TW201502315A - Wet processing apparatus and plating apparatus - Google Patents

Abstract

A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.

Description

Wet processing device and plating device

The present invention relates to a wet processing apparatus for processing a substrate such as a wafer using a treatment liquid such as a plating solution or an etching solution.

Further, the present invention relates to a plating apparatus for plating a substrate surface such as a wafer.

An electroless plating apparatus in which a substrate such as a wafer is immersed in a plating solution in a plating tank to plate a substrate is known. As shown in the eighth embodiment, the electroless plating apparatus suspends a plurality of substrate holders 101 holding the substrate W in the plating tank 100, and immerses the substrate W in the plating solution. The substrate holder 101 moves in the horizontal direction in the plating tank 100, and a metal film is deposited on the surface of the substrate W. After the substrate W is immersed in the plating solution in the plating tank 100, after a predetermined treatment time, the substrate W is picked up from the plating tank 100.

In the plating process having a long processing time, in order to increase the amount of processing, the distance between the substrates W is shortened, and a plurality of substrates W are immersed in the plating solution in the plating tank 100. However, when the distance between the substrates W is shortened and the substrate W is moved in the horizontal direction, the plating solution between the substrates W moves together with the substrate W, and the plating solution existing between the substrates W is not newly plated. Replace with liquid. As a result, the supply of metal ions to the surface of the substrate W does not proceed smoothly, and a metal film having a uniform thickness cannot be formed on the surface of the substrate W.

Electroless plating is carried out by a plating reaction to produce a reaction by-product of a gas such as hydrogen. Not all of the gas rises to the liquid surface of the plating solution, and a part of the gas remains on the surface of the substrate W in the form of bubbles. The air bubbles on the substrate W prevent the metal film from being uniformly deposited on the surface of the substrate W. Therefore, it is necessary to remove air bubbles from the surface of the substrate W.

In the electroless plating-based plating solution, no metal is passed through, and a metal film is formed on the plated surface of the substrate by chemically reducing metal ions in the plating solution. Such electroless plating is widely used for nickel-phosphorus plating, nickel-boron plating, copper plating for printed circuit boards, and the like. In particular, when a metal such as cobalt (Co) or nickel (Ni) is formed on the surface of a wire bonding or a conductive pad electrically connected to a solder bump, electroless plating can be applied (for example, JP-A-2001-267356) Bulletin).

In general, the plating apparatus is roughly classified into a single-piece processing type and a batch processing type. In the electroless plating apparatus of the conventional monolithic type, the substrate is held horizontally and rotated to perform processing (for example, refer to JP-A-2002-129344). However, when electroless plating is applied to a conductive pad to form a metal layer, there is a disadvantage that the plating time is long and the processing amount of the plating apparatus cannot be increased. Further, in the batch-type plating apparatus, as the substrate is increased in diameter in recent years, the transport mechanism of the carrier holding the substrate in batches tends to be enlarged, and the installation area of the plating apparatus is increased.

Further, when the substrate is gradually increased in diameter, it becomes difficult for the operator to touch the components of the plating device (for example, the plating tank, the substrate cleaning machine, etc.) when the entire plating apparatus is increased in size, and as a result, it is difficult to perform maintenance of the plating apparatus. The problem.

In addition, it has been conventionally known to provide a system having a high degree of versatility by providing a plurality of processing lines for performing a plating process, and performing a plating process in parallel to increase the amount of processing (see, for example, Japanese Patent Laid-Open No. Hei 06-158395 Japanese Laid-Open Patent Publication No. 2001-335995, however, because the plating apparatus is increased in size, maintenance of the plating apparatus is difficult.

Accordingly, it is a first object of the present invention to provide a wet processing apparatus that achieves uniform substrate processing.

Further, a second object of the present invention is to provide a plating apparatus which can maintain the processing amount of a plating apparatus and which can easily touch the components of the plating apparatus, and can easily perform maintenance of the plating apparatus.

A wet processing apparatus according to the present invention is characterized by comprising: a substrate holder for holding a substrate; a processing tank for storing the processing liquid therein; and a substrate holder conveying mechanism for immersing the substrate in the substrate In the state of the processing liquid, the substrate holder is moved from the holder insertion position to the holder removal position, and the substrate holder conveying mechanism includes a fixed support table that supports the substrate holder and the substrate a holder suspended from the processing tank; a movable support table disposed adjacent to the fixed support table for supporting the substrate holder; and an actuator for raising the movable support table, lifting the foregoing The substrate holder is moved away from the fixed support table, and the movable support table is moved with the substrate holder toward the holder removal position by a predetermined distance, and the movable support table is lowered until the substrate holder is supported by the substrate holder The aforementioned fixed support table, and the movable support table is separated from the substrate holder to make the front Movable supporting table toward the holder into the specified degree from the position.

A suitable feature is that the actuator includes: a first actuator that moves the movable support table up and down; and a second actuator that causes the movable support table to be in the water Move in the flat direction.

Further, it is characterized in that the conveyor further includes: a conveyor that transports the substrate holder in a horizontal direction; and an elevator that transports the substrate holder in a vertical direction between the conveyor and the substrate holder transport mechanism The lifter immerses the substrate held in the substrate holder in the processing liquid, and picks up the substrate holder from the processing tank.

A suitable feature is that the substrate holder has a protruding portion that protrudes from the outer side, and the fixed supporting table has a plurality of concave portions that are embedded in the protruding portion.

A suitable feature is that the movable support table has a plurality of recesses embedded in the protruding portion.

A plating apparatus according to another aspect of the present invention is a plated substrate, comprising: a substrate holder that holds the substrate; and a plurality of plating processing portions disposed in a lateral direction, wherein the plurality of plating processing portions respectively a plurality of processing tanks for plating the substrate; and a substrate holder transporter that transports and holds the substrate holder between the plurality of processing tanks, and the plurality of platings There is a maintenance space between the processing units.

A feature of the present invention is that the maintenance space extends in parallel with the substrate holder conveyor.

According to a preferred aspect of the present invention, a piping space is formed below the maintenance space, and a piping for conveying the processing liquid used in the plurality of processing tanks is provided.

A preferred aspect of the present invention is characterized in that a common fluid introduction port is provided below the maintenance space for supplying a common fluid required for operating the plating device to the plurality of plating treatment portions.

According to a preferred aspect of the present invention, a substrate delivery portion is further provided, wherein the substrate is transferred to the substrate holder transporter, and the substrate delivery portion is disposed adjacent to the maintenance space.

According to a preferred aspect of the present invention, the substrate delivery unit includes a spin rinse dryer that rotates and dries the substrate, and the spin rinse dryer is disposed adjacent to the maintenance space.

According to a preferred aspect of the present invention, the plating treatment unit is an electroless plating treatment unit.

According to a preferred aspect of the present invention, the plating treatment unit is an electrolytic plating treatment unit.

According to the present invention, the substrate held by the substrate holder is raised and lowered while being immersed in the treatment liquid between the holder holding position and the holder removal position. Since the surface of the substrate relatively moves the treatment liquid, replacement of the treatment liquid contacting the substrate can be promoted, and bubbles adhering to the surface of the substrate can be removed. As a result, uniform substrate processing can be achieved.

In the case of the present invention, a maintenance space is provided between the plating treatment sections. The operator can easily access the components of the plating unit from the maintenance space, and the maintenance of the plating unit can be easily performed.

