KR20100043519A - Touch key circuit and complex device for esd protection in the touch key circuit - Google Patents

Abstract

PURPOSE: A touch key circuit and a complex element thereof are provided to attenuate an ESD through a suppressor by connecting a resistor between an inner terminal of an integrated circuit part and a touch key. CONSTITUTION: A touch key circuit comprises an integrated circuit part(7) sensing the operation status of a touch pad part(6), and the touch pad part with a touch key. The integrated circuit part has an inner lead connected to the touch key. A resistor(R) is installed between the touch key and the inner lead of the integrated circuit part connected to the touch key. A protecting element is grounded in one end connected to the touch key among both ends of the resistor. The electrostatic protection element is composed of a suppressor(S) having a gap electrode. The resistor has the resistance value which ranges from 50 to 200 ohm. The resistor and an electrostatic protection device are formed in a body.

Description

Touch key circuit and complex device for ESD protection in the touch key circuit

The present invention relates to a touch key circuit and a composite device in an electronic device equipped with a touch key, and more particularly, to a touch key circuit having an electrostatic protection circuit for protecting an internal integrated circuit from static electricity flowing through the touch key, and a touch key circuit. A composite device in which an electrostatic protection circuit is integrated.

Currently, in electronic devices such as digital TVs, a plurality of touch keys are installed at the lower side of the main body, for example, for the beauty of beauty. For example, as shown in FIG. 1, various key input buttons are provided in the form of a touch key on the lower side of the main body of the digital TV. In Fig. 1, reference numeral 1 is a TV / external input key, reference 2 is a menu key, reference 3 is a volume key, reference 4 is a channel key, and reference 5 is a power key.

As described above, in a digital TV having a plurality of touch keys, the touch key is recognized by capacitive sensing. 2 is a view schematically showing a connection between the touch pad unit 6 and the integrated circuit unit 7 employed in an electronic device such as a digital TV. In the specification of the present invention, a form in which the touch pad unit 6 and the integrated circuit unit 7 of FIG. 2 are connected to each other is collectively referred to as a touch key circuit (or touch key sensor). For example, when a viewer touches a touch key (for example, Key 1) of the touch pad unit 6 with a finger, a predetermined capacitance occurs between the touch key and the finger touch surface. The capacitance value generated as described above is applied to the integrated circuit unit 7, and the integrated circuit unit 7 recognizes that the capacitance of the corresponding touch key has changed. Accordingly, the integrated circuit unit 7 recognizes that the corresponding touch key (that is, Key 1) is pressed.

However, a touch key installed in a digital TV or the like has a high possibility that an overvoltage component such as static electricity may flow in a touch process. Accordingly, a protection circuit is needed to protect the touch key circuit from overvoltage components such as static electricity flowing from the outside.

The present invention has been proposed to solve the above-described problems, and an object thereof is to provide a touch key circuit employing an electrostatic protection circuit having a very simple circuit configuration.

Another object of the present invention is to provide a composite device in which an electrostatic protection circuit having a very simple circuit configuration is integrated into a single device and applied to a touch key circuit.

In particular, the present applicant has focused on the ability to protect the integrated circuit from static electricity input through the touch key within a range that does not reduce the sensitivity of the touch key circuit.

In order to achieve the above object, a touch key circuit having an electrostatic protection circuit according to the present invention includes a touch pad unit having a touch key, and an internal terminal connected to the touch key, and sensing whether the touch key is operated in a capacitive manner. In the touch key circuit comprising an integrated circuit unit,

A resistor provided between the touch key and an internal terminal of an integrated circuit unit connected thereto; And an electrostatic protection element grounded at at least one end connected to the touch key among both ends of the resistor.

The static electricity protection element is a suppressor having a gap electrode, and the resistance has a resistance value of 50 to 200 kΩ. The resistance and the electrostatic protection element are integrally formed.

In a composite device according to a preferred embodiment of the present invention, in a touch key circuit including a touch pad unit having a touch key, and an integrated circuit unit having an internal terminal connected to the touch key and sensing whether the touch key is operated in a capacitive manner. As a composite device for electrostatic protection of

A body in which a plurality of sheets are stacked; A first external terminal formed in the body and connected to the touch key; A second external terminal formed in the body and connected to the internal terminal; A resistor pattern formed on the body, and having one end connected to the first external terminal through the first connection pattern and the other end connected to the second external terminal through the second connection pattern; A first electrode pattern formed on the sheet inside the body and having a gap electrode portion exposed to the outside of the body and connected to the first external terminal; And a second electrode pattern formed on the sheet inside the body and having a ground gap electrode portion exposed to the outside of the body,

The first electrode pattern and the second electrode pattern are formed on different sheets and stacked.

The gap electrode portion of the first electrode pattern and the ground gap electrode portion of the second electrode pattern overlap and form a gap by the thickness of the sheet interposed therebetween.

Preferably, the third electrode pattern is formed on the sheet inside the body, having a gap electrode portion exposed to the outside of the body and connected to the second external terminal; And a fourth electrode pattern formed on the sheet inside the body and having a ground gap electrode portion exposed to the outside of the body. In this case, the third and fourth electrode patterns may be formed and stacked on different sheets, and may be spaced apart from the first and second electrode patterns.

The gap electrode portion of the third electrode pattern and the ground gap electrode portion of the fourth electrode pattern overlap and form a gap by the thickness of the sheet interposed therebetween.

The first electrode pattern and the fourth electrode pattern are formed to be spaced apart from each other on the same sheet, and the second electrode pattern and the third electrode pattern are formed to be spaced apart from each other on the same sheet.

Alternatively, the ground gap electrode portion of the second electrode pattern is exposed to both ends in the width direction of the sheet, and is formed on the sheet inside the body, and has a gap electrode portion exposed to the outside of the body, and is connected to the second external terminal. The three-electrode pattern may further be included.

The ground gap electrode portion of the second electrode pattern overlaps the gap electrode portions of the first and third electrode patterns, respectively, and forms a gap by the thickness of the sheet interposed between the overlapped ground gap electrode portion and the gap electrode portion.

First to third external terminals are formed to be spaced apart from each other on the first outer surface of the body, the first to third external terminals are formed to be spaced apart from each other on the second outer surface of the body facing the first outer surface, 3 External terminals are formed in the center of the outer side surface.

The bottom surface of the body may further include first and second electrode pads spaced apart from each other. In this case, the first electrode pad is connected to the first external terminal and the second electrode pad is connected to the second external terminal.

A composite device according to another preferred embodiment of the present invention, a touch key circuit including a touch pad unit having a touch key, and an integrated circuit unit having an internal terminal connected to the touch key and sensing whether the touch key is operated in a capacitive manner. As an electrostatic protection composite device in

A body in which a plurality of sheets are stacked; A first external terminal formed in the body and connected to the touch key; A second external terminal formed in the body and connected to the internal terminal; A first electrode pattern formed on the body and connected to the first external terminal and having a gap electrode portion; A second electrode pattern formed on the body and connected to the second external terminal; A resistor pattern formed on the body and having one end connected to the first external terminal and the other end connected to the second electrode pattern; And a ground electrode pattern formed to be spaced apart from the gap electrode part on the body.

The second electrode pattern may further include a gap electrode portion spaced apart from the ground electrode pattern to form a gap.

A composite device according to another preferred embodiment of the present invention, a touch key including a touch pad unit having a touch key, and an integrated circuit unit having an internal terminal connected to the touch key and capacitively sensing whether the touch key is operated. A composite device for static electricity protection in a circuit,

A first external terminal connected to the touch key; A second external terminal connected to the internal terminal; A first sheet including a resistor pattern having one end connected to the first external terminal through the first connection pattern and the other end connected to the second external terminal through the second connection pattern; A second sheet including a first electrode pattern formed at a center thereof, one end of which is connected to a first external terminal, and the other end of which covers an upper portion of the first discharge space; And a third sheet including a second electrode pattern which is in contact with and is grounded under the first discharge space.

The first sheet, the second sheet and the third sheet are laminated.

Preferably, the fourth sheet including a third electrode pattern is formed in the center, one end is connected to the second external terminal and the other end is formed to cover the upper portion of the second discharge space portion; And a fifth sheet including a fourth electrode pattern which is in contact with and is grounded under the second discharge space portion.

In the above embodiments, the gap electrode portion and the ground gap electrode portion are covered with a discharge medium.

According to the present invention having such a configuration, the suppressor is grounded between the touch key and the internal terminal of the integrated circuit part, but a resistance is connected between the touch key and the internal terminal of the integrated circuit part. ESD attenuation is achieved by the Lesser.

As a resistance of 50 to 200 kW is connected between the touch key and the internal terminal of the integrated circuit portion and the suppressor is grounded at the touch key side, the resistance lowers the initial operating level of the suppressor and improves the ESD reduction characteristic.

By integrating the suppressor and the resistor and applying them as a single composite element to the touch key circuit, the circuit arrangement becomes simpler than disposing the resistor and the suppressor as separate circuit elements.

In particular, by lowering the initial operating level of the suppressor and applying a composite device having improved ESD attenuation characteristics to the touch key circuit, the integrated circuit and the like can be very efficiently protected from the ESD flowing into the touch key.

Hereinafter, a touch key circuit and an electrostatic protection composite device in the touch key circuit according to an embodiment of the present invention will be described with reference to the accompanying drawings.

3 is a circuit diagram of a touch key circuit having an electrostatic protection circuit according to the present invention.

An electrostatic protection circuit is provided between the touch pad portion 6 and the integrated circuit portion 7. In practice, the static electricity protection circuit is provided between each touch key of the touch pad section 6 and the internal terminals of the integrated circuit section 7 connected to the respective touch keys.

The static electricity protection circuit may include a resistor R provided between the touch key and an internal terminal of the integrated circuit unit 7 connected thereto; And a suppressor S grounded at at least one end of the resistor R connected to at least a touch key. The suppressor S has a gap electrode (not shown), which is an example of the electrostatic protection device according to claim 1.

The resistor R and the suppressor S are integrally formed. Integrating the resistor R and the suppressor S will be fully understood by the following description of the embodiment.

Preferably, the resistance (R) is to have a resistance value of 50 ~ 200Ω. This is because if the resistance value of the resistor R is set to 50 to 200 mA, the suppressor S can be sufficiently operated to attenuate the static electricity even when the static electricity of about 8 KV is input from the outside.

The present applicant installs a composite device (that is, a device in which the resistor S and the suppressor S are integrated) manufactured by the manufacturing process of the embodiment to be described later between the touch pad unit 6 and the integrated circuit unit 7. After the experiment, the results are shown in Table 1 below. Here, the ratio of the discharge medium (Al: Si) employed in the suppressor S was set to 1.5: 1. The data in Table 1 below is slightly different depending on the composite device of the first to fifth embodiments to be described later, but it is understood that the average values are described.

Table 1

 Only Suppressor  Suppressor + Resistance (4.7Ω)  Suppressor + Resistance (10Ω)  Suppressor + Resistance (50Ω)  Suppressor + Resistance (100Ω)  Suppressor + Resistance (200Ω)  working level   4 to 6 KV   4 to 5 KV     4 KV   2 to 3 KV   2 to 2.5 KV   1 to 1.5 KV  ESD 8KV Vp     1064 V     848 V     832 V     616 V     480 V      328 V  ESD 8KV Vc     54.8 V     41.7 V     36.7 V     38.7 V     34.3 V     30.1 V

Typically, the ESD resistance voltage of the integrated circuit unit 7 is about 2 to 3 KV. Therefore, for example, when the resistance value of the resistor R is less than 50 kV and an ESD of about 8 KV is applied to the touch key, the suppressor S is not operated (in this case, the suppressor S is 4 KV or more). It is supposed to work). Accordingly, since the ESD of about 8 KV is applied to the integrated circuit unit 7 via the resistor R, the integrated circuit unit 7 is damaged.

However, for example, when the resistance value of the resistor R is set to 50 kV to 200 kV and an ESD of about 8 KV is applied to the touch key, the suppressor S operates. As a result, damage to the integrated circuit unit 7 is prevented. That is, if the resistor R having a resistance value of 50 kV to 200 kV is connected between the touch pad unit 6 and the integrated circuit unit 7 and the suppressor S is grounded at the front end of the resistor R, the suppressor S The initial operating level for ESD can be reduced to approximately 1 ~ 1.5KV, and the ESD attenuation can reduce 1064V to approximately 328V for peak voltage and 54.8V to approximately 30.1V for clamping voltage. It can be seen.

As a result of the above experiment, it can be seen that if the resistance value of the resistor R is 50 to 200 kΩ, the suppressor can be operated without any problem in determining whether the touch key is sensed. Of course, the resistance value of the resistor R exemplified above may be reduced according to the ESD resistance voltage of the integrated circuit unit 7.

(First embodiment)

4 is a view for explaining the configuration and manufacturing process of the composite device according to the first embodiment of the present invention.

First, the composite device sheet of the first embodiment is produced. It will be understood by those skilled in the art even if the detailed description related to sheet production is not given.

Patterns necessary for the sheets 10, 14, and 16 manufactured as shown in FIG. 4A are formed. In FIG. 4A, the sheets 10, 12, 14, 16, and 18 show only the size of the case of forming the unit elements. In fact, each sheet 10, 12, 14, 16, 18 in the current state has the same size as the sum of the size of a plurality of unit elements until a later cutting process is performed. The first and second connection patterns 21 and 22 spaced apart from each other on the sheet 10 and the resistor patterns 23 connected to the first and second connection patterns 21 and 22 at both ends are formed. That is, the first connection pattern 21 has a predetermined length such that one end is exposed to one end portion in the longitudinal direction of the sheet 10 and the other end is directed toward the other end portion in the longitudinal direction. The second connection pattern 22 is formed with a predetermined length such that one end is exposed to one end portion in the longitudinal direction of the sheet 10 and the other end is directed toward the other end portion in the longitudinal direction. For example, conductive pastes such as Ag, Pt, and Pd are printed by screen printing to form the first and second connection patterns 21 and 22. The resistor pattern 23 is formed in the center portion of the sheet 10 in the horizontal direction, one end of which is connected to the first connection pattern 21 and the other end of which is connected to the second connection pattern 22. For example, a resistive paste such as RuO ₂ or the like is printed to form a resistive pattern 23. Here, the resistor pattern 23 may be formed on the top of the body after the lamination of all the sheets is completed and the cutting and baking are performed. Electrode patterns 24 and 25 having a tracer shape spaced apart from each other are formed on the sheet 14. The electrode pattern 24 includes a ground gap electrode portion 24a exposed to one end portion in the width direction of the sheet 14 and an inner electrode portion 24b exposed to one end portion in the longitudinal direction of the sheet 14. The electrode pattern 25 includes a gap electrode portion 25a exposed to the other end portion in the width direction of the sheet 14 and an inner electrode portion 25b exposed to one end portion in the longitudinal direction of the sheet 14. Electrode patterns 26 and 27 having a tracer shape spaced apart from each other are formed on the sheet 16. The electrode pattern 26 includes a gap electrode portion 26a exposed at one end portion in the width direction of the sheet 16 and an inner electrode portion 26b exposed at one end portion in the longitudinal direction of the sheet 16. The electrode pattern 27 includes a ground gap electrode portion 27a exposed at the other end portion in the width direction of the sheet 16 and an inner electrode portion 27b exposed at one end portion in the longitudinal direction of the sheet 16. The electrode pattern 24 and the electrode pattern 27 may be called a ground electrode pattern. Here, the ground gap electrode portion 24a and the gap electrode portion 26a are positioned to overlap each other when the sheets 14 and 16 are stacked, and the gap electrode portion 25a and the ground gap electrode portion 27a are the sheet 14. , 16) are stacked so that they overlap each other. In the first embodiment, two gap electrode portions and two ground gap electrode portions are illustrated as shown in FIG. 4A, but only one gap electrode portion and one ground gap electrode portion that overlap each other may be used. In the case where only one gap electrode portion and one ground gap electrode portion overlap each other, only the gap electrode portion of the electrode pattern connected to the external terminal connected to the touch key and the ground gap electrode portion of the electrode pattern overlapping it are shown. desirable. This is to attenuate the overvoltage component such as ESD, mainly through the touch key, before being applied to the integrated circuit unit 7 side. In addition, although two electrode patterns are formed in the sheets 14 and 16, respectively, for example, the electrode patterns 25 and 27 may be formed in another sheet separate from the sheets 14 and 16. If two electrode patterns are formed on the sheets 14 and 16, the thickness of the body can be reduced by reducing the number of sheets required compared to forming only one electrode pattern.

