KR20100058970A - Probe card, test system for flexible printed circuit board comprising the same, and test method for flexible printed circuit board - Google Patents

Abstract

PURPOSE: A probe card, a test system for a flexible printed circuit board comprising the same, and a test method for the flexible printed circuit board are provided to improve test accuracy by detecting a short circuit and disconnection between the body and the flexible printed circuit board. CONSTITUTION: A probe card(100) comprises a main body member(120), a probe pin(160), and an ion purging unit. The probe pin is projected from the main body member. The probe pin detects the disconnection or short circuit of the flexible printed circuit board. The ion purging unit purges the ion from the flexible printed circuit board or the probe pin.

Description

Probe card, Test system for flexible printed circuit board comprising the same, and test method for flexible printed circuit board comprising the same, and test method for flexible printed circuit board}

The present invention relates to a probe card, an inspection system for a flexible printed circuit board including the same, and a method for inspecting a flexible printed circuit board, and more particularly, a probe card with improved inspection accuracy, and an inspection system for a flexible printed circuit board including the same. And a method for inspecting a flexible printed circuit board.

Recently, a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP), and the like have been in the spotlight.

These flat panel display devices require a screen display unit for displaying an image and a flexible printed circuit board for transmitting an electrical signal to the screen display unit, and such a flexible printed circuit board includes a plurality of fine wiring patterns.

If a disconnection or short circuit occurs in a plurality of fine wiring patterns, an operation error may also occur in a flat panel display device on which the flexible printed circuit board is mounted. Therefore, a disconnection or short circuit of the flexible printed circuit board may be performed using an inspection system including a probe card. Check for availability.

However, when foreign matter is present on the flexible printed circuit board, the accuracy of inspection of disconnection or short circuit of the flexible printed circuit board may be reduced, and excessive time may be required to check and remove the foreign matter present on the flexible printed circuit board. .

The problem to be solved by the present invention is to provide a probe card with improved inspection accuracy and reduced inspection time.

Another object of the present invention is to provide an inspection system for a flexible printed circuit board with improved inspection accuracy and reduced inspection time.

Another object of the present invention is to provide a method for inspecting a flexible printed circuit board with improved inspection accuracy and reduced inspection time.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Probe card according to an embodiment of the present invention for achieving the above object, a probe pin protruding from the main body portion to detect whether the flexible printed circuit board disconnection or short circuit, and the flexible printed circuit board Or ion purging means for purging ions on the probe pins.

An inspection system of a flexible printed circuit board according to an embodiment of the present invention for achieving the other object, the support system including a plate for seating the flexible printed circuit board, and a light source assembly disposed below the plate; And a main body portion, probe pins protruding from the main body portion to detect disconnection or short circuit of the flexible printed circuit board, and ion purging means for purging ions to the flexible printed circuit board or the probe pins.

According to another aspect of the present invention, there is provided a method of inspecting a flexible printed circuit board, the method including providing a support system including a plate on which a flexible printed circuit board is mounted, an insulating film, and the insulating film Arranging on the plate a flexible printed circuit board comprising a wiring pattern formed on the substrate and a foreign substance disposed on the insulating film, and the main body to detect whether the flexible printed circuit board is disconnected or short-circuited. Approaching a probe card including a probe pin formed to protrude from the portion, and a first ion purge hole formed through the main body, to approach an upper portion of the flexible printed circuit board, and purge ions through the first ion purge hole. And removing the foreign matter.

According to another aspect of the present invention, there is provided a method of inspecting a flexible printed circuit board, wherein the flexible printed circuit board having a wiring pattern is disposed on a support system including a plate and a light source assembly, and the flexible printed circuit board is disposed. Disposing a probe card including a probe pin on the circuit board; purging ions on the probe pin located on the flexible printed circuit board by using an ionizer; and moving the ionizer downward. Purging ions on the flexible printed circuit board and the wiring pattern, and contacting the probe pin with the wiring pattern to check for short circuits and disconnections.

Other specific details of the invention are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “made of” refers to a component, step, operation, and / or element that includes one or more other components, steps, operations, and / or elements. It does not exclude existence or addition.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, an inspection system of a flexible printed circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 7. 1 is a schematic diagram showing an inspection system of a flexible printed circuit board according to a first embodiment of the present invention.

Referring to FIG. 1, the inspection system of the flexible printed circuit board according to the present embodiment includes a tester unit 10, a probe card 100, a support system 200, an amplifier 300, an operation unit 400, and an output unit 500. ) May be included.

The tester unit 10 may include a power applying unit (not shown) for applying power to the probe card 100, a data transmitting / receiving unit (not shown) for transmitting and receiving data to be applied to the probe card 100, and the like. .

