KR20100059130A - Apparatus for sensing substrate - Google Patents

Apparatus for sensing substrate Download PDF

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KR20100059130A
KR20100059130A KR1020080117789A KR20080117789A KR20100059130A KR 20100059130 A KR20100059130 A KR 20100059130A KR 1020080117789 A KR1020080117789 A KR 1020080117789A KR 20080117789 A KR20080117789 A KR 20080117789A KR 20100059130 A KR20100059130 A KR 20100059130A
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South Korea
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substrate
sensor
magnet
rotating member
contact
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KR1020080117789A
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Korean (ko)
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KR101071174B1 (en
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박우열
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에프엔에스테크 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus for sensing a substrate is provided to return a rotation unit to an original location using a magnetic force or an elastic force in a substrate unloading process. CONSTITUTION: A sensor(220) is fixed to one side of a body(210). A substrate contacting part contacting with one side of a substrate(S) is located on one side of a rotating unit(230). A sensing part is located on the other side of the rotating unit. The rotating unit rotates about the body to a horizontal direction. A returning unit returns the rotating unit to the original location. The returning unit is a magnet(232) included in the body and the rotating unit respectively.

Description

기판 감지장치{APPARATUS FOR SENSING SUBSTRATE}Substrate sensing device {APPARATUS FOR SENSING SUBSTRATE}

본 발명은 기판 감지장치에 관한 것으로서, 보다 상세하게는 기립상태로 이송하는 기판의 로딩상태를 매우 정확하게 감지할 수 있는 기판 감지장치에 관한 것이다. The present invention relates to a substrate sensing device, and more particularly, to a substrate sensing device capable of detecting a loading state of a substrate to be transferred to a standing state very accurately.

일반적으로 반도체나 평판디스플레이 패널을 제조하기 위하여는 웨이퍼 또는 유리 등의 기판에 다양한 처리를 하게 된다. 이 때, 상기 기판에 소정의 처리를 위하여 각 스테이지로 이송하거나 또는 이송하면서 공정을 수행하게 되는데, 이를 위해 기판 이송장치가 요구된다. Generally, in order to manufacture a semiconductor or flat panel display panel, various processes are performed on a substrate such as a wafer or glass. In this case, the substrate is transferred to each stage for a predetermined process or while the transfer is performed, the substrate transfer apparatus is required.

통상적으로 기판 이송장치는 기판을 수평상태로 이송하게 되는데, 이 경우, 기판의 폭만큼의 공간이 필요하므로 기판이 대형화되면서 설치면적 및 설치비가 증가되는 문제점이 있었다. In general, the substrate transfer apparatus transfers the substrate in a horizontal state. In this case, since the space is equal to the width of the substrate, there is a problem in that the installation area and the installation cost increase as the substrate is enlarged.

따라서 종래에도 기판을 수직 또는 수직으로부터 소정각도 기울어지게 기립시킨 상태에서 이송하는 방식이 개시되었는바, 도 1을 참조하여 종래 기립상태의 기판 이송장치(1)를 설명한다. Therefore, a method of transferring a substrate in a state where the substrate is vertically or vertically inclined at a predetermined angle has been disclosed. With reference to FIG.

도시된 바와 같이, 상면에 기판지지부(20)가 고정설치된 컨베이어밸트(10) 와, 상기 컨베이어밸트(10)를 구동하는 구동부(11)와, 기판(S)을 기립상태로 유지시키는 기립유지수단(미도시)로 구성된다. As shown, the conveyor belt 10 is fixed to the upper surface of the support substrate 20, the drive unit 11 for driving the conveyor belt 10, and standing holding means for maintaining the substrate (S) in the standing state (Not shown).

