KR20100060973A - Space transformer, probe card having space transformer, and method for manufacturing space transformer - Google Patents

Abstract

PURPOSE: A space transformer and a probe card having a space are provided to reduce a manufacture time and improve production yield by bonding each layers without additional bonding processes. CONSTITUTION: A penetration hole is formed in a substrate body(311). A probe is mounted in a patterned substrate(310) including an interconnection element. A first conductive pattern(331) is directly connected to the interconnection element. A first rinse layer(332) forms a first opening(332a) exposing a part of the first conductive pattern. A first layer(330) comprises a first connector(333) connected to the first conductive pattern. The second conductive pattern(341) is located on the first layer.

Description

SPACE TRANSFORMER, PROBE CARD HAVING SPACE TRANSFORMER, AND METHOD FOR MANUFACTURING SPACE TRANSFORMER

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a space transducer, and more particularly, to a space transducer used for a probe card capable of inspecting an object to be inspected, such as a semiconductor wafer, a probe card including a space transducer, and a manufacturing method of a space transducer.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for highly integrated semiconductor chips increases, circuit patterns formed on the wafer by the fabrication process become highly integrated, whereby the spacing between adjacent contact pads, that is, the pitch, is very narrow. .

In order to inspect such fine pitch contact pads, a space transformer is used that performs the function of pitch conversion between the probe of the probe card and the printed circuit board.

Hereinafter, a conventional probe card will be described with reference to FIG. 1.

1 is a cross-sectional view of a conventional probe card with a space transducer.

As shown in FIG. 1, a conventional probe card 10 includes a printed circuit board 11, an interposer 12, a space converter 13, and a probe 14.

The printed circuit board 11 includes a circuit pattern (not shown) and a board pad 11a formed for an inspection process, and receives and transmits an electrical signal applied from a tester (not shown) to the probe 14. Do this.

The interposer 12 is connected to the substrate pad 11a of the printed circuit board 11 to electrically connect the printed circuit board 11 and the space converter 13.

The space converter 13 is formed on the bottom surface and has a distance (pitch) between the first terminals 13a facing each other, and is formed to be narrower than the distance (pitch) between the second terminals 13b facing each other. Performs the function of pitch conversion.

In addition, the space converter 13 is formed of a multi-layer ceramic substrate (MLC) including a plurality of ceramic substrates by bonding a plurality of ceramic substrates on which a conductive pattern is formed to each other by a sintering process. The electrical signal received from the printed circuit board 11 is transmitted to the probe 14 by the conductive pattern formed in the layer.

The probe 14 is directly connected to the second terminal 13b of the space transducer 13.

As described above, since the conventional space converter 13 is formed of a plurality of ceramic substrates having conductive patterns, the manufacturing cost increases, and thus, the manufacturing cost of the probe card 10 increases. .

In addition, since the conventional space converter 13 forms a plurality of ceramic substrates having a conductive pattern and then joins and manufactures each ceramic substrate by a sintering process, there is a problem that the manufacturing time is long and the production yield is low.

In the conventional space converter 13, deformation of each ceramic substrate occurs due to a high temperature environment during the sintering step in the sintering step of bonding each ceramic substrate, or deformation of the conductive pattern formed on each ceramic substrate. There is a problem in that the flatness of the probe 14 connected to the space transducer 13 is generated due to a defect in the self flatness of the space transducer 13 due to the failure.

In addition, since the conventional space transducer 13 joins each ceramic substrate by a sintering process, the size of the space transducer 13 is increased in order to inspect a large-area to-be-tested object, such as a large area semiconductor wafer. When the ceramic substrate located is large in area, it is difficult to join the large area ceramic substrates to each other because it is difficult to join the central regions of neighboring large-area ceramic substrates by the sintering process.

One embodiment of the present invention is to solve the above-described problems, it is an object of the present invention to provide a space transducer, a probe card including a space transducer and a method of manufacturing a space transducer that can reduce the manufacturing cost.

Another object of the present invention is to provide a space transducer, a probe card including a space transducer, and a method of manufacturing the space transducer, which can reduce manufacturing time and improve manufacturing yield.