The data transmitter / receiver applies a current signal or a voltage signal to the probe card 100. The data transmitter / receiver may directly receive a voltage signal or a current signal output to the probe card 100 through the probe card 100 and the flexible printed circuit boards 1000, 1100, and 1200. In contrast, the current signal or the voltage signal applied to the probe card 100 is transmitted to the support system 200 via the flexible printed circuit boards 1000, 1100, and 1200, and amplified and received by the data transmission / reception unit. May be The probe card 100 and the support system 200 will be described in detail later.

The method of inspecting whether the flexible printed circuit boards 1000, 1100 and 1200 are open or short is performed by an inner lead of the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200. Inspection of disconnection of the short wiring patterns 1100 and 1200 that are not formed), inspection of the short circuit between the inner lead and the outer lead, and inspection of the disconnection between the inner lead and the outer lead. . In this embodiment, an inspection system of a flexible printed circuit board used for inspection of disconnection between an inner lead and an outer lead will be described as an example.

In the method of inspecting whether the flexible printed circuit boards 1000, 1100 and 1200 are disconnected or shorted, a signal applied from the tester unit 10 to the probe card 100 is transmitted to the flexible printed circuit boards 1000, 1100 and 1200. . The signal transmitted to the flexible printed circuit board 1000, 1100, 1200 may be delivered to the support system 200. The signal transmitted to the support system 200 is amplified by the amplifier 300. The amplifier 300 may include a preliminary amplifier (not shown) for removing noise and an amplifier (not shown) for amplifying the signal from which the noise is removed.

The signal transmitted to the amplifier 300 may be transmitted to the data transmitter / receiver of the tester unit 10 again. The signal transmitted to the data transmitter / receiver may be transmitted to the calculator 400. The calculation unit 400 calculates a deviation between the reference value and the transmitted signal by performing an operation on the transmitted signal. Subsequently, the value calculated by the calculator 400 may be displayed through the output unit 500 such as a monitor.

Hereinafter, the probe card included in the inspection system of the flexible printed circuit board according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4. 2 is a perspective view illustrating a probe card included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention. 3 is a cross-sectional view taken along the line AA ′ of the probe card of FIG. 2. 4 is a bottom perspective view of a probe card included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

2 to 4, the probe card 100 includes a probe pin 160 formed at one side of the main body 110 and a connector 130 formed at the other side of the main body 110.

The body portion 110 may be made of a rigid and lightweight material, for example aluminum. The material of the main body 110 is not limited thereto as long as it can maintain the outer shape of the probe card 100 and mount the connector 130 and the probe pin 160. The body portion 110 may be provided, for example, in a plate tyle to reduce the volume of the entire inspection system. The first fixing groove 120 may be formed in the main body 110 to fix the main body 110 to the conveying means.

The connector 130 is connected to an external power source and serves to apply an electrical signal to the probe pin 160. The connector 130 may be electrically connected to the probe pins 160 by the probe printed circuit board 140. An integrated circuit for applying a test signal to the probe pin 160 is mounted on the probe printed circuit board 140.

The cover part 150 is formed on the opposite side of the probe pin 160 to protect the integrated circuit and the probe pin 160 of the probe printed circuit board 140. Meanwhile, the cover part 150 also includes a first ion purge hole 170 to provide a passage through which ions are injected from the outside.

The probe pin 160 protrudes from the main body 110 to detect whether the flexible printed circuit board 1000, 1100, 1200 is disconnected or short-circuited. The probe pins 160 are disposed in a number corresponding to the number of wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200 to be inspected. In addition, the probe pin 160 is mounted on one surface of the main body 110 to correspond to the arrangement position of the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200. A plurality of probe pins 160 may be arranged in a line to form probe pin lines 165. The probe pin lines 165 may be arranged in parallel so that a plurality of flexible printed circuit boards 1000, 1100, and 1200 may be inspected at the same time. The probe printed circuit board 140 formed on one surface of the main body 110 may be formed of an elastic insulating member such as an elastic film. The probe pin 160 may be specifically mounted below the probe printed circuit board 140. Accordingly, even if the probe pins 160 are not horizontally aligned with the flexible printed circuit boards 1000, 1100 and 1200 or there is a height difference between the wiring patterns 1100 and 1200, when the external pressure is applied to the probe pins 160, each probe pin The 160 may all contact the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200, thereby reducing the inspection error. In addition, when the probe printed circuit board 140 does not have elasticity, a separate elastic film or the like is disposed on one surface of the main body unit 110, and the probe pins 160 are disposed on the elastic film so that the probe pins 160 Contact failure of the wiring patterns 1100 and 1200 may be reduced, and on the other hand, the probe pin 160 may be formed of an elastic body to reduce the contact failure.