이와 같은 기판 이송장치에 기판이 이송되고 있는지 즉, 기판이 로딩상태를 감지하는 것은 매우 중요하다. 왜냐하면, 상기 기판 이송장치에 기판이 로딩여부 또는 로딩타임을 감지해야만 공정을 수행할 수 있고, 이송오류를 범하지 않을 수 있기 때문이다. 이를 위해 도 2a에 도시된 종래의 기판 감지장치(100) 등이 기판 이송장치의 일측에 구비된다. It is very important that the substrate is transferred to the substrate transfer apparatus, that is, the substrate is loaded. This is because the process can be performed only by detecting whether the substrate is loaded or loading time in the substrate transfer device, and the transfer error can be avoided. To this end, the conventional substrate sensing apparatus 100 illustrated in FIG. 2A is provided at one side of the substrate transfer apparatus.

도 2a를 참조하면, 수직으로 설치되는 몸체(110)와, 상기 몸체(110)의 일측에 고정설치되는 센서(120)와, 상기 몸체(110)에 수직방향으로 회동가능하게 축결합되는 회동부재(130)로 구성된다. Referring to FIG. 2A, a body 110 installed vertically, a sensor 120 fixedly installed at one side of the body 110, and a rotating member pivotally coupled to the body 110 in a vertical direction. It consists of 130.

상기 센서(120)는 자석을 감지하는 센서이고, 상기 회동부재(130)의 일측에는 상기 센서(120)가 감지할 수 있는 자석(132)이 구비되며, 타측에는 기립상태로 이송(로딩)되는 기판(S)의 저면에 접하여 구름접촉하는 롤러(133)가 구비된다. The sensor 120 is a sensor for detecting a magnet, one side of the rotating member 130 is provided with a magnet 132 that can be detected by the sensor 120, the other side is transferred (loaded) in a standing state A roller 133 is provided in contact with the bottom surface of the substrate S in rolling contact.

이와 같이 구성된 종래의 기판 감지장치(100)는 기판(S)이 이송되어 오면, 상기 롤러(133)에 기판의 두께면이 접하게 되고, 계속하여 기판이 이송되면 도 2b에 도시된 바와 같이, 상기 회동부재(130)는 축결합부(131)를 중심으로 수직방향으로 회동하게 된다. In the conventional substrate sensing device 100 configured as described above, when the substrate S is transferred, the thickness surface of the substrate is in contact with the roller 133, and when the substrate is continuously transferred, as shown in FIG. Rotating member 130 is rotated in the vertical direction about the shaft coupling portion 131.

이 상태에서는 상기 자석(132)이 센서(120)로부터 멀어지게 되어 상기 센서(120)가 감지하지 못하게 된다. 이 상태는 기판(S)이 이송(로딩)되고 있는 중임을 나타내는 것이다. In this state, the magnet 132 is moved away from the sensor 120 so that the sensor 120 does not detect. This state indicates that the substrate S is being transferred (loaded).

상기 기판(S)의 이송이 완료되어 기판 이송장치(1)로부터 언로딩되면, 상기 회동부재(130)는 자중에 의하여 반대방향으로 회전하여 원위치로 복귀하게 되는 것이다. When the transfer of the substrate (S) is completed and unloaded from the substrate transfer device 1, the rotating member 130 is rotated in the opposite direction by its own weight to return to the original position.

그러나 이와 같이 작동되는 종래의 기판 감지장치는 기판의 매우 얇은 두께면을 접촉하여야 반응하도록 구성되어 오작동 우려가 있다. However, the conventional substrate sensing device operated as described above is configured to react by touching a very thin thickness surface of the substrate, which may cause a malfunction.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 기립상태로 이송하는 기판의 로딩상태를 매우 정확하게 감지할 수 있는 기판 감지장치를 제공함에 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate sensing device that can accurately detect the loading state of the substrate to be transferred to the standing state.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 기판 감지장치는 몸체; 상기 몸체의 일측에 고정설치되는 센서; 및 일측에는 상기 기판과 접촉하는 기판접촉부가 형성되고, 타측에는 상기 센서가 감지하는 센서감지부가 구비되며, 상기 기판접촉부가 상기 기판에 접촉하면 상기 몸체에 대하여 수평방향으로 회동하도록 결합되는 회동부재;를 포함한다. In order to solve the above technical problem, the substrate detecting apparatus according to the present invention includes a body; A sensor fixedly installed at one side of the body; And a rotating member formed at one side thereof, the substrate contacting portion contacting the substrate, and the other side having a sensor detecting portion detected by the sensor. It includes.

또한 상기 기판접촉부는 이송되는 상기 기판과 구름접촉하는 롤러인 것이 바람직하다. In addition, the substrate contact portion is preferably a roller in contact with the substrate to be conveyed.

또한 상기 회동부재를 원위치로 복귀시키는 복귀수단이 더 구비되는 것이 바람직하다. In addition, it is preferable that the return means for returning the rotating member to its original position.

또한 상기 복귀수단은 상기 몸체 및 회동부재에 각각 구비되는 자석인 것이 바람직하다. In addition, the return means is preferably a magnet provided in the body and the rotating member, respectively.

또한 상기 자석은 다극 자석인 것이 바람직하다.In addition, the magnet is preferably a multipole magnet.

또한 상기 복귀수단은 상기 몸체 및 회동부재에 연결되는 탄성체인 것이 바람직하다. In addition, the return means is preferably an elastic body connected to the body and the rotating member.

또한 상기 센서는 자석감지센서인 것이 바람직하다. In addition, the sensor is preferably a magnetic sensor.

또한 상기 센서감지부는 자석이 구비되는 것이 바람직하다. In addition, the sensor detecting unit is preferably provided with a magnet.

또한 상기 센서는 수발광센서인 것이 바람직하다. In addition, the sensor is preferably a light emitting sensor.

본 발명에 따르면, 기립상태로 이송하는 기판의 로딩상태를 매우 정확하게 감지할 수 있는 효과가 있다. According to the present invention, there is an effect capable of detecting the loading state of the substrate to be transferred to the standing state very accurately.

또한 기판의 언로딩시 자력 또는 탄성에 의해 원위치로 복귀시킬 수 있게 된다. In addition, it is possible to return to the original position by the magnetic force or elasticity during unloading of the substrate.

이하, 첨부된 도면을 참조하여 본 발명에 의한 기판 감지장치의 구성 및 작동을 설명한다. Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of the substrate sensing apparatus according to the present invention.

도 3을 참조하면, 본 발명에 의한 기판 감지장치(200)는 수평상태로 설치되는 몸체(210)와, 상기 몸체(210)의 일측에 고정설치되는 센서(220)와, 상기 몸체(210)에 수평방향으로 회동하도록 결합되는 회동부재(230)로 구성된다. Referring to FIG. 3, the substrate detecting apparatus 200 according to the present invention includes a body 210 installed in a horizontal state, a sensor 220 fixed to one side of the body 210, and the body 210. Rotating member 230 is coupled to rotate in the horizontal direction.

상기 회동부재(230)는 수평방향으로 회동하도록 상기 몸체(210)에 축결합되며, 일측에는 기립상태로 이송(로딩)되는 기판(S)의 면과 구름접촉하는 롤러(233)가 구비되고, 타측에는 상기 센서(220)가 감지하는 센서감지부로서 자석(232)이 구비된다. 물론, 본 실시예에서 상기 센서(220)는 자석감지센서이다. The rotating member 230 is axially coupled to the body 210 to rotate in a horizontal direction, one side is provided with a roller 233 in contact with the surface of the substrate (S) to be transported (loaded) in an upright state, On the other side, a magnet 232 is provided as a sensor detecting unit sensed by the sensor 220. Of course, in this embodiment, the sensor 220 is a magnet sensor.

