KR20100097439A - Adhesive tape for manufacturing electronic component and manufacturing method of semiconductor device using the same - Google Patents

Abstract

PURPOSE: An adhesive tape for manufacturing an electronic component and a semiconductor device manufacturing method using the same are provided to secure an object without slipping toward the front direction by forming a block on the exterior caused by the deformation of the adhesive by heat and pressure. CONSTITUTION: A heat resistive adhesive layer(2) is hardened in a structure with crosslinking density due to energy beams and thermal curing. The heat resistive adhesive layer is attached with a member(1) by heat and pressure. The deformation of the adhesive layer forms a block(3) on the exterior of the object.

Description

Adhesive tape for electronic component manufacturing and semiconductor device manufacturing method using the same {ADHESIVE TAPE FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME}

The present invention relates to an adhesive tape for manufacturing an electronic component and a method of manufacturing a semiconductor device using the same, and more particularly, to an electronic component manufacturing adhesive tape that can more stably fix an adherent substrate at a high temperature so as not to bend even in a thin lead frame. And a method for manufacturing a semiconductor device using the same.

In general, semiconductor package manufacturing technology requires compact, lightweight, multi-pin, high-speed, high functionality of the package. To this end, semiconductor packaging technologies such as Chip Size Package (CSP), Ball Grid Array (BGA), Multi Chip Module (MCM), and Wafer-Level CSP (WL-CSP) are rapidly developing. Among the packaging processes, a quad flat no lead package (QFN) semiconductor related to a chip size package (CSP) is a package having a structure in which lead terminals are exposed under the package mounting, and is a form of a semiconductor manufacturing technology method. As a manufacturing method of QFN, the following method is generally known.

First, the QFN dot-adhesive sheet attaches a mask tape made of a dot, adhesive tape or sheet to one surface of a plurality of lead frames in an attaching step, and the semiconductor chip elements are respectively mounted on semiconductor element mounting portions opposite to the lead frame in a die attach step. Mount. Subsequently, in the wire bonding process, a plurality of leads and semiconductor elements are bonded by wires to make electrical connections. Subsequently, in the epoxy molding process, the lead frame and the semiconductor element mounted on the lead frame are sealed with an epoxy resin. And finally, by peeling a mask sheet from a lead frame, several QFN units are formed and a unit semiconductor is manufactured through dicing for every QFN of a unit.

As described above As described above, after the adhesive tape is attached to the lead frame in the QFN package manufacturing process, a process including a high temperature between 150 ° C and 250 ° C is performed. In particular, in the wire bonding process of 200 ~ 250 ℃ high dimensional stability should be secured for more than 2 hours, and the lead frame must be stably supported. In the epoxy mold process between 170 ° C and 180 ° C, mold flush occurs due to mold pressure (a problem in which a molding resin leaked by resin injection pressure is coated with molding resin on the backside lead surface and die pad surface of the lead frame). Make sure that they are well attached to the leadframe.

Therefore, heat resistance characteristics are required in the die attach process with high temperature during the semiconductor package process, heat resistance and high modulus properties are required in the wire bonding operation connecting the semiconductor chip and the lead, and point and adhesion in the epoxy molding process. High temperature point and adhesive properties between the sheet and the lead frame should be realized, and finally, when the adhesive sheet is peeled off, it must satisfy very demanding high temperature process characteristics such as good peeling without residue on the lead frame.

In order to satisfy the above content, the conventional adhesive sheet and tape are characterized by using a heat resistant polyimide film as the base film, and including a heat resistant point and adhesive resin layer on the heat resistant base material. Representative, the heat-resistant adhesive resin has a method using a silicone-based and acrylic adhesive resin, it is presented in Korean Patent Nos. 10-0665441 and 10-0572191, and US Patent US6777079. In addition, the heat-resistant adhesive resin is used by mixing a thermosetting resin and a thermoplastic resin, which is typically NBR / epoxy resin system, it is presented in Korean Patent Publication No. 2004-00423658.

The silicone resin described above has excellent heat resistance and modulus properties in order to satisfy the properties. However, in the case of low adhesive force at high temperature, a slip phenomenon occurs in the shear direction in the adhesive layer and the lead frame interface in the wire bonding process, and wire bonding is not smoothly performed due to this phenomenon. In the epoxy molding process, the adhesive tape is peeled off by the epoxy molding resin injection pressure, and the backside of the lead frame is coated with an epoxy resin. On the contrary, when the adhesive force is high at high temperature, it may be difficult to peel the adhesive tape from the lead frame after the epoxy molding process, and the peeling or breakage of the lead frame and the molding resin may occur due to the stress caused by the adhesive force of the adhesive tape. There is.