The main body 110 has a first ion purge hole 170 formed through the main body 110 to purge ions to the flexible printed circuit boards 1000, 1100 and 1200. As described above, the first ion purge hole 170 may be formed to penetrate the cover 150 as well as the main body 110. The first ion purge hole 170 may be disposed on one side of the probe pin 160. A plurality of first ion purge holes 170 may be arranged in a line to form a first ion purge hole line 175. The first ion purge hole line 175 may be alternately disposed with the probe pin line 165 described above. The first ion purge hole 170 may be connected to an external ionizer through the first ion purge tube 180. The first ion purge hole 170 may purge ions emitted by the ionizer to the flexible printed circuit boards 1000, 1100, and 1200. Accordingly, foreign matter present on the flexible printed circuit boards 1000, 1100, and 1200 may be removed by an ion purge. In addition, as the ions are purged, static electricity existing on the flexible printed circuit boards 1000, 1100, and 1200 may be removed. Foreign matter and static electricity are removed through the first ion purge hole 170 and a signal is applied through the probe pin 160, thereby improving inspection accuracy. In addition, the inspection time can be shortened because a false bad signal is detected in the inspection system, thereby reducing the number of times that the inspection process is stopped. The ions injected through the first ion purge hole 170 may be, for example, an anion or a cation of argon or nitrogen in consideration of the stability of the flexible printed circuit boards 1000, 1100 and 1200 and the wiring patterns 1100 and 1200. have.

Hereinafter, a supporting system included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1, 5, and 6. 5 is an exploded perspective view illustrating a support system included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention. 6 is a cross-sectional view taken along line BB ′ of the support system of FIG. 5.

1, 5 and 6, the support system 200 of the present embodiment supports the flexible printed circuit boards 1000, 1100 and 1200 and irradiates light to the flexible printed circuit boards 1000, 1100 and 1200. Thereby improving inspection efficiency. The support system 200 may include an accommodating part 210, a plate 240, a light source assembly 280, 285, and 286, a vacuum applying hole 225a, and a second ion purge hole 225b.

The accommodating part 210 may provide an accommodating space 230 and may be fixed to a stage (not shown) of the inspection system through the second fixing groove 215. The plate 240 may be seated on an upper portion of the storage space 230, and light source assemblies 280, 285, and 286, which will be described later, may be accommodated in the storage space 230. To this end, a first seating end 230a and a second seating end 230b may be formed on the inner wall of the accommodating part 210. The plate 240 may be seated on the first seating end 230a, and the light source assemblies 280, 285, and 286 may be seated on the second seating end 230b. In addition, the storage space 230 may be evenly applied to the entire sides of the flexible printed circuit boards 1000, 1100 and 1200 without vacuum pressure or ion release being concentrated on specific portions of the flexible printed circuit boards 1000, 1100 and 1200. It can also serve to provide buffer space.

On the bottom or sidewall of the accommodating part 210 is formed a wire application groove 220a through which a wire (not shown) for transferring a signal applied to the sensor 260 mounted on the plate 240 to the tester unit 10 is introduced. Can be.

A vacuum applying hole 225a is formed on the bottom or sidewall of the accommodating part 210 to apply a vacuum pressure to the accommodating space 230. The vacuum applying hole 225a is connected to a vacuum pump (not shown) by a vacuum applying tube 275a and receives a vacuum pressure therefrom. A plurality of vacuum applying holes 225a are arranged to apply uniform vacuum pressure to the storage space 230 and to adsorb the flexible printed circuit boards 1000, 1100, and 1200 through the through holes 250 of the plate 240. Can be.

A second ion purge hole 225b is formed on the bottom or sidewall of the accommodating part 210 to purge the desorbed ions into the accommodating space 230. A plurality of second ion purge holes 225b may also be disposed to easily detach the flexible printed circuit boards 1000, 1100, and 1200. The second ion purge hole 225b may be connected to the ionizer by the second ion purge tube 275b. Desorption ions applied to the flexible printed circuit board through the second ion purge hole 225b may be, for example, argon ions or nitrogen ions. Detachable ions are blown to the flexible printed circuit boards 1000, 1100 and 1200 by using the second ion purge hole 225b to detach the flexible printed circuit boards 1000, 1100 and 1200 from the plate 240. When the printed circuit boards 1000, 1100 and 1200 are detached, sparks may be generated or wrinkles may be prevented from occurring in the flexible printed circuit boards 1000, 1100 and 1200. In other words, since the positive or negative ions are blown onto the flexible printed circuit boards 1000, 1100 and 1200 to remove static electricity present in the flexible printed circuit boards 1000, 1100 and 1200, spark generation may be reduced, and the adsorbed flexible Since the external force to be applied when the printed circuit boards 1000, 1100 and 1200 are detached is reduced, wrinkle occurrence of the flexible printed circuit boards 1000, 1100 and 1200 may be reduced.

The plate 240 may be seated on the first seating end 230a and may be fixed to the upper portion of the accommodating part 210 through the third and fourth fixing grooves 211 and 241. In the plate 240, a plurality of through holes 250 may be formed in, for example, a checkerboard shape. It is preferable that the through hole 250 is not formed in a portion where the sensor 260 is mounted so that the through hole 250 does not affect the sensor 260.

The through hole 250 provides a passage through which the vacuum pressure can be transferred to the flexible printed circuit boards 1000, 1100, and 1200 when the vacuum pressure is applied, thereby transferring the flexible printed circuit boards 1000, 1100, and 1200 to the plate 240. It serves to adsorb. In addition, the through hole 250 blows desorption ions to the lower portion of the flexible printed circuit boards 1000, 1100, and 1200 so that the flexible printed circuit boards 1000, 1100, and 1200 are easily detached from the plate 240. It plays a role.

The light source assemblies 280, 285, and 286 are mounted on the second seating end 230b and are mounted below the plate 240. The light source assemblies 280, 285, and 286 include a light source 280 and an alignment plate 285 on which the light source 280 is mounted. The light source 280 may be, for example, a point light source such as a light emitting diode (LED), a line light source such as a cold cathode fluorescent lamp (CCFL) or an external electrofluorescent lamp (EEFL).

The alignment plate 285 serves to support the light source 280. The reflector 286 formed to have an inclination along the edge of the alignment plate 285 allows the light emitted from the light source 280 to exit toward the plate 240. Accordingly, the loss of light emitted from the light source 280 can be reduced.

Light emitted from the light source assemblies 280, 285, and 286 is emitted toward the plate 240 disposed on the top of the light source assemblies 280, 285, and 286 to be present on the flexible printed circuit boards 1000, 1100, and 1200. Make sure that the foreign material can be checked with the naked eye.

Hereinafter, the operation of the inspection system according to the present embodiment will be described with reference to FIGS. 1 and 7. 7 is a schematic view showing a state in which a flexible printed circuit board is seated on an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

1 and 7, the flexible printed circuit boards 1000, 1100 and 1200 include an insulating film 1000 and wiring patterns 1100 and 1200 formed on the insulating film 1000. The insulating film 1000 may be made of, for example, an insulating material having a thickness of 20 to 100 μm. The base film 100 may be made of, for example, a polymer resin such as polyimide or polyester. The wiring patterns 1100 and 1200 may be made of a highly conductive material, for example, a metal such as gold, aluminum, or copper. The wiring patterns 1100 and 1200 may be formed of a first wiring pattern 1100 formed of an outer lead and an inner lead and a second wiring pattern 1200 facing and spaced apart from the first wiring pattern 1100. In the present embodiment, a disconnection C is generated between the inner lead and the outer lead of the first wiring pattern 1100 and the foreign material 1300 is described as an example. A driving integrated circuit (not shown) may be mounted in a space between the first wiring pattern 1100 and the second wiring pattern 1200.

The vacuum pressure applied to the storage space 230 through the vacuum application hole 225a is transmitted to the flexible printed circuit boards 1000, 1100, and 1200 through the through hole 250, and the vacuum pressure is applied to the flexible printed circuit board by the vacuum pressure. 1000, 1100 and 1200 are absorbed and fixed to the plate 240.

The light source assemblies 280, 285, and 286 are disposed in the storage space 230, and emit light to the plate 240 disposed thereon. Since the flexible printed circuit boards 1000, 1100, and 1200 are disposed on the plate 240, light emitted from the light source assemblies 280, 285, and 286 passes through the through hole 250 and the insulating film 1000. As a result, foreign matter present on the flexible printed circuit boards 1000, 1100 and 1200 may be visually detected while the flexible printed circuit boards 1000, 1100 and 1200 are adsorbed on the plate 240, thereby reducing inspection time. Can be.

By purging ions through the first ion purge hole 170 positioned in the probe card 100, foreign substances present in the flexible printed circuit boards 1000, 1100, and 1200 may be removed.

The probe pins 160 of the probe card 100 supplied with power from the tester unit 10 contact the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200 to apply a signal. On the other hand, the sensor of the support system 200 is in non-conctact with the wiring patterns (1100, 1200) of the flexible printed circuit board (1000, 1100, 1200), but in contact with the insulating film (1000) from the probe pin (160) The signal is passed through the flexible printed circuit board (1000, 1100, 1200).

When the inspection is finished or movement of the flexible printed circuit boards 1000, 1100 and 1200 is required, the flexible printed circuit board is blown by blowing ions into the flexible printed circuit boards 1000, 1100 and 1200 through the second ion purge hole 225b. It is also possible to easily detach (1000, 1100, 1200).

