KR20100115279A - Apparatus for burn-in test of semiconductor chip - Google Patents

Abstract

PURPOSE: The burn-in test setup of the semiconductor chip wirelessly transmits and receive the signal for test in the lead / light cycle. The delay time to the lead is reduced after the light and the ability of test is improved. CONSTITUTION: The connection part(30) transfers the inputted test signal in the light cycle to the chip(60) of the burn-in board(50). The wireless transceiver(100a) comprises controller and antenna. After modulating the test result value coming out from the data-out pin of chip into the frequency, the wireless transceiver outputs to the outside D/C of the burn in chamber outside.

Description

Apparatus for Burn-In test of semiconductor chip

The present invention relates to a burn-in test device for a semiconductor chip, and particularly includes a burn-in board (BIB) and a burn-in chamber outside the burn-in chamber, in which a test result value of a chip to be tested during a read / write cycle is defective. The present invention relates to an apparatus capable of performing a fast burn-in test with reliability by eliminating a time delay caused by an impedance during a burn-in test by wirelessly transmitting / receiving with a driver / comparator (D / C) for determining the control.

The semiconductor manufacturing process is largely divided into a preprocess called FAB and a postprocess called packaging / test.

The preceding process is a process of mounting a circuit device to be manufactured through various processes (diffusion, photo, etching, ion implanting and thin film) on a silicon oxide thin film called a wafer, and the post process is performed on the wafer manufactured through the previous process. After a specific test (probe / test) for each individual device and sawing (bonding, molding, trim / form) by device unit, the final shipment test (burn-in test and final test).

Among these, the burn-in test in the post-process is a test performed to increase the productivity of the final test. The burn-in test is performed to raise the temperature to 125 ° C. at room temperature, and the temperature after the burn-in test is 60 ~. The pattern test was lowered to 75 ° C., and the test result was returned to room temperature and sorted. At this time, the burn-in time is set differently according to the use.

The semiconductor equipment for this burn-in test is divided into the first generation memory burn-in test (MBT), the second generation MBT, and the third generation MBT.The first generation MBT is a monitoring burn-in tester capable of monitoring burn-in results, and the second generation MBT. Is a tester equipment with faster processing speed and data management capability than the first generation, and the third generation is a TDBI (Test During Burn-in) that has the functions of the first and second generations and can test the characteristics of the device itself.

1 is a configuration diagram showing a burn-in test apparatus of a conventional semiconductor chip.

As shown in FIG. 1, the TDBI, which is a burn-in test device, includes a clock generator 10 including a pattern generator (PG) or a tachometer generator (TG) for downloading and generating a test pattern for a burn-in test, and the clock generator 10. Receives a signal for testing a chip (device in a burn-in board (BIB) 50 inserted into a plurality of slots) 60 and sends it to each chip 60 through a connection part 30, and the connection part 30 It is composed of a D / C (Driver / Comparator) 20 to receive a signal for searching the output result of the chip 60 to determine the pass and fail (Pass / Fail).

Such a conventional burn-in test apparatus of a semiconductor chip is manufactured for 10 MHz, and the impedance generated in each board, connector, and cable in the burn-in test apparatus is not considered. As a result, an error occurs due to a time delay before the test pattern is delivered to the device. If a time delay is allowed during burn-in test to solve this problem, the test performance decreases as the test time increases. have.

In addition, as shown in FIGS. 2A and 2B, chips 60 inserted into a plurality of slots in the burn-in board 50 are connected in parallel, so that a test signal input to the chip 60 is written to a light ( At the time of write, all are written at the same time at the same time as in the graph of FIG. 2A, while at the time of reading out the test result value from the chip 60, the individual selection reads are performed as shown in the graph of FIG. 2B. SI (Service Information) is different at the time of reading. This causes a problem that cannot be tested at the same frequency.

On the other hand, if the connection of the chip 60 is not connected in parallel in order to solve the problem caused by the parallel connection of the chip 60, there is a problem that the number of chips 60 that can be tested per burn-in board is reduced .

Therefore, while eliminating the parallel connection in the burn-in board 50 as another method for solving the problem caused by the parallel connection of the chip 60, it is possible to increase the number of channels 60 to increase the number of the chip 60 can be tested. have. However, the cost of the system is increased due to the increase in the number of channels, and a plurality of connectors must be used to satisfy the high-speed test according to the increase in the number of channels, and as the size of the burn-in board 50 is limited, There is a problem that the number of connectors that can be configured in the burn-in board 50 is limited so that the number of channels cannot be effectively increased.