After pattern formation is completed, the sheet | seat 18 is made into the lowest layer, the sheet | seat 16 is laminated | stacked on it, and the sheet | seat 14 is laminated | stacked on it. The sheet 12 is laminated on the sheet 14, and then the sheet 10 is laminated thereon.

When the lamination of the sheets 10, 12, 14, 16, and 18 is completed, the laminate is formed. Use a pressure of approximately 500 to 2000 psi for stacking. After lamination, the laminate is compressed. Use a pressure of approximately 500 to 3000 psi for crimping. The compacted stack is cut to the appropriate size. When the laminate is cut periodically, the laminate is cut into a plurality of single chips. That is, a plurality of stacks in the form of a single chip as shown in FIG. 4B are generated.

Thereafter, a plurality of laminates in the form of a single chip are subjected to a degreasing and firing process. The degreasing process is performed at about 300 ° C. and then calcined at about 800 ° C. to 900 ° C. When firing is completed, the gap between the gap electrode portion 26a and the ground gap electrode portion 24a and the gap between the gap electrode portion 25a and the ground gap electrode portion 27a become a desired value (about 10 mu m). The fired laminate is referred to as the body.

Then, as shown in (c) of FIG. 4, the site where the gap discharge occurs on the side surface of the body (that is, the gap between the ground gap electrode portion 24a and the gap electrode portion 26a, the gap electrode portion 25a and the ground gap). The discharge medium 35 is printed to cover the gap between the electrode portions 27a. The discharge medium 35 includes, for example, metal materials such as Al, Ag, Pt, Ru, Cu, W, and insulators (eg, Al ₂ O ₃ , SiO ₂ ) as the main raw materials, and epoxy, silicon, glass, etc. as binders. By mixing. The discharge medium 35 may be air or a polymer. Of course, the metal material other than the metal material mentioned above may be used as the metal material of the discharge medium as long as the metal material may contribute to the surge absorption and facilitate discharge. Due to the negative resistance characteristic of the discharge medium 35, it is possible to implement an ESD clamping voltage lower than a device voltage that cannot be represented by a varistor or a diode. This makes it possible to realize excellent blocking characteristics of overvoltage components such as static electricity and surges. Here, the discharge medium 35 may be formed by a normal termination method in addition to the printing method.

The printed discharge medium 35 is heat treated to be firmly bonded to the body. That is, the discharge medium 35 is cured. In addition, external terminals 31, 32, 33, and 34 are formed on the outer surface of the body as shown in FIG. 4C using a conventional termination system. The external terminal 31 is connected to the internal electrode portion 24b, and the external terminal 32 is connected to the internal electrode portion 25b and the second connection pattern 22. The external terminal 33 is connected to the first connection pattern 21 and the internal electrode part 26b, and the external terminal 34 is connected to the internal electrode part 27b. Here, the external terminals 32 and 33 are input / output terminals. For example, the external terminal 33 may be referred to as an input terminal, and the external terminal 32 may be referred to as an output terminal. The external terminals 31 and 34 are used as ground terminals. The external terminals 31 to 34 are baked at a predetermined temperature to couple the bodies. In the first embodiment described above, the external terminals 31 to 34 are formed after the discharge medium 35 is printed. This is the case when the discharge medium curing temperature is set higher than the external terminal baking temperature. If the external terminal baking temperature is set higher than the discharge medium curing temperature, it is preferable to form the external terminal first. For example, after printing the discharge medium, the external terminal was baked. When the external terminal baking temperature is higher than the discharge medium curing temperature, the physical properties of the cured discharge medium change.

Finally, as shown in (d) of FIG. 4, a heat treatment after further laminating a protective sheet 36 for protecting the pattern or an insulating sheet capable of performing the same or similar functions to the top of the laminated sheet. do. Of course, the protective sheet 36 may be laminated together in the lamination process of the sheet. Alternatively, when the resistor pattern 23 is formed after sheet lamination, the protective sheet 36 is to be laminated before forming the resistor patterns 23 on the top of the body and before forming the external terminals 31 to 34. You may also

This completes the composite device of the first embodiment.

In the above-described first embodiment, the gap discharge in the gap between the gap electrode portion 26a and the ground gap electrode portion 24a, which overlaps up and down, and the gap between the gap electrode portion 25a and the ground gap electrode portion 27a, Is done. In general, the capacitance at the overlapping area increases as the area of overlap between the gap electrode portion overlapping the top and bottom and the ground gap electrode portion increases. Since the capacitance in these overlapping areas is an unwanted component, it is desirable to make the overlapping area as small as possible. That is, when the overlapping area between the gap electrode portion overlapped with the ground gap electrode portion is minimized, low capacitance can be realized, and the delay and distortion of the signal can be reduced when applied to a high-speed data line such as a touch key circuit. Get rid of it. For example, in the first embodiment, the shape of the electrode patterns 24, 25, 26, and 27 is used as a tracer shape, and the rounded shape will make the overlapping area smaller. In FIG. 4, since the gap electrode portions overlapped with each other and the ground gap electrode portions have an overlapping area to some extent, at least the sheets 14 and 16 may be made of a dielectric material having a low dielectric constant (eg, a dielectric constant of 10 or less). It is preferable.

On the other hand, in the above-described first embodiment, the gap between the gap electrode portion 26a and the ground gap electrode portion 24a overlapped vertically, and the gap between the gap electrode portion 25a and the ground gap electrode portion 27a are therebetween. Since the thickness can be adjusted by the thickness of the sheet interposed therebetween, the gap between the overlapping gap electrode portion and the ground gap electrode portion can be adjusted more easily and accurately.

When the composite device of the first embodiment thus completed is installed in the touch key circuit, the external terminal 33 is connected to the touch key side and the external terminal 32 is connected to the internal terminal side of the integrated circuit unit 7. The external terminals 31 and 34 are grounded. Thus, for example, the ESD flowing through the touch key is blocked by the gap discharge in the suppressor layer (that is, the portion where the gap electrode portion and the ground gap electrode portion are formed) implementing low capacitance.

In the composite device of the first embodiment, the discharge medium 35 on the side may be damaged. However, as each of the two external terminals is formed on both sides of the body in the longitudinal direction, each of the external terminals on the corresponding side is formed. The width of can be taken relatively wide, for example about 0.3mm.

(Second embodiment)

5 is a view for explaining the configuration and manufacturing process of the composite device according to a second embodiment of the present invention. Although the second embodiment is identical in appearance to the first embodiment described above in terms of appearance, it is different in that three external terminals are formed on both sides in the longitudinal direction of the body. In the composite device of the first embodiment, two external terminals were formed on both sides in the longitudinal direction of the body.

First, the composite device sheet of the second embodiment is produced. It will be understood by those skilled in the art even if the detailed description related to sheet production is not given.

Patterns necessary for the sheets 40, 44 and 46 manufactured as in FIG. 5A are formed. In FIG. 5A, the sheets 40, 42, 44, 46, and 48 show only the size of the case of forming the unit elements. In fact, each sheet 40, 42, 44, 46, 48 in the current state has the same size as the sum of the size of a plurality of unit elements until a later cutting process is performed. The first and second connection patterns 51 and 52 spaced apart from each other on the sheet 40 and the resistor patterns 53 connected to the first and second connection patterns 51 and 52 at both ends are formed. That is, the first connection pattern 51 is vertically formed such that one end is exposed to one end portion in the longitudinal direction of the sheet 40 and the other end is exposed to the other end portion in the longitudinal direction. The second connection pattern 52 is vertically formed such that one end is exposed at one end in the longitudinal direction of the sheet 40 and the other end is exposed at the other end in the longitudinal direction. For example, conductive pastes such as Ag, Pt, and Pd are printed by screen printing to form the first and second connection patterns 51 and 52. The resistor pattern 53 is formed in the center portion of the sheet 40 in the horizontal direction, one end of which is connected to the first connection pattern 51 and the other end of which is connected to the second connection pattern 52. For example, a resistive paste such as RuO ₂ or the like is printed to form a resistive pattern 53. Here, the resistor pattern 53 may be formed on the uppermost part of the body after lamination of all sheets is completed and cutting and baking are performed. A cross-shaped electrode pattern 54 is formed on the sheet 44. The electrode pattern 54 includes the ground gap electrode portion 54a exposed at one end of the sheet 44 in the width direction and the ground gap electrode portion 54b exposed at the other end in the width direction of the sheet 44 and the sheet ( An inner electrode portion 54c exposed at one end in the longitudinal direction of 44 and an inner electrode portion 54d exposed at the other end in the longitudinal direction of the sheet 44 are included. The electrode pattern 54 may be referred to as a ground electrode pattern. The electrode patterns 55 and 56 having English letter T-shape spaced apart from each other are formed on the sheet 46. The electrode pattern 55 includes a gap electrode portion 55a exposed at one end portion in the width direction of the sheet 46 and an inner electrode portion 55b and sheet 46 exposed at one end portion in the longitudinal direction of the sheet 46. It includes the internal electrode portion 55c exposed to the other end in the longitudinal direction of. The electrode pattern 56 includes a gap electrode portion 56a exposed to the other end portion in the width direction of the sheet 46 and an inner electrode portion 56b and sheet 46 exposed to one end portion in the longitudinal direction of the sheet 46. It includes the inner electrode portion 56c exposed to the other end in the longitudinal direction of. Here, the ground gap electrode portion 54a and the gap electrode portion 55a are positioned to overlap each other when the sheets 44 and 46 are stacked, and the ground gap electrode portion 54b and the gap electrode portion 56a are the sheet 44. , 46) are stacked so that they overlap each other. In the second embodiment, as shown in FIG. 5A, two gap electrode portions and two ground gap electrode portions are illustrated. However, only one gap electrode portion and one ground gap electrode portion may overlap each other. In the case where only one gap electrode portion and one ground gap electrode portion overlap each other, for example, the electrode pattern 54 is shaped like an English alphabet tee (T) so that there is no ground gap electrode portion 54b and the electrode pattern ( 56, only the gap electrode portion of the electrode pattern connected to the external terminal connected to the touch key and the ground gap electrode portion of the electrode pattern superimposed thereon are preferably shown. This is to attenuate the overvoltage component such as ESD, mainly through the touch key, before being applied to the integrated circuit unit 7 side. Then, for example, the electrode pattern 54 is formed of two English alphabet tees (T), and one of the two tees shaped electrode patterns (that is, overlaps with the gap electrode portion 56a of the electrode pattern 56). Electrode pattern 56) and the electrode pattern 56 may be formed in another sheet separate from the sheets 44 and 46. FIG. 5 (a) is to reduce the thickness of the body by reducing the number of sheets required.

After pattern formation is completed, the sheet 48 is made the lowest layer, the sheet 46 is laminated thereon, and the sheet 44 is laminated thereon. The sheet 42 is laminated on the sheet 44, and then the sheet 40 is laminated thereon.

When the stacking of the sheets 40, 42, 44, 46 and 48 is completed, the stack is formed. Use a pressure of approximately 500 to 2000 psi for stacking. After lamination, the laminate is compressed. Use a pressure of approximately 500 to 3000 psi for crimping. The compacted stack is cut to the appropriate size. When the laminate is cut periodically, the laminate is cut into a plurality of single chips. That is, a plurality of stacks of a single chip form as shown in FIG.

Thereafter, a plurality of laminates in the form of a single chip are subjected to a degreasing and firing process. The degreasing process is performed at about 300 ° C. and then calcined at about 800 ° C. to 900 ° C. When firing is completed, the gap between the gap electrode portion 55a and the ground gap electrode portion 54a, and the gap between the gap electrode portion 56a and the ground gap electrode portion 54b become a desired value (about 10 mu m). The fired laminate is referred to as the body.

Then, as shown in (c) of FIG. 5, a portion where the gap discharge occurs on the side of the body (i.e., the gap between the gap electrode portion 55a and the ground gap electrode portion 54a, the gap electrode portion 56a and the ground). The discharge medium 67 is printed so as to cover the gap between the gap electrode portions 54b. A more detailed description of the discharge medium 67 is the same as in the first embodiment described above.

The printed discharge medium 67 is heat treated to be firmly bonded to the body. That is, the discharge medium 67 is cured. In addition, external terminals 61, 62, 63, 64, 65, and 66 are formed on the outer surface of the body as shown in FIG. 5C using a conventional termination system. The external terminal 61 is connected to the first connection pattern 51 and the internal electrode portion 55c, the external terminal 62 is connected to the internal electrode portion 54d, and the external terminal 63 is connected to the internal electrode portion ( 56c) and the second connection pattern 52. The external terminal 64 is connected to the first connection pattern 51 and the internal electrode part 55b, the external terminal 65 is connected to the internal electrode part 54c, and the external terminal 66 is the second connection pattern. 52 and the internal electrode portion 56b. Here, the external terminals 61, 64; 63, 66 are input / output terminals. For example, the external terminals 61 and 64 may be referred to as input terminals, and the external terminals 63 and 66 may be referred to as output terminals. The external terminals 62, 65 are used as ground terminals. The external terminals 61 to 66 are baked at a predetermined temperature to couple the bodies. In the second embodiment, the external terminals 61 to 66 are formed after the discharge medium 67 is printed. This is the case when the discharge medium curing temperature is set higher than the external terminal baking temperature. If the external terminal baking temperature is set higher than the discharge medium curing temperature, it is preferable to form the external terminal first. For example, after printing the discharge medium, the external terminal was baked. When the external terminal baking temperature is higher than the discharge medium curing temperature, the physical properties of the cured discharge medium change.

Finally, as shown in (d) of FIG. 5, a heat treatment after further laminating a protective sheet 68 for protecting the pattern or an insulating sheet capable of performing the same or similar functions to the top of the laminated sheet. do. Of course, the protective sheet 68 may be laminated together in the lamination process of the sheet. Alternatively, when the resistor pattern 53 is formed after sheet stacking, the protective sheet 68 is to be laminated before forming the resistor patterns 53 on the top of the body and before forming the external terminals 61 to 66. You may also

This completes the composite device of the second embodiment.

In the above-described second embodiment, gap discharge occurs in the gap between the gap electrode portion 55a and the ground gap electrode portion 54a, which are overlapped up and down, and the gap between the gap electrode portion 56a and the ground gap electrode portion 54b. . In general, the capacitance at the overlapping area increases as the area of overlap between the gap electrode portion overlapping the top and bottom and the ground gap electrode portion increases. Since the capacitance in these overlapping areas is an unwanted component, it is desirable to make the overlapping area as small as possible. That is, when the overlapping area between the gap electrode portion overlapped with the ground gap electrode portion is minimized, low capacitance can be realized, and the delay and distortion of the signal can be reduced when applied to a high-speed data line such as a touch key circuit. Get rid of it. In FIG. 5, since the gap electrode portions overlapping the top and bottom and the ground gap electrode portions have an overlapping area to some extent, at least the sheets 44 and 46 are made of a dielectric material having a low dielectric constant (eg, a dielectric constant of 10 or less). It is preferable.

On the other hand, in the above-described second embodiment, the gap between the gap electrode portion 55a and the ground gap electrode portion 54a, which is overlapped up and down, and the gap between the gap electrode portion 56a and the ground gap electrode portion 54b are interposed therebetween. Since it is adjustable by the thickness of the interposed sheet, it is possible to more easily and accurately adjust the gap between the overlapping gap electrode portion and the ground gap electrode portion.

When the composite device of the second embodiment thus completed is installed in the touch key circuit, the external terminals 61 and 64 are connected to the touch key side and the external terminals 63 and 66 are connected to the internal terminal side of the integrated circuit unit 7. do. The external terminals 62, 65 are grounded. Thus, for example, the ESD flowing through the touch key is blocked by the gap discharge in the suppressor layer (that is, the portion where the gap electrode portion and the ground gap electrode portion are formed) implementing low capacitance.

(Third Embodiment)

6 and 7 are views for explaining the configuration and manufacturing process of the composite device according to a third embodiment of the present invention. The third embodiment has the same components as most of the above-described second embodiment. The difference is that the sheet 47 having the first and second electrode pads 57 and 58 formed on the bottom thereof is used instead of the sheet 48 which is the dummy sheet of the second embodiment. Therefore, it will be appreciated by those skilled in the art that the structure and manufacturing process of the composite device of the third embodiment may be sufficiently understood by referring to the description of the second embodiment.

Here, the effect of leaving the first and second electrode pads 57, 58 formed in the longitudinal direction and spaced apart from each other will be described.

The width of each external terminal (i.e., each external terminal visible on the bottom) of the composite element of the second embodiment is very narrow, about 0.2 mm. In the SMT for the composite device of such a second embodiment, there are six solder paste portions (that is, six external terminals located on the bottom of the composite device). In this case, if the amount of solder in each position is quantitative, there is no problem in the adhesion strength, but if a small amount of solder is added to the SMT, there is a problem in that the adhesion strength drops.

However, in the composite device of the third embodiment, the electrode pads 57 and 58 are formed on the bottom of the composite device so that the area where solder can adhere is wider than in the second embodiment. Accordingly, when the SMT of the composite device of the third embodiment has many parts where solder can adhere to the bottom surface, the adhesion strength of the second embodiment is eliminated by improving the adhesion strength.

Of course, if necessary, the sheet 47 on which the first and second electrode pads 57 and 58 of the third embodiment are formed is also applicable to the above-described first embodiment.

(Example 4)

8 is a view for explaining the configuration and manufacturing process of the composite device according to a fourth embodiment of the present invention. The fourth embodiment is significantly different in that the gap electrode is formed on the upper surface of the body compared with the first to third embodiments described above in appearance.

First, the composite device sheet of the fourth embodiment is produced. It will be understood by those skilled in the art even if the detailed description related to sheet production is not given.

Patterns necessary for the sheet 70 manufactured as in FIG. 8A are formed. In FIG. 8A, the sheets 70 and 72 only show the size of the case in which the unit elements are formed. The sheet 72 collectively refers to a plurality of dummy sheets. In fact, each sheet 70, 72 in the current state has the same size as the sum of the plurality of unit elements until the subsequent cutting process is performed. The first and second electrode patterns 71 and 73 and the ground electrode pattern 74 spaced apart from each other on the sheet 70, and the resistor patterns 75 connected to the first and second electrode patterns 71 and 73 at both ends thereof. ). That is, one end of the ground electrode pattern 74 is exposed to one end of the sheet 70 in the longitudinal direction, and the other end is formed to have a predetermined length toward the other end of the sheet 70 in the longitudinal direction. The first electrode pattern 71 has a gap electrode portion 71a opposed to the ground electrode pattern 74 so as to form a predetermined gap, and internal electrode portions 71b exposed to both end portions in the longitudinal direction of the sheet 70; 71c). The second electrode pattern 73 is formed on the sheet 70, but is formed at a portion opposite to the portion where the first electrode pattern 71 is formed around the ground electrode pattern 74. The second electrode pattern 73 includes a gap electrode portion 73a opposed to the ground electrode pattern 74 to form a predetermined gap, and an inner electrode portion 73b exposed to both end portions in the longitudinal direction of the sheet 70. 73c). For example, conductive pastes such as Ag, Pt, and Pd are printed by screen printing to form the first and second electrode patterns 71 and 73 and the ground electrode pattern 74. The portion of the ground electrode pattern 74 which faces the gap electrode portions 71a and 73a becomes the ground gap electrode portion. Reference numerals for the ground gap electrode portions in the ground electrode pattern 74 are not separately indicated. The resistor pattern 75 is formed in the sheet 70 in a horizontal direction, and one end thereof is connected to the first electrode pattern 71 and the other end thereof is connected to the second electrode pattern 73. For example, a resistive paste such as RuO ₂ or the like is printed to form a resistive pattern 75. Here, the resistor pattern 75 may be formed on the top of the body after the lamination of the sheets is completed and the cutting and baking are performed. In FIG. 8, two gap electrode portions are formed to be spaced apart from the ground electrode pattern 74, but at least one gap electrode portion may be provided. When there is only one gap electrode part, it is preferable to show only the gap electrode part (for example 71a) of the electrode pattern (for example 71) connected with the external terminal connected with the touch key. This is to attenuate the overvoltage component such as ESD, mainly through the touch key, before being applied to the integrated circuit unit 7 side.

After the pattern formation is completed, the sheet 70 is laminated on the sheet 72 as the lowermost layer.

When the stacking of the sheets 70 and 72 is completed, the stack is formed. Use a pressure of approximately 500 to 2000 psi for stacking. After lamination, the laminate is compressed. Use a pressure of approximately 500 to 3000 psi for crimping. The compacted stack is cut to the appropriate size. When the laminate is cut periodically, the laminate is cut into a plurality of single chips. That is, a plurality of stacks in the form of a single chip as shown in FIG. 8B are generated.

Thereafter, a plurality of laminates in the form of a single chip are subjected to a degreasing and firing process. The degreasing process is performed at about 300 ° C. and then calcined at about 800 ° C. to 900 ° C. When firing is completed, the gap between the gap electrode portion 71a and the ground gap electrode portion opposite thereto, and the gap between the gap electrode portion 73a and the ground gap electrode portion opposite thereto, becomes a desired value (about 10 mu m). The fired laminate is referred to as the body.