Therefore, in order to solve the above problems, the existing invention technology has introduced a technique called 'standoff' to bury the lead frame in the adhesive layer of the adhesive tape. As described with reference to FIG. 3, a technique of 'stand off' is buried in the adhesive layer in the 'B stage' state by about 5 to 30% of the thickness of the lead frame, and the lead frame is fixed by heat curing the thermosetting adhesive layer. Therefore, the problems occurring during the wire bonding process and the epoxy molding have been solved and presented in Korean Patent Publication No. 10-2005-0062385. However, since the above technique embeds about 5-30% of the thickness of the lead frame into the adhesive layer in the 'B stage' state and heat-cures the adhesive layer, the crosslinking density of the adhesive layer (polymer) is increased, so that shrinkage occurs. The thin lead frames have a problem in that the adherent substrate cannot be stably fixed at a high temperature such that the adhesive films are bent in a stacked state.

The present invention has been made to solve the above problems, an object of the present invention is an adhesive tape for electronic component manufacturing and a semiconductor using the same can be more stably fixed to the substrate at high temperature so as not to bend in the case of a thin lead frame It is to provide a method of manufacturing the device.

These and other objects and advantages of the present invention will become more apparent from the following description of a preferred embodiment thereof.

The above object is a pressure-sensitive adhesive tape for producing an electronic component comprising a heat-resistant base film and a heat-resistant pressure-sensitive adhesive layer, wherein the heat-resistant pressure-sensitive adhesive layer is cured into a structure having a high crosslink density by energy rays and heat curing, and has heat resistance, and the substrate is adhered by heat and pressure. The heat resistant pressure sensitive adhesive layer is deformable from heat and pressure, and the deformation of the pressure sensitive adhesive layer forms a block on the outer surface of the adherend, so that the adherend can be fixed so as not to slip in the shear direction. It is achieved by an adhesive tape for producing an electronic component.

Here, the heat-resistant pressure-sensitive adhesive layer is characterized in that the elastic modulus at 200 ° C is 1.0 x 10 ⁴ Pa to 1.0 x 10 ⁸ Pa.

Preferably, the heat-resistant pressure-sensitive adhesive layer comprises an energy ray-curable acrylic oligomer resin, a thermosetting acrylic pressure-sensitive adhesive resin, and a radical initiator and a heat curing agent for curing them, and the solid solution / thermosetting acrylic pressure-sensitive adhesive of the energy ray-curable acrylic oligomer resin The ratio of the solid solution of the resin is characterized by being 1/9 to 2/3.

Also preferably, the heat resistant pressure sensitive adhesive layer is characterized in that the thickness of 5 ㎛ ~ 10 ㎛.

Also preferably, the height of the block is characterized in that 0.2㎛ ~ 3㎛.

Also preferably, the block formed on the heat-resistant adhesive layer is a rolling method comprising a rolling method comprising a rolling temperature of 25 ° C. to 150 ° C., a rolling pressure of 0.1 Mpa to 1 Mpa, and a rolling speed of 50 mm / min to 5000 mm / min. It characterized by formed by.

Also preferably, the block formed on the heat-resistant pressure-sensitive adhesive layer is a hot press method, the temperature of the pressing plate in contact with the lead frame surface of the semiconductor 50 ℃ ~ 180 ℃, the temperature of the pressing plate in contact with the adhesive tape surface It characterized in that formed by the hot press method consisting of 100 ℃ ~ 180 ℃ and a pressure of 0.5Mpa ~ 7Mpa.

Also preferably, the block formed on the heat-resistant adhesive layer is formed by a combination of a rolling method and a hot press method, the rolling method is a rolling temperature of 25 ℃ ~ 150 ℃, rolling pressure 0.1Mpa ~ 1Mpa and rolling speed 50mm / min ~ 5000㎜ / min, the hot press method is the temperature of the pressing plate in contact with the lead frame surface of the semiconductor 50 ℃ ~ 180 ℃, the temperature of the pressing plate in contact with the adhesive tape surface 100 ℃ ~ 180 ℃ and the pressure is characterized in that carried out under the conditions of 0.5Mpa ~ 7Mpa.

In addition, the above object is a method of manufacturing a semiconductor device using a pressure-sensitive adhesive tape for electronic component manufacturing, the step of attaching the lead frame of the semiconductor to the heat-resistant pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape consisting of a heat-resistant base film and a heat-resistant pressure-sensitive adhesive layer, by the heat and pressure And a step of forming a block in the heat resistant pressure sensitive adhesive layer and a step of removing the adhesive tape.

Here, the attaching step is characterized in that the rolling method.