Hereinafter, an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention will be described in detail with reference to FIGS. 8 to 11. 8 is a perspective view illustrating a probe card included in an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention. 9 is a cross-sectional view taken along the line CC ′ of the probe card of FIG. 8. 10 is a bottom perspective view of a probe card included in an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention. FIG. 11 is a schematic view illustrating a flexible printed circuit board seated on an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention. In the following embodiments, the same reference numerals are used to designate the same elements as in the previous embodiment, and descriptions are omitted or simplified.

8 to 11, the inspection system of the flexible printed circuit board according to the present embodiment further includes a foreign matter suction hole 171b disposed in the probe card 101.

The foreign material suction hole 171b may be disposed to be adjacent to the first ion purge hole 171a. The foreign matter may not be removed by only the ion purge of the first ion purge hole 171a due to the size of the foreign matter being adsorbed on the flexible printed circuit boards 1000, 1100, and 1200. In this case, foreign matter remaining in the flexible printed circuit boards 1000, 1100, and 1200 may be removed by using the foreign matter suction hole 171b.

A plurality of foreign material suction hole 171b may be arranged in a line to form a foreign material suction hole line 175b, and a plurality of foreign material suction hole lines 175b may be arranged in parallel. The foreign material suction hole line 175b may be alternately disposed with the probe pin line 165. The foreign material suction hole line 175b, the first ion purge hole line 175a, and the probe pin line 165 may be sequentially disposed. One set of the foreign matter suction hole line 175b, the first ion purge hole line 175a, and the probe pin line 165 removes the foreign matter of one flexible printed circuit board 1000, 1100, and 1200, and disconnects or You can check for shorts. In this embodiment, a single probe card is used to remove foreign substances from three flexible printed circuit boards 1000, 1100, and 1200, and checks for disconnections or short circuits. However, the inspection system of the present embodiment is not limited thereto. no. The first ion purge hole 171a is connected to the first ion purge hole tube 181a, and the foreign material suction hole 171b is connected to the foreign material suction tube 181b to receive the purge ions and the suction pressure.

1, 7, and 12, a method of inspecting a flexible printed circuit board according to a third embodiment of the present invention will be described in detail. 12 is a flowchart illustrating a test method of a flexible printed circuit board according to a third exemplary embodiment of the present invention.

1, 7, and 12, a support system 200 including a plate 240 and light source assemblies 280, 285, and 286 is provided (S100).

The plate 240 may include a through hole 250, a vacuum applying hole 225a, and a second ion purge hole 225b to enable communication of vacuum pressure and ions. The light source assemblies 280, 285, and 286 are disposed under the plate 240 to emit light toward the plate 240.

Subsequently, the flexible printed circuit boards 1000, 1100, and 1200 including the foreign matter 1300 are disposed on the plate 240 (S200).

The flexible printed circuit boards 1000, 1100 and 1200 include an insulating film 1000, wiring patterns 1100 and 1200 formed on the insulating film 1000, and foreign matter 1300 positioned on the insulating film 1000. The wiring patterns 1100 and 1200 may include disconnection portions C. The plate 240 is seated on the accommodating portion 210 of the support system 200, and a vacuum application hole 225a for applying a vacuum pressure to the accommodating space 230 is formed on the bottom or sidewall of the accommodating portion 210. It is. Since the vacuum pressure is provided to the flexible printed circuit boards 1000, 1100 and 1200 through the accommodating portion 210 and the through-hole 250 through the vacuum applying hole 225a, the flexible printed circuit boards 1000, 1100 and 1200 may be separated. The plate 240 may be fixed by adsorption.

Subsequently, the light source assemblies 280, 285 and 286 are turned on and the presence of the foreign matter 1300 positioned on the insulating film 1000 is checked (S300).

Foreign matter present on the flexible printed circuit boards 1000, 1100, and 1200 may be visually identified by the light emitted from the light source assemblies 280, 285, and 286. Accordingly, there is no need to interrupt the inspection process to confirm the presence of foreign substances, and the inspection time can be shortened because the presence of foreign substances on the plate 240 can be confirmed without moving the flexible printed circuit boards 1000, 1100, and 1200. Can be.

Subsequently, the probe card 100 including the first ion purge hole 171a approaches the upper portion of the flexible printed circuit board (S400).

The position of the probe card 100 may be adjusted such that the position of the foreign matter detected in the previous step and the position of the first ion purge hole 171a correspond.

Subsequently, foreign substances are removed by purging ions through the first ion purge hole 171a (S500).