It is also an object of the present invention to provide a space transducer, a probe card including the space transducer, and a method of manufacturing the space transducer which can improve the self flatness.

Another object of the present invention is to provide a space transducer, a probe card including a space transducer, and a manufacturing method of the space transducer, which can be formed in a large area for inspecting a large-area subject.

As a technical means for achieving the above-described technical problem, the first aspect of the present invention is a space transducer for a probe card including a probe, the substrate body portion is formed in the through hole and a portion is located in the through hole A pattern substrate including an interconnecting element protruding from the substrate body portion, to which the probe is mounted, a first conductive pattern located on the pattern substrate and directly connected to the interconnecting element, A first layer including a first resin layer having a first opening that exposes at least a portion of the first conductive pattern, and a first connection part disposed in the first opening and connected to the first conductive pattern; A second conductive pattern extending in a surface direction in direct connection with the first connection portion, the second conductive pattern being positioned on the first layer A space converter including a second resin layer having a second opening to expose at least a portion of the second conductive pattern, and a second layer including a second connection portion disposed in the second opening and connected to the second conductive pattern To provide.

The second layer may be repeatedly formed to include a multilayer conductive pattern.

Each of the interconnection element and the second connection part may be formed in the pattern substrate and the second layer, respectively, and the distance between the neighboring interconnection element and the neighboring second connection part may be different from each other.

The display device may further include an insulation layer positioned between the pattern substrate and the first layer.

In addition, a second aspect of the present invention provides a method of manufacturing a space transducer for a probe card including a probe, the method comprising the steps of: (a) providing a substrate; (b) a first conductive pattern on the substrate; A first layer including a first resin layer formed on the first resin layer and exposing at least a portion of the first conductive pattern, and a first connection part disposed on the first opening and connected to the first conductive pattern; Forming (c) a second conductive pattern directly connected to the first connecting portion and extending in a plane direction on the first layer, and at least a portion of the second conductive pattern positioned on the first layer; Forming a second layer comprising a second resin layer having an exposed second opening and a second connecting portion positioned in the second opening and connected to the second conductive pattern; and (d) from the substrate, One A substrate main body portion having a through hole corresponding to the previous pattern, and an interconnection element positioned at a portion of the through hole and directly connected to the first conductive pattern and protruding from the substrate main body portion to mount the probe; It provides a method of manufacturing a space converter comprising the step of forming a patterned substrate.

Step (c) may be repeated to form a multilayer conductive pattern.

In each of the steps (c) and (d), a plurality of the second connection parts and the interconnection elements are formed in the second layer and the pattern substrate, respectively, and are adjacent to the gap between the adjacent second connection parts. The spacing of the interconnection elements can be different from each other.

The method may further include forming an insulating layer on the substrate to be positioned between the substrate and the first layer.

In the step (b), forming a first conductive layer on the substrate, forming a first photoresist pattern corresponding to the first conductive pattern on the first conductive layer, the first photoresist pattern Etching the first conductive layer to form the first conductive pattern by using a mask, forming a first resin film on the substrate, and forming a first resin film on the first resin film. Forming a second photoresist pattern, etching the first resin film using the second photoresist pattern as a mask to form a first resin layer having the first opening, and forming a first conductive layer in the first opening The method may include filling the material and forming the first connection part by removing a portion positioned on the first resin layer.

Step (c) is a step of forming a second conductive layer on the first layer, forming a third photoresist pattern corresponding to the second conductive pattern on the second conductive layer, the third photo Etching the second conductive layer to form the second conductive pattern by using a resist pattern as a mask, forming a second resin film on the first layer, and forming the second opening on the second resin film. Forming a fourth photoresist pattern corresponding to and forming a second resin layer having the second opening by etching the second resin film using the fourth photoresist pattern as a mask. The method may include filling the second conductive material with the second conductive material and removing the portion positioned on the second resin layer to form the second connection portion.

