KR20110001445U - The development equipment of auto surface defect machine vision and using methods of semiconductor BGA - Google Patents

Abstract

As information and communication develops, communication systems must develop accordingly, and the trend toward miniaturization and lightening of the system is increasing. The present invention automatically checks the state of the ball among the semiconductor parts formed by using the ball at the bottom of the semiconductor instead of the lead frame of the semiconductor to miniaturize the system among the semiconductor devices essential for information and communication equipment, and checks whether the defect is in Machine Vision. This invention is an equipment that automatically inspects and classifies defects. The present invention automatically inspects semiconductor BGA device components and inspects the quality in real time in the manufacturing line, contributing to the identification of the cause of defect rate and improvement of quality and improving productivity. The system consists of machine vision system, inspection method, inspection algorithm and system to classify defects.

This system consists of one line scan CCD camera for BGA inspection, frame grabber, computer and lighting equipment for image processing, and one area scan CCD camera, frame grabber and image processing for Riview inspection. It consists of hardware and software such as computer and lighting equipment. Firstly, it is a device that captures the image of the object, and the image data is transferred to the computer's memory through the image frame grabber. CCD camera consists of camera body, signal cable and lens. It is a device that receives the image data stored in the CCD camera, and is in charge of driving and interface of the CCD camera. The frame grabber used in this system consists of three parts: camera interface, image memory and PCI bus interface. The instrument part consists of a transport mechanism to smooth the part and transport it onto the correct inspection system, an optical mechanism for the optimal inspection environment, and a housing for light control. And an optical filter. The control panel is a PLC and other electrical and electronic systems that provide outputs to the motion controller, proximity sensor, lighting controller, host computer and peripheral equipment for driving inspection programs, and reports on defective parts. The inspection software runs on Windows XP's O / S on the main computer, and plays a key role in controlling peripherals, conducting inspections, setting inspection items and parameters, as well as storing images for the BGA.

BGA Inspection Vision System, Semiconductor Component Inspection Equipment, LCD Component Inspection Equipment, Electrical Component Inspection Equipment, Electronic Component Inspection Equipment, Mechanical Component Inspection Equipment.

Description

The development equipment of auto surface defect machine vision and using methods of semiconductor BGA}

This inspection technology field is a semiconductor component element that is essential for home appliances and communication equipments, and it cannot be identified by the naked eye during production, and it must be expanded by 10 times or more through a microscope and perform automatic inspection as it flows in the process. This inspection device is an important device that automatically inspects the quality of the appearance of the BGA. Accurate defect inspection is required and needs to be processed quickly and accurately. In addition, the configuration of the inspection equipment of the present invention is largely divided as shown in the [representative diagram], the feeder part, the escape part and the transfer part, the instrument part, the inspection part and the lighting, the optical part, the control panel and the inspection software part, the driving unit to put the product into the vision part by alignment. It consists of a motor part. The mechanism consists of a transport mechanism for smoothing and aligning the BGA and transporting it over the correct inspection system, an optical mechanism for optimal inspection environment, and a housing for light control.The optics includes a camera and lens to obtain clear images, high brightness It consists of LED special lighting and optical filter. In addition, the inspection unit should use one set of line scan cameras and use one set of area cameras to enlarge the review and defective parts for the purpose of BGA regeneration in case of failure. Inspection conditions were developed for full inspection. And the automatic inspection of BGA is as follows.

-. BGA from the conveyor at the end of the process is introduced into the tester

-. The incoming BGA is photographed and inspected from above the ball in the ongoing situation.

-. For each inspection, it is determined whether or not the BGA is defective.

-. In the case of good products, make sure to load them into good cassete.

-. In case of defective product, load it into defective product cassette.

-. The above process is completed in 0.8 ~ 1.0 sec / 1pcs.

-. It displays the inspection results and statistics. Therefore, this device is an inspection equipment using robot technology as part of the field that adopts the automation technology in the production process, and the field that requires image recognition processing technology, precision control technology, precision optical technology, and mechanical design technology. to be.

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        Wiley & Sons, 1980

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[Image 3] Image processing, Craig A.Lindly

[Document 4] FARA MVE-02 Hardware

[5] Laser Focus World, A PennWell Publication

[6] The design world of motor's parts

[7] Rfael. C conzalez and Richard E. Woods, Digital Image

        Processingrentic Hall 2001.

