KR20110001176A - Manufacturing method for organic light emitting device - Google Patents

Abstract

PURPOSE: An organic light emitting device manufacturing method is provided to prevent the damage of a panel which may occur during the manufacturing process by spreading the protective material made of acryl resin on a dummy part of a substrate. CONSTITUTION: A first electrode(121) is formed on a first substrate(110). An organic film(122) is formed on the first electrode. A second electrode(123) is formed on the organic film. The first substrate is attached with a second substrate(130). The curing agen(150) is spread on a dummy part(135) of the second substrate.

Description

Manufacturing Method for Organic Light Emitting Device {Manufacturing Method For Organic Light Emitting Device}

The present invention relates to a method of manufacturing an organic light emitting display device, and more particularly, to a method of manufacturing an organic light emitting display device, which prevents a substrate from being broken during a scribing process, thereby improving product reliability and productivity. .

Recently, the importance of flat panel displays (FPDs) has increased with the development of multimedia. In response to this, a variety of liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs), organic light emitting devices (Organic Light Emitting Devices), etc. Flat panel displays have been put into practical use.

In particular, the organic light emitting device has a high response time with a response speed of 1 ms or less, low power consumption, and self-luminous light. In addition, there is no problem in viewing angle, which is advantageous as a moving image display medium regardless of the size of the device. In addition, low-temperature manufacturing is possible, and the manufacturing process is simple based on the existing semiconductor process technology has attracted attention as a next-generation flat panel display device in the future.

In general, an organic light emitting display device is formed by forming a plurality of light emitting diodes including a first electrode, an organic layer, and a second electrode on a first substrate, sealing the second substrate and the substrate with an adhesive, and then manufacturing the same. Scribing produces the final product. However, in the scribing process, there is a problem in that the second substrate of the organic light emitting display device is damaged.

The present invention provides a method of manufacturing an organic light emitting device that can improve the reliability and productivity by preventing the substrate from being damaged during the scribing process of the organic light emitting device.

According to one or more exemplary embodiments, a method of manufacturing an organic light emitting display device includes: forming a plurality of organic light emitting diodes on a first substrate, bonding the first substrate to a second substrate, and a pile of the second substrate. It may include applying a protective agent to the portion and reducing the thickness by etching the first substrate and the second substrate.

The dummy portion of the second substrate may be a portion protruding outward from the outermost portion of the first substrate.

The protective agent may be an acrylic resin.

The acrylic resin may be any one selected from the group consisting of urethane acrylate, methyl methacrylate, methyl acrylate, ethyl acrylate, methacrylate, butyl acrylate and cyano acrylate.

The protective agent may be applied in a thickness of 0.1 to 3mm.

After applying the protective agent to the dummy portion of the second substrate, the protective agent may further comprise the step of natural curing.

The natural hardening may be performed for 1 second to 1 minute.

The etching of the first substrate and the second substrate may be performed by etching the bonded first substrate and the second substrate in a hydrofluoric acid (HF) solution.

The etching of the first substrate and the second substrate may be performed for 1 to 30 minutes.

After the etching of the first substrate and the second substrate to reduce the thickness, scribing the bonded first substrate and the second substrate by a stick unit including a plurality of organic light emitting diodes; The method may further include performing lighting inspection of the plurality of organic light emitting diodes in units of sticks, and scribing the plurality of organic light emitting diodes in units of sticks to respective individual organic light emitting diodes.

The organic electroluminescent device of the present invention has an advantage of preventing damage to the substrate during the scribing process, thereby improving the reliability and productivity of the product.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing an organic light emitting diode according to an exemplary embodiment of the present invention, and FIGS. 2A to 2E are diagrams illustrating a method of manufacturing an organic electroluminescent device according to the flowchart of FIG. 1. . Hereinafter, the flowchart of FIG. 1 and the drawings of respective processes of FIGS. 2A to 2E will be described together.

Referring to FIG. 2A, an organic light emitting diode 120 is formed on the first substrate 110 (S10).

In more detail, any one of indium tin oxide (ITO), indium zinc oxide (IZO) or zinc oxide (ZnO) is sputtered or evaporated on a transparent substrate 110 made of glass, plastic, or a conductive material. The first electrode 121 is formed by evaporation, vapor phase deposition, or electron beam deposition.