In the step (d), forming a fifth photoresist pattern corresponding to the through hole on the substrate facing the first layer, and etching the substrate by using the fifth photoresist pattern as a mask. Forming the through hole exposing a first conductive pattern, filling a third conductive material in the through hole, and removing a portion located on the substrate facing the first layer to form the interconnect element. And etching the substrate so that the thickness of the substrate becomes thin.

The method may further include overturning the substrate such that the substrate on which the first layer and the second layer are formed is positioned on the substrate.

In addition, a third aspect of the present invention provides a probe card including a probe, comprising: a substrate main body having a through hole formed therein; A pattern substrate including a connection element, a first conductive pattern on the pattern substrate and directly connected to the interconnect element, a first opening on the pattern substrate and exposing at least a portion of the first conductive pattern A first layer including a formed first resin layer and a first connecting portion positioned in the first opening and connected to the first conductive pattern, and positioned on the first layer and directly connected to the first connecting portion in a plane direction; An extended second conductive pattern, a second opening formed on the first layer and having a second opening exposing at least a portion of the second conductive pattern; A space transducer including a resin layer and a second layer disposed in the second opening and including a second connection portion connected to the second conductive pattern, and the space transducer to face the probe; Provided is a probe card including a printed circuit board including a terminal connected to a connection portion.

The space converter may include a multilayer conductive pattern by repeatedly forming the second layer.

The interconnection element and the second connection part may be formed in plural on the pattern substrate and the second layer, respectively, and the distance between the neighboring interconnection element and the neighboring second connection portion may be different from each other.

According to one of the problem solving means of this invention mentioned above, since each layer is formed including a resin layer, there exists a technical effect that manufacturing cost is reduced.

In addition, since each layer is bonded without performing a separate bonding process, there is a technical effect that the production time is reduced and the production yield is improved.

In addition, since each layer does not perform a separate bonding process, there is a technical effect of improving its flatness.

In addition, since each layer does not perform a separate bonding process, there is a technical effect that can be formed in a large area for inspecting a large-area subject.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Throughout the specification, when a member is located “on” another member, this includes not only when one member is in contact with another member but also when another member exists between the two members. In addition, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated.

Hereinafter, a space converter and a probe card including the same according to an embodiment of the present invention will be described with reference to FIG. 2.

2 is a cross-sectional view of a space converter and a probe card including the same according to an embodiment of the present invention.

As shown in FIG. 2, the probe card 1000 according to an exemplary embodiment includes a printed circuit board 100, an interposer 200, a space converter 300, and a probe 400.

The printed circuit board 100 is formed in a substantially disk shape and includes a probe circuit pattern (not shown) and a terminal 110 connected to the probe circuit pattern (not shown) for an inspection process. The printed circuit board 100 may be connected to a computer for an inspection process. The probe circuit pattern (not shown) is connected to the terminal 110 formed on the lower surface of the printed circuit board 100. The interposer 200 is connected to the terminal 110.

The interposer 200 serves to connect the printed circuit board 100 and the space converter 300, and the second terminal of the terminal 110 of the printed circuit board 100 and the space converter 300 to be described later. The connection between the connecting portion 343. The space converter 300 is positioned to face the printed circuit board 100 with the interposer 200 therebetween.

The space converter 300 includes a pattern substrate 310, an insulating layer 320, a first layer 330, and a second layer 340.

The pattern substrate 310 faces the probe 400 and includes a substrate body 311 and an interconnect element 312.

The substrate main body 311 may be formed from a double side polished silicon wafer, and includes a through hole 311a formed through the substrate main body 311 in correspondence to the probe 400. do. A part of the interconnection element 312 is located in the through hole 311a, and one surface of the substrate main body 311 facing the probe 400 has a step with an end exposed to the outside of the interconnection element 312. It is coming true.

The interconnection element 312 is partially located in the through hole 311a and protrudes from the substrate body 311 toward the probe 400. One end of the protruding interconnect element 312 is mounted with a probe 400, and the other end of the interconnect element 312 is connected with the first conductive pattern 331 of the first layer 330. The insulating layer 320 is positioned on the pattern substrate 310.

