead frame or a printed circuit board and sealed with a sealing material such as an epoxy molding compound (EMC) to protect the interior, and then to the motherboard or system It is used by mounting on PCB Core (Printed Circuit Board CORE).
Recently, as high-speed, high-capacity and high-integration of electronic devices has progressed, the demand for miniaturization and light weight of power devices has also increased. One way to solve the above requirement is to configure a stacked power module by mounting a plurality of semiconductor chips in a single semiconductor package.
1 is an exemplary view showing an example of a conventional power module structure.
The
The
The
However, in the case of the conventional semiconductor chip package including a plurality of chips as described above, the amount of heat generated according to the operation is increased, which causes various problems due to thermal stress.
In addition, in the case of a multi-chip package in which a plurality of chips are stacked through spacers, a heat trapping phenomenon, which is accumulated without heat dissipation, occurs between the chips and the chip. The effect of heat transfer to the system becomes less severe, causing problems due to thermal stress.
In particular, since the heat generation increases due to the increased junction temperature of the chip internal circuit due to the high speed operation and the high integration, the electronic devices using the semiconductor chip package, for example, mobile products, do not smoothly discharge heat corresponding to the increased heat generation. Characteristics of the conductor chip package, for example, refresh characteristics, operating speed, lifespan, etc. may be deteriorated.
Looking at the power module structure disclosed to reduce such thermal stress is as follows. 2 is an exemplary view showing another conventional power module structure, Figure 3 is an exemplary view showing another conventional power module structure.
In another example of the conventional power module structure as shown in FIG. 2, the
Meanwhile, as shown in FIG. 3, the
However, these power module structures have a structure in which a circuit board is formed by adhering the
Accordingly, the conventional power module structure is provided with a
The present invention was created by the above needs, by excluding the configuration of the aluminum PCB layer used to dissipate heat of the device in the module and by configuring the thermally conductive sheet as an insulating layer to reduce the material cost and shorten the manufacturing process The purpose is to provide a power module structure that can improve the production efficiency.
According to an embodiment of the present invention for achieving the above object, a lead frame (lead frame); An element unit including a plurality of circuit elements; A power device electrically connected to the lead frame; A double-sided PCB core on which the device unit and the power device are mounted; A sealing layer protecting the device portion and the power device mounted on the lower portion of the PCB core; An insulation layer formed on an upper surface of the PCB core; And a heat dissipation plate bonded to the insulating layer to dissipate heat generated by the device unit and the power device to the outside.
Preferably, the double-sided PCB core has a plurality of thermally conductive parts formed to correspond to the devices mounted on the lower surface.
Preferably, the thermally conductive portion is formed at a position corresponding to the power device.
According to the present invention, by excluding the configuration of the aluminum PCB layer used to dissipate heat of the device in the module, it is possible to reduce the material cost and improve the production efficiency due to the shortening of the manufacturing process.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
4 is an exemplary view showing a power module structure according to an embodiment of the present invention.
As shown in FIG. 4, the power module structure of the present invention includes a
The
The insulating
The double-
The
The
Meanwhile, a plurality of heat
The sealing
In the present invention having such a configuration, the
In addition, since the
In addition, since the
While the present invention has been particularly shown and described with reference to the particular embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
1 is an exemplary view showing an example of a conventional power module structure.
2 is an exemplary view showing another conventional power module structure.
3 is an exemplary view showing another conventional power module structure.
4 is an exemplary view showing a power module structure according to an embodiment of the present invention.
<Brief description of main drawing codes>
10: substrate 20: insulating layer
30: power element 35: wire
40: device chip 50: lead frame
60: heat sink 90: sealing material
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090061967A KR20110004514A (en) | 2009-07-08 | 2009-07-08 | Power module assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090061967A KR20110004514A (en) | 2009-07-08 | 2009-07-08 | Power module assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110004514A true KR20110004514A (en) | 2011-01-14 |
Family
ID=43611968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090061967A KR20110004514A (en) | 2009-07-08 | 2009-07-08 | Power module assembly |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20110004514A (en) |
-
2009
- 2009-07-08 KR KR1020090061967A patent/KR20110004514A/en not_active Application Discontinuation
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |