KR20100055914A - Manufacturing method of substrate for probe - Google Patents

Abstract

PURPOSE: A method for manufacturing a board for a probe is provided to minimize the heat conduction in the probe bonding by forming a pad on a polyimide used as adiabatic and insulation materials. CONSTITUTION: An insulating layer is formed on the substrate on which a via is formed. A hole is formed on the insulating layer. The inner wall of the hole is plated. A photoresist pattern corresponding to the flat type of the pad is formed. A metal material is plated in the pattern and the pad(330) is formed. The photoresist is removed.

Description

Substrate manufacturing method for probes {MANUFACTURING METHOD OF SUBSTRATE FOR PROBE}

The present invention relates to a method for manufacturing a substrate for a probe, and more particularly, to a method for manufacturing a substrate for a probe that can freely form and arrange a pad.

Many chips in a wafer such as semiconductor integrated circuits (hereinafter referred to as 'inspection') have an EDS (Electrical Die Sorting) process that checks electrical properties whether they are manufactured according to specifications. This kind of inspection is performed by using an electrical connection device such as a probe card having a plurality of probes pressed against the pad of the object to be examined, a probe block, and the like. This type of electrical connection device is used to electrically connect the test subject's pad and the tester. In any type of probe, a probe is formed and stood on a wiring board such as ceramic, and the overdrive acts on the probe while the tip portion of the probe is pressed against the electrode of the object under test, and the probe is bent by elastic deformation.

Referring to FIG. 1, the probe assembly 100 includes a substrate 120 and a probe 110 electrically connected to the pad 121 formed on the substrate 120 in a standing state. The probe 110 is divided into a tip portion 112, a beam portion, a main post portion supporting them, and a base portion 111 connecting the other side with a substrate in a cantilever shape. The base portion 111 is formed on the substrate 120. It is configured to be electrically connected to the pad 121 formed in.

2 shows a conventional high temperature cofired ceramic substrate (HTCC). Specifically, the ceramic substrate 200 includes a via 210, a connection portion 220 extending from the via 210, and a pad 230 formed at an end of the connection portion 220.

The high temperature cofired ceramic substrates (HTCC) have advantages such as high insulation, low thermal expansion and excellent fracture strength than FR-4.

However, since the manufacturing method of the HTCC substrate for the probe card is a MLC (Multi-Layer Ceramic) formed by forming a printed pattern on a tape cast ceramic sheet, laminating it, and then sintering at a high temperature, it is difficult to manage shrinkage. .

Due to the shrinkage rate, there is a problem in that the cover pad of the via to be formed on the ceramic surface on which the probe is to be standing must grow in proportion to the size of the substrate.

In the case of a chip having a small chip size and a small pitch of the chip, such a problem cannot be coped with due to a large space constraint for arranging the cover pad of the via and the bonding pad of the probe. Therefore, when the pad for bonding and the cover pad of the via formed on the substrate are insulated from the polyimide having thermal insulation effect, and vertically connected through the hole hole relatively smaller than the cover pad of the via, the space between the pad for bonding and the cover pad of the via formed on the substrate is spaced. By avoiding constraints and forming only pads for electrodes of appropriate size on the polyimide surface, space utilization can be easily avoided by the cover pads of vias in existing ceramic substrates and interference by electrode connection passages required for bonding.

In addition, the HTCC substrate has a relatively high thermal conductivity (20-30 W / m · k), so that the probe bonding process, which is bonded by local laser soldering rather than reflow soldering, heats around even if the output of the laser beam is increased. Soldering is not possible due to the nature of the substrate to be ejected.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a probe substrate for freeing the shape and arrangement of the pads.

In order to solve the above technical problem, the method for manufacturing a probe substrate includes: 1) forming a via in a substrate; 2) forming an insulating layer on the substrate on which the via is formed; 3) forming a hole in the insulating layer; 4) plating the inner wall of the hole; 5) forming a photoresist pattern corresponding to the planar shape of the pad; 6) forming a pad by plating a metal material on the pattern; And 7) removing the photoresist.

In addition, it is preferable that the connecting portion extending from the via is further formed in step 1).

In addition, the insulating layer is preferably a polyimide material.

In addition, in the step 3), it is preferable to process the hole using a laser.

In addition, in the step 3), the hole is preferably formed to expose the via or the connection part.

In addition, the step 4) is preferably plated with at least one of gold or copper.

In addition, the metal material in step 6) is preferably at least one or more of copper, gold, and nickel.

According to the present invention, there is an effect that can freely the shape and arrangement of the pad. This enables fine pitch implementation of the pads and probes.

In addition, since the pad is formed on the polyimide used as a heat insulating and insulating material, by minimizing the heat conduction during the bonding of the probe, it is possible to bond the probe even with a relatively low heat.

Hereinafter, a method for manufacturing a probe substrate according to the present invention will be described with reference to the accompanying drawings.

First, in order to manufacture the probe substrate according to the present invention, a via 302 and a connection portion 304 extending from the via 302 are formed in the ceramic substrate 300 (see FIG. 3).

Next, an insulating layer thin film 310 is formed on the substrate 300 on which the via is formed. Polyimide is used as the insulating layer thin film 310, and in particular, a liquid polyimide having excellent heat resistance is used rather than a dry polyimide having low heat resistance. This is to minimize the damage of the thin film during the laser hole processing to be performed later (see Fig. 4).

Next, after calcining the liquid polyimide, holes 312 are formed through laser hole processing. In particular, the hole 312 is preferably formed at a position where the via 302 or the connection portion 304 is exposed (see FIG. 5). When the hole processing is completed, the hole is plated with gold or copper.

Next, a photoresist 320 is coated on the insulating layer on which the hole is formed (see FIG. 6), and a photoresist pattern 322 is formed through a photolithography process (see FIG. 7). Of course, the photoresist pattern 322 corresponds to the planar shape of the pad to be formed later. The photoresist preferably uses a liquid or dry polyimide.

Next, a metal material is plated on the photoresist pattern 322 to form a pad 330 (see FIG. 8). The metal material is preferably at least one of copper, nickel, and gold.

Finally, the photoresist pattern is removed to complete it (see FIG. 9).

Polyimide as an insulating material solves the two problems of HTCC described above.

First, since the HTCC substrate described above is MLC, it is difficult to manage the shrinkage rate, and accordingly, according to the present invention, a laser via is processed on a polyimide used as an insulating material, and the cover pad of the via is located on the ceramic, and the bonding pad is Separation to be located on top of the polyimide ensures a margin in the design space, and fine pitch correspondence is possible by placing the bonding pads in an alternating arrangement.

Second, it is not suitable for laser bonding process because the thermal conductivity of HTCC substrate is relatively high, but since the polyimide as an insulating material is formed as shown in FIG. Soldering is facilitated by effectively transferring the laser beam to the probe pad without being emitted into the substrate.

1 shows a conventional probe card.

2 shows a substrate used in a conventional probe card.

3 to 9 illustrate a method for manufacturing a probe substrate according to the present invention.

Claims (7)

1) forming vias in the substrate; 2) forming an insulating layer on the substrate on which the via is formed; 3) forming a hole in the insulating layer; 4) plating the inner wall of the hole; 5) forming a photoresist pattern corresponding to the planar shape of the pad; 6) forming a pad by plating a metal material on the pattern; And 7) removing the photoresist; manufacturing method for a probe substrate comprising a. The method of claim 1, The method of claim 1, wherein the connecting portion extending from the via is further formed. The method of claim 1, The insulating layer is a probe substrate manufacturing method, characterized in that the polyimide material. The method of claim 1, Step 3) is a method of manufacturing a substrate for a probe, characterized in that the hole processing using a laser. The method of claim 2, The method of claim 3, wherein the holes are formed to expose vias or connections. The method of claim 1, Step 4) is a probe substrate manufacturing method, characterized in that the plating with gold or copper. The method of claim 1, The method of claim 6, wherein the metal material is at least one of copper, nickel and gold.

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