1‧‧‧ device framework

2‧‧‧Loading

3‧‧‧Control Department

4‧‧‧ aligner

5‧‧‧ Driving agencies

6‧‧‧Spin Flush Dryer

10‧‧‧Substrate loader

12‧‧‧Substrate transfer robot

14‧‧‧Storage tank

16‧‧‧Pre-processing unit

16a‧‧‧Pretreatment tank

16b‧‧‧Flushing tank

18‧‧‧nuclear forming unit

18a‧‧‧nuclear forming trough

18b‧‧‧ rinse tank

20‧‧‧First plating unit

20a‧‧‧ plating trough

20b‧‧‧ rinse tank

24‧‧‧Second plating unit

24a‧‧‧Second plating tank

24b‧‧‧flushing tank

26‧‧‧Workbench

28, 282‧‧‧The substrate holder erects the falling mechanism

30‧‧‧Conveyor

32‧‧‧ Arms

34‧‧‧claw

40‧‧‧Fixed base

42, 242‧‧‧ substrate holder

44, 244‧‧‧ Keep the arm

44a~44c‧‧‧first to third slit

45‧‧‧Support arm

46‧‧‧Protruding

46a‧‧‧outer part

46b‧‧‧ intermediate part

46c‧‧‧ inside part

50, 51‧‧‧ substrate holder transport mechanism

52‧‧‧ activity support

52a‧‧‧ recess

53‧‧‧First actuator

55, 56‧‧‧ lifts

59‧‧‧Fixed support table

59a‧‧‧ recess

60‧‧‧ Lifts

61‧‧‧Retainer support

62‧‧‧ Lifts

63‧‧‧Retainer support

64‧‧‧Horizontal actuators

75‧‧‧second actuator

76‧‧‧Actuator table

80‧‧‧ Lifts

81, 82, 83, 84‧‧‧ lifts

100‧‧‧ plating tank

101‧‧‧Substrate holder

201‧‧‧ device framework

202‧‧‧Loading

203‧‧‧Control Department

204‧‧‧ aligner

205‧‧‧Travel agency

206‧‧‧Spin Flush Dryer

210‧‧‧Substrate loader

212‧‧‧Substrate transfer robot

214‧‧‧Storage tank

229‧‧‧Processing tank

230‧‧‧Conveyor

231‧‧‧Plating treatment department

232‧‧‧ Arm

233‧‧‧ Lifts

234‧‧‧claw

240‧‧‧Fixed base

244a~244c‧‧‧first to third slit

260‧‧‧Pretreatment tank

262‧‧‧ rinse tank

264‧‧‧nuclear forming trough

266‧‧‧ rinse tank

268‧‧‧First plating tank

268a‧‧‧ plating unit

270‧‧‧ rinse tank

272‧‧‧Second plating tank

274‧‧‧ rinse tank

275‧‧‧Blowing groove

280‧‧‧Workbench

290‧‧‧Pharmaceutical supply unit

300‧‧‧Maintenance space

300a‧‧‧Rack

300b‧‧‧Support feet

302‧‧‧Substrate interface

304‧‧‧Filter

305‧‧‧Filter box

306‧‧‧Pipe space

308‧‧‧Common fluid introduction埠

W‧‧‧Substrate

The first drawing mode shows a front view of an electroless plating apparatus according to an embodiment of the present invention.

The second figure shows a diagram of the substrate holder.

The third figure shows a diagram of the holding arms of the substrate holder.

The fourth figure shows a perspective view of the first plating tank and the substrate holder conveying mechanism.

The fifth drawing is an explanatory view of the operation of the substrate holder conveying mechanism.

Fig. 6(a) is a view showing the substrate holder before the first actuator is raised, and Fig. 6(b) is a view showing the substrate holder raised by the first actuator.

The seventh drawing shows a perspective view of the first plating tank, the substrate holder conveying mechanism, and the elevator.

The eighth drawing shows a perspective view of a plating tank for an electroless plated substrate.

Fig. 9 is a front view showing an electroless plating apparatus according to an embodiment of the present invention.

The tenth figure shows a diagram of the substrate holder.

The eleventh figure shows a view of the holding arm of the substrate holder.

The twelfth figure is an A-line arrow view of the ninth figure.

The thirteenth picture is a schematic cross-sectional view of line B-B of the ninth figure.

Fig. 14 is a front view showing an electroless plating apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The wet processing apparatus is a device that processes a substrate such as a wafer using a treatment liquid such as a plating solution or an etching liquid. Examples of the wet processing apparatus include an electroless plating apparatus and a wet etching apparatus. The electroless plating apparatus is a plating apparatus that coats the surface of the substrate with metal without current passing through the plating solution. In the wet etching apparatus, the substrate is immersed in a liquid such as an organic solvent, the photoresist applied to the surface of the substrate is removed by etching, or the substrate is immersed in an etching solution in which sulfuric acid and hydrogen peroxide are mixed, and removed on the surface of the substrate. An etching device for a layer such as copper. Following as a wet process One embodiment of the apparatus describes an electroless plating apparatus, but the wet processing apparatus is not limited to the electroless plating apparatus.

The first drawing mode shows a front view of an electroless plating apparatus according to an embodiment of the present invention. As shown in the first figure, the electroless plating apparatus includes a device frame 1, a loading cassette 2 on which a wafer cassette containing a substrate W such as a wafer is mounted, a control unit 3 that controls the operation of the electroless plating apparatus, and The orientation plane or node of the substrate W is aligned with the aligner 4 in the specified direction. Further, the electroless plating apparatus further includes a spin rinse dryer (SRD) 6 for rotating the substrate W after the plating to be dried at a high speed, and the storage tank 14 is stored in a vertical posture. The substrate holder 42 is mounted on the substrate holder 42 by the substrate W to be plated, and the plated substrate W is taken out from the substrate holder 42; and the substrate transfer robot 12 transports the substrate. W.

The traveling mechanism 5 is disposed along the arrangement of the loading cassettes 2, and the traveling mechanism 5 is provided with the substrate transporting robot 12. An aligner 4 is disposed adjacent to the traveling mechanism 5 . The substrate transfer robot 12 moves into the wafer cassette mounted on the loading cassette 2 by moving on the traveling mechanism 5, takes out the substrate W to be plated from the wafer cassette, and sends the substrate W to the substrate loader 10.

The apparatus frame 1 is provided with a processing unit 16 before the surface of the substrate W (for example, removing copper oxide on the surface of the substrate W), and a core forming unit 18 for forming a palladium core on the surface of the substrate W, for example. The pretreatment unit 16 includes a pretreatment tank 16a for storing a treatment liquid before the surface of the substrate W is pretreated, and a rinse tank 16b for washing the substrate W immersed in the pretreatment liquid with a cleaning liquid (for example, pure water). The core forming unit 18 includes a core forming groove 18a for forming a palladium core on the surface of the substrate W, and a rinse tank 18b for washing the substrate W on which the palladium core is formed by a cleaning liquid (for example, pure water).

The electroless plating apparatus further includes: electroless plating on the surface of the substrate W For example, a first plating unit (first processing unit) 20 that forms a cobalt layer (Co); and a second plating unit that forms a gold layer (Au) by electroless plating on the surface of the substrate W (second processing unit) )twenty four. The first plating unit 20 includes a first plating tank (first treatment tank) 20a that stores a plating solution (first treatment liquid) such as a cobalt plating solution, and a cleaning liquid (for example, pure water). The rinsing tank 20b of the substrate W immersed in the plating solution in the first plating tank 20a.

The second plating unit 24 includes a second plating tank (second treatment tank) 24a that stores a plating liquid (second treatment liquid) such as a gold plating solution, and a cleaning liquid (for example, pure water). The rinsing tank 24b of the substrate W immersed in the plating solution in the second plating tank 24a. The pretreatment unit 16, the core forming unit 18, the first plating unit 20, the second plating unit 24, and the storage tank 14 are arranged in a straight line in this order.

Each of the first plating unit 20 and the second plating unit 24 includes an overflow tank (not shown). The plating liquid overflowed by the plating tanks 20a and 24a flows into the overflow tank, respectively, and is returned to the plating tanks 20a and 24a through a circulation line (not shown). A temperature adjustment unit for the filter and the plating solution is provided in the circulation line.