In this case, the first electrode 121 may be an anode and may be a transparent electrode or a reflective electrode. When the first electrode 121 is a transparent electrode, the first electrode 121 may be formed of any one of indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). In addition, when the first electrode 121 is a reflective electrode, the first electrode 121 may be formed of any one of aluminum (Al), silver (Ag), or nickel (Ni) under a layer made of any one of ITO, IZO, or ZnO. The reflective layer may further include a reflective layer, and in addition, the reflective layer may be included between two layers made of any one of ITO, IZO, or ZnO.

In the present exemplary embodiment, the passive matrix organic light emitting diode is described as an example, but the thin film transistor is not disclosed, but the present invention is not limited thereto. That is, the first substrate 110 may further include a thin film transistor including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode.

Subsequently, a material emitting red, green, or blue light is deposited on the first electrode 121 to form an organic layer 122 including at least a light emitting layer. Further, a hole injection layer, a hole transport layer, an electron transport layer or an electron injection layer may be further formed on or below the light emitting layer.

In this case, the hole injection layer may play a role of smoothly injecting holes from the first electrode 121 to the light emitting layer, and may include cupper phthalocyanine (CuPc), poly (3,4) -ethylenedioxythiophene (PEDOT), and polyaniline (PANI). ) And NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine) may be formed of any one or more selected from the group consisting of, but is not limited thereto.

In addition, the hole transport layer serves to facilitate the transport of holes, NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'-bis- (3-methylphenyl) -N, N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenyl-amino) -triphenylamine) It may be formed as above, but is not limited thereto.

In addition, the emission layer may be formed of a material emitting red, green, and blue, and may be formed using a phosphorescent or fluorescent material. When the light emitting layer is red, CBP (carbazole biphenyl) or mCP (including host material containing 1,3-bis (carbazol-9-yl), PIQIr (acac) (bis (1-phenylisoquinoline) acetylacetonate iridium), PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) formed of a phosphor containing a dopant including any one or more selected from the group consisting of Alternatively, the present invention may be formed of a fluorescent material including PBD: Eu (DBM) ₃ (Phen) or perylene, but is not limited thereto. When the light emitting layer is green, it includes a host material including CBP or mCP. , Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium) may be formed of a phosphor including a dopant material, and alternatively, a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum) But may not be limited thereto. If the blue, it includes a host material including CBP or mCP, and can be formed of a phosphorescence material including a dopant material including _{(4,6-F 2 ppy) 2} Irpic, alternatively, spiro-DPVBi, It may be formed of a fluorescent material including any one selected from the group consisting of spiro-6P, distilbenzene (DSB), distriarylene (DSA), PFO-based polymer and PPV-based polymer, but is not limited thereto.

In addition, the electron transport layer serves to facilitate the transport of electrons, and may be formed of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq, and SAlq. However, the present invention is not limited thereto.

In addition, the electron injection layer serves to facilitate the injection of electrons, but may be formed of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq, but is not limited thereto.

As described above, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the electron injection layer may be formed by an evaporation method, a spin coating method or a co-deposition method.

Subsequently, the second electrode 123 is formed by depositing magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag), or an alloy thereof having a low work function on the organic layer 122. In this case, the second electrode 123 may be formed to have a thickness thin enough to transmit light when the organic light emitting diode is a front or double-side light emitting structure, and when the organic light emitting diode is the bottom light emitting structure, light may be emitted. It can be formed thick enough to reflect.

As described above, the organic light emitting diode 120 including the first electrode 121, the organic layer 122, and the second electrode 123 may be formed, and although not shown in the drawing, the organic light emitting diode is driven. A driving unit may also be formed.

Next, the first substrate 110 and the second substrate are bonded to each other (S20).

More specifically, after applying an adhesive 140 such as a sealant or a frit on a second substrate 130 made of a transparent glass substrate, the first substrate 110 having a plurality of organic light emitting diodes 120 formed thereon. And the second substrate 130 are aligned and bonded to each other.

Next, the adhesive 140 of the bonded first substrate 110 and the second substrate 130 is cured.

In this case, when the coated adhesive 140 is a sealant, UV may be cured by irradiation, and when the adhesive 140 is a frit, laser curing may be performed.