The foreign matter may be removed from the flexible printed circuit boards 1000, 1100, and 1200 by ions purged through the first ion purge hole 171a, for example, argon ions or nitrogen ions. In this case, the probe card 100 may include only the first ion purge hole 170 as in the first embodiment of the present invention, and similarly to the second embodiment, the probe card 100 may include the foreign material suction hole together with the first ion purge hole 171a. 171b may be provided. When the foreign matter suction hole 171b is provided, the foreign matter adsorbed on the large sized or flexible printed circuit boards 1000, 1100 and 1200 may be removed by applying a vacuum suction pressure to the foreign matter suction hole 171b.

Subsequently, power is applied to the probe card 100 from the tester unit 10, and the probe pins 160 of the probe card 100 are connected to the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200. Contact with. On the other hand, the sensor of the support system 200 is non-conctact with the wiring patterns 1100 and 1200 of the flexible printed circuit boards 1000, 1100 and 1200, but in contact with the insulating film 1000 to contact the probe pins 160. Receives a signal passing through the flexible printed circuit board (1000, 1100, 1200) from. The noise of the signal delivered to the support system 200 is then removed in the preamplifier and the noise canceled signal is amplified in the amplifier. Subsequently, the signal transmitted to the amplifier 300 is transmitted to the data transmitter / receiver and the calculator 400 of the tester unit 10 again. The calculation unit 400 calculates a deviation between the reference value and the transmitted signal by performing an operation on the transmitted signal. Accordingly, it is possible to check whether the flexible printed circuit boards 1000, 1100, and 1200 are shorted or disconnected. Subsequently, the value calculated by the calculator 400 is displayed through the output unit 500 such as a monitor. In this case, the inspection accuracy of the flexible printed circuit boards 1000, 1100, and 1200 is remarkably improved because foreign materials do not exist or are extremely insignificant on the flexible printed circuit boards 1000, 1100, and 1200 due to visual confirmation of the foreign matter and ion purging. Can be.

Subsequently, desorption ions are blown to the storage space 230 using the second ion purge hole 225b formed on the bottom or sidewall of the accommodating portion 210, and the desorption ions are blown through the through hole 250. The flexible printed circuit boards 1000, 1100 and 1200 may be detached from the plate 240 by applying to (1000, 1100, 1200). As a result, sparks or wrinkles can be prevented from occurring in the flexible printed circuit boards 1000, 1100, and 1200.

Hereinafter, a method of inspecting a flexible printed circuit board according to a fourth exemplary embodiment of the present invention will be described in detail with reference to FIGS. 13 to 15.

13 and 14, a flexible printed circuit board 1000 and 1100 having a wiring pattern 1100 formed on a support system 200 including a plate 240 and light source assemblies 280, 285, and 286. Next, the probe card 100 including the probe pins 160 is disposed on the flexible printed circuit boards 1000 and 1100 (S101).

The method may include fixing the flexible printed circuit boards 1000 and 1100 after placing the flexible printed circuit boards 1000 and 1100 on the support system 200. In this case, a vacuum pressure may be applied through the vacuum application and the ion purge hole 226. The vacuum pressure may be generated in the vacuum pump 276c and transferred to the storage space 230 through the vacuum application tube 276a, the vacuum application and ion purge tube 276, and the vacuum application and ion purge hole 226. On the other hand, the vacuum application and ion purge tube 276 of the present embodiment is also connected to the ion purge tube 276b, the ionizer for desorption ion generation when the disconnection or short-circuit inspection of the flexible printed circuit board is completed in a later step The insulating substrate 1000 may be detached from the plate 240 by blowing ions onto the insulating substrate 1000 using the 276d. In the present embodiment, only one vacuum application and one ion purge hole 226 may be formed in the storage space 230, and thus, vacuum pressure application or desorption ion blowing efficiency may be improved.

Next, referring to FIGS. 13 to 15, ions are purged from the probe pins 160 positioned on the printed circuit board 1000 using the ionizers 1170, 1180, and 1190 (S201). Accordingly, the foreign matter attached to the probe pin 160 may be removed to prevent an inspection error.

The ionizers 1170, 1180, and 1190 are connected to the vertical support 1190, the vertical support 1190, and the horizontal support 1180 and the ion support nozzle 1170 connected to the horizontal support 1180. It may include. The horizontal support 1180 is adjustable in length. Accordingly, the ion injection nozzle 1170 may be disposed in proximity to the foreign matter attached to the probe pin 160.

Subsequently, the ionizers 1170, 1180, and 1190 are moved downward to purge ions to the flexible printed circuit boards 1000 and 1100 and the wiring pattern 1100 (S301). The horizontal support 1180 may move upward or downward along the vertical support 1190. Thus, by moving the horizontal supporter 1180 downward, foreign matters formed on the flexible printed circuit boards 1000 and 1100 and the wiring pattern 1100 may also be removed to improve inspection efficiency. In this case, foreign matter attached to the probe pins 160 and falling and attached to the flexible printed circuit boards 1000 and 1100 and the wiring pattern 1100 may also be removed.

