KR20100063591A - Light emitting diode and backlight unit having the same - Google Patents

Abstract

PURPOSE: A light emitting diode and a backlight unit are provided to control a corrosion and discoloration with maintaining a high reflectivity by forming a protective layer with thing thickness formed into gold or a titanium on a reflective layer formed into a silver or an aluminum. CONSTITUTION: A lead frame(120) includes a base metal layer(120a), a reflective layer(120b) and a protective layer(120c). The reflective layer is formed on the surface of the base metal layer. The protective layer is formed into a metal on the surface of the reflecting layer. The lead frame includes a first lead terminal and a second lead terminal which electrically is separated each other. The reflecting layer includes one selected among a silver and an aluminum. The protective layer includes one selected among a gold and a titanium.

Description

LIGHT EMITTING DIODE AND BACKLIGHT UNIT HAVING THE SAME}

The present invention relates to a light emitting diode and a backlight unit having the same, and more particularly, to a light emitting diode and a backlight unit having the same can be improved through a lead frame having a high reflectance and high reliability.

In general, a light emitting diode (LED) is a kind of semiconductor device used to convert an electrical signal into light by using the characteristics of a compound semiconductor, and has high luminous efficiency, long life, and low power consumption. In addition, the technology field using light emitting diodes is increasing due to many advantages of being environmentally friendly.

Such a light emitting diode is typically manufactured in a package structure in which a light emitting chip is mounted on a lead frame, and is configured to perform the light emitting operation of the light emitting chip in response to power applied from the outside through the lead frame.

Conventional light emitting diodes mainly use a silver plated lead frame to increase reflectance, but the silver plated lead frame is vulnerable to moisture or heat, which causes problems such as deterioration of brightness and lifespan due to corrosion or discoloration when driving for a long time. In addition, in order to improve the corrosion problem, a gold-plated lead frame has been developed in place of silver plating, but a low reflectance of gold causes a problem of lowering light efficiency of the light emitting diode.

Accordingly, the present invention has been made in view of such a problem, and the present invention provides a lead frame resistant to corrosion while maintaining a high reflectance.

In addition, the present invention provides a light emitting diode that can improve the light emitting efficiency by using the above-described lead frame.

In addition, the present invention provides a backlight unit having the light emitting diode described above.

A lead frame according to an aspect of the present invention includes a base metal layer, a reflective layer formed on the surface of the base metal layer, and a protective layer formed of metal on the surface of the reflective layer. The reflective layer includes any one selected from silver (Ag) and aluminum (Al). The protective layer includes any one selected from gold (Au), nickel (Ni), and titanium (Ti).

When the protective layer is formed of gold, the protective layer may be formed to a thickness of 600 nm or less. When the protective layer is formed of nickel or titanium, the protective layer may be formed to a thickness of 20nm or less.

The lead frame may further include a nickel layer formed between the base metal layer and the reflective layer.

A light emitting diode according to an aspect of the present invention may be coupled to a light emitting chip that generates light, a metal member on which the light emitting chip is mounted, and the metal member to fix the metal member, and at least part of the light emitting chip and the metal member. It includes a housing formed with an opening to expose the. The metal member includes a base metal layer, a reflective layer formed on the surface of the base metal layer, and a protective layer formed of metal on the surface of the reflective layer. The reflective layer may include any one selected from silver (Ag) and aluminum (Al). The protective layer may include any one selected from gold (Au), nickel (Ni), and titanium (Ti). When the protective layer is formed of gold, the protective layer may be formed to a thickness of 600 nm or less. When the protective layer is formed of nickel or titanium, the protective layer may be formed to a thickness of 20nm or less. The metal member may further include a nickel layer formed between the base metal layer and the reflective layer.

In one embodiment, the metal member is composed of slugs for dissipating heat generated from the light emitting chip. In this case, the light emitting diode may further include a lead frame for applying power to the light emitting chip.

In another embodiment, the metal member is formed of a lead frame for applying power to the light emitting chip.

For example, the lead frame may include a first lead terminal including a chip mounting portion on which the light emitting chip is mounted and at least one reflective surface formed by bending the chip mounting portion, and a second spaced apart from the first lead terminal. It includes a lead terminal. The first lead terminal may include a stepped part bent from the chip mounting part and a first inclined surface forming the reflective surface between the chip mounting part and the stepped part. The first lead terminal may further include a second inclined surface that is bent from the chip mounting portion and positioned to face the first inclined surface. The first lead terminal may be bent from the chip mounting part, and further include third and fourth inclined surfaces adjacent to the first and second inclined surfaces. In addition, the first lead terminal may include first wing portions that are bent upward from the chip mounting portion to form the reflective surface. The second lead terminal may include a wire bonding part and second wing parts bent to face upward from the wire bonding part and disposed in parallel with the first wing parts. At least one of the first wing parts and the second wing parts may be formed to be wider as it moves away from the chip mounting part and the wire bonding part. The housing may be formed to cover outer surfaces of the first wings and the second wings. Meanwhile, at least some of the outer surfaces of the first wings and the second wings may be exposed to the outside.

As another example, the lead frame may include a chip mounting part in which the light emitting chip is mounted, a first external lead part extending from the chip mounting part to the outside of the housing, and a first wing part extending from the chip mounting part. A second terminal including a lead terminal, spaced apart from the first lead terminal, a wire bonding portion, a second outer lead portion extending out of the housing from the wire bonding portion, and a second wing portion extending from the wire bonding portion; It may include a lead terminal. The first wing portion and the second wing portion are bent from the chip mounting portion and the wire bonding portion, respectively, and disposed on both sides of the chip mounting portion. The first wing portion may be formed to extend to the side of the wire bonding portion of the second lead terminal. At least one of the first wing portion and the second wing portion may be formed to be wider as it moves away from the chip mounting portion. The housing may be formed to cover outer surfaces of the first wing part and the second wing part. On the other hand, at least some of the outer surface of the first wing and the second wing may be formed to be exposed to the outside.

As another example, the lead frame includes recesses adjacent to each other, and the recesses include a first lead terminal and a second lead terminal forming one cup on which the light emitting chip is mounted. The first lead terminal and the second lead terminal include wing portions extending from the recesses to the outside of the housing. The first lead terminal and the second lead terminal may include an inclined surface extending inclined from the bottom surface of the recessed portion and connected to the wing portion.

The light emitting diode may further include a reflector formed on an inner wall of the opening of the housing. The reflector is formed of the same material as the metal member. The reflector may include a hollow reflective part positioned to face an inner surface of the opening of the housing and a heat radiating part extending from the reflective part and exposed to the outside of the housing.

The housing may include at least one cutout formed to enclose a portion of the area adjacent to the opening to expose the wire bonding area.

The light emitting diode may further include an encapsulant filled in an opening of the housing to cover the light emitting chip, and including a phosphor for converting at least a portion of the light generated from the light emitting chip into light having a different wavelength.

In order to implement white light, the light emitting chip may include a blue chip that generates blue light, and the phosphor may include a yellow phosphor that converts at least a portion of the blue light generated from the blue chip into yellow light. Alternatively, the light emitting chip may include a blue chip generating blue light, and the phosphor may include a red phosphor and a green phosphor converting at least a portion of the blue light generated from the blue chip into red light and green light, respectively. have. The light emitting chip may include a blue chip for generating blue light and a red chip for generating red light, and the phosphor converts at least a portion of the blue light and the red light generated from the blue chip and the red chip into green light. It may include a green phosphor. Furthermore, the light emitting chip includes a blue chip for generating blue light and a green chip for generating green light, and the phosphor converts at least a portion of the blue and green light generated from the blue chip and the green chip into red light. It may comprise a red phosphor.

The backlight unit according to an aspect of the present invention includes a light guide plate and at least one light emitting diode disposed on a side of the light guide plate to supply light to the light guide plate. The light emitting diode includes a lead frame and a light emitting chip. The lead frame includes a base metal layer, a reflective layer formed on the surface of the base metal layer, and a protective layer formed of metal on the surface of the reflective layer. The light emitting chip is mounted on the lead frame, and generates light in response to a power applied through the lead frame. The reflective layer includes any one selected from silver (Ag) and aluminum (Al). The protective layer includes any one selected from gold (Au), nickel (Ni), and titanium (Ti).