또한 상기 회동부재(230)와 몸체(210)는 이들의 축결합부(231) 주위에 자석(211)이 구비된다. 상기 자석(211,241)은 상호 인력 또는 척력에 의해 상기 회동 부재(230)를 원위치로 복귀시키는 기능을 한다. In addition, the rotating member 230 and the body 210 is provided with a magnet 211 around the shaft coupling portion 231. The magnets 211 and 241 function to return the pivot member 230 to its original position by mutual attraction or repulsive force.

도 4 및 도 5를 참조하여 본 실시예(200)의 작동상태를 설명한다. 4 and 5 will be described in the operating state of the present embodiment (200).

먼저, 도 4와 같이, 기판(S)의 이송(로딩) 전에는 센서(220)가 회동부재(230)의 자석(232)을 감지할 수 있도록 근접하게 위치한다. First, as shown in FIG. 4, before the transfer (loading) of the substrate S, the sensor 220 is located close to the magnet 232 of the rotation member 230.

이 상태에서 기판(S)이 이송(로딩)되어 오면 상기 기판(S)의 두께방향이 아닌 일면에 롤러(233)가 구름접촉하게 되고, 도 5와 같이, 계속하여 기판이 이송되면 상기 롤러(233)가 구름접촉하면서 상기 회동부재(230)는 축결합부(231)를 중심으로 수평방향으로 회동하게 된다. 이와 같이 롤러(233)가 기판(S)의 두께방향이 아닌 면에 접촉하기 때문에 접촉오류가 발생할 여지가 거의 없다. 이 상태에서는 상기 자석(232)이 센서(220)로부터 멀어지게 되므로, 상기 센서(220)는 자석(232)을 감지할 수 없다. 이와 같이 센서(220)가 자석(232)을 감지하지 못하는 경우에는 기판이 이송(로딩) 중이라는 것을 나타낸다.When the substrate S is transported (loaded) in this state, the roller 233 is brought into contact with the surface of the substrate S, not in the thickness direction, and as shown in FIG. 5, when the substrate is continuously transferred, the roller ( While the 233 is in contact with the cloud, the rotating member 230 rotates about the shaft coupling portion 231 in the horizontal direction. Thus, since the roller 233 contacts the surface other than the thickness direction of the board | substrate S, there is little room for a contact error. In this state, since the magnet 232 is moved away from the sensor 220, the sensor 220 cannot detect the magnet 232. As described above, when the sensor 220 does not detect the magnet 232, this indicates that the substrate is being transferred (loaded).

상기 기판(S)의 이송이 완료되어 언로딩되면, 상기 회동부재(230) 및 몸체(210)의 축결합부(231) 주위에 각각 구비되는 자석(211,241)의 인력 또는 척력의 작용으로 상기 회동부재(230)는 원위치로 복귀하게 된다. 따라서 상기 센서(220)는 회동부재(230)의 자석(232)을 감지하게 되고, 이 상태는 기판(S)이 언로딩되었다는 것을 나타낸다. When the transfer of the substrate (S) is completed and unloaded, the rotation by the action of the attraction or repulsive force of the magnets 211 and 241 provided around the shaft coupling portion 231 of the rotating member 230 and the body 210, respectively. The member 230 is returned to its original position. Therefore, the sensor 220 detects the magnet 232 of the rotation member 230, and this state indicates that the substrate S is unloaded.

도시된 바와 달리, 본 발명에 의한 기판 감지장치는 다양한 변형이 가능하다. 예를 들어 상기 센서와 자석 대신 수발광 센서나 기타 공지의 센서 및 센서감지부로 대체할 수 있다. 또한 회동부재의 원위치로의 복귀를 위한 자석 대신 탄성 체를 구비할 수도 있다. 예를 들어 양단이 회동부재와 몸체에 각각 연결되는 스프링으로 대체할 수 있는 것이다. Unlike the illustration, the substrate sensing apparatus according to the present invention can be variously modified. For example, it may be replaced by a light emitting sensor or other known sensors and sensor detection units instead of the sensors and magnets. It may also be provided with an elastic body instead of a magnet for returning the rotation member to its original position. For example, both ends can be replaced by springs connected to the rotating member and the body, respectively.