The substrate loader 10 is disposed adjacent to the storage tank 14 . The substrate loader 10 includes a table 26 on which the substrate holder 42 is horizontally placed, and a substrate holder erecting and lowering mechanism 28 that causes the substrate holder 42 to stand upside down. The substrate holder erecting and lowering mechanism 28 is provided on the side of the table 26. The substrate holder erecting and lowering mechanism 28 is configured to convert the substrate holder 42 from a vertical posture to a horizontal posture and to place the substrate holder 42 on the table 26. The substrate W is mounted on the substrate holder 42 on the table 26, and the substrate W is taken out from the substrate holder 42.

The electroless plating apparatus includes a conveyor 30 that transports the substrate W in the horizontal direction. The conveyor 30 includes a fixed base 40 extending horizontally from the substrate loader 10 to the pre-processing unit 16, an arm 32 that can be horizontally moved on the fixed base 40, and a jaw that is attached to the arm 32. (gripper) 34. A driving source for moving the arm 32 in the horizontal direction may be a linear motor or a rack and pinion or the like. The jaws 34 are configured to hold the substrate holder 42.

The substrate holder 42 will be described with reference to the second figure. The second figure shows a diagram of the substrate holder 42. As shown in the second figure, the substrate holder 42 has projections 46, 46 that protrude from the outside. The support arm 45 extends between the projections 46,46. Two holding arms 44, 44 for holding the substrate W are fixed to the support arm 45. The conveyor 30 conveys the substrate holder 42 in a state where the gripper 34 holds the support arm 45.

Each of the holding arms 44 has a first slit 44a, a second slit 44b, and a third slit 44c. The third figure shows a view of the substrate W sandwiched by the slits 44a to 44c of the holding arm 44. The third figure shows one holding arm 44. As shown in the third figure, the substrate W is held by the substrate holder 42 by inserting the peripheral edge portion of the substrate W into the slits 44a to 44c. As shown in the second figure, the substrate W is sandwiched by the slits 44a to 44c of the two holding arms 44, 44 by sliding the substrate W from the position where the dotted line is displayed to the position where the solid line is displayed. The mounting of the substrate W to the substrate holder 42 is performed by the substrate transfer robot 12 shown in the first drawing or the substrate sliding mechanism (not shown) mounted on the table 26. In addition, the second slit 44b may be omitted.

The electroless plating apparatus includes a substrate holder transport mechanism 50 that transports the substrate holder 42 from the holder input position IN to the holding state in a state where the substrate W is immersed in the plating liquid in the first plating tank 20a. The substrate take-up position OUT and the substrate holder transport mechanism 51 transport the substrate holder 42 from the holder input position IN to the holder in a state where the substrate W is immersed in the plating liquid in the second plating tank 24a. Take out the position OUT. The holder input position IN is a position at which the substrate holder 42 holding the substrate W is placed in the plating grooves 20a and 24a, and the holder take-out position OUT is taken out from the plating grooves 20a and 24a to hold the substrate W. The position of the substrate holder 42. Since the substrate holder transport mechanisms 50, 51 have the same configuration, the following description will be given. The configuration of the substrate holder transport mechanism 50 is omitted, and the description of the substrate holder transport mechanism 51 is omitted.

The fourth figure shows a perspective view of the first plating tank 20a and the substrate holder conveying mechanism 50. Hereinafter, the first plating tank 20a is simply referred to as a plating tank 20a. As shown in the fourth figure, a substrate holder transport mechanism 50 is provided adjacent to the plating tank 20a. In the substrate holder transport mechanism 50, the substrate holder 42 is immersed in the plating liquid in the plating tank 20a, and the substrate holder 42 is moved from the holder insertion position IN in the direction of the arrow display to the holder take-out position OUT. .

The substrate holder transport mechanism 50 includes: two fixed support tables 59 for supporting the substrate holder 42 and suspending the substrate holder 42 in the plating tank 20a; and two movable support tables 52 for supporting the substrate holder 42; And two first actuators 53 that raise and lower the two movable support tables 52. The two movable support bases 52 are disposed adjacent to the two fixed support bases 59, respectively. These fixed support tables 59 and movable support tables 52 constitute different portions of the protruding portion 46 of the support substrate holder 42.

The fixed support table 59 is disposed on both sides of the plating tank 20a. The fixed support table 59 can also be fixed to both side walls of the plating tank 20a. A plurality of recesses 59a for supporting the projections 46 of the substrate holder 42 are formed on the fixed support table 59. The plurality of recesses 59a are arranged in a straight line along the transport direction of the substrate holder 42. The substrate holder transport mechanism 50 is disposed between the lifters 55 and 56 and the plating tank 20a. A plurality of recesses 52a for supporting the projections 46 of the substrate holder 42 are formed on the movable support table 52. The plurality of recesses 52a are arranged in a straight line along the transport direction of the substrate holder 42. A first actuator 53 is coupled to the lower portion of the movable support table 52. The first actuator 53 can use, for example, a cylinder.

The substrate holder transport mechanism 50 further includes an actuator stage 76 that fixes the first actuator 53, and a second actuator 75 that moves the movable support base 52 and the first actuator 53 in the horizontal direction. The second actuator 75 is coupled to the first actuator 53 via the actuator stage 76. Second actuator For example, a combination of a servo motor and a ball screw mechanism or a linear motor can be used.

The fixed support table 59 and the movable support table 52 are arranged in parallel with each other. The position of the fixed support table 59 is fixed. The movable support table 52 is moved up and down by the first actuator 53, and is further moved in the horizontal direction by the second actuator 75. The second actuator 75 extends in parallel with the fixed support table 59 to move the movable support table 52 in a direction parallel to the fixed support table 59. In other words, the movable support table 52, the first actuator 53, and the actuator stage 76 are integrally moved in the horizontal direction by the second actuator 75.

Next, the operation of the substrate holder transport mechanism 50 will be described with reference to the fifth diagram. Step 1 is the substrate holder 42 placed on the fixed support table 59 by the elevator 55 shown in the first figure. The protruding portion 46 of the substrate holder 42 is fitted into the recess 59a of the fixed support table 59, and the substrate holder 42 is suspended in the plating groove 20a. The position of the substrate holder 42 is the holder input position IN. The holder input position IN holds the position where the substrate holder 42 of the substrate W is placed in the plating tank 20a. The substrate holder 42 is transported from the holder insertion position IN to the holder take-out position OUT by the substrate holder transport mechanism 50 while the substrate W is immersed in the plating solution. The holder take-out position OUT is a position at which the substrate holder 42 holding the substrate W is taken out from the plating tank 20a.

Next, in step 2, the first actuator 53 raises the movable support table 52, and the projection 46 of the substrate holder 42 is inserted into the recess 52a of the movable support table 52. In a state where the protruding portion 46 is supported by the movable support table 52, the first actuator 53 lifts the movable support table 52 together with the substrate holder 42 to move the substrate holder 42 away from the fixed support table 59. This step 2 is the first actuator 53 raising the movable support table 52 by the fixed support table 59. The distance at which the substrate holder 42 is raised is maintained at a distance in a state in which the entire substrate W held by the substrate holder 42 is immersed in the plating solution (treatment liquid) in the plating tank 20a.

In the step 3, in a state where the movable holding table 52 lifts the substrate holder 42, the second actuator 75 moves the movable support table 52 and the substrate holder 42 in the horizontal direction toward the holder take-out position OUT by a predetermined distance. When the substrate holder 42 moves in the horizontal direction, the substrate W is still immersed in the plating solution. The moving distance of the substrate holder 42 in the horizontal direction can be appropriately changed. In the example shown in the fifth figure, the moving distance of the substrate holder 42 in the horizontal direction is equal to the distance between the adjacent concave portions 59a of the fixed support table 59.

Step 4 is the first actuator 53 supporting the projection 46 of the substrate holder 42 on the fixed support table 59, and lowering the movable support table 52 to the movable support table 52 from the substrate holder 42. More specifically, the first actuator 53 lowers the movable support table 52 together with the substrate holder 42 and causes the protruding portion 46 of the substrate holder 42 to be embedded in the additional recess 59a of the fixed support table 59. Thereby, the substrate holder 42 is again supported by the fixed support table 59. The first actuator 53 further lowers the movable support table 52 to move the movable support table 52 away from the substrate holder 42. This step 4 is such that the first actuator 53 lowers the movable support table 52 lower than the fixed support table 59.

Step 5 After the movable support table 52 is separated from the substrate holder 42, the first actuator 53 moves the movable support table 52 in the horizontal direction toward the holder input position IN by the specified distance. Therefore, the movable support table 52 returns to the initial position shown in step 1. In step 6, the new substrate holder 42 is transported to the holder input position IN, and the protruding portion 46 of the substrate holder 42 is fitted into the recess 59a of the fixed support table 59.

The first actuator 53 and the second actuator 75 repeatedly perform the operations of steps 1 to 5. As a result, the substrate holder 42 moves up and down and moves from the holder input position IN to the holder take-out position OUT. When the substrate holder 42 reaches the holder take-out position OUT, the substrate holder 42 is taken out from the plating tank 20a by the lifter 56.

A plurality of substrate holders 42 are continuously conveyed to the plating tank 20a. The substrate holders 42 are put into the holder insertion position IN of the plating tank 20a one by one, and are taken out one by one from the holder take-out position OUT of the plating tank 20a. A plurality of substrate holders 42 are present in the plating tank 20a at any time, and the substrate W held by the substrate holders 42 is plated with a plating solution.

As is understood from the fifth figure, as the substrate holder 42 rises and falls, the substrate W rises and falls in a state of being immersed in the plating solution. Since the surface of the substrate W relatively moves up and down with respect to the plating solution, the plating solution in contact with the substrate W can be replaced with a new plating solution. Further, by raising and lowering the substrate W, bubbles adhering to the surface of the substrate W can be removed. Therefore, a metal film of a uniform thickness can be formed on the surface of the substrate W.

The sixth diagram (a) shows the substrate holder 42 before the first actuator 53 is raised, and the sixth diagram (b) shows the substrate holder 42 after the first actuator 53 is raised. Figure. Step 2 shown in the fifth figure is that the first actuator 53 raises the movable support table 52 and raises the substrate holder 42 from the position shown in the sixth figure (a) to the sixth figure (b). position. As shown in the sixth diagram (b), the entire substrate W held by the substrate holder 42 at the raised position is still immersed in the plating solution.

Electroless plating is started when the substrate W is immersed in the plating solution, and plating of the substrate W is started. When the substrate W is lifted from the plating solution, the plating of the substrate W is completed. In the present embodiment, even if the substrate holder 42 is raised, the substrate W is immersed in the plating solution, so that the plating of the substrate W is not interrupted.

The seventh drawing shows a perspective view of the first plating tank 20a, the substrate holder conveying mechanism 50, the elevator 55, and the elevator 56. As shown in the seventh figure, the elevator 55 and the elevator 56 are disposed adjacent to the substrate holder transport mechanism 50. The lifter 55 is a single-direction elevator that is configured to raise and lower the substrate holder 42, and the lifter 56 is a two-way elevator that is configured to raise and lower the substrate holder 42 and further move the substrate holder 42 in the horizontal direction.

The lifter 55 includes two retainer support portions 61 for supporting the two projecting portions 46 of the substrate holder 42 and two lifters 60 for raising the retainer support portions 61 together with the substrate holder 42 And down. The holder support portion 61 and the lift 60 are disposed on the outer side of the substrate holder transport mechanism 50.

The lifter 55 is configured to move the substrate holder 42 in the vertical direction between the conveyor 30 and the substrate holder transport mechanism 50 by moving the substrate holder 42 in the vertical direction. More specifically, the conveyor 30 holds the substrate holder 42 with its jaws 34 and conveys the substrate holder 42 to the elevator 55. The elevator 60 of the elevator 55 raises the holder support portion 61 to cause the holder support portion 61 to receive the substrate holder 42. Next, the elevator 60 lowers the holder supporting portion 61 together with the substrate holder 42 to place the substrate holder 42 on the fixed support table 59 of the substrate holder conveying mechanism 50, and immerses the substrate W in the plating groove 20a. In the plating solution. The position of the substrate holder 42 placed on the fixed support table 59 by the lifter 55 is the holder input position IN shown in the first step of the fifth drawing. The elevator 55 receives the substrate holder 42 from the conveyor 30 at the raised position of the holder support portion 61. After the conveyor 30 sends the substrate holder 42 to the elevator 55, it can move in order to convey the substrate holder 42 held by the substrate W processed in another processing tank.

The elevator 56 includes two holder supporting portions 63 that respectively support the two protruding portions 46 of the substrate holder 42 , and two elevators 62 that raise and lower the holder supporting portions 63 together with the substrate holder 42 ; The holder support portion 63 and the lifter 62 move the two horizontal actuators 64 in the horizontal direction. The holder support portion 63, the lifter 62, and the horizontal actuator 64 are disposed on the outer side of the substrate holder transport mechanism 50.

The lifter 56 is configured to move the substrate holder 42 in the vertical direction between the substrate holder transport mechanism 50 and the conveyor 30 by moving the substrate holder 42 in the vertical direction. again The lifter 56 is configured to convey the substrate holder 42 in a horizontal direction between two adjacent processing tanks (that is, the plating tank 20a and the flushing tank 20b). More specifically, the elevator 62 raises the holder support portion 63 to support the substrate holder 42 placed on the fixed support table 59 to the holder support portion 63, and further raises the holder support portion 63 together with the substrate holder 42. . The position of the substrate holder 42 when supported by the holder supporting portion 63 of the elevator 56 is the holder take-out position OUT. The horizontal actuator 64 moves the holder support portion 63 and the substrate holder 42 in the raised position in the horizontal direction to the flushing tank 20b of the adjacent processing tank. In addition, the lifter 56 immerses the substrate W held in the substrate holder 42 in the washing liquid in the rinse tank 20b, picks up the substrate W from the cleaning liquid, and finally raises the holder support portion 63 to hold the substrate holder. 42 is delivered to conveyor 30.

As described above, the substrate W held by the substrate holder 42 is immersed in the plating liquid in the first plating tank 20a and the cleaning liquid in the rinsing tank 20b by the lifter 56 and the substrate holder transport mechanism 50, respectively. Then, the substrate W is picked up from the plating solution and the cleaning solution. Further, when the conveyor 30 is sent to the elevator 55, the conveyor 30 receives only the substrate holder 42 from the elevator 56. The operation of the lifters 55, 56 to transport the substrate holder 42 can be performed independently of the operation of the conveyor 30. Thereby, the throughput of the entire device can be increased.

The holder supporting portions 61, 63 of the lifters 55, 56, the recess 59a of the fixed support base 59, and the recess 52a of the movable support base 52 are disposed to support different portions of the protruding portion 46 of the substrate holder 42, respectively. That is, as shown in the second figure, the holder supporting portions 61, 63 of the elevators 55, 56 support the outer side portion 46a of the protruding portion 46, and the concave portion 59a of the fixed supporting table 59 supports the inner portion 46c of the protruding portion 46, the movable supporting table The recess 52a of 52 supports the intermediate portion 46b between the outer portion 46a and the inner portion 46c.

Next, the operation of the electroless plating apparatus will be described with reference to the first drawing. First, by The lifter 80 disposed adjacent to the storage tank 14 takes out the substrate holder 42 in the vertical posture from the storage tank 14. The elevator 80 is configured to raise and lower the substrate holder 42 and further move the substrate holder 42 in the horizontal direction to form a two-way elevator. Since the configuration of the elevator 80 is the same as that of the elevator 56 shown in FIG. 7, the detailed description thereof will be omitted. The elevator 80 can take out any of the substrate holders 42 in a plurality of substrate holders 42 arranged in the storage tank 14 in a neat manner. The elevator 80 feeds the substrate holder 42 to the conveyor 30, and the conveyor 30 delivers the substrate holder 42 to the substrate holder of the substrate loader 10 to erect the falling mechanism 28. The substrate holder of the substrate loader 10 raises the tilt mechanism 28 to convert the substrate holder 42 from the vertical posture to the horizontal posture, and then places it on the table 26.

The substrate transfer robot 12 takes out one substrate W from the wafer cassette mounted on the cassette 2 and places it on the aligner 4. The aligner 4 aligns the orientation plane or the position of the notch with a specified direction. The substrate transfer robot 12 takes out the substrate W from the aligner 4 and inserts the substrate W into the substrate holder 42 placed on the stage 26. More specifically, the substrate transfer robot 12 loads the substrate W to the substrate holder 42 by sliding the substrate W from the position shown by the broken line in the second figure to the position displayed by the solid line. Alternatively, a substrate sliding mechanism (not shown) for sliding the substrate W in parallel may be provided on the table 26, the substrate transfer robot 12 sends the substrate W to the substrate sliding mechanism, and the substrate sliding mechanism mounts the substrate W on the substrate. 42.

Next, the substrate holder erects the falling mechanism 28 to convert the substrate holder 42 from a horizontal posture to a vertical posture. The jaws 34 of the arms 32 hold the substrate holder 42 in the upright state, and the conveyor 30 moves the substrate holder 42 to a predetermined position above the pretreatment tank 16a. An elevator 81 is provided adjacent to the pretreatment tank 16a. The elevator 81 is a two-way elevator that is configured to raise and lower the substrate holder 42 and further move the substrate holder 42 in the horizontal direction. Since the configuration of the elevator 81 is the same as that of the elevator 56 shown in FIG. 7, the detailed description thereof will be omitted.

The lifter 81 receives the substrate holder 42 from the conveyor 30, lowers the substrate holder 42, and immerses the substrate W held by the substrate holder 42 in the pretreatment liquid in the pretreatment tank 16a. The surface of the substrate W is pretreated by a pretreatment liquid. This pretreatment is, for example, a treatment of removing copper oxide on the surface of the substrate W. After the pretreatment, the elevator 81 raises the substrate holder 42 to pick up the substrate W from the pretreatment liquid.

The lifter 81 moves the substrate holder 42 in the horizontal direction to the rinse tank 16b adjacent to the pretreatment tank 16a, and lowers the substrate holder 42 to immerse the substrate W in the washing liquid in the rinse tank 16b. The substrate W is washed by a cleaning solution. After the washing, the lifter 81 raises the substrate holder 42 and picks up the substrate W from the washing liquid in the rinse tank 16b.

The conveyor 30 receives the substrate holder 42 from the elevator 81, and moves the substrate holder 42 to a predetermined position above the core forming groove 18a. An elevator 82 is provided adjacent to the core forming groove 18a. The elevator 82 is configured to raise and lower the substrate holder 42 and further move the substrate holder 42 in the horizontal direction to form a two-way elevator. Since the configuration of the elevator 82 is the same as that of the elevator 56 shown in FIG. 7, the detailed description thereof will be omitted.

The lifter 82 receives the substrate holder 42 from the conveyor 30, lowers the substrate holder 42, and arranges the substrate W held by the substrate holder 42 in the core forming groove 18a. The core forming groove 18a imparts a core (for example, a palladium core) for depositing a metal film to the surface of the substrate. Thereafter, the elevator 82 raises the substrate holder 42 and lifts the substrate W from the core forming groove 18a. Next, the lifter 82 moves the substrate holder 42 in the horizontal direction to the rinse tank 18b adjacent to the core forming groove 18a, and lowers the substrate holder 42 to immerse the substrate W in the washing liquid in the rinse tank 18b. The substrate W is washed by a cleaning solution. After the washing, the lifter 82 raises the substrate holder 42 and picks up the substrate W from the washing liquid in the rinse tank 18b.

The conveyor 30 receives the substrate holder 42 from the elevator 82, and moves the substrate holder 42 to a predetermined position above the plating tank 20a. The elevator 55 receives the substrate holder 42 from the conveyor 30, lowers the substrate holder 42, and places the substrate holder 42 on the substrate holder transport mechanism 50 as described above. The position of the substrate holder 42 is the above-described holder input position IN. As shown in FIG. 5, in a state where the entire substrate W is immersed in the plating liquid in the plating tank 20a, the substrate holder transport mechanism 50 moves the substrate holder 42 up and down while transporting the substrate from the holder input position IN. The holder 42 to the holder take out the position OUT. The substrate W moves in the plating solution, and at this time, the first stage of electroless plating is performed on the surface of the substrate W. The electroless plating of the first stage is, for example, cobalt (Co) plating.

After the substrate holder 42 is immersed in the plating solution for a predetermined period of time, the subsequent substrate holder 42 holding the other substrate is placed in the holder insertion position IN of the plating tank 20a. That is, the plurality of substrate holders 42 are continuously supplied to the plating tank 20a at predetermined time intervals, and are continuously taken out from the plating tank 20a at specified time intervals.

The lifter 56 raises the substrate holder 42 that has reached the holder take-out position OUT, and picks up the substrate W from the plating liquid. Next, the lifter 56 moves the substrate holder 42 in the horizontal direction to the rinse tank 20b adjacent to the plating tank 20a, and lowers the substrate holder 42 to immerse the substrate W in the washing liquid in the rinse tank 20b. The substrate W is washed by a cleaning solution. After the washing, the lifter 56 raises the substrate holder 42 and picks up the substrate W from the washing liquid in the rinse tank 20b.

The conveyor 30 receives the substrate holder 42 from the elevator 56, and moves the substrate holder 42 in a horizontal direction to a predetermined position above the second plating tank 24a. An elevator 83, an elevator 84, and a substrate holder transport mechanism 51 are disposed adjacent to the second plating tank 24a. The lifter 83 is a single-direction elevator configured to raise and lower the substrate holder 42, and the lifter 84 is a substrate holder. 42 is raised and lowered, and the two-way elevator is further configured to move the substrate holder 42 in the horizontal direction. The lifter 83 and the lifter 84 have the same configuration as the lifter 55 and the lifter 56, respectively.

The elevator 83 receives the substrate holder 42 from the conveyor 30, lowers the substrate holder 42, and places the substrate holder 42 on the substrate holder transport mechanism 51. The position of the substrate holder 42 is the above-described holder input position IN. In the same manner as the substrate holder transport mechanism 50, the substrate holder transport mechanism 51 moves the substrate holder 42 up and down while the entire substrate W is immersed in the plating liquid in the plating tank 24a, and simultaneously enters the position IN from the holder. The substrate holder 42 is transported to the holder take-out position OUT. The substrate W moves in the plating solution, and at this time, the second stage of electroless plating is performed on the surface of the substrate W. The electroless plating of the second stage is, for example, gold (Au) plating.

After the substrate holder 42 is immersed in the plating solution for a predetermined period of time, the subsequent substrate holder 42 holding the other substrate is placed in the holder insertion position IN of the plating tank 24a. That is, a plurality of substrate holders 42 are continuously supplied to the plating tank 24a at specified time intervals, and are continuously taken out from the plating tank 24a at specified time intervals.

The elevator 84 raises the substrate holder 42 that has reached the holder take-out position OUT, and picks up the substrate W from the plating liquid. Next, the lifter 84 moves the substrate holder 42 in the horizontal direction to the rinse tank 24b adjacent to the plating tank 24a, and lowers the substrate holder 42 to immerse the substrate W in the washing liquid in the rinse tank 24b. The substrate W is washed by a cleaning solution. After the washing, the lifter 84 raises the substrate holder 42 and picks up the substrate W from the washing liquid in the flushing tank 24b.