Next, referring to FIG. 2C, which is a plan view of FIGS. 2B and 2B, a protective agent 150 is applied to the dummy part 135 of the second substrate 130.

In more detail, a plurality of panels including the emission region 170 are positioned on the first substrate 110 and the second substrate 130.

Here, the second substrate 130 may be larger than the first substrate 110 in which the organic light emitting diode 120 is formed on the process margin. Therefore, when the first substrate 110 and the second substrate 130 are bonded to each other, the dummy part 135 of the second substrate 130 protruding out of the first substrate 110 is present. The protective agent 150 is applied to the dummy part 135 of the second substrate 130.

The protecting agent 150 may use an acrylic resin as a material having a strong physical property against hydrofluoric acid (HF), which is an etching liquid, in a later step of etching the substrate. Examples of the acrylic resin may be any one selected from the group consisting of urethane acrylate, methyl methacrylate, methyl acrylate, ethyl acrylate, methacrylate, butyl acrylate and cyano acrylate, and cyano acryl Rate can be used.

In particular, the cyanoacrylate reacts with moisture in the air, as shown in Scheme 1 below, and the cyanoacrylate is polymerized to form a polymer chain, thereby rapidly curing. Therefore, the protective agent 150 applied to the dummy part 135 of the second substrate 130 may be naturally cured for 1 second to 1 minute.

(○ in Scheme 1 represents an unshared electron pair.)

In addition, the protecting agent 150 may be applied to the dummy part 135 of the second substrate 130 at a thickness t of 0.1 to 3 mm. Here, when the thickness of the protective agent 150 is 0.1mm or more, the dummy portion 135 of the second substrate 130 may be prevented from being etched by the etchant in a subsequent etching process, and the thickness of the protective agent 150 is 3mm. If it is below, it can prevent that time takes for hardening the protective agent 150 long.

Next, the bonded first and second substrates 110 and 130 are etched (S50).

That is, the first substrate 110 and the second substrate 130 are immersed in the hydrofluoric acid (HF) etchant to etch. At this time, the surface of the first substrate 110 and the second substrate 130 is etched by the etchant to reduce the thickness.

This etching process may be performed for 1 to 30 minutes, preferably 10 to 20 minutes.

Next, referring to FIG. 2D, the bonded first substrate 110 and the second substrate 130 are scribed in units of sticks (S60).

In this case, the scribing process may be scribed using a scribing wheel or a laser cutting method. In addition, when scribing in units of sticks, the dummy part 135 and the protection agent 150 applied to the dummy part 135 of the upper and lower side of the second substrate 130 may be scribed and removed. .

In addition, the second substrate 130 is scribed smaller than the first substrate 110 so that the driving unit 160 is exposed in the scribing process.

Next, a signal is applied to the driver 160 of each of the exposed panels through a probe test device to perform a lighting test.

Through such lighting inspection, the panel of each stick unit is inspected for good or poor and returned to the disposal or repair process if it is determined to be defective, and to a later process if it is determined to be good.

Next, referring to FIG. 2E, each of the first and second substrates 110 and 130 in a stick unit is scribed into individual panels (S80).

At this time, the scribing process may use the above-described scribing wheel or laser cutting method, the protective agent 150 applied to the dummy portion 135 and the dummy portion 135 of the second substrate 130 is scribed It can be iced and removed.

Finally, the individual scribed panels 180 may be shipped through a post process such as packaging (S90).

As described above, in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, by applying a protective agent to the dummy portion of the second substrate, the dummy portion is etched in the substrate etching process so that the dummy portion of the second substrate is a subsequent process (2). There is an advantage to prevent the panels from breaking in one scribing process).

Therefore, the scribing process of the second substrate, which is conventionally scribed first, secondly scribed on a stick basis, and thirdly scribed by individual panels, can be reduced to two times. There is an advantage to improve the productivity.

Hereinafter, preferred embodiments of the present invention will be described in order to help understanding of the present invention. However, the following examples are merely to illustrate the present invention is not limited to the following examples.

Experiment: Measurement of panel damage according to the type of protective agent

<Examples>

On the lower substrate having a thickness of 1.26 mm and having a size of 365 × 460 mm, ITO was formed to have a thickness of 130 nm as a first electrode, and DPVBi (4,4′-bis (2,2) as a host on the first electrode. Perylene was mixed with 2 wt% of '-diphenyl vinyl) -1,1'-biphenyl) to form a blue light emitting layer having a thickness of 25 nm, and then the Al film was 150 nm thick with a second electrode. To form a light emitting diode.