Subsequently, the probe pin 160 is contacted with the wiring patterns 1100 of the flexible printed circuit boards 1000 and 1100 to inspect the short circuit and disconnection of the wiring pattern 1100 (S401). This step may include checking the abnormality of the wiring pattern 1100 using the light sources of the light source assemblies 280, 285, and 286. For example, after visually determining whether the wiring pattern 1100 is abnormal using the light sources of the light source assemblies 280, 285, and 286, the wiring pattern of the flexible printed circuit boards 1000 and 1100 using the probe pin 160. The short circuit and the disconnection of 1100 can be checked.

Subsequently, the insulating substrate 1000 may be detached by releasing the contact between the probe pin 160 and the wiring pattern 1100 and blowing ions onto the insulating substrate 1000 using the deionizer ionizer ionizer 276d. Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that it can be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a schematic diagram showing an inspection system of a flexible printed circuit board according to a first embodiment of the present invention.

2 is a perspective view illustrating a probe card included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

3 is a cross-sectional view taken along the line AA ′ of the probe card of FIG. 2.

4 is a bottom perspective view of a probe card included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

5 is an exploded perspective view illustrating a support system included in an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

6 is a cross-sectional view taken along line BB ′ of the support system of FIG. 5.

7 is a schematic view showing a state in which a flexible printed circuit board is seated on an inspection system of a flexible printed circuit board according to a first exemplary embodiment of the present invention.

8 is a perspective view illustrating a probe card included in an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention.

9 is a cross-sectional view taken along the line CC ′ of the probe card of FIG. 8.

10 is a bottom perspective view of a probe card included in an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention.

FIG. 11 is a schematic view illustrating a flexible printed circuit board seated on an inspection system of a flexible printed circuit board according to a second exemplary embodiment of the present invention.

12 is a flowchart illustrating a test method of a flexible printed circuit board according to a third exemplary embodiment of the present invention.

13 is a flowchart illustrating a test method of a flexible printed circuit board according to a fourth exemplary embodiment of the present invention.

14 and 15 are schematic diagrams illustrating an inspection method of a flexible printed circuit board according to a fourth exemplary embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

10: tester unit 100, 101: probe card

110: first fixing groove 120: main body

130: connector 140: probe printed circuit board

150: cover portion 160: probe pin

165: probe pin lines 170 and 171a: first ion purge hole

171b: foreign material suction hole 175, 175a: first ion purge hole line

180, 181a: first ion purge hole tube

181b: Foreign material suction tube 175b: Foreign material suction hole line

200: support system 210: storage

215: second fixing groove 220a: wire applying groove

225a: vacuum application hole 225b: second ion purge hole

230: storage space 230a: first seating end

230b: second seating end 240: plate

250: through hole 260: sensor

275a: vacuum application tube 275b: second ion purge tube

280: light source 285: alignment plate

300: amplifier 400: calculator

500: output unit 1000: insulating film

1100: first wiring 1200: second wiring

1300: foreign matter

Claims (32)