The conveyor 30 receives the substrate holder 42 from the elevator 84, moves the substrate holder 42 in the horizontal direction, and delivers the substrate holder upside down mechanism 28. The substrate holder erecting and lowering mechanism 28 places the substrate holder 42 horizontally on the table 26 in the same manner as described above. Substrate transfer machine The person 12 takes out the substrate W from the substrate holder 42 by sliding the substrate W from the position shown by the solid line in the second figure to the position shown by the broken line. Alternatively, the substrate W may be slid from the substrate holding position of the substrate holder 42 by a substrate sliding mechanism (not shown) provided on the table 26, and then the substrate transfer robot 12 may take out the substrate W from the substrate sliding mechanism.

Thereafter, the substrate transfer robot 12 transports the substrate W to the spin rinse dryer 6. The spin rinse dryer 6 rotates the substrate W at a high speed to dry the substrate. The substrate transfer robot 12 takes out the dried substrate W from the spin rinse dryer 6 and returns it to the wafer cassette loaded with the crucible 2. Thereby, the processing of the substrate W is completed.

Next, other embodiments of the present invention will be described with reference to the drawings. Fig. 9 is a front view showing an electroless plating apparatus according to an embodiment of the present invention. As shown in FIG. 9, the plating apparatus includes a device frame 201, a loading cassette 202 on which a substrate W such as a wafer is housed, a control unit 203 that controls the operation of the plating apparatus, and an orientation flat or notch of the substrate W. The aligner 204 is positioned in a specified direction. Further, the plating apparatus includes a spin rinse dryer (SRD) 206 that spins the substrate W after the plating is rotated at a high speed, and the substrate loader 210 mounts the substrate W before plating on the substrate holder 242 ( The substrate W after plating is taken out from the substrate holder 242, and the substrate transfer robot 212 transports the substrate W.

A traveling mechanism 205 is disposed along the arrangement of the loading cassettes 202, and the traveling mechanism 205 is provided with a substrate transfer robot 212. The substrate transfer robot 212 moves into the wafer cassette mounted on the loading cassette 202 by moving on the traveling mechanism 205, and takes out the substrate W before plating from the wafer cassette, and sends the substrate W to the substrate loader 210. The substrate holder 242 is delivered. The aligner 204, the spin rinse dryer 206, the substrate loader 210, and the substrate transfer robot 212 are disposed in the apparatus frame 201.

In the apparatus frame 201, a plurality of processing tanks 229 used for the substrate W plating process and a conveyor (substrate holder conveyor) 230 for transporting the substrates W are disposed. The conveyor 230 has an arm 232 having a jaw 234. The conveyor 230 conveys the substrate holder 242 holding the substrate W between the substrate loader 210 and the processing tank 229, and further moves the substrate holder 242 up and down together with the substrate W.

The processing tanks 229 are arranged in a straight line, and the conveyors 230 are arranged along the arrangement direction of the processing tanks 229. The plating processing unit 231 is configured by the processing tank 229 and the conveyor 230. The plating apparatus of this embodiment includes two plating processing sections 231 and 231 arranged in the lateral direction. In the plating treatment units 231 and 231 of the present embodiment, no current flows through the plating solution, and the electroless plating treatment portion on the surface of the substrate W is plated with metal. However, the plating treatment portions 231 and 231 may plate the electrolytic plating treatment portion on the surface of the substrate W with a metal by flowing a current through the plating solution.

The plurality of processing tanks 229 include: a storage tank 214 for storing the substrate holder 242; a pretreatment liquid before the pretreatment of the substrate W; the substrate W is pretreated, and the substrate W is washed with a treatment liquid (pure water). The rinsing tank 262; a nucleus forming groove 264 for forming a palladium core on the surface of the substrate W; and a rinsing tank 266 for immersing the substrate W immersed in the core forming groove 264 with a treatment liquid (pure water). Further, the plurality of processing tanks 229 include: a first plating tank 268 which forms a cobalt (Co) layer or a nickel (Ni) layer on the surface of the substrate W by electroless plating; and is washed with a treatment liquid (pure water). The rinsing tank 270 is immersed in the substrate W of the first plating tank 268; further, by electroless plating, for example, a second plating tank 272 forming a gold (Au) layer on the surface of the substrate W; and a treatment liquid (pure water) The rinsing tank 274 immersed in the second plating tank 272 is washed; and the rinsing tank 275 for dewatering the substrate W after washing is performed. The first plating tank 268 is composed of a plurality of plating units 268a. The pretreatment tank 260, the rinsing tank 262, the core forming tank 264, the rinsing tank 266, the first plating tank 268, the rinsing tank 270, the second plating tank 272, The flushing tank 274, the blowing tank 275, and the storage tank 214 are arranged in a straight line in this order.

The pretreatment tank 260, the core forming tank 264, the first plating tank 268, the second plating tank 272, and each of the flushing tanks 262, 266, 270, and 274 are capable of holding a processing tank having a rectangular cross section of each processing liquid, and Each has an overflow tank (not shown). The overflow treatment liquid is circulated through the circulation line by the pump and then supplied to the treatment tank again. A temperature adjustment unit for the filter and the plating solution is provided in the circulation line.

Two chemical supply units 290 and 290 for supplying a chemical required for the substrate W plating treatment such as a plating solution are disposed at one end of the plating treatment portions 231 and 231. The substrate delivery portion 302 is disposed at the other end of the plating treatment portions 231 and 231. The substrate delivery unit 302 includes two substrate loaders 210 and 210, two spin rinse dryers 206, one aligner 204, one traveling mechanism 205, and one substrate transfer robot 212. In addition, since the two spin flushing dryers 206 are arranged in an overlapping manner, the ninth drawing shows one spin flushing dryer 206.

The substrate loader 210 is disposed adjacent to the storage tank 214, and includes a table 280 on which the substrate holder 242 is horizontally placed, and a substrate holder erecting and lowering mechanism 282 that causes the substrate holder 242 to stand upside down. The substrate holder erecting mechanism 282 is disposed on the side of the table 280. The substrate holder erecting and lowering mechanism 282 is configured to convert the substrate holder 242 from a vertical posture to a horizontal posture, and the substrate holder 242 is placed on the table 280.

A traveling mechanism 205 is disposed between the loading cassette 202 and the spin flushing dryer 206 in the direction in which the loading cassettes 202 are arranged, and the traveling mechanism 205 is provided with the substrate transport robot 212. An aligner 204 is disposed adjacent to the traveling mechanism 205.

The conveyor 230 includes a fixed base 240 that is fixed to the apparatus frame 201 and extends horizontally from the substrate loader 210 to the pre-treatment tank 260; horizontally on the fixed base 240 An elevator 233 configured to move; and an arm 232 coupled to the elevator 233. The arm 232 moves integrally with the elevator 233 in the horizontal direction, and the arm 232 can be raised and lowered by the elevator 233. A driving source for moving the elevator 233 and the arm 232 in the horizontal direction may be a linear motor, a rack, a pinion or the like. The arm 232 has one jaw 234, and the jaw 234 is configured to hold one substrate holder 242.

The substrate holder 242 will be described with reference to the tenth drawing. The tenth figure shows a diagram of the substrate holder 242. As shown in the tenth diagram, the substrate holder 242 is constituted by holding arms 244, 244 that hold the substrate W, and support members 246 that support the holding arms 244, 244. The holding arm 244 has a first slit 244a, a second slit 244b, and a third slit 244c. The eleventh figure shows a view of the substrate W sandwiched by the slits 244a to 244c of the holding arm 244. The eleventh figure shows one holding arm 244. As shown in the eleventh figure, the peripheral edge portion of the substrate W is sandwiched by the slits 244a to 244c, and the substrate W is held by the substrate holder 242. As shown in FIG. 9, the substrate transfer robot 212 or the substrate slide mechanism (not shown) mounted on the table 280 slides the substrate W from the position shown by the broken line to the position where the solid line is displayed, and the substrate W is held by two. The slits 244a to 244c of the arms 244 and 244 are interposed.