According to such a lead frame, a light emitting diode, and a backlight unit having the same, in using a lead frame, a slug or a reflector made of a metal used in a light emitting diode package, a gold, nickel or titanium is formed on a reflective layer formed of silver or aluminum. By forming the formed protective layer to a thin thickness, the occurrence of defects such as corrosion and discoloration can be suppressed while maintaining the reflectance at a predetermined level or more.

The above-described features and effects of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, those skilled in the art to which the present invention pertains may easily implement the technical idea of the present invention. Could be. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a plan view illustrating a light emitting diode according to an exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1, and FIG. 3 specifically illustrates the lead frame illustrated in FIG. 2. It is an enlarged view.

1 is a plan view illustrating a light emitting diode according to an exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1, and FIG. 3 specifically illustrates the lead frame illustrated in FIG. 2. It is an enlarged view.

1, 2, and 3, the light emitting diode 100 according to an embodiment of the present invention includes a light emitting chip 110, a metal member 120 and a metal member 120 on which the light emitting chip 110 is mounted. ) Is coupled to the housing 130 to fix the metal member 120. In addition, the light emitting diode 100 is filled in the openings 132 of the first and second conductive wires 140 and 150 and the housing 130 for electrically connecting the light emitting chip 110 and the metal member 120. It may further include an encapsulant 160.

In the present embodiment, the metal member 120 on which the light emitting chip 110 is mounted is configured as a lead frame for applying power to the light emitting chip 110. For convenience of description, the same reference numerals as the metal member 120 are attached to the lead frame.

The lead frame 120 supports the light emitting chip 110, and receives power from the outside to supply the light emitting chip 110 to the light emitting chip 110.

The lead frame 120 may include a first lead terminal 122 and a second lead terminal 124 spaced apart at predetermined intervals and electrically separated from each other. The light emitting chip 110 is mounted on, for example, the first lead terminal 122.

The first lead terminal 122 is electrically connected to the light emitting chip 110 through the first conductive wire 140, and the second lead terminal 124 is electrically connected to the light emitting chip 110 through the second conductive wire 150. And can be electrically connected. Meanwhile, the first lead terminal 122 may be electrically connected to the lower surface of the light emitting chip 110 through the conductive adhesive. Portions of the first lead terminal 210 and the second lead terminal 220 are exposed to the outside of the housing 130 for electrical connection with an external circuit board.

As shown in FIG. 3, the lead frame 120 includes the base metal layer 120a, the reflective layer 120b formed on the surface of the base metal layer 120a, and the protective layer 120c formed of metal on the surface of the reflective layer 120b. ).

The base metal layer 120a is formed of a metal having excellent conductivity and workability. For example, the base metal layer 120a is formed of copper (Cu) or a copper alloy in which zinc (Zn) or iron (Fe) is mixed with copper. The base metal layer 120a is formed to have a thickness of, for example, about 0.1 to 1.0 mm.

The reflective layer 120b is formed of a metal having high reflectance on the surface of the base metal layer 120a in order to increase the reflectance of the lead frame 120. For example, the reflective layer 120b is formed of silver (Ag) or aluminum (Al). The reflective layer 120b may be formed on the surface of the base metal layer 120a through a plating method. As the thickness of the reflective layer 120b is thicker, the reflectance may be increased, but the material cost may be increased. For example, the reflective layer 120b is formed on the surface of the base metal layer 120a to a thickness of about 1 to 50 μm.

The protective layer 120c is formed on the surface of the reflective layer 120b to prevent corrosion of the lead frame 120. Since the reflective layer 120b formed on the surface of the base metal layer 120a has high reflectance but is weak against high temperature and high humidity, and thus is easily corroded and discolored, the protective layer 120c is disposed on the surface of the reflective layer 120b to prevent corrosion and discoloration. To form.

The protective layer 120c is formed of a metal having a lower reflectance than the reflective layer 120b but excellent in a fiffusion barrier property. For example, the protective layer 120c is formed of gold (Au), nickel (Ni), or titanium (Ti). The protective layer 120c made of gold (Au), nickel (Ni), or titanium (Ti) may be formed through a plating process. When using the plating process, electrolytic plating of a solution that provides metal ions, or an electrolytic solution that provides gold (Au), nickel (Ni), or titanium (Ti) ions is performed using dimethylamine borane (DMAB) or EDTA standards. By appropriately mixing a reducing agent such as a solution and a corrosion inhibitor, electroless plating may be performed to obtain a gold, nickel or titanium film. In contrast, the protective layer 120c made of gold (Au), nickel (Ni), or titanium (Ti) may be formed through sputtering.

As the thickness of the protective layer 120c is too thick, the function of protecting the reflective layer 120b from chemical attack becomes stronger, but the brightness of the light emitting diode 100 is lowered. As the thickness of the protective layer 120c is thinner, the brightness increases. Manufacturing is not easy and the function as a protective film may be weakened. Therefore, it is preferable that the protective layer 120c is selected to have a suitable optimum thickness capable of simultaneously serving as a high reflectance and an antioxidant film.

4 is a graph showing the light efficiency of the LED package according to the change in the thickness of the reflective layer formed of gold. In FIG. 4, the y-axis package light efficiency is formed of gold on the reflective layer formed of silver, assuming that the light efficiency of the package using a lead frame that does not form a protective layer formed of gold on the reflective layer formed of silver is 100%. The light efficiency ratio of the package using the lead frame in which the protective layer was formed is shown. 4, the thickness of the reflective layer is fixed at 3 mu m.

3 and 4, when the protective layer 120c formed of gold on the reflective layer 120b having a thickness of about 3 μm has a thickness of about 2 nm or less, light efficiency of about 90% was obtained. Forming (120c) at a thickness of about 200 nm yields about 85% light efficiency, and forming a protective layer (120c) at a thickness of about 300 nm yields about 83% light efficiency and a protective layer (120c). ) Was formed to a thickness of about 600nm it was confirmed that the light efficiency of about 75%. On the other hand, when the thickness of the protective layer 120c is about 640 nm, the light efficiency is about 70%, and when the thickness of the protective layer 120c is about 700 nm, the light efficiency is about 60%, and the protective layer 120c is shown. When formed to a thickness of about 600nm or more, it was confirmed that the light efficiency of the lead frame 120 drops sharply to 60%, which is the original light efficiency of gold.

Therefore, the gold protective layer 120c formed on the reflective layer 120b is formed at about 0.1 nm or more, which is a minimum thickness capable of preventing corrosion of the reflective layer 120b, and the light efficiency can be maintained at a predetermined level or more. By forming a thickness of about 600 nm or less, which is the maximum thickness, corrosion of the reflective layer 120b can be prevented and the package light efficiency of the light emitting diode 100 can be maintained at about 75% or more.

5 is a graph showing the light transmittance according to the thickness of the protective layer formed of nickel or titanium.

3 and 5, since the light transmitted through the protective layer 120c is reflected by the reflective layer 120b having a high reflectance, the higher the light transmittance of the protective layer 120c, the higher the reflectance of the lead frame 120 is. do. As the thickness of the nickel (Ni) or titanium (Ti) used as the protective layer 120c increases, the light transmittance can be seen to decrease, but the light transmittance of about 10% or more can be obtained even at a thickness of about 20 nm. As the thickness of the protective layer 120c increases, the reflectance of the lead frame 120 decreases while the function of the protective film is improved. Accordingly, the light efficiency can be improved as compared with the decrease in reflectance due to corrosion and discoloration of the reflective layer 120b.

Therefore, the protective layer 120c of nickel (Ni) or titanium (Ti) formed on the reflective layer 120b is formed to about 0.1 nm or more, which is a minimum thickness capable of preventing corrosion of the reflective layer 120b, By forming a thickness of about 20 nm or less, which is the maximum thickness that can maintain the light transmittance above a certain level, it is possible to prevent corrosion of the reflective layer 120b and to reduce a decrease in light reflectance of the lead frame 120.

 The reflective layer 120b and the protective layer 120c may be formed on both surfaces of the lead frame 120 as a whole, or may be formed on one side or only a necessary portion.

6 is a view showing a lead frame according to another embodiment of the present invention. In FIG. 6, except that the nickel layer is added, the remaining components are the same as those shown in FIG. 3, and the same reference numerals are used for the same components, and detailed description thereof will be omitted.

Referring to FIG. 6, the lead frame 120 may further include a nickel layer 120d formed between the base metal layer 120a and the reflective layer 120b. As described above, the nickel layer 120d may be formed below the reflective layer 120b, and then the reflective layer 120b and the metal protective layer 120c may be sequentially formed to obtain a similar reflectance as in FIG. 3. As described above, by forming the nickel layer 120d which is cheaper than the reflective layer 120b such as silver (Ag), the manufacturing cost can be reduced by reducing the amount of the reflective layer 120b used.

Referring back to FIGS. 1 and 2, the light emitting chip 110 is mounted on the lead frame 120 and generates light in response to a power applied through the lead frame 120. For example, the light emitting chip 110 is mounted on the first lead terminal 122, and the first lead terminal 122 and the second lead terminal through the first conductive wire 140 and the second conductive wire 150. And electrically connected to 124, respectively. The light emitting chip 110 may be made of a semiconductor material such as, for example, gallium nitride, arsenic nitride, or phosphorus nitride. The light emitting chip 110 may generate light of various wavelength bands according to its use. For example, the light emitting chip 110 may generate light in a blue, red, yellow, or ultraviolet wavelength band.

The housing 130 is coupled to the lead frame 120 to fix the lead frame 120. That is, the housing 130 is formed to surround at least a portion of the first lead terminal 122 and the second lead terminal 124 to fix the first lead terminal 122 and the second lead terminal 124. The housing 130 may be formed of, for example, polyphthalamide (PPA) resin.

An opening 132 is formed in the housing 130 to expose a light emitting chip 110 and a portion of the lead frame 120 on which the light emitting chip 110 is mounted. The opening 132 may be formed in a funnel shape in which the opening area becomes wider from the inner side adjacent to the lead frame 120 toward the outer side. Accordingly, the inner surface of the housing 130 in which the opening 132 is formed may be formed as an inclined surface inclined at a predetermined angle, and a reflective material may be formed on the inner surface.

The encapsulant 160 is filled in the opening 132 of the housing 130 to cover the light emitting chip 110. The encapsulant 160 is for protecting the light emitting chip 110 from the outside, and is formed of, for example, a transparent epoxy or silicone resin. In the encapsulant 160, a phosphor 162 for converting a wavelength of light generated from the light emitting chip 110 may be formed. For example, the encapsulant 160 may include any one or more of red, green, and blue phosphors to implement light of a desired color such as white light.

The light emitting diode 100 may implement white light through a combination of the light emitting chip 110 and the phosphor 162.

In an embodiment, the light emitting chip 110 may be formed of a blue chip that generates blue light, and the phosphor 162 may be formed of a yellow phosphor that converts at least a portion of the blue light generated from the blue chip into yellow light. . The blue light generates blue light having a maximum light emission wavelength of about 430 nm to 470 nm, and is formed of, for example, an InGaN-based light emitting diode chip. The yellow phosphor is excited by part of the blue light generated in the blue chip to emit yellow light. The yellow phosphor may include, for example, Yttrium Aluminum Garnet (Y ₃ Al ₅ O ₁₂ ; hereinafter referred to as 'YAG') based, silicate based, or TAG based fluorescent materials. Therefore, the LED 100 emits white light by mixing blue light emitted from the blue chip and yellow light emitted from the yellow phosphor.

In another embodiment, the light emitting chip 110 is formed of a blue chip for generating blue light, the phosphor 162 is a red phosphor for converting at least a portion of the blue light generated from the blue chip into red light and green light, respectively; Green phosphor. The red phosphor may be formed of, for example, an inorganic compound or a solid solution having a crystal structure similar to SrS: Eu, (Sr, Ca) S: Eu, CaS: Eu, (Sr, Ca) GeS: Eu, and CaAlSiN _3. Can be. The green phosphor may be formed of, for example, SrGa ₂ S ₄ : Eu and (Ba, Sr, Ca) ₂ SiO ₄ : Eu. Accordingly, the light emitting diode 100 emits white light by mixing blue light emitted from the blue chip, red light emitted from the red phosphor, and green light emitted from the green phosphor. As such, when white light is realized using the light emitting chip 110 made of the blue chip, the red phosphor, and the green phosphor, up to 20% of the light emitting diode using the blue chip and the yellow phosphor having color reproducibility of about 85 or less is used. An improved color reproducibility of about 90 to 110 can be obtained.

In another embodiment, the light emitting diode 100 may include two light emitting chips 110 and one type of phosphor 162 for generating light of different colors. For example, the light emitting chip 110 may include a blue chip for generating blue light and a red chip for generating red light, and the phosphor 162 may include at least one of blue light and red light generated from the blue chip and the red chip. It may include a green phosphor for converting a part to green light. Alternatively, the light emitting chip 110 may include a blue chip for generating blue light and a green chip for generating green light, and the phosphor 162 may include at least a portion of the blue light and the green light generated from the blue chip and the green chip. It may include a red phosphor for converting to red light.

According to the light emitting diode 100 having such a configuration, light generated from the light emitting chip 110 or the phosphor 162 and directed downward is reflected by the lead frame 120 and directed upward. In this case, the lead frame 120 including the protective layer 120c formed of gold (Au), nickel (Ni), or titanium (Ti) is used on the reflective layer 120b formed of silver (Ag) or aluminum (Al). As a result, defects such as corrosion and discoloration can be suppressed while maintaining the reflectance of the lead frame 120 at a predetermined level or more.

Meanwhile, the lead frame 120 according to the present invention may be applied to various models such as a top view package, a side view package, a lamp package, and a chip package.

7 is a cross-sectional view showing a light emitting diode according to another embodiment of the present invention.

Referring to FIG. 7, the light emitting diode 200 according to another embodiment of the present invention applies power to the light emitting chip 110, the metal member 220 on which the light emitting chip 110 is mounted, and the light emitting chip 110. The lead frame 120 and a housing 130 for fixing the metal member 220 and the lead frame 120. In addition, the light emitting diode 200 may include an encapsulant formed to cover the first and second conductive wires 140 and 150 and the light emitting chip 110 to electrically connect the light emitting chip 110 and the lead frame 120. 160) may be further included.

In the present embodiment, the metal member 220 on which the light emitting chip 110 is mounted is composed of slugs for dissipating heat generated from the light emitting chip 110. For convenience of explanation, the same reference numerals as those of the metal member 220 are attached to the slug. In addition, since the other components except the slug 220 has a configuration similar to that shown in FIGS. 1 and 2, the same reference numerals are used, and detailed description thereof will be omitted.

Slug 220 is disposed inside the center of the housing 130, the upper portion of the light emitting chip 110 is mounted, the lower portion is exposed to the outside of the housing 130 to increase the heat dissipation efficiency.

In order to prevent corrosion and discoloration while maintaining the high reflectance, the slug 220, like the lead frame 120 shown in FIG. 3, has a reflective layer formed on the surface of the base metal layer 120a and the base metal layer 120a ( 120b) and a protective layer 120c formed of metal on the surface of the reflective layer 120b. For example, the reflective layer 120b is formed of silver (Ag) or aluminum (Al), and the protective layer 120c is formed of gold (Au), nickel (Ni), or titanium (Ti). As such, since the actual configuration of the slug 220 except for the shape is the same as that of the lead frame 120 illustrated in FIG. 3, detailed description thereof will be omitted.

FIG. 8 is a plan view illustrating a light emitting diode according to still another embodiment of the present invention, FIG. 9 is a cross-sectional view taken along line AA ′ of FIG. 8, and FIG. 10 is line B-B ′ of FIG. 8. 11 is a cross-sectional view taken along the line CC ′ of FIG. 8.

8 to 11, a light emitting diode according to another embodiment of the present invention includes a lead frame composed of a first lead terminal 21 and a second lead terminal 23. For example, as shown in FIG. 3, the first lead terminal 21 and the second lead terminal 23 include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel, or titanium. can do.

The first lead terminal 21 includes a chip mounting portion 21a on which the light emitting chip 27 is mounted, a first external lead portion 21b extending from the chip mounting portion 21a to the outside of the housing 25, and a chip mounting portion. And a first wing portion 21c extending from the portion 21a. The second lead terminal 23 extends from the wire bonding portion 23a, the second external lead portion 23b extending from the wire bonding portion 23a to the outside of the housing 25, and the wire bonding portion 23a. It includes two wings 23c. The first lead terminal 21 and the second lead terminal 23 are separated from each other and electrically separated from each other. The first blade opening portion 21c and the second wing portion 23c are bent from the chip mounting portion 21a and the wire bonding portion 23a, respectively, and disposed on both sides of the chip mounting portion 21a to form both reflection surfaces. do. The first wing portion 21c and the second wing portion 23c are arranged side by side to face each other with respect to the chip mounting portion 21a.

The first wing portion 21c may extend to the side of the wire bonding portion 23c of the second lead terminal 23. In addition, as shown, the first wing portion 21c may have a wider width than the second wing portion 23c, but is not limited thereto. For example, the second wing portion 23c may extend to a portion where the chip mounting portion 21a and the first external lead portion 21b of the first lead terminal 21 are connected to each other. The 23c may have the same width as the first wing portion 21c or may have a wider width than that.

The first wing portion 21c and the second wing portion 23c each have a structure bent from the chip mounting portion 21a and the wire bonding portion 23a. The reflective surface formed by the first wing portion 21c and the second wing portion 23c may be formed to have a predetermined inclination angle with respect to the chip mounting portion 21a or may be vertically formed. The first wing portion 21c and the second wing portion 23c may be formed by bending from the lead frame, but are not limited thereto, and may be formed through various methods such as pressing or welding or welding other than bending. Can be.

On the other hand, the housing 25 is coupled to and support the first lead terminal 21 and the second lead terminal 23. The housing 25 may be formed by insert molding the first lead terminal 21 and the second lead terminal 23. The housing 25 covers the lower surfaces of the chip mounting portion 21a and the wire bonding portion 23a. In addition, the housing 25 may cover the outer surfaces of the first wing portion 21c and the second wing portion 23c. The outer surfaces of the first wing portion 21c and the second wing portion 23c may be completely covered by the housing 25, but are not limited thereto, and the first wing portion 21c and the second wing portion 23c may not be limited thereto. At least a portion of the outer surface of the) may be exposed to the outside.

The housing 25 forms an inner wall of the opening together with the first wing portion 21c and the second wing portion 23c. In particular, the housing 25 forms an inner wall 25w of both side surfaces orthogonal to both side reflective surfaces formed by the first wing portion 21c and the second wing portion 23c. The inner walls 25w may be formed to be inclined as shown. On the other hand, the chip mounting portion 21a and the wire bonding portion 23a form the bottom surface of the opening.

The first lead terminal 21 and the second lead terminal 23 are each of the first external lead portion 21b and the second external lead portion 23b protruding out of the housing 25 to be electrically connected to an external power source. ). The first external lead portion 21b and the second external lead portion 23b may have various shapes and may be bent into various shapes.

The light emitting chip 27 is mounted on the chip mounting portion 21a of the first lead terminal 21 and electrically connected to the wire bonding portion 23a of the second lead terminal 23 by the first conductive wire 29a. Connected. The light emitting chip 27 may be electrically connected to the first lead terminal 21 through the second conductive wire 29b or may be electrically connected to the first lead terminal 21 through the conductive adhesive.

Meanwhile, an encapsulant (not shown) including a phosphor may be formed inside the housing 25 to cover the light emitting chip 27. Since the encapsulant including the phosphor has been described with reference to FIG. 2, a detailed description thereof will be omitted.

According to this embodiment, the first wing portion 21c of the first lead terminal 21 and the second wing portion 23c of the second lead terminal 23 are disposed on both inner wall surfaces of the opening, thereby The reflectance can be improved. Particularly, in the side light emitting diode having an elongated opening, the first wing portion 21c and the second wing portion 23c are located on side surfaces formed side by side in the long axis direction, thereby forming reflective surfaces over a large area. Can be formed. On the other hand, the first wing portion 21c and the second wing portion 23c reflect the light incident on the housing 25, thereby reducing the discoloration of the housing 25 by the light. In addition, heat absorbed and converted by the second wing unit 23c may be discharged to the outside through the second lead terminal 23. Therefore, heat can be emitted through the second lead terminal 23 in addition to the first lead terminal 21, thereby improving the heat dissipation performance of the light emitting diode.

12 is a view illustrating a manufacturing process of the first lead terminal and the second lead terminal according to an embodiment of the present invention.

Referring to FIG. 12, the flat metal plate is punched to form first and second lead terminals 21 and 23 spaced apart from each other. The first lead terminal 21 includes a chip mounting portion 21a, a first external lead portion 21b, and a first wing portion 21c, and the first wing portion 21c is along the bend line B. FIG. It is bent upward to form a reflective surface. The second lead terminal 23 includes a wire bonding portion 23a, a second outer lead portion 23b, and a second wing portion 23c, and the second wing portion 23c is along the bend line B. FIG. It is bent upward to form a reflective surface. As shown, the first wing portion 21c may extend to the side of the wire bonding portion 23a of the second lead terminal 23. In addition, although the second wing portion 23c is shown as being terminated near the chip mounting portion 21a, the second wing portion 23c is connected to the chip mounting portion 21a and the first external lead portion 21b. It may extend to the part which becomes.

Alternatively, the first lead terminal 21 and the second lead terminal 23 may be manufactured using a casting or welding technique. In this case, the process of bending the 1st wing part 21c and the 2nd wing part 23c is abbreviate | omitted.

In the present exemplary embodiment, the first lead terminal 21 and the second lead terminal 23 are illustrated as having a rectangular first wing portion 21c and a second wing portion 23c, but are not limited thereto. The first wing portion 21c and the second wing portion 23c may be formed in various shapes according to the package shape of the light emitting diode.

13 is a view illustrating a shape of a lead frame according to another embodiment.

Referring to FIG. 13, as described with reference to FIG. 12, the first lead terminal 31 includes a chip mounting portion 31a, a first external lead portion 31b, and a first wing portion 31c. The second lead terminal 33 includes a wire bonding portion 33a, a second external lead portion 33b, and a second wing portion 33c. However, at least one of the first wing portion 31c and the second wing portion 33c is formed to be wider as it moves away from the chip mounting portion 31a. For example, as illustrated in FIG. 7, the first wing part 31c and the second wing part 33c are disposed to correspond to the inclined surface when the inner walls 25w perpendicular to the long axis direction are formed to be inclined. The width can be widened, and thus wider reflective surfaces can be provided on both sides of the opening.

In the present embodiment, a package of a side light emitting diode having an elongated opening is illustrated and described as an example, but the present invention is not limited to the side light emitting diode, and various types of packages using a plastic housing and a lead frame, It can also be applied to packages with circular or rectangular openings, for example.

14 is a plan view illustrating a light emitting diode according to still another embodiment of the present invention, FIG. 15 is a cross-sectional view taken along line BB of FIG. 14, and FIG. 16 is a view illustrating various first lead terminals applicable to the light emitting diode. 17 is a view showing a first lead terminal according to another embodiment of the present invention.

14 and 15, the light emitting diode includes a pair of lead terminals, that is, a first lead terminal 51 and a second lead terminal 53. As shown in FIG. 3, the first lead terminal 51 and the second lead terminal 53 may include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel, or titanium.

The first lead terminal 51 includes a chip mounting portion 51b on which the light emitting chip 57 is mounted, a stepped portion 51a formed by bending from the chip mounting portion 51b, a chip mounting portion 51b, and a stepped portion 51a. And a first inclined surface 51c formed between the two surfaces to form a reflective surface (see Fig. 16 (a)). The second lead terminal 53 may be spaced apart from the first lead terminal 51 and may be positioned at the same height as the stepped portion 51a of the first lead terminal 51.

Meanwhile, the first lead terminal 51 may be further bent from the chip mounting portion 51b and further include a second inclined surface 51d positioned to face the first inclined surface 51c (FIG. 16B). ) Reference). In addition, the first lead terminal 51 may further include an end portion 51e extending from the second inclined surface 51d and positioned in parallel with the stepped portion 51a at the same height (Fig. 16 (c)). Reference).

The first lead terminal 51 and the second lead terminal 53 are supported by the housing 55. For convenience, the housing 55 is divided into an upper housing 55a and a lower housing 55b based on the positions of the stepped portions 51a and the second lead terminals 53 of the first lead terminal 51.

The housing 55 may have an elongated opening 56 exposing portions of the first lead terminal 51 and the second lead terminal 53, and the first lead terminal 51 is formed by the opening 56. The chip mounting portion 51b and the first and second inclined surfaces 51c and 51d are exposed, and a part of the second lead terminal 53 is exposed. In addition, a portion of the stepped portion 51a of the first lead terminal 51 may be exposed.

The first lead terminal 51 and the second lead terminal 53 are spaced apart from each other in the opening 56. In addition, the first lead terminal 51 and the second lead terminal 53 extend through the side wall of the housing 55 to be electrically connected to the external power source, respectively. The first lead terminal 51 and the second lead terminal 53 extending to the outside may have various shapes and may be bent into various shapes.

On the other hand, the chip mounting portion 51b of the first lead terminal 51 is positioned downward toward the lower housing 55b, whereby a recess is formed in the bottom of the opening 56. On the other hand, the first inclined surface 51c of the first lead terminal 51 crosses the major axis direction of the opening 56 and terminates before meeting the inner wall in the short axis direction of the housing 55 or the inner wall. That is, the first inclined surface 51c exposed by the opening 56 is not continuous but intermittent. Therefore, the reflectance in the long axis direction can be increased without changing the directivity angle characteristic in the short axis direction, and it is possible to control light distribution in the long axis direction and the short axis direction separately. The second inclined surface 51d of the first lead terminal 51 also crosses the major axis direction of the opening 56 and terminates before meeting the inner wall in the short axis direction of the housing 55 or the inner wall. That is, the second inclined surface 51d is formed symmetrically with the first inclined surface 51c, whereby a light distribution having symmetry can be obtained.

The light emitting chip 57 is mounted on the chip mounting portion 51b and is electrically connected to the second lead terminal 53 through the conductive wire 59. The light generated by the light emitting chip 57 is reflected by the first inclined surface 51c and the second inclined surface 51d before reaching the inner wall 55w of the housing 55. Therefore, since a part of the light emitted from the light emitting chip 57 is reflected on the first inclined surface 51c and the second inclined surface 51d having high reflectance, the luminous efficiency of the light emitting diode package is improved. In addition, the amount of light incident directly on the inner wall of the housing 55 can be reduced, so that discoloration of the inner wall of the housing 55 can be alleviated, and as a result, the package life can be extended.

Referring to FIG. 17, in order to improve the reflectance in the short axis direction and to prevent discoloration of the inner wall of the housing 55 in the short axis direction, the first lead terminal 51 may be formed at the opening portion 56 from the chip mounting portion 51b. It may include wings (51f) each extending in both the short axis direction. The wing parts 51f are bent from the chip mounting part 51b to form third and fourth inclined surfaces. In addition, since the wing portions 51f are separated from the first and second inclined surfaces 51c and 51d, they may be bent to have different inclination angles, so that the reflection characteristics in the short axis direction and the reflection characteristics in the long axis direction can be individually adjusted. .

Meanwhile, an encapsulant 63 containing phosphors may be formed on the light emitting chip 57. The encapsulant 63 can be formed by doping a liquid resin containing a phosphor into a recess formed on the chip mounting portion 51b. Therefore, the sealing agent 63 which is confined and convex in the recessed part can be formed. Meanwhile, since the encapsulant 63 including the phosphor has been described with reference to FIG. 2, detailed description thereof will be omitted.

Meanwhile, the encapsulant 63 may fill the opening 56, and after the encapsulant 63 is formed in the concave portion, the transparent molding part 65 is additionally formed in the opening 56 to open the opening 56. You can also fill

18 is schematic views illustrating a light emitting diode according to another embodiment of the present invention. In Fig. 18, (a) is a plan view through the package body, (b) is a cross-sectional view taken along line CC of (a), and (c) is a cross-sectional view taken along line DD of (a). The wings are indicated by dashed lines.

Referring to FIG. 18, the light emitting diode includes a pair of lead terminals, that is, a first lead terminal 71 and a second lead terminal 73. As shown in FIG. 3, the first lead terminal 71 and the second lead terminal 73 may include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel, or titanium.

The first lead terminal 71 includes a chip mounting portion 71a on which the light emitting chip 77 is mounted, and first wing portions 71w that are bent to face upward from the chip mounting portion 71a to form a reflective surface. Include. The second lead terminal 73 may include a wire bonding portion 73a and second wing portions 73w that are bent upward from the wire bonding portion 73a to form a reflective surface. The first lead terminal 71 and the second lead terminal 73 are spaced apart from each other, and the first wing portions 71w and the second wing portions 73w are disposed parallel to each other to form both reflection surfaces. Each of the first wing portions 71w and the second wing portions 73w may have a symmetrical structure with respect to the chip mounting portion 71a and the wire bonding portion 73a to which the first wing portions 71w and the second wing portions 73w are connected, as shown. A light distribution having symmetry can be obtained. However, the present invention is not limited thereto, and the first wing portions 71w and the second wing portions 73w may be asymmetrical structures having different widths.

On the other hand, the housing 75 is coupled to the first lead terminal 71 and the second lead terminal 73 to support them. The housing 75 covers the lower surfaces of the first lead terminal 71 and the second lead terminal 73 and surrounds outer surfaces of the first wing portions 71w and the second wing portions 73w. In addition, the housing 75 fills a gap between the chip mounting portion 71a of the first lead terminal 71 and the wire bonding portion 73a of the second lead terminal 73, and the first wing portions 71w and the first wing portion 71w. The gaps between the second wings 73w may be filled. In addition, the housing 75 may cover upper surfaces of the first wing portions 71w and the second wing portions 73w.

The first lead terminal 71 and the second lead terminal 73 respectively extend out of the housing 75 to be electrically connected to an external power source. The first lead terminal 71 and the second lead terminal 73 extending to the outside may have various shapes and may be bent into various shapes.

Meanwhile, the first wing portions 71w and the second wing portions 73w are disposed parallel to each other to form both reflection surfaces, and the housing 75 includes the first wing portions 71w and the second wing portions 73w. In addition, the inner wall of the opening can be formed. In particular, the housing 75 forms inner walls 75w of both sides connecting the two reflecting surfaces formed by the first wing portions 71w and the second wing portions 73w. The inner walls 75w may be formed to be inclined as shown.

The light emitting chip 77 is mounted on the chip mounting portion 71a of the first lead terminal 71 and is electrically connected to the second lead terminal 73 through the conductive wire 79. The light emitting chip 77 may be connected to the first lead terminal 71 and the second lead terminal 73 through two conductive wires 79, and electrically connected to the first lead terminal 71 through the conductive adhesive. The second lead terminal 73 may be electrically connected to the second lead terminal 73 through one conductive wire 79.

According to the present exemplary embodiment, since the first lead terminal 71 and the second lead terminal 73 are disposed on the bottom surface and both sides of the opening, the reflection efficiency of the light emitted from the light emitting chip 77 can be improved. In particular, in the side surface light emitting diode package having an elongated opening, the first wing portions 71w and the second wing portions 73w are located on the side surfaces formed in parallel in the long axis direction, thereby reflecting a large surface area. Can form them. On the other hand, the first wings 71w and the second wings 73w reflect the light incident on the housing 75 to reduce the discoloration of the housing 75 by the light. In addition, heat dissipation performance of the package may be improved by dissipating heat through the first wings 71w and the second wings 73w. In addition, when the thickness of the housing 75 surrounding the outer surfaces of the first wing portions 71w and the second wing portions 73w is reduced, heat dissipation through the housing 75 is promoted to further improve heat dissipation performance. Is improved.

19 is a view illustrating a manufacturing process of the first lead terminal and the second lead terminal illustrated in FIG. 18, and FIG. 20 is a view illustrating a manufacturing process of the first lead terminal and the second lead terminal according to another exemplary embodiment.

Referring to FIG. 19, the flat metal plate is punched or pressed to form first lead terminals 71 and second lead terminals 73 spaced apart from each other. The first lead terminal 71 and the second lead terminal 73 each have a chip mounting portion 71a and a wire bonding portion 73a, and the first wing portions 71w and the second wing portions extending from both sides thereof. (73w). The first wing portions 71w and the second wing portions 73w are bent upward to form both reflecting surfaces.

In the present exemplary embodiment, the first lead terminal 71 and the second lead terminal 73 are illustrated as having rectangular first wing portions 71w and second wing portions 73w, respectively, but are not limited thereto. no.

Referring to FIG. 20, the first lead terminals 71 and the second lead terminals 73 are first wing portions 81w that are wider as they move away from the chip mounting portion 71a and the wire bonding portion 73a, respectively. ) And second wings 83w. The wider first wing portions 81w and second wing portions 83w have a larger reflective surface on both elongated sides when the inner walls 75w are formed to be inclined, for example, as shown in FIG. 18. Can provide them.

21 is a schematic diagram illustrating a light emitting diode according to another embodiment of the present invention. In Fig. 21, (a) is a plan view through the housing, (b) is a cross-sectional view taken along the line CC of (a), and (c) is a cross-sectional view taken along the line DD of (a). The parts are indicated by dotted lines. For convenience, the light emitting chip and the conductive wire are omitted.

Referring to FIG. 21, the light emitting diode according to the present embodiment has substantially the same components as the light emitting diode described with reference to FIG. 18. However, there is a difference that the outer surfaces of the first wing portions 71w and the second wing portions 73w are exposed to the outside of the housing 85. That is, in this embodiment, at least some of the outer surfaces of the first wing portions 71w and the second wing portions 73w are exposed to the outside. Accordingly, heat generated in the package may be discharged to the outside through the first wing parts 71w and the second wing parts 73w, thereby improving heat dissipation efficiency.

22 is a schematic diagram illustrating a light emitting diode according to another embodiment of the present invention. In FIG. 22, (a) is the top view which looked through the housing, (b) is sectional drawing cut along the CC line of (a), (c) is sectional drawing cut along the DD line of (a), and a wing | blade. The parts are indicated by dotted lines. For convenience, the light emitting chip and the conductive wire are omitted.

Referring to FIG. 22, the light emitting diode according to the present embodiment has substantially the same components as the light emitting diode described with reference to FIG. 18. However, the chip mounting portion 91a of the first lead terminal 91, the wire bonding portion 93a of the second lead terminal 93, the first wing portions 91w and the second wing portions 93w are illustrated in FIG. 18. It is formed longer than the corresponding components of the first wings 91w and the second wings 93w make up most of both sides of the package. On the other hand, the housing 95 covers the lower surfaces of the first lead terminal 91 and the second lead terminal 93, and fills the gaps therebetween to join them. In addition, the housing 95 is formed between both reflective surfaces formed by the first wing portions 91w and the second wing portions 93w to form inner walls 95w. The inner walls 95w may be formed to be inclined.

According to this embodiment, the heat dissipation efficiency can be further improved by increasing the widths of the first wing portions 91w and the second wing portions 93w to almost the width of the housing 95.

In the foregoing embodiments, the package of the side light emitting diode having an elongated opening is illustrated and described as an example, but the embodiments are not limited to the side light emitting diode package, and various types of plastic housings and lead frames are used. It can also be applied to packages, for example packages with circular or rectangular openings.

FIG. 23 is a perspective view illustrating a light emitting diode according to still another embodiment of the present invention, and FIG. 24 is a cross-sectional view of the light emitting diode shown in FIG. 23.

23 and 24, the light emitting diode according to the present embodiment includes the light emitting chip 2, the first lead terminal 12, the second lead terminal 14, and the first lead for applying power to the light emitting chip 2. And a housing 20 for supporting the lead terminal 12 and the second lead terminal 14, and a light-transmitting encapsulant 30 formed to protect the light emitting chip 2.

As shown in FIG. 3, the first lead terminal 12 and the second lead terminal 14 may include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel, or titanium.

The first lead terminal 12 and the second lead terminal 14 are formed in a substantially plate shape. The first lead terminal 12 and the second lead terminal 14 are formed to be spaced apart from each other in a state supported by the housing 30. In addition, recesses 122 and 142 that are open toward each other are formed at adjacent ends of the first lead terminal 12 and the second lead terminal 14. The recessed portions 122 and 142 of the first lead terminal 12 and the second lead terminal 14 form a concave cup in which the light emitting chip 2 is mounted. The first lead terminal 12 and the second lead terminal 14 have a gap between them so that the gap between them is relatively large near the edges of the cup outer portion, in particular near the edges of the first lead terminal 12 and the second lead terminal 14. It is formed, which contributes to improving the support strength and durability of the housing 20 for supporting the first lead terminal 12 and the second lead terminal 14.

The housing 20 is formed to cover a portion of the first lead terminal 12 and the second lead terminal 14, avoiding the cup bottom surface formed by the depressions 122 and 142. Bottom surfaces of the depressions 122 and 142, that is, the cup bottom surfaces 123 and 143, are exposed to the outside. In addition, the cup bottom surfaces 123 and 143 are preferably located on the same plane as the bottom surface of the housing 20. In this case, the cup bottom surfaces 123 and 143 may be, for example, electrical contacts connected to electrode patterns formed on an external printed circuit board. Since the cup bottom surfaces 123 and 143 are exposed to the outside in a thin thickness and a large area, the cup bottom surfaces 123 and 143 may greatly contribute to dissipating heat of the light emitting chip 2 to the outside.

The first lead terminal 12 and the second lead terminal 14 include wings 124 and 144 extending from the recesses 122 and 142 to the outside of the side of the housing 20, respectively. The wings 124 and 144 constitute a heat dissipation part that emits heat generated from the light emitting chip 2 to the outside air. In particular, each of the wings 124 and 144 is exposed to the outside air in the shape of a wide plate. Therefore, heat generated in the light emitting chip 2 can be effectively released into the outside air in a convection manner. In this case, the wing parts 124 and 144 may be used as electrical contact parts. In this case, the cup bottom surfaces 123 and 143 may perform only a heat dissipation function.

The light emitting chip 2 is mounted on the recess 122 of the first lead terminal 12 to be electrically connected to the first lead terminal 12. In addition, the recessed portion 142 of the light emitting chip 2 and the second lead terminal 14 are electrically connected to each other through a conductive wire.

The first lead terminal 12 and the second lead terminal 14 extend inclined from the bottom surfaces of the depressions 122 and 142, that is, the cup bottom surfaces 123 and 143, and thus the wing portions 124 and 144. And inclined surfaces connected with the. That is, the inner surface of the depressions 122 and 142, that is, the inner surface of the cup, is formed as an inclined surface to reflect some of the light emitted from the light emitting chip 2 upward.

Meanwhile, the first lead terminal 12 and the second lead terminal 14 may include a rough surface R, as shown in an enlarged view of FIG. 24. The rough surface R is, for example, a surface formed by a surface treatment process such as sand blasting, and the depressions 122 and 142 scatter light to contribute to widening the direction of light and increasing the efficiency of the light. In the outer portion of the depressions 122 and 142 covered by the housing 20, the adhesion of the first lead terminal 12 and the second lead terminal 14 to the resin constituting the housing 20 is increased. Can be.

The encapsulant 30 made of a light transmissive resin is filled in the cup formed by the recesses 122 and 142. For example, the encapsulant 30 may include a first encapsulation portion 32 mainly composed of a silicone resin and a second encapsulation portion 34 mainly composed of an epoxy resin or a hard silicone resin. In this case, one of the first encapsulation part 32 and the second encapsulation part 34 may include a phosphor.

25 is a cross-sectional view illustrating a light emitting diode according to another embodiment of the present invention.

Referring to FIG. 25, the light emitting diode according to the present embodiment has substantially the same components as the light emitting diode described with reference to FIG. 24. However, the first lead terminal 12 and the second lead terminal 14 extend vertically from the bottom surfaces of the recesses 122 and 142, that is, the cup bottom surfaces 123 and 143, and thus the base end of the cup. A vertical surface forming (5) and inclined surfaces extending obliquely from the vertical surface and connected to the wing portions 124 and 144 to form the upper end 6 of the cup.

In the cup formed by the recesses 122 and 142, an encapsulant 30 made of a light transmissive resin may be sequentially formed at the base end 5 and the upper end 6 positioned thereon. Accordingly, the lens phenomenon can be formed more effectively.

FIG. 26 is a perspective view illustrating a light emitting diode according to another embodiment of the present invention, FIG. 27 is a plan view of the light emitting diode shown in FIG. 26, and FIG. 28 is a cross-sectional view taken along the line II-II of FIG. 27.

26, 27, and 28, the light emitting diode includes a light emitting chip 2, a housing 10, a lead frame 20, an encapsulant 30, and a reflector 40.

The lead frame 20 may include six lead terminals 22 and 24. Six lead terminals 22 and 24 are supported by the housing 10. As shown in FIG. 3, the lead frame 20 may include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel, or titanium.

The housing 10 is formed by molding a resin, and an opening 12, which is a space in which the light emitting chip 2 is accommodated, is formed in the center of the upper surface. The housing 10 has six lead terminals 22 and 24, respectively, with inner lead terminals 22a and 24a located inside the opening 12 and outer lead terminals 22b and 24b located outside the opening 12. It is limited to). The number of lead terminals 22 and 24 constituting the lead frame 20 may be variously changed.