Main body; A probe pin protruding from the main body to detect whether a flexible printed circuit board is disconnected or short-circuited; And And probe purging means for purging ions to the flexible printed circuit board or the probe pin. The method of claim 1, And the ion purge means is an ion purge hole formed through the body portion. 3. The method of claim 2, And a plurality of probe pins arranged in a line to form probe pin lines, and the probe pin lines are arranged in parallel. The method of claim 3, wherein And a plurality of the ion purge holes arranged in a row to form an ion purge hole line, wherein the ion purge hole line is alternately arranged with the probe pin line. The method of claim 3, wherein And a foreign material suction hole disposed adjacent to the ion purge hole. The method of claim 5, And a plurality of foreign matter suction holes arranged in a row to form a foreign substance suction hole line, and the foreign substance suction hole line is alternately arranged with the probe pin line. A support system comprising a plate for seating a flexible printed circuit board, and a light source assembly disposed below the plate; A probe pin protruding from the main body to detect whether the main body and the flexible printed circuit board are disconnected or shorted; And And an ion purging means for purging ions to the flexible printed circuit board or the probe pin. The method of claim 7, wherein And said ion purge means is a first ion purge hole formed through said body portion. The method of claim 7, wherein And the light source assembly emits light toward the flexible printed circuit board to detect the presence of foreign matter on the flexible printed circuit board seated on the plate. The method of claim 9, The light source assembly includes an alignment plate and an LED arranged on the alignment plate. The method of claim 10, And a reflector formed along an edge of the alignment plate. The method of claim 7, wherein The support system further includes a through hole formed in the plate, And the support system provides a vacuum pressure or desorption ions to the flexible printed circuit board through the through hole. The method of claim 7, wherein The support system further includes an enclosure in which the plate is seated and the light source assembly is received. And a vacuum application hole for applying a vacuum pressure to the storage portion and a second ion purge hole for providing detachable ions to the storage portion. The method of claim 13, The support system further includes a through hole formed in the plate, And a vacuum pressure or desorption ions applied to the housing through the vacuum applying hole or the second ion purge hole is provided to the flexible printed circuit board through the through hole. 15. The method of claim 14, And said ions are argon ions or nitrogen ions. The method of claim 7, wherein The flexible printed circuit board includes an insulating film and a wiring pattern formed on the insulating film, The probe pin is in contact with the wiring pattern of the flexible printed circuit board, And the support system includes a sensor which is in contact with the wiring pattern of the flexible printed circuit board but is in contact with the insulating film to receive a signal from the probe pin. The method of claim 16, A flexible printed circuit board further includes a tester unit applying a voltage to the probe pin, an amplifying unit amplifying a signal detected from the support system, a calculating unit calculating the amplified signal, and an output unit outputting the calculated signal. Inspection system. The method of claim 8, And a plurality of probe pins arranged in a line to form probe pin lines, and the probe pin lines are arranged in parallel. The method of claim 18, The plurality of first ion purge holes are arranged in a row to form a first ion purge hole line, and the first ion purge hole line is alternately arranged with the probe pin line. The method of claim 18, And a foreign material suction hole disposed adjacent to the first ion purge hole. The method of claim 20, The foreign matter suction hole is arranged in a plurality of lines to form a foreign material suction hole line, the foreign material suction hole line is alternately arranged with the probe pin line. Providing a support system comprising a plate for seating a flexible printed circuit board; Disposing a flexible printed circuit board including an insulating film, a wiring pattern formed on the insulating film, and a foreign material positioned on the insulating film on the plate; A probe card including a main body portion, a probe pin protruding from the main body portion to detect disconnection or short circuit of the flexible printed circuit board, and a first ion purge hole formed through the main body portion of the flexible printed circuit board; Approaching the top; And And purging the ions through the first ion purge hole to remove the foreign substances. 23. The method of claim 22, The support system further comprises a light source assembly disposed below the plate, And after the placing of the flexible printed circuit board on the plate, turning on the light source assembly and checking for the presence of foreign matter on the insulating film. The method of claim 22 or 23, The plate further includes a through hole, and disposing the flexible printed circuit board on the plate may provide a vacuum pressure to the flexible printed circuit board through the through hole to fix the flexible printed circuit board to the plate. A method for inspecting a flexible printed circuit board comprising the step of making. The method of claim 24, The support system further includes an enclosure in which the plate is seated and the light source assembly is received. The accommodating part is formed with a vacuum applying hole for applying a vacuum pressure to the accommodating part, And the vacuum pressure is provided to the flexible printed circuit board through the receiving portion and the through hole through the vacuum applying hole. 26. The method of claim 25, The housing further includes a second ion purge hole for providing ions to the housing, And detaching the flexible printed circuit board from the plate by blowing ions into the housing part. The method of claim 22 or 23, The support system further includes a sensor formed on the plate, after the foreign material removing step to contact the probe pin to the wiring pattern to apply a signal to the flexible printed circuit board, The sensor may further include detecting a short circuit or disconnection of the flexible printed circuit board by receiving a signal from the probe pin while contacting the wiring pattern of the flexible printed circuit board. method of inspection. 28. The method of claim 27, Contacting the probe card with the flexible printed circuit board and applying a voltage to the probe pin using a tester unit; Amplifying a signal detected from the sensor using an amplifier; And calculating the amplified signal using an associating unit. And And outputting the calculated signal using an output unit. Disposing a flexible printed circuit board having a wiring pattern formed on the support system including a plate and a light source assembly, and disposing a probe card including a probe pin on the flexible printed circuit board; Purging ions to the probe pins using an ionizer; And Contacting the probe pin with the wiring pattern to inspect for short circuits and disconnections. The method of claim 29, The inspecting of the short circuit and the disconnection may include inspecting an abnormality of the wiring pattern using a light source of the light source assembly. The method of claim 29, And purging the ions includes purging ions on the flexible printed circuit board and the wiring pattern. The method of claim 30, Purging ions on the probe pin, the flexible printed circuit board, and the wiring pattern includes moving the ionizer up and down to purge ions on the probe pin, the flexible printed circuit board, and the wiring pattern, respectively. Inspection method of flexible printed circuit board.

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