Preferably, the rolling process is characterized in that the rolling is carried out at a rolling temperature of 25 ℃ ~ 150 ℃, rolling pressure 0.1Mpa ~ 1Mpa and rolling speed 50mm / min ~ 5000mm / min.

Also preferably, the attaching step may be performed by hot pressing.

Also preferably, the hot pressing method may be performed in a temperature range of 50 ° C. to 180 ° C. of the pressing plate in contact with the lead frame surface, and 100 ° C. to 180 ° C. of the pressing plate in contact with the adhesive tape surface. Characterized in that the pressure is carried out at 0.5Mpa ~ 7Mpa.

Also preferably, the attaching process is characterized in that the combination of the rolling method and hot press method.

Also preferably, the rolling process may be performed at a rolling temperature of 25 ° C. to 150 ° C., a rolling pressure of 0.1 Mpa to 1 Mpa, and a rolling speed of 50 mm / min to 5000 mm / min. The process may be performed at a temperature of 50 ° C. to 180 ° C. of the compression plate in contact with the lead frame surface, a temperature of 100 ° C. to 180 ° C. of the compression plate in contact with the adhesive tape surface, and a compression pressure of 0.5 Mpa to 7 Mpa. .

Also preferably, the heat resistant pressure sensitive adhesive layer is characterized in that the thickness of 5 ㎛ ~ 10 ㎛.

Also preferably, the height of the block is characterized in that 0.2㎛ ~ 3㎛.

Also preferably, the heat resistant pressure-sensitive adhesive layer is characterized in that the elastic modulus at 200 ° C is 1.0 x 10 ⁴ Pa to 1.0 x 10 ⁸ Pa.

According to the present invention, a block is formed on the outer surface of the substrate by deformation of the pressure-sensitive adhesive layer due to heat and pressure, and the pressure-sensitive adhesive layer on which the block is formed has an effect such that the adhered substrate can be well fixed so as not to move in the shear direction.

Therefore, the adhesive tape for manufacturing an electronic component according to the present invention is an industrial material, and has an effect of excellent workability and reliability when manufacturing various electronic components.

Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention. These examples are only presented by way of example only to more specifically describe the present invention, it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .

Although the present invention describes a semiconductor packaging process by way of example, the present invention is not limited thereto, and of course, the present invention can also be applied as a mask sheet on a high temperature manufacturing process of various electronic components. 1 is a cross-sectional view of a semiconductor including an adhesive tape for manufacturing an electronic component according to the present invention, FIG. 2 is a cross-sectional view of the adhesive tape for manufacturing an electronic component according to the present invention, and FIG. 3 is a cross-sectional view of the adhesive tape according to the prior art.

According to the present invention, a pressure-sensitive adhesive tape for manufacturing an electronic component and a method for manufacturing a semiconductor device using the same induce deformation of the pressure-sensitive adhesive layer by applying additional heat and pressure to the pressure-sensitive adhesive layer that has been cured by heat and energy rays. The present invention relates to attaching an adhesive layer to a metal adherend in a state, and thereby forming a block on the outside of the adherend by deformation of the adhesive layer.

In general, in the manufacturing method of the QFN semiconductor, all processes include a high temperature process of temperature between 170 ~ 250 ℃, which causes problems among each process. First, in the wire bonding process, when the modulus of the point and adhesive layer is low, uneven settlement of the lead frame may occur, and when the modulus is high, a slip phenomenon occurs in the shear direction between the lead frame and the adhesive layer interface. Can't freeze frame These problems are a problem that the process of connecting the conductor between the semiconductor element and the lead is not made smoothly. In addition, in the epoxy molding process, if the lead frame and the adhesive layer are adhered only by the adhesive force of the tape, when the adhesive force is low, the adhesive tape or sheet may be peeled off by the pressure of the molding resin. This can lead to the problem of flushing. Therefore, in order to solve each problem that may occur in the above processes, the present invention introduces a method of inducing the deformation of the adhesive resin by the heat and pressure, thereby raising the adhesive layer to the outside of the substrate to form a block. The block formed by the deformation of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape can prevent the slip phenomenon of the lead frame that can occur in the shear direction, thereby smoothly proceeding the wire bonding process. In addition, the block thus formed has an advantage that the process can be performed so that the molding resin is not coated on the lead frame backside by preventing mold flush that may occur from the injection pressure of the molding resin in the molding process.

Hereinafter, an adhesive tape for manufacturing an electronic component and a method of manufacturing a semiconductor device using the same according to the present invention will be described in detail.