Next, the layout in the apparatus frame 201 of the electroless plating apparatus of the present embodiment will be described with reference to the ninth embodiment. As shown in FIG. 9, the electroless plating apparatus of the present embodiment includes two plating treatment sections (electroless plating treatment sections) 231 and 231, and the plating treatment sections 231 and 231 are laterally disposed in the apparatus frame 201, and Separated from each other. A maintenance space 300 that can enter the components of the plating apparatus is provided between the plating treatment sections 231, 231. The wire portion of the ninth diagram represents the maintenance space 300. The service space 300 extends parallel to the conveyors 230, 230 and is disposed adjacent to the conveyors 230, 230. With this configuration, the operator can easily enter the conveyors 230, 230, and the maintenance of the conveyors 230, 230 can be easily performed. One portion of the maintenance space 300 is located between the medication supply units 290, 290.

The plating treatment units 231 and 231 are disposed on both sides of the maintenance space 300. By doing this The operator can quickly recognize both of the plating processing units 231, 231 from the maintenance space 300. Further, the plating apparatus including the two plating treatment sections 231 and 231 can be operated in accordance with various plating conditions. For example, the operation of the one plating treatment unit 231 is stopped, the maintenance of the plating processing unit 231 is performed, and the other plating processing unit 231 can be operated. Further, each of the plating treatment portions 231, 231 can perform different plating treatments by using different processing liquids.

The spin rinse dryer 206 is disposed between the substrate loaders 210, 210 and disposed adjacent to the end of the maintenance space 300. Thus, the operator can easily enter the spin rinse dryer 206, and the repair of the spin rinse dryer 206 can be easily performed.

The twelfth figure is an A-line arrow view of the ninth figure. As shown in Fig. 12, a filter 304 that does not allow passage of an unnecessary substance contained in the treatment liquid, and a filter case 305 that accommodates the filter 304 are disposed on the outer wall surface of the apparatus frame 201. In the past plating apparatus, since the filter 304 is disposed at the lower portion of the wall surface outside the apparatus frame 201, the work of repairing or replacing the filter 304 is laborious. In the plating apparatus of the present embodiment, since the filter 304 is disposed on the upper surface of the outer wall of the apparatus frame 201, the operator can easily enter the filter 304. As a result, maintenance (repair, replacement, etc.) of the filter 304 can be easily performed.

The thirteenth picture is a schematic cross-sectional view of line B-B of the ninth figure. In the thirteenth diagram, the medicine supply unit 290 is displayed in a mode for convenience of viewing the figure. As shown in Fig. 13, between the plating processing units 231, 231, a gantry 300a which serves as an operator's foot and a supporting leg 300b, 300b for supporting the gantry 300a are provided. A maintenance space 300 is formed above the gantry 300a, and a piping space 306 is formed below the gantry 300a. A pipe for transporting the treatment liquid used for the plating treatment is collectively disposed in the piping space 306. These pipes are, for example, pipes connected to the filter 304 and the drug supply units 290, 290.

It is also possible to receive a common fluid such as pure water or nitrogen (N ₂ ) required for operating the electroless plating apparatus from the common supply apparatus, and introduce the common fluid supplied to the plating processing sections 231, 231 into the joint (joint) 308. It is provided below the gantry 300a (in the piping space 306). As shown in Fig. 13, the common fluid can also be supplied from the downstairs where the plating apparatus is installed through the piping.

According to the present embodiment, the worker can easily recognize the state in the processing tank 229 from the maintenance space 300 provided between the plating processing units 231, 231. Further, since the filter 304 and the filter case 305 are disposed on the upper surface of the plating device, the filter 304 can be replaced from the outside of the plating device. By disposing the filter case 305 on the upper surface of the outer wall of the plating apparatus, although the maintenance of the inside of the plating apparatus from the outside of the plating apparatus is somewhat restricted, the plating apparatus can be easily performed by providing the maintenance space 300. Internal maintenance. Furthermore, by providing the piping space 306 under the maintenance space 300, the space can be effectively utilized.

Next, the processing operation of the plating apparatus configured as described above will be described. First, the substrate holder 242 in the vertical posture is taken out from the storage tank 214 by the arm 232 of the conveyor 230. The arm 232 holding the substrate holder 242 is moved in the horizontal direction and sent to the substrate holder 242 to the substrate loader 210. The substrate holder erecting and lowering mechanism 282 of the substrate loader 210 converts the substrate holder 242 from the vertical posture to the horizontal posture and places it on the table 280.

The substrate transfer robot 212 takes out one substrate W from the cassette mounted on the cassette 202 and places it on the aligner 204. The aligner 204 aligns the orientation plane or the location of the notch to a specified direction. The substrate transfer robot 212 takes out the substrate W from the aligner 204, and inserts the substrate W into the substrate holder 242 placed on the stage 280. More specifically, the substrate transfer robot 212 horizontally moves the substrate W to a predetermined position so that the substrate W is sandwiched by the slits 244a to 244c of the holding arm 244, and the substrate W is displayed from the dotted line of the tenth figure. Swipe to the position shown by the solid line, and The substrate W is loaded into the substrate holder 242. Alternatively, a substrate sliding mechanism (not shown) for sliding the substrate W in parallel may be provided on the table 280. The substrate transfer robot 212 sends the substrate W to the substrate sliding mechanism, and the substrate sliding mechanism mounts the substrate W on the substrate. In 242.

Next, the substrate holder erects the falling mechanism 282 to convert the substrate holder 242 from a horizontal posture to a vertical posture. The gripper 234 of the arm 232 holds the substrate holder 242 in the upright state. In this state, the conveyor 230 moves the substrate W and the substrate holder 242 in a horizontal direction to a predetermined position above the pretreatment tank 260. Then, the lifter 233 lowers the arm 232, and immerses the substrate W and the substrate holder 242 in the treatment liquid in the pretreatment tank 260 to clean the surface of the substrate W. After the substrate W is processed in advance, the lifter 233 raises the arm 232 and lifts the substrate W and the substrate holder 242 from the processing liquid in the pretreatment tank 260.

Next, the arm 232 moves the substrate holder 242 to a designated position above the flushing tank 262. Then, the lifter 233 lowers the support arm 232, and the substrate W and the substrate holder 242 are immersed in the treatment liquid (usually pure water) in the rinse tank 262 to wash the surfaces of the substrate W and the substrate holder 242. After the substrate W is washed, the lifter 233 raises the arm 232, and picks up the substrate W and the substrate holder 242 from the processing liquid in the rinse tank 262.

Next, the arm 232 moves the substrate holder 242 to a designated position above the core forming groove 264. Then, the lifter 233 lowers the support arm 232, and immerses the substrate W and the substrate holder 242 in the treatment liquid in the core formation groove 264, thereby forming a palladium core (palladium catalyst) on the surface of the substrate W, for example. Thereafter, the lifter 233 raises the arm 232 and lifts the substrate W and the substrate holder 242 from the treatment liquid of the core forming groove 264.

Second, the arm 232 moves the substrate holder 242 to a designated position above the irrigation tank 266. Then, the elevator 233 lowers the arm 232 by the substrate W and the substrate holder 242. The substrate W and the substrate holder 242 are washed by immersing in a treatment liquid (usually pure water) in the rinse tank 266. Thereafter, the lifter 233 raises the arm 232, and picks up the substrate W and the substrate holder 242 from the processing liquid of the rinse tank 266.

Next, the arm 232 moves the substrate holder 242 to a designated position above the first plating tank 268. Then, the lifter 233 lowers the arm 232, and immerses the substrate W and the substrate holder 242 in one of the plating liquids (treatment liquids) of the plurality of plating units 268a held in the first plating tank 268. Electroless plating of cobalt (Co) or nickel (Ni) is performed on the surface of the substrate W, for example. Further, the same operation is repeated for a plurality of substrates W, and the substrate W is immersed in the plating liquid (treatment liquid) in all the plating units 268a. After the specified plating time, the conveyor 230 picks up the substrate W and the substrate holder 242 one by one from the plating solution of the first plating tank 268.