[8] Simon Haykim, Adaptive Filter Wedge Bridge Prence Hall 2002.

9 Tannas. L> E.Jr, "Evolution of flat-panel display," proceedings of

 the IEEE, vol82, no.4, pp 499-509, Apr. 1994

This inspection technology field is a semiconductor component element, which is essentially installed in home appliances and communication devices, and cannot be identified by the naked eye at the time of production, and is only a field that can be inspected by expanding more than 10 times through a microscope. Therefore, it is a field that needs image recognition processing technology, precision control technology, precision optical technology, and mechanical design technology as inspection equipment using robot technology. Next, the detailed configuration of each equipment is as follows. This system is composed of feeder part, transfer part, instrument part, inspection part and lighting and optics part, control panel and inspection software part and driving motor part as shown in [representative diagram]. First, the feeder unit arranges each loaded BGA to over 100PPM and supplies it to Escape. Transfer then places EGA aligned BGAs on the stage of the vision section, and the mechanism section provides a transfer mechanism to smooth the flow of the BGA and transfer it onto the correct inspection system, an optical mechanism for an optimal inspection environment, and It consists of a housing for lighting control. The lighting and optics consists of a set of line scan cameras and lenses, high-brightness LED special lighting and optical filters to obtain BGA images. The control part was developed as a PLC and other electrical and electronic systems that output power to the host computer and peripheral equipment for driving the motion control unit, proximity sensor, lighting control unit, inspection program, and report the defective parts. The board block diagram and the flow chart are shown to illustrate the function.

The inspection system of the semiconductor component device BGA is started by inspection software, and the user adjusts the inspection object and inspection parameters to set the degree of judgment of the inspection and start the inspection. The transfer mechanism automatically detects and operates the flow of the semiconductor component BGA, and when the semiconductor component BGA reaches the inspection position with the camera and the optics, the lighting and the camera operate to obtain an image of the semiconductor component BGA, which is the main computer. It checks whether it is bad or normal by receiving the test. Frame Grabber is a plug-n-play board for acquiring images in Machine Vision application program. It can easily interface the camera connected with Frame Grabber with various trigger, strobe and asynchronous reset options, and control and monitor external events. There is an I / O function. Frame Grabber consists of three main parts: Camera Interface, Image Memory and PCI-bus Interface. Connector Pin-Out consists of two 15-pin / 26-pin video connectors and digital I / O ports. . Power terminal, 2. camera pulse terminal, 3. lighting pulse terminal 4. motor driver terminal, 5. limit sensor terminal

The following briefly summarizes the function of each terminal.

 1) MCU: A medium that executes commands received through serial communication with a PC.

 2) Power supply unit: Circuit that applies voltage and current required for electronic parts.

 3) Motor drive part and lighting: pulse and driving direction signal for driving motor

    Make circuit and lighting signal applied.

 4) Pulse generator: The camera can be used to take a test object while the X-Y Stage is moving.

    Circuit giving a pulse.

 5) Sensor drive unit: Circuit to determine the presence or absence of the inspection object.

When a defect is detected, the main computer sends a defective output signal to the PLC to send out an output signal to the user so that the user can recognize the defect, and at the same time, sends a signal to the ejecting mechanism to eject the defective product. It is designed to allow the user to monitor the signal from the external outputs and perform additional tasks such as changing parameters or adjusting the test settings as required.

1. BGA Inspection Department

(1) Line scan CCD camera, 8K ---------- 1 set

(2) magnification lens ----------------- 1 set

(3) Front Ring LED light -------------- 1 unit

(4) frame grabber board --------------- 1 set

(5) fixtures for camera and light ------ 1 unit

2. BGA Reinspection Department

(1) Area scan CCD camera, 1K ---------- 1 set

(2) magnification lens (x30) ------------ 1 set

(3) light ----------------------------- 1 unit

(4) frame grabber board --------------- 1 set

(5) fixtures for camera and light ------ 1 unit

3. System control unit

(1) MCU Part

(2) Control from PC with RS-232C serial communication

(3) Camera Trigger Signal Generation

(4) Deliver Image to PC

(5) Integrate vision system, logistic system, sensor, etc. in PC

    Control

4. Personal Computer

(1) PC for BGA inspection & Review --------- 2 set

   master PC and Sleeve PC

(2) PC for Reinspection ------------ 1 set

5. Logistic System

(1) frame -------------------------- 1 unit

(2) aligning unit ------------------ 1 unit

(3) Defective main detection conveyor ------ 1 unit

(4) Extra conveyor ----------------- 1 unit

(5) defective product separation device ------------ 1

(6) other defective products separation device ------- 1

(7) sensors ------------------------ 1 unit

6. Image processing software

(1) image processing algorithm ----- 2 units

(2) GUI ----------------- 1 unit

7. General

1.Descriptions of Objects to Be Inspected

(1) Objects: Defect for BGA

(2) Conveyor Line Speed: 60meter / min

(3) Inspection Tact time and speed:

-Inspection time: 20 ~ 60 ms

-Inspection accuracy: 0.2 ~ 03Mil

(4). Inspection item of the inspection subject:

-Ball Presence: Missing Ball, Double ball, Extra ball

-Ball Position: 10um (0.5Mil)

-Ball Pitch: 10um (0.5Mil

-Ball Size: Large Ball, Snall Ball 10um (0.5mil)

-Ball Quality: Circularity

-Package Surface: Reject Mark

-Package Dimension: 12um (0.5Mil)

-Miss Align: 12um (0.5Mil)

(5) Rosolution: 5um

(6) Detection Capability: 5um defects or larger

This development system is concerned with the construction, inspection method and specification of machine vision system for inspecting the components of semiconductor component BGA, reporting inspection results to users, and separating defects. Optical mechanism and lighting for optimal inspection environment It is composed of a housing for control, and the lighting and the camera are operated to obtain an image of the semiconductor component device BGA, and it is transmitted from the main computer to perform an inspection to determine whether it is defective or normal. Send the output signal to PLC so that the user can recognize the defect. Output signal is sent to the user. The user monitors the signal from the external output, and if necessary, changes the parameters related to the inspection setting or adjusts the inspection degree. can do. At the same time, it sends out a signal to the ejecting mechanism to inject the defective product. Therefore, the present invention automatically inspects the semiconductor BGA device parts and inspects the quality in real time in the manufacturing line, contributing to the identification of the cause of the defective rate and improvement of quality and improving productivity. If a defect is detected, the main computer sends a bad output signal to the PLC to send out an output signal to the user so that the user can recognize the defect, and at the same time, sends a signal to the ejecting mechanism to automatically eject the defective product. . In addition, the user can change the parameters related to the inspection setting or adjust the inspection degree if necessary, and is designed to be more flexible and convenient than the conventional simple function, and ultimately reduce the defective rate to contribute to the improvement of quality and productivity. It became.

The present invention is designed to prevent contamination during the alignment and inspection process, which is a conventional problem, and the inspection speed is reduced by about two times or more compared to the conventional method, and the inspection accuracy, that is, the inspection yield is improved by three times compared with the conventional method. Developed together.

The present invention relates to the construction, inspection method, and specification of a machine vision system for inspecting semiconductor BGA device components, reporting inspection results to users, and isolating defective products. This vision system includes one line scan CCD camera for BGA inspection, a frame grabber, computer for image processing, hardware and software for lighting, and one area scan CCD camera for frame inspection, image processing for review inspection. It consists of hardware and software such as computer and lighting equipment. The user of this system is operated by using monitor, mouse, and keyboard, and it adopts button type menu and Wizard method so that user can operate easily and conveniently. The system was developed with a camera unit, a frame grabber unit, an optics unit, a control panel, and four modules and instrumentation units.

- a digital CCD camera is an apparatus for recording an image of the object, image data is transferred to the memory of the computer via the Image Frame Grabber. CCD camera consists of camera body, signal cable and lens.

- Frame Grabber is a device subject to transmit image data stored in the CCD Camera, is also in charge of driving and interface of the CCD camera. The frame grabber used in this system consists of three parts: camera interface, image memory and PCI bus interface.

- lighting devices Appropriate lighting equipment is used according to the inspection object and item, and the lighting equipment of this system is composed of red LED light, source and bracket as top lighting. The review lighting device is a top light and consists of a red LED light and a half mirror light.

The control unit was developed as a PLC and other electrical and electronic systems that provide output to the host computer and peripheral equipment for driving motion control, proximity sensors, lighting controls, inspection programs and reports on defective parts.