Heat resistant base film

The heat-resistant base film according to the present invention is polyester, polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether ether ketone, triacetyl cellulose, polyether imide, polyethylene naphthalate, poly It may be at least one (plastic) film selected from propylene and polycarbonate, but is not limited thereto. In addition, a metal foil may be used instead of a plastic film as a substrate, and at least one metal foil selected from a foil, an alloy foil, and a plated foil made of aluminum, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, or the like may be used. . In the case of the base film, when the coefficient of thermal expansion is large, the difference in coefficient of thermal expansion with the lead frame increases, and when it returns to room temperature, the lead frame attached to the sheet may cause warpage, and such warpage may cause dimensional instability in the molding process. There is a risk of mold mold failure due to position deformation. Therefore, as a heat resistant substrate satisfying these conditions, a heat resistant film having a glass transition temperature of 150 ° C. or higher is preferable, and the thermal expansion coefficient of the substrate at 100 ° C. to 200 ° C. is preferably 5 ppm / ° C. to 50 ppm / ° C., and 10 ppm / More preferably 25 ° C to 25 ppm / ° C.

Adhesive resin

The energy ray-curable acrylic oligomer resins include urethane acrylates, polyester acrylates, epoxy acrylates, and acrylic acrylates. In addition to acrylics, thiol addition resins having an allyl group at the molecular end, photo-cationic polymerization resins, thinners, etc. Mole-containing polymers, diazotized amino-novolak resins. In addition, polymers reactive to high energy radiation include epoxidized polybutadienes, unsaturated polyesters, polyglycidyl methacrylates, polyacrylamides and polyvinyl siloxanes. As for the functional group reacting in the said resin, about 2-6 pieces are preferable. In addition, the weight average molecular weight of these acrylic oligomer resins is preferably about 300 to 8,000. These can react with the radical initiator with an energy ray to form a crosslinked structure, whereby the adhesive resin can have the characteristics of internal cohesion. Therefore, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape has heat resistance characteristics, and when peeled off, it is possible to obtain a pressure-sensitive adhesive layer free of residue.

Thermosetting acrylic pressure-sensitive adhesives are methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) Alkyl (meth) acrylates such as acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate and dodecyl (meth) acrylate; Has the ability to Moreover, about 40,000-3,000,000 are preferable, and, as for the weight average molecular weight of these acrylic resin, about 700,000-1,200,000 are more preferable. These can be used together with a thermosetting agent to ensure cohesiveness essentially and to suppress adhesive residue.

The mixed acrylic pressure-sensitive adhesive may be cured only when the thermosetting agent and the energy ray initiator are included. Examples of the curing agent include isocyanate, epoxy, aziridine and chelate crosslinking agents. Although the usage-amount of a hardening | curing agent is not limited, Based on 100 weight part of acrylic adhesive resin, 0.1-20 weight part of hardening | curing agents is preferable, More preferably, 2-7 weight part is preferable. Thus an acrylic pressure-sensitive adhesive may be designed to achieve the appropriate adhesive strength by the use with a heat-curing agent. In addition, the energy ray initiator may be selected from benzyldimethyl ketal, hydroxycyclohexyl phenyl ketone, hydroxy dimethyl acetophenone, methyl- [4methylthiophenyl] -2-morpholine propanone, 4-benzyl-4'-methyldi Phenyl sulfide, isopropyl thioxanthone, 2-chlorothioxanthone, ethyl 4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, benzophenone, 4-methylbenzophenone, methyl- Ortho-benzo-benzoate, methylbenzoylformate, 4-phenylbenzophenone, 2,4,6-trimethylbenzoyl-diphenyl phosphine, 2-hydroxy-1,2-diphenyl ethanone and the like are used. The energy ray initiator may be selected according to the coating / drying temperature of the pressure-sensitive adhesive layer and the energy ray irradiation conditions to be used, and the amount of the energy ray initiator is 0.01 to 0.2 based on 100 weight of the energy ray-curable oligomer resin. Weight part is preferable. In addition, it is preferable to use an energy ray initiator in mixture of 2 or more types by 1 type according to a design purpose.

Composition method of pressure-sensitive adhesive layer

The constitution method of the pressure-sensitive adhesive layer using the pressure-sensitive adhesive according to the present invention is as follows.

First, the composition of the impregnated resin is composed of an energy ray-curable acrylic oligomer resin, a thermosetting acrylic adhesive resin, and an adhesive composition including a radical initiator and a thermosetting agent to cure them, which are prepared at a suitable viscosity to coat the adhesive resin solution by dissolving in a solvent. do.

