KR20100062315A - 반도체 패키지 및 그 제조 방법 - Google Patents
반도체 패키지 및 그 제조 방법 Download PDFInfo
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- KR20100062315A KR20100062315A KR1020080120884A KR20080120884A KR20100062315A KR 20100062315 A KR20100062315 A KR 20100062315A KR 1020080120884 A KR1020080120884 A KR 1020080120884A KR 20080120884 A KR20080120884 A KR 20080120884A KR 20100062315 A KR20100062315 A KR 20100062315A
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Abstract
Description
Claims (22)
- 상면에 다수의 도전성 패턴을 가지며, 하면에 상기 도전성 패턴과 전기적으로 연결된 다수의 하부 랜드를 가지는 서브스트레이트;상기 서브스트레이트의 상부에 형성되어, 상기 도전성 패턴과 전기적으로 연결되는 제 1 반도체 다이;상기 서브스트레이트의 상부에서 상기 제 1 반도체 다이와 이격되게 형성되며, 상기 도전성 패턴과 전기적으로 연결되는 상부 솔더볼;상기 제 1 반도체 다이와 상기 상부 솔더볼의 상부에 형성되어, 상기 상부 솔더볼과 전기적으로 연결되는 다수의 상부 랜드; 및상기 제 1 반도체 다이와 상기 상부 솔더볼을 감싸도록, 상기 서브스트레이트의 상부에 형성되는 인캡슐런트를 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 인캡슐런트는 상기 다수의 상부 랜드를 감싸며,상기 인캡슐런트의 상면과 상기 상부 랜드의 상면이 동일 평면을 이루는 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 제 1 반도체 다이의 하부에 형성되어, 상기 제 1 반도체 다이와 상기 도전성 패턴을 전기적으로 연결하는 도전성 범프를 더 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 서브스트레이트의 하부에 형성되어 상기 하부 랜드와 전기적으로 연결되는 하부 솔더볼을 더 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 제 1 반도체 다이의 상부에 형성되며, 도전성 와이어를 통해 상기 상부 랜드와 전기적으로 연결되는 제 2 반도체 다이를 더 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 5 항에 있어서,상기 인캡슐런트는 상기 상부 랜드, 상기 제 2 반도체 다이 및 상기 도전성 와이어를 감싸며,상기 인캡슐런트의 상면, 상기 상부 랜드의 상면 및 상기 제 2 반도체 다이의 상면이 동일 평면을 이루는 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 제 1 반도체 다이는 접착부재를 이용해 상기 서브스트레이트의 상부에 부착되며, 도전성 와이어를 이용해 상기 도전성 패턴과 전기적으로 연결되는 것을 특징으로 하는 반도체 패키지.
- 제 7 항에 있어서,접착부재를 이용해 상기 제 1 반도체 다이의 상부에 부착되며, 도전성 와이어를 이용해 상기 도전성 패턴과 전기적으로 연결되는 제 2 반도체 다이를 더 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 7 항에 있어서,상기 인캡슐런트를 관통하도록 형성되어, 상기 상부 솔더볼과 전기적으로 연결되는 TMV(Through Mold Via)를 더 포함하는 것을 특징으로 하는 반도체 패키지.
- 제 9 항에 있어서,상기 상부 랜드가 상기 인캡슐런트의 상부에 돌출된 형태로 형성되며, 상기 TMV와 전기적으로 연결되는 것을 특징으로 하는 반도체 패키지.