Therefore, the present invention has been made to solve the above problems, by embedding a device for wireless communication with the outside of the chamber in the burn-in board by wirelessly transmitting and receiving a signal for testing the chip to be tested during the read / write cycle An object of the present invention is to provide a fast burn-in test apparatus for a semiconductor chip.

Another object of the present invention is to wirelessly transmit and receive a signal for a test during a read / write cycle, thereby reducing the time delay between the test result and the read lead, thereby improving the performance of the burn-in test. To provide a test device.

Another object of the present invention is to perform a burn-in test of the final test (burn-in test) to perform a final test (high-end) through expensive equipment in the post-process as the burn-in test at a high speed To provide.

Another object of the present invention is to divide the chips in the burn-in board into a plurality of zones to perform the burn-in test of the chips for each zone and to output the test result of the chip to the outside through the existing wired network through the connection section for each burn-in test The present invention provides a burn-in test apparatus for a semiconductor chip that can reduce time delays.

Yet another object of the present invention is to divide a chip in a burn-in board into a plurality of zones and perform burn-in tests of the chips in each zone, thereby reducing the number of radio transceivers and performing burn-in tests at a high speed. To provide.

The feature of the burn-in test device of the semiconductor chip according to the present invention for achieving the above object is that each chip on the basis of the test signal input during the write cycle of the signal for testing a plurality of chips generated from the clock generator It includes a wireless transceiver that modulates the test result value (voltage value) from the data out pin of the chip during the reader cycle to a frequency and outputs it to an external D / C (Driver / Comparator) outside the burn-in chamber through wireless communication.

Another feature of the burn-in test apparatus of the semiconductor chip according to the present invention for achieving the above object is to divide the chip in the burn-in board into at least two or more zones for each zone, is configured for each zone, generated by the clock generator Based on the test signal input during the write cycle among the signals for testing a plurality of chips, the chip included in each zone modulates the test result value (voltage value) from the data out pin of the chip during the reader cycle into a frequency and then wirelessly It includes at least two transceivers for outputting to the external D / C outside the burn-in chamber through communication.

Another feature of the burn-in test device of the semiconductor chip according to the present invention for achieving the above object is to divide the chip in the burn-in board into at least two or more zones for each zone, is configured for each zone, generated in the clock generator Based on the test signal input during the write cycle among the signals for testing a plurality of chips, the test result value (voltage value) coming from the data out pin of the chip during the reader cycle from the chips included in each zone to the wire through the connection part. It includes at least two transceivers to output to the external D / C outside the burn-in chamber.

Preferably, each transmitting and receiving unit stores the test result values input from each chip in the storage unit configured for each zone, and then transmits the test result values stored in the storage unit for each zone to the D / C at predetermined time intervals. It is done.

Another feature of the burn-in test device of the semiconductor chip according to the present invention for achieving the above object is to divide the chip in the burn-in board into at least two or more zones for each zone, and configured for each zone, a plurality of clock generator At least two radios that output the test result value (voltage value) from the data out pin of the chip during the reader cycle in the chip included in each zone based on the test signal input during the write cycle among the signals for testing two chips. It includes a transceiver and an integrated transceiver for receiving the test result value output from the wireless transceiver and output to the external D / C outside the burn-in chamber through wireless communication.

Another feature of the burn-in test device of the semiconductor chip according to the present invention for achieving the above object is to divide the chip in the burn-in board into at least two or more zones for each zone, and configured for each zone, a plurality of clock generator At least two radios that output the test result value (voltage value) from the data out pin of the chip during the reader cycle in the chip included in each zone based on the test signal input during the write cycle among the signals for testing two chips. And a transceiver and at least two integrated transceivers for outputting the test result values output from the wireless transceiver to external D / C outside the burned-in chamber through a connection unit.

Preferably, the test result value output from the wireless transceiver is transmitted to the integrated transceiver through wireless or wired communication.

Preferably, the transceiver unit or the integrated transceiver unit includes a storage unit for storing a test result value (voltage value), wherein the storage unit is detachable from the burn-in board at regular intervals to move the test result value to the outside. It is characterized by.

Preferably, the wireless transceiver comprises a controller and an antenna, characterized in that for receiving the test signal input during the write cycle to the wireless communication to transmit to each chip.

The burn-in test apparatus of the semiconductor chip according to the present invention as described above has the following effects.

First, by sending and receiving signals for testing wirelessly during the read / write cycle, the test results can improve test performance by reducing the delay time from write to read.