The coating method of the crude resin solution can be cast and transfer methods. First, the casting method is a method of forming a pressure-sensitive adhesive layer by coating and drying the crude liquid on a heat-resistant substrate, and the transfer method forms a pressure-sensitive adhesive layer by coating and drying the crude liquid on a release film, the pressure-sensitive adhesive layer thus formed After the lamination to the heat-resistant substrate again, there are methods of transferring. In general, the coating thickness of the pressure-sensitive adhesive layer is determined in consideration of the adhesive force and the internal cohesion of the pressure-sensitive adhesive layer, but in the present invention, in consideration of block formation formed by deformation of the pressure-sensitive adhesive layer due to heat and pressure, the thickness is preferably 5 μm to 10 μm.

In addition, the heat-resistant pressure-sensitive adhesive layer according to the present invention can form a block by deformation of the pressure-sensitive adhesive layer by heat and pressure, when such a block is formed too high or crushing due to damage of the pressure-sensitive adhesive layer, when peeling the tape, Sticky residues may occur. Also, if it is too low, it cannot act as a block. Therefore, in order to form the block of an appropriate height, without damaging an adhesive layer, it is most preferable that an adhesive layer makes the solid solution ratio of an energy-beam acrylic curable oligomer resin / thermosetting acrylic adhesive resin into 1/9-2/3. At this time, when energy ray oligomer content is added more than necessary, the crosslinked structure by mutual penetration may not be formed, or an adhesive layer becomes hard more than necessary, and a block cannot be formed. Moreover, it is preferable to mix and use an energy-beam curable oligomer resin in 1 type or 2 types according to a design purpose.

Energy ray and ultraviolet curing method

The curing method of the pressure-sensitive adhesive layer prepared by the above method may induce a crosslinked structure in the pressure-sensitive adhesive layer by performing a curing reaction by energy rays such as visible light, ultraviolet rays, and electron beams, and the type of energy rays is not particularly limited. It is preferable to harden using ultraviolet rays. UV curing is a chemical reaction that takes place in a very short time and must be fully cured to a certain amount of light for a short time. If the curing reaction is performed at a light quantity below a certain amount, unreacted reaction may be included in the curing reaction product. If curing is performed at a light quantity above a certain amount, the base film or the adhesive resin may be decomposed. In addition, since ultraviolet light is accompanied by infrared rays, side effects due to heat of infrared rays may occur. Therefore, the light quantity is preferably 10 to 2000 mJ / cm 2 based on the ultraviolet ray A region, and more preferably about 400 to 1000 mJ / cm 2. In addition, UV lamps can be largely divided into a mercury lamp including a short wavelength (ultraviolet rays B, C) region and a metal halide lamp including a long wavelength (ultraviolet A) region as a main region, a mixture of the two lamps Or curing can be formed using each lamp, the light quantity control can be adjusted through the lamp height or the irradiation time of ultraviolet rays. In addition, the thermosetting adhesive resin may be thermally cured in a aging chamber or an oven. It is preferable that the temperature of thermosetting consists of 25 degreeC-80 degreeC, and it is more preferable at about 40 degreeC-60 degreeC. And the fermentation period is 5 to 7 days is preferred.

Attachment method of adhesive tape and lead frame

The adhesive tape prepared by the above method may be attached to the metal lead frame by various methods, and may be proceeded as follows.

Here, the lead frame is engraved with a terminal pattern made of a metal such as copper or an alloy containing copper, and the electrical contact portion of the terminal portion is plated with a metal material such as nickel, palladium, gold, and silver. There is. The thickness of the lead frame is 25 ~ 300㎛ and consists of various thicknesses.

In the first rolling method, the adhesive tape can be attached to the lead frame by rolling. At this time, the rolling temperature is preferably rolled at 25 ℃ ~ 150 ℃, the rolling pressure is preferably 0.1Mpa ~ 1Mpa, the rolling speed is preferably 50mm / min ~ 5000mm / min.

As a second hot press method, the adhesive tape can be attached by pressing together with heat while the adhesive tape is laminated on the lead frame. At this time, when the compression temperature and pressure are compressed at too low or too low pressure, the pressure-sensitive adhesive layer may not be deformed and blocks may not be formed. In addition, since the pressure-sensitive adhesive layer may be crushed when pressed at an excessively high temperature or high pressure, the temperature of the pressing plate in contact with the surface of the lead frame is preferably 50 ° C to 180 ° C. In addition, the temperature of the pressing plate in contact with the adhesive tape surface is preferably 100 ° C to 180 ° C. In addition, the crimping pressure is preferably 0.5Mpa to 7Mpa.

Third, by mixing the first and the second, there is a method of adhering by hot pressing after rolling.