The insulating layer 320 is formed of silicon oxide (SiOx), silicon nitride (SiNx), or the like, and serves as a layer for preventing a short circuit between the first layer 330 and the pattern substrate 310. The first layer 330 is positioned on the pattern substrate 310 with the insulating layer 320 interposed therebetween.

The first layer 330 is disposed between the pattern substrate 310 and the second layer 340, and is bonded to the pattern substrate 310 and the second layer 340. The first conductive pattern 331 and the first layer 330 are bonded to each other. The resin layer 332 and the first connection part 333 are included.

The first conductive pattern 331 is made of a conductive material such as titanium (Ti) and copper (Cu) and extends in a plane direction. The first conductive pattern 331 is directly connected to the interconnect element 312 and the first connector 333 to electrically connect between the interconnect element 312 and the first connector 333 and at the same time the first connector 333. ) To interconnect element 312.

The pitch here refers to the spacing between neighboring interconnect elements 312 and the spacing between neighboring first connections 333.

The first resin layer 332 is positioned on the pattern substrate 310 with the first conductive pattern 331 interposed therebetween, and includes a first opening 332a exposing a portion of the first conductive pattern 331. . The first connection part 333 is positioned in the first opening part 332a.

The first connector 333 is positioned in the first opening 332a and is directly connected to the first conductive pattern 331 and the second conductive pattern 341 of the second layer 340. The first connection 333 is electrically connected to the interconnection element 312 on which the probe 400 is mounted.

The second layer 340 is disposed on the first layer 330 and adhered to the first layer 330, and the second conductive pattern 341, the second resin layer 342, and the second connection portion 343 are disposed on the first layer 330. It includes.

The second conductive pattern 341 is made of a conductive material such as titanium and copper and extends in the plane direction. The second conductive pattern 341 is directly connected to the first connecting portion 333 and the second connecting portion 343 to electrically connect between the first connecting portion 333 and the second connecting portion 343 and at the same time, the second connecting portion 343. ) To the first connector 333 to perform the function of pitch conversion.

Here, the pitch refers to the distance between the neighboring second connecting portions 343 and the distance between the neighboring second connecting portions 343.

The second resin layer 342 is positioned on the first layer 330 with the second conductive pattern 341 interposed therebetween, and includes a second opening 342a exposing a portion of the second conductive pattern 341. do. The second connecting portion 343 is positioned in the second opening 342a.

The second connector 343 is positioned in the second opening 342a to be directly connected to the second conductive pattern 341 and the interposer 200. The second connector 343 is electrically connected to the interconnecting element 312 and the interposer 200 on which the probe 400 is mounted.

As described above, the space converter 300 according to an exemplary embodiment of the present invention is connected to a probe circuit pattern (not shown) of the printed circuit board 100 to connect the second connection portion 343 to the interconnect element 312. Perform pitch conversion. In other words, the spacing of neighboring interconnect elements 312, the spacing of neighboring first connectors 333, and the spacing of neighboring second connectors 343 are different from each other.

In another embodiment, the space converter 300 may include a plurality of second layers 340 to include an Nth layer, and include a multilayer conductive pattern by a combination of the first layers 330 to Nth layers. It can perform the function of pitch conversion.

The probe 400 is mounted on the interconnection element 312 and connected to the probe circuit pattern (not shown) of the printed circuit board 100 through the space converter 300, and is applied to the inspected object such as a semiconductor wafer during the inspection process. The electrical signal passing through the space converter 300 from the printed circuit board 100 in contact with the formed contact pads is transmitted to the contact pads of the object under test, or serves to receive the electrical signal through the object under test.

In another embodiment, the interconnect element 312 of the space converter 300 without the interposer 200 is directly connected with the terminal 110 of the printed circuit board 100 to allow the space converter ( The connection between 300 and the printed circuit board 100 may be performed, in which case the interconnect element 312 is positioned corresponding to the terminal 110 of the printed circuit board 100, and the second connection 343 is It is located in correspondence with the probe 400. That is, the interconnection element 312 is connected to the terminal 110 of the printed circuit board 100 and the probe 400 is mounted to the second connection portion 343.

Hereinafter, a method of manufacturing a space converter according to an embodiment of the present invention will be described with reference to FIGS. 3 to 15.

3 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention, and FIGS. 4 to 15 are views illustrating a method of manufacturing a space converter according to an embodiment of the present invention.

First, as illustrated in FIGS. 3 and 4, a substrate 710 is prepared (S100).

Specifically, an insulating substrate 710 on which both surfaces are polished, such as a silicon wafer polished on both sides, is provided.

Next, an insulating layer 320 is formed on the substrate 710 (S200).

Specifically, the substrate 710 is exposed to a nitrogen environment or an oxygen environment to form an insulating layer 320 made of an insulating material such as silicon oxide or silicon nitride on the substrate 710.

Next, as shown in FIGS. 4 to 8, the first layer 330 is formed (S300).

Hereinafter, the process of forming the first layer 330 will be described in detail.

First, as shown in FIG. 4, the first conductive layer 720 made of one or more of copper, titanium, and the like using a sputtering process or the like on the substrate 710 with the insulating layer 320 interposed therebetween. To form.

Next, after forming a photoresist layer made of a photoresist material on the first conductive layer 720 and aligning a mask having an image corresponding to the first conductive pattern 331 to be formed later on the photoresist layer, The photoresist layer is exposed by irradiating ultraviolet rays or the like to the photoresist layer through the mask. The exposed photoresist layer is developed using a developer after exposure to form a first photoresist pattern 730 corresponding to the first conductive pattern 331. In this case, a portion to be formed of the first conductive pattern 331 is covered by the first photoresist pattern 730.

Next, as shown in FIG. 5, the first conductive layer 720 is etched by using a wet etching process or a dry etching process using the first photoresist pattern 730 as a mask to form a first layer from the first conductive layer 720. The conductive pattern 331 is formed.

Next, as shown in FIG. 6, after the first photoresist pattern 730 is removed using an ashing process or a lift off process, the substrate is disposed so as to sandwich the first conductive pattern 331. A first resin film 740 is formed on 710.

Next, a photoresist layer made of a photoresist material is formed on the first resin film 740, and a mask having an image corresponding to the first openings 332a to be formed later on the photoresist layer is aligned. The photoresist layer is exposed by irradiating ultraviolet rays or the like to the photoresist layer through a mask. The exposed photoresist layer is developed using a developing solution after exposure to form a second photoresist pattern 750 corresponding to the first opening 332a. In this case, a portion to be formed by the first opening 332a is exposed by the second photoresist pattern 750.

Next, as shown in FIG. 7, the first resin film 740 is etched by using a wet etching process or a dry etching process using the second photoresist pattern 750 as a mask to form the first resin film 740. The first resin layer 332 having the openings 332a is formed.

Next, the first conductive material 760 is filled in the first opening 332a using a plating process using the first conductive pattern 331, a pasting process using a coating apparatus, or a sputtering process. In this case, the first conductive material 760 may also be formed on the first opening 332a.

Next, as shown in FIG. 8, a portion of the first conductive material 760 and the second photoresist pattern 750 which are portions positioned on the first resin layer 332 using a mechanical polishing process or a chemical polishing process. ) Is removed from the first resin layer 332 to form the first connecting portion 333.

The first layer 330 is formed by the above process.

Next, as shown in FIGS. 8 to 11, the second layer 340 is formed (S400).

Hereinafter, the process of forming the second layer 340 will be described in detail.

First, as shown in FIG. 8, a second conductive layer 770 made of one or more of copper, titanium, and the like is formed on the first layer 330 by using a sputtering process.

Next, after forming a photoresist layer made of a photoresist material on the second conductive layer 770, aligning a mask having an image corresponding to the second conductive pattern 341 to be formed later on the photoresist layer, The photoresist layer is exposed by irradiating ultraviolet rays or the like to the photoresist layer through the mask. The exposed photoresist layer is developed using a developer after exposure to form a third photoresist pattern 780 corresponding to the second conductive pattern 341. In this case, a portion to be formed of the second conductive pattern 341 is covered by the third photoresist pattern 780.

Next, as shown in FIG. 9, the second conductive layer 770 is etched by using a wet etching process or a dry etching process using the third photoresist pattern 780 as a mask to form a second layer from the second conductive layer 770. A conductive pattern 341 is formed.

Next, after the third photoresist pattern 780 is removed using an etching process or a lift-off process, a second resin film 790 is disposed on the first layer 330 so as to sandwich the second conductive pattern 341. Form.

Next, a photoresist layer made of a photoresist material is formed on the second resin film 790, and a mask having an image corresponding to the second openings 342a to be formed later on the photoresist layer is aligned. The photoresist layer is exposed by irradiating ultraviolet rays or the like to the photoresist layer through a mask. The exposed photoresist layer is developed using a post-exposure developer to form a fourth photoresist pattern 810 corresponding to the second opening 342a. In this case, a portion to be formed by the second opening 342a is exposed by the fourth photoresist pattern 810.

Next, as shown in FIG. 10, the second resin film 790 is etched by using a wet etching method or a dry etching process using the fourth photoresist pattern 810 as a mask to form the second resin film 790 from the second resin film 790. The second resin layer 342 having the openings 342a is formed.

Next, the second opening 342a is formed in the second opening 342a using a plating process using the first conductive part 331, the first connection part 333, and the second conductive pattern 341, or a pasting process or a sputtering process using the coating device. Fill the conductive material 820. In this case, the second conductive material 820 may also be formed on the second opening 342a.

Next, as shown in FIG. 11, a portion of the second conductive material 820 and a fourth photoresist pattern 810, which are portions located on the second resin layer 342 using a mechanical polishing process or a chemical polishing process. ) Is removed from the second resin layer 342 to form the second connecting portion 343.

The second layer 340 is formed by the above process.

In another embodiment, the spatial transducer 300 has a plurality of second layers 340 formed therein so as to be multi-layer conductive by a combination of the first layers 330 to Nth layer, including the first layers 330 to Nth layer. The process of forming the second layer 340 may be repeated to include the pattern.

Next, as shown in FIG. 12, the substrate 710 is flipped over (S500).

Specifically, the first layer 330 and the second layer 340 are inverted so that the substrate 710 is positioned on the upper side.

Next, as shown in FIGS. 12 to 15, the pattern substrate 310 is formed (S600).

Hereinafter, the process of forming the pattern substrate 310 will be described in detail.

First, as shown in FIG. 12, a photoresist layer made of a photoresist material is formed on one surface of the substrate 710 facing the first layer 330 with the substrate 710 therebetween, and the photoresist layer After aligning a mask having an image corresponding to the through hole 311a to be formed later on the photoresist layer, the photoresist layer is exposed by irradiating ultraviolet rays or the like to the photoresist layer through the mask. The exposed photoresist layer is developed using a developer after exposure to form a fifth photoresist pattern 910 corresponding to the through hole 311a. In this case, a portion to be formed through the through hole 311a is exposed by the fifth photoresist pattern 910.

Next, as shown in FIG. 13, the substrate 710 and the insulating layer 320 pass through the substrate 710 and the insulating layer 320 using a wet etching process or a dry etching process using the fifth photoresist pattern 910 as a mask. The through hole 311a exposing the first conductive pattern 331 of the first layer 330 is formed by etching the 320.

Next, the third conductive material 920 is filled in the through hole 311a by using a plating process using the first conductive pattern 331, a pasting process using a coating apparatus, or a sputtering process. In this case, the third conductive material 920 may also be formed on the through hole 311a.

Next, as shown in FIG. 14, a portion and a third portion of the third conductive material 920 which is a portion located on the substrate 710 facing the first layer 330 using a mechanical polishing process or a chemical polishing process. 5 photoresist pattern 910 is removed from substrate 710 to form interconnect element 312.

