KR20100079467A - Wet station apparatus - Google Patents

Wet station apparatus Download PDF

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Publication number
KR20100079467A
KR20100079467A KR1020080137966A KR20080137966A KR20100079467A KR 20100079467 A KR20100079467 A KR 20100079467A KR 1020080137966 A KR1020080137966 A KR 1020080137966A KR 20080137966 A KR20080137966 A KR 20080137966A KR 20100079467 A KR20100079467 A KR 20100079467A
Authority
KR
South Korea
Prior art keywords
wafer holder
weight
wet station
robot arm
station apparatus
Prior art date
Application number
KR1020080137966A
Other languages
Korean (ko)
Inventor
구종민
Original Assignee
주식회사 동부하이텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 동부하이텍 filed Critical 주식회사 동부하이텍
Priority to KR1020080137966A priority Critical patent/KR20100079467A/en
Publication of KR20100079467A publication Critical patent/KR20100079467A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer holder accommodating a plurality of wafers; A robot arm picking up and transferring a wafer holder; And a plurality of baths in which the chemical contained in the wafer holder is accommodated, and the robot arm includes a weight measuring unit for measuring the weight of the wafer holder.

Description

Wet station device {WET STATION APPARATUS}

An embodiment relates to a wet station apparatus.

Generally, a semiconductor device is manufactured by performing various unit processes, and various chemicals are used in performing such various unit processes. Here, the unit process using the chemical is mainly performed using a bath in which the chemical is accommodated. In the semiconductor manufacturing process using such a bath, etching or surface cleaning of the wafer to remove unnecessary films is an essential process.

Here, the cleaning and etching are mainly used in the overflow method in which the process is performed by overflowing the pure water, chemicals, etc. of the chemical bath.

Embodiments provide a wet station capable of detecting a breakage of a wafer or an accident during a process and easily coping with it.

Wet station according to the embodiment is a wafer holder for receiving a plurality of wafers; A robot arm picking up and transferring the wafer holder; And a plurality of baths in which the chemical contained in the wafer holder is accommodated, and the robot arm includes a weight measuring unit for measuring the weight of the wafer holder.

The wet station apparatus according to the embodiment includes a weight measuring unit for measuring the weight of the wafer holder on the robot arm.

The operator can monitor the weight of the wafer holder by the weight measuring unit, and detect breakage or departure of the wafer.

That is, the wet station apparatus according to the embodiment may allow the user to detect and cope with this when the wafer is broken or left off and remains in the bath.

In particular, it is difficult to visually check the inside of the bath containing the chemicals, and if a wafer or the like remains in the bath, the composition of the chemicals is affected. As a result, changes in the composition of the chemical can affect the entire wet process.

In this case, the wet station apparatus according to the embodiment may compensate for such a problem and prevent defects of the wafer.

In the description of the embodiments, each substrate, arm, rail, bath, or the like is described as being formed "on" or "under" of each substrate, arm, rail, bath, or the like. In the case, “on” and “under” include both being formed “directly” or “indirectly” through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is a diagram illustrating a wet station according to an embodiment. 2 is a front view illustrating the wafer holder. 3 is a block diagram illustrating a process of driving the wet station.

1 to 3, the wet station includes a robot arm 100, a transfer rail 200, baths 300, a buffer unit 400, and a loading-unloading unit 500.

The robot arm 100 picks up and transports the wafer holder 600. In more detail, the robot arm 100 transfers the wafer holder 600 up and down and back and forth.

The robot arm 100 includes a weight measuring unit 110 for measuring the weight of the wafer holder 600. The weight measuring unit 110 is disposed above the robot arm 100. The weight measuring unit 110 includes sensors for measuring the weight of the wafer holder 600.

The weight measuring unit 110 measures the weight of the wafer holder 600 and transmits the weight to the driving unit 700 for driving the wet station according to the embodiment.

In addition, the robot arm 100 further includes a fixing part for picking up the wafer holder 600 and a motor for transferring the wafer holder 600 up and down.

In addition, the robot arm 100 may further include a motor for moving back and forth along the transfer rail 200.

The wafer holder 600 accommodates a plurality of wafers 10. The wafer holder 600 includes a chuck 610 for being picked up by the robot arm 100 and a support 620 for supporting the wafers 10.