The present invention can be induced by utilizing the above attachment methods to form blocks in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape, and can also be heated through an additional oven treatment or a heating plate to maximize block formation. Moreover, the height of the block formed in an adhesive layer is 0.2 micrometer-3 micrometers, Preferably they are 0.5 micrometer-2 micrometers. If the height of the block is too low, the lead frame cannot be supported. If the height of the block is too high, the line forming the block is caught between the epoxy molding resin and the edge of the lead frame during peeling, and the adhesive layer is formed on the semiconductor surface. Because you can tear it off.

Manufacturing Method of Semiconductor Device

The manufacturing method of the semiconductor device according to the present invention will be described using the method of attaching the adhesive tape to the lead frame. Semiconductor devices not described herein will be referred to prior art known to those skilled in the art.

In the method of manufacturing a semiconductor device according to the present invention, in the method of manufacturing a semiconductor device using the adhesive tape for manufacturing an electronic component, a step of attaching a lead frame of a semiconductor to a heat resistant adhesive layer of an adhesive tape comprising a heat resistant base film and a heat resistant adhesive layer And forming a block in the heat resistant pressure sensitive adhesive layer by overheating and pressure, and removing the adhesive tape.

The attaching process may be performed by any one of a rolling method, a hot press method, or a combination of a rolling method and a hot press method, and each method is as described above.

According to this manufacturing method, as shown in FIG. 1 or FIG. 2, the block 3 is formed on the pressure-sensitive adhesive layer to prevent slip phenomenon of the lead frame, which may occur in the shear direction, thereby preventing the wire bonding process. Since it can be performed smoothly, it can provide the manufacturing method of the semiconductor device which was excellent in workability and reliability.

In the method of manufacturing a semiconductor device according to the present invention, a die bonding process, a wire bonding process, and a sealing resin encapsulation process, which are processes related to heat-resistant adhesive tapes in a semiconductor device manufacturing process, will be referred to the related art. Omit. That is, the die-bonding process and the wire bonding process after attaching the lead frame of the semiconductor to the heat-resistant pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape consisting of a heat-resistant base film and a heat-resistant pressure-sensitive adhesive layer and forming a block in the heat-resistant pressure-sensitive adhesive layer by heat and pressure And a sealing resin encapsulation process are sequentially performed, followed by a process of removing the adhesive tape.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.

[Example]

As shown in Table 1, the acrylic pressure-sensitive adhesive (AT-311; Ternary) used 45.7 weight based on the total weight of the crude liquid, and isocyanate-based curing agent (CAT-45; Ternary) was 1.6 weight, energy ray Phenol novolac acrylate (EB9656; Cytec), a curable oligomer, is 7.4 wt.%, And 2,4,6-trimethylbenzoyl-diphenyl phosphine (Darocur TPO; Ciba), a UV initiator, is 0.2 By weight, 0.1 weight of hydroxycyclohexyl phenyl ketone (Irgacure184; Ciba), which is an ultraviolet initiator, and 45 weight of ethyl acetate solvent were used to prepare a pressure-sensitive adhesive that was ultraviolet curable and thermosetting. Using this pressure-sensitive adhesive, a polyimide film (25NPI; Kaneka; 25 µm), which is a heat resistant substrate, was coated and dried at 10 µm. Thereafter, the pressure-sensitive adhesive layer was cured by ultraviolet irradiation and aging at 50 ° C. to prepare an adhesive tape. At this time, the modulus of elasticity at 200 ° C. is 9.2 × 10 ⁶ Pa.

TABLE 1

 Example 1

Blocks were formed by a rolling method using the prepared adhesive tape. The adhesive tape was attached onto the lead frame at the rolling temperature of 50 ° C., the rolling pressure of 0.3 Mpa, and the rolling speed of 150 mm / min, and then the adhesive tape was peeled off from the lead frame.

[Example 2]

A block was formed by hot pressing using the prepared adhesive tape. The pressure-sensitive adhesive tape was attached on the lead frame at a hot press condition of 100 ° C. of the pressure plate in contact with the lead frame surface of the semiconductor, 150 ° C. of the pressure plate in contact with the pressure-sensitive adhesive tape surface, and a compression pressure of 0.9 Mpa. The adhesive tape was peeled off from the lead frame.

Example 3

A block was formed by a combination of a rolling method and a hot press method using the prepared adhesive tape. After the rolling method of Example 1 was performed, the hot press method of Example 2 was performed.