- 상면에 다수의 도전성 패턴을 가지며, 하면에 상기 도전성 패턴과 전기적으로 연결된 다수의 하부 랜드를 가지는 서브스트레이트를 준비하는 서브스트레이트 준비 단계;상기 서브스트레이트의 상부에 제 1 반도체 다이를 배치하여 상기 도전성 패 턴과 전기적으로 연결시키고, 상기 서브스트레이트의 상부에 상부 솔더볼을 상기 제 1 반도체 다이와 이격되게 형성하여 상기 도전성 패턴과 전기적으로 연결시키는 반도체 다이 연결 및 상부 솔더볼 형성 단계;회로 패턴이 형성된 캐리어를 상기 제 1 반도체 다이의 상부에 배치시켜 상기 회로 패턴을 상기 상부 솔더볼에 접합시키는 캐리어 접합 단계;상기 제 1 반도체 다이, 상기 상부 솔더볼 및 상기 회로 패턴을 감싸도록 인캡슐레이션하여, 상기 서브스트레이트와 상기 캐리어 사이에 인캡슐런트를 형성하는 인캡슐런트 형성 단계; 및상기 캐리어를 제거하여 상기 인캡슐런트의 상면에 상부 랜드를 형성하는 캐리어 제거 단계를 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 11 항에 있어서,상기 반도체 다이 연결 및 상부 솔더볼 형성 단계는상기 제 1 반도체 다이의 하부에 형성된 도전성 범프를 이용하여 상기 제 1 반도체 다이와 상기 도전성 패턴을 전기적으로 연결하는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 11 항에 있어서,상기 캐리어 접합 단계는상기 회로 패턴을 도전성 물질로 형성하고, 상기 캐리어를 상기 회로 패턴과 다른 재질로 형성하여 준비하는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 13 항에 있어서,상기 캐리어 제거 단계는 식각 공정에 의해 이루어지는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 11 항에 있어서,상기 서브스트레이트의 하부에 하부 솔더볼을 형성하여, 상기 하부 랜드와 전기적으로 연결시키는 하부 솔더볼 형성 단계를 더 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 11 항에 있어서,상기 캐리어 접합 단계는도전성 와이어를 통해 상기 회로 패턴과 전기적으로 연결되는 제 2 반도체 다이를 상기 캐리어에 더 형성하는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 상면에 다수의 도전성 패턴을 가지며, 하면에 상기 도전성 패턴과 전기적으로 연결된 다수의 하부 랜드를 가지는 서브스트레이트를 준비하는 서브스트레이트 준비 단계;상기 서브스트레이트의 상부에 제 1 반도체 다이를 부착하여 상기 도전성 패턴과 전기적으로 연결시키고, 상기 서브스트레이트의 상부에 상부 솔더볼을 상기 제 1 반도체 다이와 이격되게 형성하여 상기 도전성 패턴과 전기적으로 연결시키는 반도체 다이 연결 및 상부 솔더볼 형성 단계;상기 제 1 반도체 다이와 상기 상부 솔더볼을 감싸도록 인캡슐레이션하여, 상기 서브스트레이트의 상부에 인캡슐런트를 형성하는 인캡슐런트 형성 단계;상기 인캡슐런트 중 상기 상부 솔더볼과 대응되는 영역에 관통홀을 형성하여, 상기 솔더볼을 외부로 노출시키는 관통홀 형성 단계;상기 관통홀의 내부에 도전성 물질을 도포하여 상기 상부 솔더볼과 전기적으로 연결되는 TMV(Through Mold Via)를 형성하는 TMV 형성 단계;회로 패턴이 형성된 캐리어를 상기 제 1 반도체 다이의 상부에 배치시켜 상기 회로 패턴을 상기 TMV에 접합시키는 캐리어 접합 단계; 및상기 캐리어를 제거하여 상기 인캡슐런트의 상면에 상부 랜드를 형성하는 캐리어 제거 단계를 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 11 항에 있어서,상기 반도체 다이 연결 및 상부 솔더볼 형성 단계는접착부재를 이용해 상기 제 1 반도체 다이를 상기 서브스트레이트의 상부에 부착시키고, 도전성 와이어를 이용해 상기 도전성 패턴과 전기적으로 연결시키는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 18 항에 있어서,상기 반도체 다이 연결 및 상부 솔더볼 형성 단계는접착부재를 이용해 제 2 반도체 다이를 상기 제 1 반도체 다이의 상부에 부착시키고, 도전성 와이어를 이용해 상기 도전성 패턴과 전기적으로 연결시키는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 17 항에 있어서,상기 캐리어 접합 단계는상기 회로 패턴을 도전성 물질로 형성하고, 상기 캐리어를 상기 회로 패턴과 다른 재질로 형성하여 준비하는 과정을 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 20 항에 있어서,상기 캐리어 제거 단계는 식각 공정에 의해 이루어지는 것을 특징으로 하는 반도체 패키지의 제조 방법.
- 제 17 항에 있어서,상기 서브스트레이트의 하부에 하부 솔더볼을 형성하여, 상기 하부 랜드와 전기적으로 연결시키는 하부 솔더볼 형성 단계를 더 포함하는 것을 특징으로 하는 반도체 패키지의 제조 방법.
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