The light emitting chip 2 is directly connected to three lead terminals 22 of the lead frame 20, and the remaining three lead terminals 24 are electrically connected to the light emitting chip 2 through a conductive wire.

The reflector 40 is formed to be installed at least on the inner wall of the opening 12 of the housing 10. The reflector 40 may be formed of the same material as the lead frame 20. That is, the reflector 40 may include a base metal layer, a reflective layer made of silver or aluminum, and a protective layer made of gold, nickel or titanium, as shown in FIG. 3.

The reflector 40 is supported by the housing 10 together with the lead frame 20. The reflector 40 extends from the hollow reflector 42 and the reflector 42 positioned to face the inner surface of the opening 12 of the housing 10 and is exposed to the outside of the housing 10. And (44).

The reflector 42 is a hollow cylinder having a circumference at the top and the bottom, respectively, and is formed in a shape in which the inner circumference has an inclination of a predetermined slope because the circumference at the top is larger than the circumference at the bottom. The shape of this reflecting portion 42 corresponds to the shape of the opening 12 of the housing 10, so that the reflecting portion 42 is positioned with its side facing the inner surface of the opening 12.

The heat radiating portion 44 is a portion extending from the reflecting portion 42 and thermally exposed to the outside of the housing 10. For example, the heat radiating portion 44 is formed extending laterally from a portion of the circumference of the top of the reflecting portion 42. A heat radiation hole 13 may be formed at a side of the housing 10 to allow thermal exposure of the heat radiation portion 44.

The heat dissipation unit 44 may improve heat dissipation characteristics of the light emitting diode as the number thereof increases. The heat dissipation portion 44 has a bent strip shape extending from the circumferential portion of the upper end of the reflecting portion 42, but from the top or bottom of the reflecting portion 42 or from any side between the top and the bottom thereof. It can be changed to various structures extending in the radial direction. In addition, the heat radiating portion 44 may have an annular structure extending from the entire circumference of the reflecting portion 42.

Meanwhile, the reflector 40 may have various shapes as long as it surrounds the inner surface of the opening 12 of the housing 10.

29 is a plan view illustrating a light emitting diode according to still another embodiment of the present invention, and FIG. 30 is a cross-sectional view of the light emitting diode shown in FIG. 29.

29 and 30, a light emitting diode includes a lead frame including a first lead terminal 210 and a second lead terminal 220, a light emitting chip 300, a conductive wire 400, and a housing 510. And an encapsulant 600.

The first lead terminal 210 and the second lead terminal 220 is for applying power to the light emitting chip 300, as shown in Figure 3, a base metal layer, a reflective layer made of silver or aluminum, and gold, It may include a protective layer made of nickel or titanium.

The light emitting chip 300 is mounted on the first lead terminal 210 and is electrically connected to the second lead terminal 220 through the conductive wire 400.

An opening 520 is formed in the housing 510 to expose a portion of the light emitting chip 300, the first lead terminal 210, and the second lead terminal 220. The opening 520 may be formed so that the central region of the housing 510 is inclined. That is, the opening 520 is formed in a shape that gradually decreases in size from the upper surface of the housing 510 toward the lower side.

In addition, at least one cutout 530 is formed in the housing 510 such that a portion of the area adjacent to the opening 520 is embedded to expose the wire bonding area. The cutout 530 may expose a portion of the second lead terminal 220, that is, the conductive wire 400 connected to the light emitting chip 300 to expose the wire bonding region bonded to the second lead terminal 220. For example, one side of the opening 520 is formed on a region where the second lead terminal 220 is disposed in the opening 520. As such, when the cutout portion 530 is formed such that a portion of the housing 510 is inserted from one side of the opening 520 toward the peripheral area of the housing 510, the partial region of the second lead terminal 220, namely, , The wire bonding area is exposed. As a result, one end of the conductive wire 400 is bonded to the light emitting chip 300 mounted on the first lead terminal 210, and the other end of the conductive wire 400 is exposed through the cutout 530. Is bonded to the wire bonding region of the.

The shape and size of the wire bonding region of the second lead terminal 220 may be variously modified by adjusting the shape and size of the cutout 530. In addition, when two or more conductive wires 400 or two or more light emitting chips 300 are present, a plurality of cutouts 530 may be formed corresponding to the number of conductive wires 400.

The encapsulant 600 is formed to fill the opening 520 and the cutout 530 of the housing 510 to encapsulate the light emitting chip 300.

Although not shown, the reflector described above may be formed on the inner wall of the housing 510 in which the opening 520 and the cutout 530 are formed.

As such, when the cutout 530 for wire bonding is formed in a part of the housing 510, the size of the light emitting diode is reduced by reducing the size of the housing 510 and at the same time, a space for wire bonding is secured. It is possible to minimize defects that may occur during bonding.

31 is an exploded perspective view illustrating a backlight unit according to an embodiment of the present invention.

Referring to FIG. 31, the backlight unit includes a light guide plate 310 and at least one light emitting diode 320 disposed on a side surface of the light guide plate 310 to supply light to the light guide plate 310.

The light emitting diode 320 may be mounted on a circuit board 330 such as a printed circuit board (PCB) or a flexible printed circuit board (FPCB). The light emitting diodes 320 are arranged in a line at regular intervals along the length direction of the circuit board 330, for example. The light emitting diode 320 emits light in response to a power applied through the circuit board 330.

Since the light emitting diode 320 may be made of various embodiments illustrated in FIGS. 1 to 30, a detailed description thereof will be omitted.

The light guide plate 310 changes the path of the light incident from the light emitting diode 320 disposed on the side surface and guides the light guide plate 310 toward the liquid crystal display panel to be disposed thereon. The light guide plate 310 is preferably formed of a transparent material to minimize the loss of light. The light guide plate 310 is formed of, for example, a transparent polymethyl methacrylate (PMMA) or polycarbonate (PC) material.

A predetermined reflection pattern (not shown) for scattering reflection of light may be formed on the lower surface of the light guide plate 310. For example, the reflective pattern formed on the lower surface of the light guide plate 310 may include a printing pattern or an uneven pattern. Accordingly, light incident from the light emitting diode 320 into the light guide plate 310 is scattered and reflected by the reflection pattern, and light incident on the upper surface of the light guide plate 310 at an angle exceeding a specific critical angle is received by the light guide plate 310. It will exit through the upper surface of the.

The light guide plate 310 may have a plate shape in which the incident surface on which the light emitting diodes 320 are disposed and the opposite surface of the light facing surface have the same thickness, or may have a wedge shape that becomes thinner from the incident surface to the light facing surface. have.

The backlight unit may further include a reflective sheet 340 disposed on the bottom surface of the light guide plate 310. The reflective sheet 340 reflects light leaking to the outside through the lower surface of the light guide plate 310 to the inside of the light guide plate 310 to improve light utilization efficiency. The reflective sheet 340 is formed of, for example, white polyethylene terephthalate (PET) or polycarbonate (PC).

In addition, the backlight unit may further include at least one optical sheet 350 disposed on the light guide plate 310. The optical sheet 350 may include at least one of a diffusion sheet for diffusing light to improve luminance uniformity, a light collecting sheet for condensing light to improve front luminance, a reflective polarizing sheet for increasing luminance through recycling of light, and the like. can do.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1 is a plan view showing a light emitting diode according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

FIG. 3 is an enlarged view specifically showing the lead frame shown in FIG. 2.

4 is a graph showing the light efficiency of the LED package according to the change in the thickness of the reflective layer formed of gold.

5 is a graph showing the light transmittance according to the thickness of the protective layer formed of nickel or titanium.

6 is a view showing a lead frame according to another embodiment of the present invention.

7 is a cross-sectional view showing a light emitting diode according to another embodiment of the present invention.

8 is a plan view illustrating a light emitting diode according to still another embodiment of the present invention.

9 is a cross-sectional view taken along line AA ′ of FIG. 8.

FIG. 10 is a cross-sectional view taken along the line BB ′ of FIG. 8.

FIG. 11 is a cross-sectional view taken along the line CC ′ of FIG. 8.

12 is a view illustrating a manufacturing process of the first lead terminal and the second lead terminal according to an embodiment of the present invention.