Experimental Results and Results

Experimental Example 1 Measurement of Elastic Modulus

The elasticity modulus evaluation instrument used the viscoelastic spectrometer manufactured by Leometrics, and measured in the shear mode of 1 Hz, heating up 5 degreeC per minute. The pressure-sensitive adhesive layer prepared as described above is preferably 1.0 x 10 ⁴ Pa to 1.0 x 10 ⁸ Pa at 200 ° C, and in order to form a block without damaging the pressure-sensitive adhesive layer by heat and pressure, 1.0 x 10 ⁵ Pa to 1.0 at 200 ° C. x 10 ⁸ Pa is more preferred.

Experimental Example 2 Evaluation of Epoxy Molding Process

The epoxy molding process was evaluated by attaching the adhesive tape onto the leadframe, making a sample, and treating the leadframe sample on which the adhesive tape was laminated by aging for 2 hours in a high temperature oven (175 ° C.) under similar conditions as in the die-etch process. Proceed. In addition, under similar conditions such as wire bonding, the resultant is left on a hot plate at 220 ° C. for 45 minutes to process a lead frame sample in which adhesive tape is laminated. And finally, the sample laminated the adhesive tape on the lead frame using an epoxy resin, the molding process is carried out for 3 minutes at 175 ℃. The sample thus prepared was peeled off the adhesive tape from the lead frame at room temperature, and observed on the surface of the lead frame and the epoxy resin surface formed on the peeled sample. Observation on the surface can be confirmed by using a microscope whether the occurrence of the mold flush and the occurrence of the adhesive residue that may occur in the peeled off the adhesive tape. In detail, observation was carried out using a BX51 microscope.

(Experimental example 3: height measurement of the block formed from deformation of an adhesive layer)

The adhesive tapes were laminated according to Examples 1 to 3, and the adhesive tapes were peeled off, and the heights of the blocks formed from the clamping of the peeled adhesive surfaces were measured and summarized in Table 2 below. The height of the blocks was measured using an LSM 5 Pascal Confocal laser scanning microscope.

 TABLE 2

As can be seen in Table 2, the adhesive tape for manufacturing the electronic component according to an embodiment of the present invention is that all of the blocks formed in the heat-resistant adhesive layer can be fixed so that the adhered substrate does not slip in the shear direction (slip) occurs You can check it. However, according to the embodiment, the height of block formation varies, but the height of block formation according to the lamination method is the smallest in the lamination method employing the rolling method, and the method of mixing the rolling and hot press is the highest. . In addition, the adhesive tape is laminated according to Examples 1 to 3, and subjected to a similar high temperature treatment from the die-etching process to the wire bonding process, and then the epoxy molding is carried out, and then the laminated adhesive tape is peeled off to remove the lead. As a result of observing the surface of the frame and the epoxy molding resin, the adhesive tape for manufacturing the electronic component according to the embodiment of the present invention has dimensional stability in the molding process due to the formation of clamping, so that a bad mold flush due to position deformation did not occur. Most of the residues did not occur, but it could be confirmed that in Example 3 in which the rolling method and the hot press method were mixed.

Although the present invention has been described in detail with reference to only a few embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the present invention, and such changes and modifications are within the scope of the appended claims.

1 is a cross-sectional view of a semiconductor including a pressure-sensitive adhesive tape for producing electronic components according to the present invention.

2 is a cross-sectional view of the adhesive tape for producing an electronic component according to the present invention.

Figure 3 is a cross-sectional view of the adhesive tape according to the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

1: heat resistant base film 2: heat resistant adhesive layer

3: block formed from heat and pressure 4: lead

5: die pad 6: die bonding adhesive

7: semiconductor chip 8: wire

9: epoxy molding resin

Claims (18)