Second, the chips in the burn-in board may be divided into a plurality of zones, and burn-in tests of the chips may be performed in each zone to perform burn-in tests at high speed.

Third, the chips in the burn-in board are divided into a plurality of zones to perform burn-in tests of the chips in each zone, and the test results of the chips are output to the outside through the existing wired network through the connection unit for each zone. High speed, high test performance can be achieved without major structural changes.

Fourth, as the burn-in test is performed at high speed, some of the final tests performed by the expensive equipment in the post-process can be performed during the burn-in test, thereby improving productivity and reducing costs. have.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments with reference to the accompanying drawings.

A preferred embodiment of the burn-in test apparatus for a semiconductor chip according to the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be embodied in various forms, and only the present embodiments are intended to complete the disclosure of the present invention and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

First embodiment

3 is a block diagram illustrating a structure of a burn-in test apparatus of a semiconductor chip according to an exemplary embodiment of the present invention.

As shown in FIG. 3, the burn-in test apparatus includes a connection unit 30 which transmits a test signal input during a write cycle among the signals for testing the plurality of chips 60 in the clock generator 10 to each chip 60. On the basis of the test signal transmitted through the connection unit 30, each chip 60 modulates the test result value (voltage value) coming from the data out pin of the chip 60 at a reader cycle into a frequency and then performs wireless communication. It is composed of a wireless transceiver 100a that outputs to the external D / C 20 outside the burn-in chamber 40 through.

At this time, the wireless transceiver 100a includes a controller and an antenna, and the test signal input during the light cycle from the connection unit 30 is also received by wireless communication using the wireless transceiver 100a to each chip ( 60). However, in the present specification, since the test signals input during the write cycle are all written at once as shown in the graph of FIG. 2A, no time delay occurs. Therefore, only the test result values output during the read cycle are output to the wireless transceiver 100. The description will be limited to those received from. And it should be noted that the above-described limited embodiment is for the purpose of description and not of limitation.

The wireless transceiver 100a may transmit a test result value input from each chip 60 to the D / C 20 in real time, and also add a separate storage unit together with a controller and an antenna, thereby providing each chip. The test result value inputted at 60 may be stored in the storage unit and then transmitted to the D / C 20 at predetermined time intervals. In this case, when the wireless transceiver 100a transmits the test result to the D / C 20 in real time, the test result values received by the D / C 20 may be simultaneously received. In order to reduce interference between them, it is preferable to transmit using different carrier frequencies for each chip 60. When the wireless transceiver 100a transmits the test results stored in the storage unit to the D / C 20 at predetermined time intervals, since the test results are sequentially transmitted, interference between the test result values does not occur. It is preferable to transmit on a carrier wave.

For reference, in the case of the burn-in board 50, the temperature is raised to 125 ° C. at the time of testing, so that the wireless transceiver 100a (controller, antenna, storage) may be used at high temperature. For example, a high-temperature radio chip, which is a broadband semiconductor using GaN, should be used. In this case, the high-temperature wireless chip is a known technology and detailed description thereof will be omitted.

As such, the chip 60 to be burn-in test can be tested at the same time without the time delay of the chips 60 in the burn-in board 50 by installing the wireless transceiver 100a on each of them to improve the test performance. Can be.

Second embodiment

However, the burn-in test apparatus having the configuration as shown in FIG. 3 requires the same number of wireless transceivers 110a as the number of chips 60 to perform the burn-in test. In other words, when the 400 chips 60 are burned in, the 400 wireless transceiver 100a is required, which increases the cost of the burn-in test apparatus.

FIG. 4 is a block diagram illustrating a structure of a burn-in test apparatus of a semiconductor chip according to another exemplary embodiment to solve the problem of FIG. 3.

As shown in FIG. 4, the burn-in test apparatus includes a connection unit 30 which transmits a test signal input during a write cycle among the signals for testing the plurality of chips 60 in the clock generator 10 to each chip 60. The chip 60 in the burn-in board 50 is divided into a plurality of zones 60a, 60b, 60c, 60d, 60e, and 60f for each zone, and is configured for each zone, so that the connection portion 30 is divided. On the chip 60 included in each zone, the test result value (voltage value) from the data out pin of the chip 60 is modulated to a frequency based on the test signal transmitted through the burn-in chamber through wireless communication. 40 is composed of a plurality of wireless transceiver 100b output to the external D / C (20). At this time, by configuring the plurality of wireless transceiver 100b as a wired transceiver, the test result of the chip 60 obtained in each zone is external D / C outside the chamber 40 burned into the wire through the connector 30. 20). However, in the present embodiment, for the sake of clarity, only the output to the external D / C 20 through wireless communication will be described. However, it should be noted that this is for the purpose of describing the present invention in detail and is not intended to be limiting.