The wafer holder 600 is fastened to the robot arm 100 by the chuck 610 and is moved up and down and back and forth by the operation of the robot arm 100. The wafer holder 600 is immersed in the chemical 20 contained in the baths 300.

The transfer rail 200 transfers the robot arm 100 back and forth. The transfer rail 200 is disposed on the baths 300 and the buffer unit 400.

A plurality of baths 300 are disposed below the transfer rail 200. The baths 300 each contain various chemicals 20. For example, the baths 300 may contain an etching solution for etching the wafers 10, and may contain a cleaning solution for cleaning the wafers 10. In addition, the baths 300 may contain a drying solution for drying the wafers 10, and the like.

The buffer unit 400 accommodates the wafer holder 600 for a predetermined period of time. For example, the buffer unit 400 accommodates the wafer holder 600 that is at or after the wet process.

The loading-unloading unit 500 loads or unloads the wafer holder 600 into the buffer unit 400.

The wet station according to the embodiment includes a driver 700. The driver 700 drives the robot arm 100, the transfer rail 200, and the loading-unloading unit 500.

In addition, the driver 700 receives the weight of the wafer holder 600 from the weight measuring unit 110 and displays the weight on the operator. Therefore, the wet station according to the embodiment includes a display unit 800 for displaying the weight of the wafer holder 600, the display unit 800 is the wafer holder 600 received from the drive unit 700 The weight of the is displayed.

In addition, the driving unit 700 may provide an alarm to an operator or the like when the weight of the wafer holder 600 is out of an error range of a predetermined value.

The wet station according to the embodiment includes the weight measuring unit 110 for measuring the weight of the wafer holder 600 on the robot arm 100.

The operator may monitor the weight of the wafer holder 600 by the weight measuring unit 110 and may detect breakage or departure of the wafer 10.

That is, the wet station according to the embodiment enables the user to detect and cope with this when the wafer 10 is damaged or left off and remains in the baths 300.

In particular, it is difficult for an operator to visually check the inside of the baths 300, and if the wafer 10 or the like remains in the baths 300, it may affect the composition of the chemical 20. do. As a result, changes in the composition of the chemical 20 can affect the entire wet process.

In this case, the wet station according to the embodiment may compensate for such a problem and prevent defects of the wafer 10.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a diagram illustrating a wet station according to an embodiment.

2 is a front view illustrating the wafer holder.

3 is a block diagram illustrating a process of driving the wet station.

Claims (6)

A wafer holder accommodating a plurality of wafers; A robot arm picking up and transferring the wafer holder; And The wafer holder includes a plurality of baths containing the chemicals immersed, The robot arm includes a weighing unit for measuring the weight of the wafer holder. The wet station apparatus of claim 1, further comprising a driver configured to provide an alarm when the weight of the wafer holder is out of an error range of a set weight. The wet station apparatus of claim 1, wherein the robot arm moves the wafer holder up, down, left, and right to immerse the wafer holder in the baths. 2. The wet station apparatus of claim 1 comprising a loading-unloading portion for unloading the wafer holder. The wet station apparatus of claim 1, wherein the weight measuring unit is disposed above the robot arm. The wet station apparatus of claim 1, further comprising a display configured to display a weight of the wafer holder.
KR1020080137966A 2008-12-31 2008-12-31 Wet station apparatus KR20100079467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080137966A KR20100079467A (en) 2008-12-31 2008-12-31 Wet station apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080137966A KR20100079467A (en) 2008-12-31 2008-12-31 Wet station apparatus

Publications (1)

Publication Number Publication Date
KR20100079467A true KR20100079467A (en) 2010-07-08

Family

ID=42640559

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080137966A KR20100079467A (en) 2008-12-31 2008-12-31 Wet station apparatus

Country Status (1)

Country Link
KR (1) KR20100079467A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11024517B2 (en) 2016-05-27 2021-06-01 Semes Co., Ltd. Apparatus and transfer unit which measures weight remaining on a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11024517B2 (en) 2016-05-27 2021-06-01 Semes Co., Ltd. Apparatus and transfer unit which measures weight remaining on a substrate
US11804386B2 (en) 2016-05-27 2023-10-31 Semes Co., Ltd. Transfer unit, and apparatus and method for treating substrate

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