In the pressure-sensitive adhesive tape for electronic component manufacturing consisting of a heat resistant base film and a heat resistant adhesive layer, The heat-resistant pressure-sensitive adhesive layer is cured into a structure of high crosslinking density by energy rays and heat curing, has heat resistance, and adheres the adhered substrate by heat and pressure, The heat-resistant pressure-sensitive adhesive layer is deformable from heat and pressure, the deformation of the pressure-sensitive adhesive layer to form a block on the outside of the substrate to be adhered, characterized in that the substrate can be fixed so as not to slip (slip) in the shear direction Adhesive tape for manufacturing parts. The method of claim 1, The heat-resistant pressure-sensitive adhesive layer is characterized in that the elastic modulus at 200 ℃ 1.0 x 10 ⁴ Pa to 1.0 x 10 ⁸ Pa, the adhesive tape for producing electronic components. The method of claim 1, The heat-resistant pressure-sensitive adhesive layer comprises an energy ray-curable acrylic oligomer resin, a thermosetting acrylic pressure-sensitive adhesive resin, and a radical initiator and a heat curing agent for curing them, and the solid solution of the energy ray-curable acrylic oligomer resin / solid solution of the thermosetting acrylic adhesive resin The ratio of powder is 1/9 to 2/3, The adhesive tape for electronic component manufacture characterized by the above-mentioned. The method of claim 1, The heat-resistant pressure-sensitive adhesive layer is a thickness of 5 ㎛ ~ 10 ㎛, the adhesive tape for electronic component manufacturing. The method of claim 1, Adhesive tape for producing electronic components, characterized in that the height of the block is 0.2㎛ ~ 3㎛. 6. The method according to any one of claims 1 to 5, Block formed in the heat-resistant adhesive layer, An adhesive tape for producing an electronic part, characterized in that formed by a rolling method comprising a rolling temperature of 25 ° C. to 150 ° C., a rolling pressure of 0.1 Mpa to 1 Mpa, and a rolling speed of 50 mm / min to 5000 mm / min. 6. The method according to any one of claims 1 to 5, Block formed in the heat-resistant adhesive layer, A hot press method, comprising a temperature of 50 ° C. to 180 ° C. of a press plate in contact with a lead frame surface of a semiconductor, a temperature of 100 ° C. to 180 ° C. of a press plate in contact with the adhesive tape surface, and a pressure of 0.5 Mpa to 7 Mpa. Adhesive tape for electronic component production, characterized in that formed by the pressing method. 6. The method according to any one of claims 1 to 5, Blocks formed on the heat-resistant adhesive layer is formed by a combination of a rolling method and a hot press method, The rolling method is carried out under the conditions of the rolling temperature of 25 ℃ ~ 150 ℃, rolling pressure 0.1Mpa ~ 1Mpa and rolling speed 50mm / min ~ 5000mm / min, The hot press method is carried out under the conditions of the temperature of the pressing plate in contact with the lead frame surface of the semiconductor 50 ℃ ~ 180 ℃, the temperature of the pressing plate in contact with the adhesive tape surface 100 ℃ ~ 180 ℃ and the pressure of 0.5Mpa ~ 7Mpa Adhesive tape for producing electronic components, characterized in that carried out. In the manufacturing method of a semiconductor device using the adhesive tape for electronic component manufacturing, Attaching a lead frame of a semiconductor to a heat resistant pressure sensitive adhesive layer of a pressure sensitive adhesive tape comprising a heat resistant base film and a heat resistant pressure sensitive adhesive layer, Forming a block in the heat resistant pressure-sensitive adhesive layer by heat and pressure, And removing the adhesive tape. 10. The method of claim 9, The said attaching process is a rolling method, The manufacturing method of the semiconductor device characterized by the above-mentioned. The method of claim 10, The rolling method of attaching is carried out at a rolling temperature of 25 ° C. to 150 ° C., a rolling pressure of 0.1 Mpa to 1 Mpa, and a rolling speed of 50 mm / min to 5000 mm / min. 10. The method of claim 9, The said attaching process is a hot press system, The manufacturing method of the semiconductor device characterized by the above-mentioned. The method of claim 12, The hot pressing method may be carried out at a temperature of 50 ° C. to 180 ° C. of the pressing plate in contact with the lead frame surface, a temperature of 100 ° C. to 180 ° C. of the pressing plate in contact with the adhesive tape surface, and a pressure of 0.5 Mpa to 7 Mpa. Method for manufacturing a semiconductor device, characterized in that carried out in. 10. The method of claim 9, And said attaching step comprises a combination of a rolling method and a hot press method. The method of claim 14, The rolling process is carried out at a rolling temperature of 25 ℃ ~ 150 ℃, rolling pressure 0.1Mpa ~ 1Mpa and rolling speed 50mm / min ~ 5000mm / min, The hot pressing method may be carried out at a temperature of 50 ° C. to 180 ° C. of the pressing plate in contact with the lead frame surface, a temperature of 100 ° C. to 180 ° C. of the pressing plate in contact with the adhesive tape surface, and a pressure of 0.5 Mpa to 7 Mpa. Method for manufacturing a semiconductor device, characterized in that carried out in. The method according to any one of claims 9 to 15, The heat resistant pressure sensitive adhesive layer has a thickness of 5 μm to 10 μm, wherein the semiconductor device manufacturing method. The method according to any one of claims 9 to 15, The height of said block is 0.2 micrometer-3 micrometers, The manufacturing method of a semiconductor device. The method according to any one of claims 9 to 15, The heat-resistant pressure-sensitive adhesive layer is a method of manufacturing a semiconductor device, characterized in that the modulus of elasticity at 200 ℃ is 1.0 x 10 ⁴ Pa to 1.0 x 10 ⁸ Pa.

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