Next, the arm 232 of the conveyor 230 moves the substrate holder 242 to a designated position above the rinsing tank 270. Then, the lifter 233 lowers the support arm 232, and the substrate W and the substrate holder 242 are immersed in the treatment liquid (usually pure water) in the rinse tank 270 to wash the surfaces of the substrate W and the substrate holder 242. Thereafter, the lifter 233 raises the arm 232 and lifts the substrate W and the substrate holder 242 from the processing liquid of the rinse tank 270.

Next, the arm 232 moves the substrate holder 242 to a designated position above the second plating tank 272. Then, the lifter 233 lowers the arm 232, and immerses the substrate W and the substrate holder 242 in the plating liquid (treatment liquid) in the second plating tank 272, and electrolessly deposits the substrate W. A gold (Au) layer is formed on the surface. Thereafter, the lifter 233 raises the arm 232 and lifts the substrate W and the substrate holder 242 from the plating liquid of the second plating tank 272.

Next, the arm 232 moves the substrate W and the substrate holder 242 to a predetermined position above the rinsing tank 274. Then, the elevator 233 lowers the arm 232 by using the substrate W and the substrate. The holder 242 is immersed in the treatment liquid (usually pure water) in the rinse tank 274 to wash the surface of the substrate W. Thereafter, the lifter 233 raises the arm 232 and lifts the substrate W and the substrate holder 242 from the processing liquid of the rinse tank 274.

After the substrate W is plated, the arm 232 moves the substrate W and the substrate holder 242 in the horizontal direction to a position above the blowing groove 275. The arm 232 is lowered by the elevator 233, and the substrate W and the substrate holder 242 are placed at predetermined positions in the blowing groove 275. The blowing tank 275 removes water droplets adhering to the surfaces of the substrate W held by the substrate holder 242 and the substrate holder 242 by spraying air or an inert gas such as nitrogen (N ₂ ) to dry them. After the blowing process is completed, the gripper 234 of the arm 232 holds the substrate holder 242, and the arm 232 is raised by the lifter 233, and the substrate holder 242 is picked up from the blowing groove 275.

The arm 232 is moved in the horizontal direction, and the substrate holder 242 is sent to the substrate holder upright down mechanism 282. The substrate holder erecting and lowering mechanism 282 places the substrate holder 242 horizontally on the table 280 in the same manner as described above. The substrate transfer robot 212 takes out the substrate W from the substrate holder 242 by sliding the substrate W from the position shown by the solid line in the tenth figure to the position shown by the broken line. Alternatively, the substrate W may be slid from the substrate holding position of the substrate holder 242 by a substrate sliding mechanism (not shown) provided on the table 280, and then the substrate transfer robot 212 may take out the substrate W from the substrate sliding mechanism. Thereafter, the substrate transfer robot 212 transports the plated substrate W to the spin rinse dryer 206. The spin rinse dryer 206 dries the substrate by rotating the substrate W at a high speed. The substrate transfer robot 212 takes out the dried substrate from the spin rinse dryer 206 and returns it to the cassette on which the cassette 202 is loaded. Thereby, the processing of one substrate is completed.

Fig. 14 is a front view showing a plating apparatus according to another embodiment of the present invention. Because the processing tank 229 shown in FIG. 14 has the same processing tank 229 as shown in FIG. It is composed, so the representation is simplified. The network cable portion of Fig. 14 shows the maintenance space 300. The difference between the plating apparatus shown in FIG. 14 and the plating apparatus shown in FIG. 9 is that the spin rinse dryer 206 and the substrate loaders 210, 210 are disposed adjacent to the maintenance space 300. With this configuration, the operator can easily enter the spin rinse dryer 206 and the substrate loader 210, and the repair of the spin rinse dryer 206 and the substrate loader 210 can be easily performed. The conveyors 230 and 230 of the plating treatment units 231 and 231 of the present embodiment are not disposed adjacent to the maintenance space 300. However, as shown in the ninth diagram, the conveyors 230 and 230 may be disposed adjacent to the maintenance space 300.

The above-described two embodiments are examples in which the elevator 233 of the conveyor 230 moves the substrate holder 242 in the horizontal direction and moves up and down. However, the elevator can also be provided by cutting off the elevator from the conveyor 230. At this time, a plurality of elevators are respectively disposed adjacent to the processing tank 229, and the conveyor 230 is configured to move the arm 232 only in the horizontal direction.

The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and it is a matter of course that the invention can be carried out in various different forms within the scope of the technical idea. For example, the above embodiment is an example in which the maintenance space 300 is provided in an electroless plating apparatus. However, the maintenance space 300 may be provided in an electrolytic plating apparatus. Even if the maintenance space 300 is provided in the electrolytic plating apparatus, the same effects as described above can be obtained.

20a‧‧‧ plating trough

50‧‧‧Substrate holder conveying mechanism

52‧‧‧ activity support

52a‧‧‧ recess

53‧‧‧First actuator

59‧‧‧Fixed support table

59a‧‧‧ recess

75‧‧‧second actuator

76‧‧‧Actuator table

Claims (13)

A wet processing apparatus comprising: a substrate holder that holds a substrate; a processing tank that stores a processing liquid therein; and a substrate holder conveying mechanism that immerses the substrate in the processing liquid In the state, the substrate holder is moved from the holder insertion position to the holder take-out position, and the substrate holder transport mechanism includes a fixed support table that supports the substrate holder and suspends the substrate holder In the processing tank; a movable support table disposed adjacent to the fixed support table for supporting the substrate holder; and an actuator for raising the movable support table and lifting the substrate holder until The substrate holder is separated from the fixed support table, and the movable support table is moved with the substrate holder toward the holder removal position by a predetermined distance, and the movable support table is lowered until the substrate holder is supported by the fixed support table. And the aforementioned movable support table is separated from the aforementioned substrate holder to enable the aforementioned movable support Toward the holder into the specified degree from the position. The wet processing apparatus of claim 1, wherein the actuator comprises: a first actuator that moves the movable support table up and down; and a second actuator that causes the movable support table Move in the horizontal direction. The wet processing apparatus of claim 1, wherein the method further comprises: a conveyor that transports the substrate holder in a horizontal direction; and an elevator that transports the substrate holder in a vertical direction between the conveyor and the substrate holder transport mechanism, and the lift holds the substrate The substrate of the device is immersed in the treatment liquid, and the substrate holder is picked up from the treatment tank. The wet processing apparatus according to claim 1, wherein the substrate holder has a protruding portion that protrudes outside, and the fixed supporting table has a plurality of concave portions that are embedded in the protruding portion. The wet processing apparatus of claim 4, wherein the movable support table has a plurality of recesses embedded in the protruding portion. A plating apparatus for plating a substrate, comprising: a substrate holder that holds the substrate; and a plurality of plating processing portions disposed in a lateral direction, wherein each of the plurality of plating processing portions includes: a plurality of a processing tank for plating the substrate; and a substrate holder transporter that transports and holds the substrate holder between the plurality of processing tanks between the plurality of plating processing portions There is maintenance space. The plating apparatus of claim 6, wherein the maintenance space extends in parallel with the substrate holder transporter. The plating apparatus of claim 6, wherein a piping space is formed below the maintenance space, wherein the processing liquid for transporting in the plurality of processing tanks is provided Piping. The plating apparatus of claim 6, wherein a common fluid introduction crucible is provided below the maintenance space for supplying a common fluid required for operating the plating apparatus to the plurality of plating treatments unit. A plating apparatus according to claim 6, further comprising a substrate delivery portion that transfers the substrate to the substrate holder conveyer, wherein the substrate delivery portion is disposed adjacent to the maintenance space. The plating apparatus according to claim 10, wherein the substrate delivery portion includes a spin rinse dryer that rotates and dries the substrate, and the spin rinse dryer is disposed adjacent to the maintenance space. The plating apparatus of claim 6, wherein the plating treatment unit is an electroless plating treatment unit. The plating apparatus of claim 6, wherein the plating treatment unit is an electrolytic plating treatment unit.