Therefore, when the burn-in test is performed by using the burn-in test apparatus configuring the wireless transceiver 100b one by one for each of the plurality of zones as shown in FIG. 4, first, the connection unit 30 is a chip provided by the clock generator 10. The test signal input during the write cycle among the signals for testing 60 is transferred to each chip 60 divided by regions.

Subsequently, the chip 60 outputs a test result based on the input test signal during a reader cycle, and each wireless transceiver 100b configured for each zone is located in a plurality of chips 60 within its own zone. After receiving the test result value (voltage value) output during the reader cycle in the data out pin of the modulated to the frequency and outputs to the external D / C (20) outside the burn-in chamber 40 through wireless communication.

The wireless transceiver 100b may transmit the test result value input from each chip 60 to the D / C 20 in real time for each zone, and also add a storage unit for each zone along with a controller and an antenna. For example, the test result values input from each chip 60 may be stored in the storage unit, and the test result values stored in the storage unit may be transmitted to the D / C 20 for each region at predetermined time intervals. .

As such, when the wireless transceiver 100b transmits the test results to the D / C 20 in real time for each zone, the wireless transceiver 100b may reduce the interference of the test results simultaneously received by the D / C 20. It is preferable to transmit stars 60a, 60b, 60c, 60d, 60e and 60f using different carrier frequencies. When the wireless transceiver 100a transmits the test results stored in the storage unit to the D / C 20 at predetermined time intervals, since the test results are sequentially transmitted and no interference is generated, the wireless transceiver 100a transmits a single carrier. desirable.

As shown in FIG. 4, the burn-in test apparatus is configured to perform the burn-in test by dividing the burn-in board 50 for each zone, thereby reducing the number of wireless transceivers 100b compared to the burn-in test apparatus of FIG. 3. That is, when testing the 400 chips 60, when configuring the wireless transceiver 110a of the same number as the number of the chip 60 as shown in Figure 3, but need 400 wireless transceiver 100a In the case of configuring one wireless transceiver 100b for each zone as shown in FIG. 4, when divided into ten zones, only 40 wireless transceivers 100b are required, thereby reducing the cost of the burn-in test apparatus.

Third Embodiment

FIG. 5 is a block diagram illustrating a structure of a burn-in test apparatus of a semiconductor chip according to another exemplary embodiment for solving the problem of FIG. 3.

As shown in FIG. 5, the burn-in test apparatus includes a connection unit 30 which transmits a test signal input during a write cycle among the signals for testing the plurality of chips 60 in the clock generator 10 to each chip 60. The chip 60 in the burn-in board 50 is divided into a plurality of zones 60a, 60b, 60c, 60d, 60e, and 60f for each zone, and is configured for each zone, so that the connection portion 30 is divided. A plurality of wireless transceivers 100b for modulating the test result value (voltage value) coming from the data out pin of the chip 60 at the time of the reader cycle in the chip 60 included in each zone based on the test signal transmitted through the frequency 100b ) And an integrated wireless transceiver 200 that receives all frequencies modulated by the plurality of wireless transceivers 100b and outputs them to the external D / C 20 outside the burn-in chamber 40 through wireless communication. .

Therefore, the burn-in test using the burn-in test apparatus constituting the integrated wireless transceiver 200 for receiving and outputting all the modulated frequencies from the radio transceiver 100b, which is configured for each of a plurality of zones, as shown in FIG. 5. First, the chip 60 in the burn-in board 50 is divided into a plurality of zones 60a, 60b, 60c, 60d, 60e, and 60f for each zone, and one wireless transceiver for each zone. It constitutes 100b.

In addition, the plurality of wireless transceivers 100b configured for each zone are frequency-modulated by the test results of the plurality of chips 60 configured in the zone and then transmitted to one integrated wireless transceiver 200 again. At this time, the method of transmitting the test results from the plurality of wireless transceivers 100b to the integrated wireless transceiver 200 may be performed by any one of a wireless communication and a wired communication method.

Then, the integrated wireless transceiver 200 collects the test results of the chip 60 for each zone transmitted wirelessly or by wire, and outputs them to the external D / C 20 outside the burn-in chamber 40 through wireless communication.