Next, the sealant was applied to the upper substrate having a thickness of 1.26 mm and the size of 370 × 470 mm, and then bonded to the lower substrate to be UV cured. Then, after applying Loctite instant adhesive having a cyanoacrylate as a main component to a dummy portion of the upper substrate to a thickness of 390㎛, it was naturally cured for 30 seconds. Thereafter, the substrates were etched by immersing in a hydrofluoric acid etchant for 20 minutes.

Comparative Example 1

It was prepared under the same conditions as in the above-described embodiment except that UV curing was performed using a 3bond UV curing agent which is a UV curing agent as a protective agent.

Comparative Example 2

A protective agent was prepared under the same conditions as in the above-described example except that Aixa instant adhesive mainly containing epoxy was used.

After scribing the panels of the organic light emitting diodes manufactured according to Examples and Comparative Examples 1 and 2 in units of sticks, the panels were observed for breakage and are shown in Table 1 below.

Type of protection Thickness of dummy part after etching (㎛) Damage Example Cyanoacrylate 380.5 Not broken Comparative Example 1 UV curing agent 199.3 damage Comparative Example 2 Epoxy 150.3 damage

Referring to Table 1, when looking at the remaining thickness of the dummy portion after etching the substrates according to the embodiment of the present invention and Comparative Examples 1 and 2, the embodiment has almost no change in thickness, while Comparative Examples 1 and 2 are half the thickness It can be seen that the decrease below.

Therefore, in the case of the embodiment using a strong protective agent, that is, an acrylic resin to the etching solution of the substrate, it can be seen that the panel is not damaged because the thickness of the dummy part is thick during the scribing process. On the other hand, in case of comparative examples using a weak protective agent in the etchant of the substrate, the protective layer does not protect the dummy portion of the substrate and the substrate is etched thin, it can be seen that the panel is damaged in the scribing process later.

Through the above experiments, the method of manufacturing an organic light emitting display device according to an embodiment of the present invention by using a protective agent that can be easily applied to the dummy portion of the substrate, thereby preventing damage to the panel that may occur in the manufacturing process There is an advantage that can be prevented.

In addition, the conventional three scribing process can be reduced to two, there is an advantage that can improve the productivity of the product.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 is a flow chart showing a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

2a to 2e is a process-specific diagram showing a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Claims (10)

Forming a plurality of organic light emitting diodes on the first substrate; Bonding the first substrate to a second substrate; Applying a protective agent to the dummy portion of the second substrate; And And etching the first substrate and the second substrate to reduce the thickness of the organic light emitting diode. The method of claim 1, The dummy portion of the second substrate is a manufacturing method of the organic light emitting device is a portion protruding out more than the outermost of the first substrate. The method of claim 1, The protective agent is a method of manufacturing an organic light emitting device is an acrylic resin. The method of claim 3, wherein The acrylic resin is a method of manufacturing an organic light emitting device is any one selected from the group consisting of urethane acrylate, methyl methacrylate, methyl acrylate, ethyl acrylate, methacrylate, butyl acrylate and cyano acrylate. The method of claim 1, The protective agent is a method of manufacturing an organic light emitting device to apply a thickness of 0.1 to 3mm. The method of claim 1, After applying the protective agent to the dummy portion of the second substrate, The method of manufacturing an organic light emitting device further comprising the step of natural curing the protective agent. The method of claim 6, The natural hardening is performed for 1 second to 1 minute. The method of claim 1, Etching the first substrate and the second substrate, A method of manufacturing an organic light emitting display device, wherein the bonded first substrate and the second substrate are immersed in a hydrofluoric acid (HF) solution for etching. The method of claim 8, The etching of the first substrate and the second substrate is performed for 1 minute to 30 minutes. The method of claim 1, After the step of etching the first substrate and the second substrate to reduce the thickness, Scribing the bonded first substrate and the second substrate by a stick unit including a plurality of organic light emitting diodes; Performing lighting inspection of the plurality of organic light emitting diodes in units of sticks; And And scribing the plurality of organic electroluminescent devices in the stick unit to each individual organic electroluminescent device.

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