Next, as shown in FIG. 15, the substrate 710 is etched from the substrate 710 by etching the substrate 710 so that the thickness of the substrate 710 is thinned by using a wet etching process such as a dipping process using an etchant. 311 is formed. The formation of the substrate body portion 311 causes the interconnect element 312 to protrude from the substrate body portion 311.

The space converter 300 according to an exemplary embodiment of the present invention including the pattern substrate 310, the first layer 330, and the second layer 340 at the same time as the pattern substrate 310 is formed by the above process. Is prepared.

The probe 400 is mounted on the interconnection element 312 of the space converter 300 manufactured by the above-described process, and the terminal 110 of the printed circuit board 100 is connected to the second connection portion 343, or The terminal 110 of the printed circuit board 100 may be connected to the interconnect element 312 of the space converter 300 and the probe 400 may be mounted to the second connection 343.

As described above, in the method of manufacturing the space transducer, the probe card, and the space transducer according to the exemplary embodiment of the present invention, the first layer 330 and the second layer 340 of the space transducer 300 are made of a conductive pattern and a resin layer. As a result, the manufacturing cost is reduced compared to the space converter in which each layer is formed of a ceramic substrate.

In addition, since the pattern substrate 310, the first layer 330, and the second layer 340 of the space converter 300 are bonded without performing a separate bonding process, each layer is formed of a ceramic substrate. Compared to this, manufacturing time is reduced and manufacturing yield is improved.

In addition, the pattern substrate 310, the first layer 330, and the second layer 340 of the space transducer 300 are bonded without performing a separate bonding process, and the pattern substrate 310 is polished on both sides flat. Since it is formed from the silicon wafer, the self-flatness of the space transducer 300 is improved to improve the flatness of the probe 400 connected to the interconnect element 312 or the second connection 343.

In addition, since the pattern substrate 310, the first layer 330, and the second layer 340 of the space transducer 300 are bonded without performing a separate bonding process, a large area to be inspected can be examined. It is possible to form the space transformer 300 by the area.

In addition, because the spatial transducer 300 includes an interconnect element 312 which may itself serve as an interposer 200 for mounting the probe 400 or for connecting to the printed circuit board 100. There is no need for a separate interposer or a separate interconnecting element for mounting the probe 400 for the connection of the printed circuit board 100 and the space converter 300, thereby increasing the manufacturing cost of the probe card 1000. Savings.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention. Should be.

1 is a cross-sectional view of a conventional probe card with a space transducer,

2 is a cross-sectional view of a space converter and a probe card including the same according to an embodiment of the present invention;

3 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention.

4 to 15 are views for explaining a method of manufacturing a space converter according to an embodiment of the present invention.

Claims (15)