The integrated wireless transmission / reception unit 200 may transmit the test result values input for each zone to the D / C 20 in real time, and also add a storage unit together with a controller and an antenna to store the input test result values. After storing the data in the storage unit, the data may be transmitted to the D / C 20 at predetermined time intervals. In this case, since the test results are transmitted sequentially and no interference is generated, it is preferable to transmit on a single carrier.

Fourth embodiment

6 is a block diagram illustrating a structure of a burn-in test apparatus of a semiconductor chip according to another exemplary embodiment for solving the problem of FIG. 3.

As illustrated in FIG. 6, the burn-in test apparatus transmits a test signal input during a write cycle among the signals for testing the plurality of chips 60 in the clock generator 10 to each chip 60, and each of the chips 60. A plurality of zones 60a, 60b, 60c, 60d, 60e, 60f are connected to the connection unit 30 to transmit the result value tested in the outside and the chip 60 in the burn-in board 50 for each zone. Test results coming out of the data out pin of the chip 60 during the reader cycle in the chip 60 included in each zone based on the test signal transmitted through the connection unit 30. A plurality of radio transceivers 100b for modulating a value (voltage value) into a frequency, and a chamber 40 that is wired through the connection unit 30 by receiving all frequencies modulated by the radio transceivers 100b. The integrated wired transmission / reception unit 300 outputs to the outside D / C 20).

Therefore, as shown in FIG. 6, the burn-in test constituting the integrated wired transceiver 300 that receives all modulated frequencies from the wireless transceiver 100b configured for each of the plurality of zones and outputs them to the outside through the connection unit 30. When the burn-in test is performed using the device, first, the chip 60 in the burn-in board 50 is divided into a plurality of zones 60a, 60b, 60c, 60d, 60e and 60f by zones, and each zone. One wired transceiver 100b is configured for each.

In addition, the plurality of wireless transceivers 100b configured for each zone are frequency-modulated by the test results of the plurality of chips 60 configured in the zone and then transmitted to one integrated wired transceiver 300. At this time, the method of transmitting the test results from the plurality of wireless transceivers 100b to the integrated wired transceiver 300 is performed by either a wireless communication or a wired communication method.

Then, the integrated wired transmission / reception unit 300 collects the test results of the chip 60 for each zone transmitted wirelessly or wired to the external D / C 20 outside the chamber 40 burned out through the connection unit 30. Output Accordingly, high speed and high test performance can be performed without major changes in the structure of the existing burn-in test apparatus.

The integrated wired transmission / reception unit 300 may transmit the test result value input for each zone to the D / C 20 in real time, and also adds a storage unit together with a controller and an antenna to receive the input test result value. After storing the data in the storage unit, the data may be transmitted to the D / C 20 at predetermined time intervals. In this case, since the test results are transmitted sequentially and no interference is generated, it is preferable to transmit on a single carrier.

Meanwhile, in the case of storing the test result values in the storage units in the wireless transceiver 100a, 100b, 200 and the wired transceiver 300 in the configuration of FIGS. 3 to 6, the wireless transceiver 100a ( Although it may be transmitted to the D / C 20 through the 100b) 200 and the wired transceiver 300, respectively, the storage in the configured wireless transceiver 100a, 100b, 200 and wired transceiver 300 The unit can be detachably mounted, and the test unit can be moved to the outside by removing the storage unit from the burn-in board at regular intervals by the administrator.

Although the technical spirit of the present invention described above has been described in detail in a preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a configuration diagram showing a burn-in test apparatus of a conventional semiconductor chip

2A and 2B are diagrams for explaining a structure in which chips inserted into a plurality of slots in a conventional burn-in board are connected in parallel, and a delay time generated during a write / read cycle in such a structure.

3 is a block diagram showing the structure of a burn-in test device of a semiconductor chip according to an embodiment of the present invention

4 is a block diagram showing the structure of a burn-in test device of a semiconductor chip according to another embodiment of the present invention

5 is a configuration diagram showing the structure of a burn-in test apparatus of a semiconductor chip according to another embodiment of the present invention

6 is a block diagram illustrating a structure of a burn-in test apparatus of a semiconductor chip according to another exemplary embodiment for solving the problem of FIG. 3.