The software sector consists of a hardware interface module, such as a frame grabber for obtaining a BGA image of the inspection program, a digital I / O that sends the inspection result signal to the PLC, and a UI module for displaying the interface and inspection status with the user. It is developed as a test setup module for selection and test configuration, and a kernel module for analyzing, processing, and measuring images. The inspection performance and inspection items of this development system are as follows.

 1. Inspection Tact time and speed:

-Inspection time: 20 ~ 60 ms

-Inspection accuracy: 0.2 ~ 03Mil

 2. Inspection item of inspection subject:

-Ball Presence: Missing Ball, Double ball, Extra ball

-Ball Position: 10um (0.5Mil)

-Ball Pitch: 10um (0.5Mil

-Ball Size: Large Ball, Snall Ball 10um (0.5mil)

-Ball Quality: Circularity

-Package Surface: Reject Mark

-Package Dimension: 12um (0.5Mil)

-Miss Align: 12um (0.5Mil)

The software part displays the interface and inspection status with the hardware interface module such as a frame grabber for obtaining the BGA image of the inspection program, digital I / O which sends the inspection result signal to the PLC as shown in [Fig. 1]. It was developed as a UI module for selecting, inspection setting module for selecting inspection items and inspection environment setting, and kernel module for analyzing, processing, and measuring images. The following is about each drawing, etc. First, [FIG. 3] shows that the inspection is performed by adjusting the X-Y precision stage by the concept of the present development equipment. [Figure 4] is a UI showing the display screen and control of the equipment as a whole screen, [Figure 5] is a calibration complete screen of the camera, lighting, optical system, etc. of the vision system, and [Figure 6] is the BGA inspection equipment It is an external appearance, [FIG. 7] shows a control board flowchart, and [FIG. 8] shows an inspection method in a flow chart. 9 is a view showing the angle adjustment position of the measuring device, etc. [10] is a picture of the entire equipment and each part. FIG. 11 is a self-developed Auto X-Y-Z motorized stage part, and FIG. 12 is a front view and a side view of a self-developed Auto X-Y-Z motorized stage part. FIG. 13 is a plan view of a self-developed Auto X-Y-Z motorized stage unit, and FIG. 14 shows the entire equipment drawing and a front view, a plan view, a side view, and an elevation view.

1 is a software internal structure diagram such as image acquisition and image processing.

2 is a diagram illustrating a process such as the operation flow of the entire equipment and the alignment of parts, and the control process of each part is also included to make it easy to understand.

3 is an overall equipment structure diagram and configuration diagram.

4 is an inspection screen GUI.

5 is a calibration complete screen of a camera, lighting, an optical system, and the like of a vision system.

6 is an overall appearance of the equipment.

7 shows a control board flowchart.

8 shows the inspection method in a flow chart.

Figure 9 shows the angle adjustment position of the measuring instrument and the like.

Figure 10 shows the appearance of the overall equipment.

11 is an auto-developed Auto X-Y-Z motorized stage.

12 is a plan view of a self-developed Auto X-Y-Z motorized stage.

13 is a front view and a side view of a self-developed Auto X-Y-Z motorized stage.

Figure 14 shows the external equipment and front view, side view, elevation view of the overall equipment.

Claims (17)

Invention of semiconductor device visual device automatic inspection equipment  [Figure 1] and internal structure diagram of Software such as image acquisition and image processing  2 is a schematic diagram illustrating a process such as an operation flow and alignment of an entire apparatus.  Control process diagram of each unit Instrument design and structure diagram of image acquisition unit  3 and the mechanical design, structure, function, etc. of the BGA overall inspection equipment  [Figure 4] and screen configuration, structure  5 and the overall appearance of the equipment, appearance.  6 and the alignment principle of the photo and camera, lighting, optical system, and the like of the BGA vision system.  7 and control board flow chart, control mechanism design, control structure, function  8 and system operation principle and method  9 and the angle adjusting position of the measuring instrument  [Figure 10] and the overall equipment, such as each part and configuration design  Motorized X-Y-Z Stage Blueprint and Stage Adjustment Method  FIG. 11 and an auto-developed Auto X-Y-Z motorized stage unit.  12 is a front view, side view of the self-developed Auto X-Y-Z motorized Stage.  Figure 13 and a plan view of a self-developed Auto X-Y-Z motorized Stage.  [Fig. 10] and the overall equipment picture and each configuration and design.  [Figure 14] and the external equipment and front view, side view, elevation view of the entire equipment

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