13 is a view illustrating a shape of a lead frame according to another embodiment.

14 is a plan view showing a light emitting diode according to another embodiment of the present invention.

15 is a cross-sectional view taken along line B-B of FIG. 14.

16 illustrates various first lead terminals applicable to a light emitting diode.

17 is a view illustrating a first lead terminal according to another embodiment of the present invention.

18 is schematic views illustrating a light emitting diode according to another embodiment of the present invention.

FIG. 19 is a view illustrating a manufacturing process of the first lead terminal and the second lead terminal illustrated in FIG. 18.

20 is a view illustrating a manufacturing process of a first lead terminal and a second lead terminal according to another embodiment.

21 is a schematic diagram illustrating a light emitting diode according to another embodiment of the present invention.

22 is a schematic diagram illustrating a light emitting diode according to another embodiment of the present invention.

23 is a perspective view showing a light emitting diode according to another embodiment of the present invention.

24 is a cross-sectional view of the light emitting diode shown in FIG. 23.

25 is a cross-sectional view illustrating a light emitting diode according to another embodiment of the present invention.

26 is a perspective view showing a light emitting diode according to another embodiment of the present invention.

FIG. 27 is a plan view of the light emitting diode of FIG. 26.

FIG. 28 is a cross-sectional view taken along the line II-II of FIG. 27.

29 is a plan view showing a light emitting diode according to another embodiment of the present invention.

30 is a cross-sectional view of the light emitting diode shown in FIG. 29.

31 is an exploded perspective view illustrating a backlight unit according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: light emitting diode 110: light emitting chip

120: lead frame 120a: base metal layer

120b: reflective layer 120c: protective layer

120d: nickel layer 130: housing

160: sealing agent 162: phosphor

Claims (43)

A base metal layer; A reflective layer formed on the surface of the base metal layer; And And a protective layer formed of a metal on a surface of the reflective layer. The method of claim 1, The reflective layer includes any one selected from silver (Ag) and aluminum (Al). The method of claim 1, The protective layer is a lead frame comprising any one selected from gold (Au), nickel (Ni) and titanium (Ti). The method of claim 3, When the protective layer is formed of gold, the protective layer has a thickness of less than 600nm. The method of claim 3, When the protective layer is formed of nickel or titanium, the protective layer has a thickness of 20nm or less. The method of claim 1, And a nickel layer formed between the base metal layer and the reflective layer. A light emitting chip for generating light; A metal member on which the light emitting chip is mounted; And A housing coupled to the metal member to fix the metal member, the housing having an opening for exposing the light emitting chip and at least a portion of the metal member; The metal member includes a base metal layer, a reflective layer formed on the surface of the base metal layer, and a protective layer formed of a metal on the surface of the reflective layer. The method of claim 7, wherein The reflective layer comprises a light emitting diode comprising any one selected from silver (Ag) and aluminum (Al). The method of claim 7, wherein The protective layer is a light emitting diode comprising any one selected from gold (Au), nickel (Ni) and titanium (Ti). 10. The method of claim 9, If the protective layer is formed of gold, the protective layer has a thickness of less than 600nm. 10. The method of claim 9, When the protective layer is formed of nickel or titanium, the protective layer has a thickness of 20nm or less. The method of claim 7, wherein The metal member further comprises a nickel layer formed between the base metal layer and the reflective layer. The method of claim 7, wherein And the metal member is a slug for dissipating heat generated from the light emitting chip. The method of claim 13, And a lead frame for applying power to the light emitting chip. The method of claim 7, wherein The metal member is a light emitting diode, characterized in that the lead frame for applying power to the light emitting chip. The method of claim 15, wherein the lead frame A first lead terminal including a chip mounting portion on which the light emitting chip is mounted and at least one reflective surface formed by bending the chip mounting portion; And And a second lead terminal spaced apart from the first lead terminal. The method of claim 16, The first lead terminal includes a stepped portion bent from the chip mounting portion and a first inclined surface forming the reflective surface between the chip mounting portion and the stepped portion. The method of claim 17, The first lead terminal is bent from the chip mounting portion, the light emitting diode further comprising a second inclined surface facing the first inclined surface. The method of claim 18, And the first lead terminal is bent from the chip mounting portion and further includes third and fourth inclined surfaces adjacent to the first and second inclined surfaces. The method of claim 16, And the first lead terminal includes first wing portions that are bent upward from the chip mounting portion to form the reflective surface. 21. The method of claim 20, wherein the second lead terminal A light emitting diode comprising: a wire bonding portion and second wing portions bent to face upward from the wire bonding portion and disposed to be parallel to the first wing portions. The method of claim 20, At least one of the first wing portion and the second wing portion is a light emitting diode, characterized in that the width is wider away from the chip mounting portion and the wire bonding portion. The method of claim 20, And the housing covers outer surfaces of the first wings and the second wings. The method of claim 20, Light emitting diodes, characterized in that at least some of the outer surface of the first wings and the second wings are exposed to the outside. The method of claim 15, wherein the lead frame A first lead terminal including a chip mounting portion on which the light emitting chip is mounted, a first external lead portion extending from the chip mounting portion to the outside of the housing, and a first wing portion extending from the chip mounting portion; And A second lead terminal spaced apart from the first lead terminal and including a wire bonding portion, a second outer lead portion extending from the wire bonding portion to the outside of the housing, and a second wing portion extending from the wire bonding portion; , Wherein the first wing and the second wing are bent from the chip mounting portion and the wire bonding portion, respectively, and disposed on both sides of the chip mounting portion. The method of claim 25, And the first wing portion extends toward a side of the wire bonding portion of the second lead terminal. The method of claim 25, At least one of the first wing and the second wing is a light emitting diode, characterized in that the width is wider away from the chip mounting portion. The method of claim 25, The housing is a light emitting diode, characterized in that for covering the outer surface of the first wing and the second wing. The method of claim 25, Light emitting diodes, characterized in that at least a portion of the outer surface of the first wing portion and the second wing portion is exposed to the outside. The method of claim 15, The lead frame includes recesses adjacent to each other, and the recesses include a first lead terminal and a second lead terminal forming one cup on which the light emitting chip is mounted. 31. The method of claim 30, And the first lead terminal and the second lead terminal include wing portions extending from the recesses to the outside of the housing. The method of claim 31, wherein And the first lead terminal and the second lead terminal include an inclined surface extending obliquely from a bottom surface of the recessed portion and connected to the wing portion. The method of claim 7, wherein And a reflector formed on an inner wall of the opening of the housing, wherein the reflector is formed of the same material as the metal member. 34. The method of claim 33, The reflector may include a hollow reflector positioned to face an inner surface of the opening of the housing and a heat radiator extending from the reflector to be exposed to the outside of the housing. 34. The method of claim 33, And the housing includes at least one cutout formed to incorporate a portion of the region adjacent to the opening to expose a wire bonding region. The method of claim 7, wherein And an encapsulant filled in an opening of the housing to cover the light emitting chip, the encapsulating agent including a phosphor for converting at least a portion of the light generated by the light emitting chip into light having a different wavelength. The method of claim 36, The light emitting chip includes a blue chip for generating blue light, The phosphor includes a yellow phosphor that converts at least a portion of the blue light generated from the blue chip into yellow light. The method of claim 36, The light emitting chip includes a blue chip for generating blue light, The phosphor includes a red phosphor and a green phosphor for converting at least a portion of the blue light generated from the blue chip into red light and green light, respectively. The method of claim 36, The light emitting chip includes a blue chip generating blue light and a red chip generating red light, The phosphor includes a green phosphor that converts at least a portion of the blue light and the red light generated from the blue chip and the red chip into green light. The method of claim 36, The light emitting chip includes a blue chip generating blue light and a green chip generating green light, The phosphor includes a red phosphor that converts at least a portion of the blue light and the green light generated from the blue chip and the green chip into red light. Light guide plate; And At least one light emitting diode disposed on the side of the light guide plate for supplying light to the light guide plate, The light emitting diode, A lead frame including a base metal layer, a reflective layer formed on the surface of the base metal layer, and a protective layer formed of metal on the surface of the reflective layer; And And a light emitting chip mounted on the lead frame and configured to generate light in response to power applied through the lead frame. The method of claim 41, wherein The reflective layer comprises any one selected from silver (Ag) and aluminum (Al). The method of claim 41, wherein The protective layer includes any one selected from gold (Au), nickel (Ni) and titanium (Ti).

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