DESCRIPTION OF THE REFERENCE NUMERALS

10: clock generator 20: D / C (Driver / Comparator)

30: connection part 40: chamber

50: burn-in board 60: chip

100, 200: wireless transceiver 300: wired transceiver

Claims (20)

Based on the test signal input during the write cycle among the signals for testing a plurality of chips generated by the clock generator, the test result (voltage value) coming from the data out pin of the chip during the reader cycle in each chip is modulated with frequency. And a wireless transceiver configured to output an external D / C (Driver / Comparator) outside the burn-in chamber through wireless communication. The method of claim 1, And the wireless transceiver transmits a test result value input from each chip to the D / C in real time. The method of claim 2, The wireless transceiver is a burn-in test device of the semiconductor chip, characterized in that for transmitting the test result value for each chip using a different carrier frequency (carrier frequency). The method of claim 1, The wireless transceiver stores the test result values input from each chip in a storage unit and transmits them to the D / C at predetermined time intervals. The method of claim 4, wherein The wireless transceiver of the semiconductor chip burn-in test apparatus, characterized in that for transmitting the test result value for each chip in a single carrier (carrier frequency). The chips in the burn-in board are divided into at least two zones for each zone, and are configured for each zone, and within each zone based on a test signal input during a write cycle among the signals for testing a plurality of chips generated from the clock generator. Including included at least two transceivers for modulating the test result value (voltage value) from the data out pin of the chip during the reader cycle to the frequency and output to the external D / C outside the burn-in chamber through wireless communication A burn-in test device for semiconductor chips. The chips in the burn-in board are divided into at least two zones for each zone, and are configured for each zone, and within each zone based on a test signal input during a write cycle among the signals for testing a plurality of chips generated from the clock generator A semiconductor comprising at least two transceivers for outputting a test result value (voltage value) coming from a data out pin of a chip during a reader cycle in an included chip to an external D / C outside the chamber burned out by wire through a connection part. Burn-in test device of the chip. 8. The method according to claim 6 or 7, Each of the transceiver unit is a burn-in test device of the semiconductor chip, characterized in that for transmitting the test result value input from each chip in each zone to the D / C in real time. The method of claim 8, And the transceiver unit transmits a test result value for each zone using different carrier frequencies. 8. The method according to claim 6 or 7, Each of the transceivers stores the test result values input from each chip in a storage unit configured for each zone, and then transmits the test result values stored in the storage unit for each zone to the D / C at predetermined time intervals. Burn-in test device of semiconductor chip. The method of claim 10,  And the transceiver unit transmits a test result value for each zone by a single carrier frequency. The chips in the burn-in board are divided into at least two zones by zones, and are configured for each zone, and are included in each zone based on a test signal input during a write cycle among signals for testing a plurality of chips in a clock generator. At least two radio transceivers that output a test result value (voltage value) from the chip's data out pin during a reader cycle on the chip; And an integrated transceiver configured to receive a test result value output from the wireless transceiver and output the external D / C outside the burn-in chamber through wireless communication. The chip in the burn-in board is divided into at least two zones for each zone, and is configured for each zone, and is included in each zone based on a test signal input during a write cycle among signals for testing a plurality of chips in a clock generator. At least two radio transceivers that output a test result value (voltage value) from the chip's data out pin during a reader cycle on the chip; And at least two integrated transceivers for outputting a test result value output from the wireless transceiver to an external D / C outside the burned-in chamber through a connection unit. The method according to claim 12 or 13, And a test result value output from the wireless transceiver is transmitted to the integrated transceiver through wireless or wired communication. The method according to claim 12 or 13, The integrated transceiver of the semiconductor chip burn-in test device, characterized in that for transmitting in real time the test results of the chip for each zone transmitted from the wireless transceiver. The method according to claim 12 or 13, The integrated transceiver unit stores the test result of the chip for each zone transmitted from the wireless transceiver unit in a storage unit, and then transmits the test result values stored in the storage unit to the D / C at predetermined time intervals, respectively. Burn-in test device of the chip. The method according to claim 12 or 13, And the integrated transceiver transmits a task result value in a single carrier frequency. The method according to any one of claims 6, 7, 12, and 13, The transceiver unit or the integrated transceiver unit includes a storage unit for storing a test result value (voltage value), wherein the storage unit is removable and detachable from the burn-in board at predetermined time intervals to move the test result value to the outside. Burn-in test device of semiconductor chip. The method according to any one of claims 6, 7, 12, and 13, And a connection unit configured to transfer a test signal input during a write cycle among the signals for testing the plurality of chips in the clock generator to each chip. The method according to any one of claims 6, 7, 12, and 13, The wireless transceiver includes a controller and an antenna, the burn-in test device of the semiconductor chip, characterized in that for receiving the test signal input during the write cycle to the wireless communication and transmit to each chip.

Images