A spatial transducer used for a probe card comprising a probe, A pattern substrate comprising a substrate body portion having a through hole formed therein and an interconnection element positioned at a portion of the through hole and protruding from the substrate body portion to mount the probe thereon; A first conductive pattern disposed on the pattern substrate and directly connected to the interconnection element, a first resin layer formed on the pattern substrate, and having a first opening portion exposing at least a portion of the first conductive pattern and the first conductive pattern; A first layer disposed in a first opening and including a first connection part connected to the first conductive pattern; A second conductive pattern positioned on the first layer and directly connected to the first connection part and extending in a surface direction, and a second opening positioned on the first layer and exposing at least a portion of the second conductive pattern; A second layer including a formed second resin layer and a second connection part disposed in the second opening and connected to the second conductive pattern; Space converter comprising a. The method of claim 1, And the second layer is repeatedly formed to include a multilayer conductive pattern. The method of claim 1, The interconnection element and the second connection portion are each formed in plural on the pattern substrate and the second layer, Wherein the spacing of the neighboring interconnection elements and the spacing of the neighboring second connections are different from each other. The method of claim 1, And a dielectric layer positioned between the patterned substrate and the first layer. In the method of manufacturing a space transducer used for a probe card comprising a probe, (a) preparing a substrate, (b) a first conductive pattern on the substrate, a first resin layer formed on the substrate and having a first opening portion exposing at least a portion of the first conductive pattern, and in the first opening portion; Forming a first layer comprising a first connection portion connected to the conductive pattern, (c) a second conductive pattern directly connected to the first connecting portion and extending in a surface direction on the first layer, and a second positioned on the first layer and exposing a part or more of the second conductive pattern Forming a second layer including a second resin layer having an opening formed therein and a second connection portion disposed in the second opening and connected to the second conductive pattern; and (d) a portion of the substrate main body in which the through hole corresponding to the first conductive pattern is formed and a portion of the through hole are directly connected to the first conductive pattern and protruding from the substrate main body portion. Forming a patterned substrate including an interconnect element on which the probe is mounted Method of manufacturing a space converter comprising a. The method of claim 5, And repeating step (c) to form a multilayer conductive pattern. The method of claim 5, In each of (c) and (d), The second connection portion and the interconnection element are respectively formed in the plurality of the second layer and the pattern substrate, The spacing of the neighboring second connections and the spacing of the neighboring interconnection elements are different from each other. The method of claim 5, Forming an insulating layer on the substrate such that the insulating layer is positioned between the substrate and the first layer. The method of claim 5, In step (b), Forming a first conductive layer on the substrate, Forming a first photoresist pattern corresponding to the first conductive pattern on the first conductive layer, Etching the first conductive layer using the first photoresist pattern as a mask to form the first conductive pattern; Forming a first resin film on the substrate, Forming a second photoresist pattern corresponding to the first opening on the first resin film, Etching the first resin film using the second photoresist pattern as a mask to form a first resin layer having the first openings; Filling a first conductive material in the first opening; and Removing the portion positioned on the first resin layer to form the first connection portion Method of manufacturing a space converter comprising a. The method of claim 5, Step (c) is, Forming a second conductive layer on the first layer, Forming a third photoresist pattern corresponding to the second conductive pattern on the second conductive layer, Etching the second conductive layer using the third photoresist pattern as a mask to form the second conductive pattern; Forming a second resin film on the first layer, Forming a fourth photoresist pattern corresponding to the second opening on the second resin film, Etching the second resin film using the fourth photoresist pattern as a mask to form a second resin layer having the second opening; Filling a second conductive material in the second opening; and Removing the portion located on the second resin layer to form the second connection portion Method of manufacturing a space converter comprising a. The method of claim 5, In step (d), Forming a fifth photoresist pattern corresponding to the through hole on the substrate facing the first layer, Forming the through hole exposing the first conductive pattern by etching the substrate using the fifth photoresist pattern as a mask; Filling a third conductive material into the through hole; Removing the portion located on the substrate opposite the first layer to form the interconnect element; and Etching the substrate to form a thickness of the substrate to form the substrate body part Method of manufacturing a space converter comprising a. The method of claim 5, And overturning the substrate such that the substrate having the first layer and the second layer formed thereon is positioned on the substrate. A probe card comprising a probe, the probe card comprising: A pattern substrate comprising a substrate body portion having a through hole formed therein and an interconnection element positioned at a portion of the through hole and protruding from the substrate body portion to which the probe is mounted, the pattern substrate being located on the pattern substrate and being interconnected A first conductive pattern directly connected to the element, a first resin layer formed on the pattern substrate and having a first opening to expose at least a portion of the first conductive pattern, and the first conductive pattern located in the first opening A first conductive layer including a first connecting portion connected to the first layer and a second conductive pattern extending on a first surface in direct contact with the first connecting portion, the second conductive pattern being positioned on the first layer and A second resin layer having a second opening that exposes at least a portion of the second conductive pattern, and a second opening formed in the second opening and connected to the second conductive pattern; The space converter comprising a second layer comprising a second connecting portion, and A printed circuit board facing the probe with the space transducer interposed therebetween and having a terminal connected to the second connection portion Probe card comprising a. The method of claim 13, And the space transducer includes a multilayer conductive pattern in which the second layer is repeatedly formed. The method of claim 13, The interconnection element and the second connection portion are each formed in plural on the pattern substrate and the second layer, And the spacing of the neighboring interconnection elements and the spacing of the neighboring second connections are different from each other.

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