도 1은 종래 기판 이송장치를 나타낸 것이다. Figure 1 shows a conventional substrate transfer apparatus.

도 2a 및 도 2b는 종래 기판 감지장치를 나타낸 것이다. 2A and 2B show a conventional substrate sensing device.

도 3은 본 발명에 의한 기판 감지장치의 정면도를 나타낸 것이다. Figure 3 shows a front view of the substrate detecting apparatus according to the present invention.

도 4 및 도 5는 본 발명에 의한 기판 감지장치의 평면도를 나타낸 것이다. 4 and 5 show a plan view of the substrate sensing apparatus according to the present invention.

**도면의 주요부분에 대한 부호의 설명**** Description of the symbols for the main parts of the drawings **

200: 기판 감지장치 210: 몸체 200: substrate detection device 210: body

220: 센서 230: 회동부재220: sensor 230: rotating member

231: 결합부 232: 센서감지부231: coupling unit 232: sensor detection unit

233: 롤러 233: roller

Claims (9)

몸체;Body; 상기 몸체의 일측에 고정설치되는 센서; 및 A sensor fixedly installed at one side of the body; And 일측에는 상기 기판의 면과 접촉하는 기판접촉부가 형성되고, 타측에는 상기 센서가 감지하는 센서감지부가 구비되며, 상기 기판접촉부가 상기 기판에 접촉하면 상기 몸체에 대하여 수평방향으로 회동하도록 결합되는 회동부재;를 포함하는 것을 특징으로 하는 기판 감지장치.One side is formed with a substrate contact portion in contact with the surface of the substrate, the other side is provided with a sensor sensing unit for sensing the sensor, the rotating member is coupled to rotate in a horizontal direction with respect to the body when the substrate contact portion is in contact with the substrate Substrate sensing apparatus comprising a. 제1항에 있어서, The method of claim 1, 상기 기판접촉부는 이송되는 상기 기판의 면과 구름접촉하는 롤러인 것을 특징으로 하는 기판 감지장치. And the substrate contacting portion is a roller in contact with the surface of the substrate being conveyed. 제1항에 있어서,The method of claim 1, 상기 회동부재를 원위치로 복귀시키는 복귀수단이 더 구비되는 것을 특징으로 하는 기판 감지장치.And a return means for returning the pivot member to its original position. 제3항에 있어서,The method of claim 3, 상기 복귀수단은 상기 몸체 및 회동부재에 각각 구비되는 자석인 것을 특징으로 하는 기판 감지장치. The return means is a substrate sensing device, characterized in that the magnet provided on the body and the rotating member, respectively. 제4항에 있어서,The method of claim 4, wherein 상기 자석은 다극 자석인 것을 특징으로 하는 기판 감지장치. And the magnet is a multipole magnet. 제3항에 있어서,The method of claim 3, 상기 복귀수단은 상기 몸체 및 회동부재에 연결되는 탄성체인 것을 특징으로 하는 기판 감지장치. And the return means is an elastic body connected to the body and the rotation member. 제1항에 있어서,The method of claim 1, 상기 센서는 자석감지센서인 것을 특징으로 하는 기판 감지장치. The sensor is a substrate sensing device, characterized in that the magnet sensor. 제8항에 있어서,The method of claim 8, 상기 센서감지부는 자석이 구비되는 것을 특징으로 하는 기판 감지장치.And the sensor detecting unit is provided with a magnet. 제1항에 있어서,The method of claim 1, 상기 센서는 수발광센서인 것을 특징으로 하는 기판 감지장치.The sensor is a substrate sensing device, characterized in that the light emitting sensor.
KR1020080117789A 2008-11-26 2008-11-26 Apparatus for sensing substrate KR101071174B1 (en)

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