Then, as shown in (c) of FIG. 8, a gap where the gap discharge occurs (that is, a gap between the gap electrode portion 71a and the ground gap electrode portion opposite thereto, the gap electrode portion 73a and the ground gap electrode opposite thereto). The discharge medium 85 is printed to cover the gap between the portions. The detailed description of the discharge medium 85 is replaced with the description of the discharge medium of the first embodiment described above.

The printed discharge medium 85 is heat treated to be firmly bonded to the body. That is, the discharge medium 85 is cured. Then, the external terminals 81, 82, 83, 84 are formed on the outer surface of the body as shown in Fig. 8 (c) using a conventional termination system. The outer terminal 81 is connected to the exposed portion of the first electrode pattern 71 (that is, the inner electrode portions 71b and 71c) and surrounds one end surface of the body. The external terminal 82 is connected to the exposed portion of the second electrode pattern 73 (that is, the internal electrode portions 73b and 73c) and surrounds the other end surface of the body. The external terminal 83 is connected to the ground electrode pattern 74, and the external terminal 84 is formed on the side opposite to the side on which the external terminal 83 is formed, and the first and second electrode patterns 71 and 73 It is not connected to the ground electrode pattern 74 and the resistor pattern 75. Here, the external terminals 81 and 82 are input / output terminals. For example, the external terminal 81 may be referred to as an input terminal, and the external terminal 82 may be referred to as an output terminal. The external terminals 83 and 84 are used as ground terminals.

The external terminals 81 to 84 are baked at a predetermined temperature to couple the bodies. In the fourth embodiment described above, the external terminals 81 to 84 are formed after the discharge medium 85 is printed. This is the case when the discharge medium curing temperature is set higher than the external terminal baking temperature. If the external terminal baking temperature is set higher than the discharge medium curing temperature, it is preferable to form the external terminal first. For example, after printing the discharge medium, the external terminal was baked. When the external terminal baking temperature is higher than the discharge medium curing temperature, the physical properties of the cured discharge medium change.

Finally, as shown in (d) of FIG. 8, a heat treatment after further laminating a protective sheet 86 for pattern protection or an insulating sheet capable of performing the same or similar functions to the top of the laminated sheet. do. Of course, the protective sheet 86 may be laminated together in the lamination process of the sheet. Alternatively, when the resistor pattern 75 is formed after sheet stacking, the protective sheet 86 is to be laminated before forming the resistor patterns 75 on the top of the body and before forming the external terminals 81 to 84. You may also

This completes the composite device of the fourth embodiment.

When the composite device of the fourth embodiment thus completed is installed in the touch key circuit, the external terminal 81 is connected to the touch key side and the external terminal 82 is connected to the internal terminal side of the integrated circuit unit 7. The external terminals 83 and 84 are grounded. Thus, for example, the ESD flowing through the touch key is blocked by the gap discharge in the suppressor layer (that is, the portion where the gap electrode portion and the ground gap electrode portion are formed) implementing low capacitance.

In the composite device of the fourth embodiment described above, it is rather difficult to reduce the gap distance, but since the discharge medium 85 is placed on the upper surface of the body and protected by a protective sheet, the composite device is more resistant to physical shock than the composite device of the first to third embodiments. strong.

In addition, since the three-terminal structure, the circuit arrangement is relatively easy as compared with the composite elements of the first to third embodiments.

(Example 5)

9 is a view for explaining the configuration and manufacturing process of the composite device according to a fifth embodiment of the present invention. Compared to the first to fourth embodiments described above, the fifth embodiment is greatly different in that a gap electrode is formed inside the body.

First, the composite device sheet of the fifth embodiment is produced. It will be understood by those skilled in the art even if the detailed description related to sheet production is not given.

Patterns necessary for the sheets 100, 120, 130, 140, and 150 manufactured as shown in FIG. 9A are formed. In FIG. 9A, the sheets 100, 110, 120, 130, 140, 150, and 160 show only sizes of units in the case of forming unit devices. In fact, each sheet 100, 110, 120, 130, 140, 150, 160 in the current state has the same size as the sum of the size of a plurality of unit elements until a later cutting process is performed. The first and second connection patterns 101 and 102 spaced apart from each other on the sheet 100, and the resistor patterns 103 connected to the first and second connection patterns 101 and 102 at both ends are formed. That is, one end of the first connection pattern 101 is exposed to one end of the longitudinal direction of the sheet 100 and the other end is exposed to the other end of the longitudinal direction. One end of the second connection pattern 102 is exposed at one end in the longitudinal direction of the sheet 100 and the other end is exposed at the other end in the longitudinal direction. For example, conductive pastes such as Ag, Pt, and Pd are printed by screen printing to form the first and second connection patterns 101 and 102. The resistor pattern 103 is formed in the center portion of the sheet 100 in the horizontal direction, and one end thereof is connected to the first connection pattern 101, and the other end thereof is connected to the second connection pattern 102. For example, a resistive paste such as RuO ₂ or the like is printed to form a resistive pattern 103. Here, the resistor pattern 103 may be formed on the top of the body after the lamination of all the sheets is completed and the cutting and baking are performed.

In the center portion of the sheet 120, for example, the cylindrical first discharge space portion is drilled, and in the center portion of the sheet 140, the cylindrical second discharge space portion is drilled. In the sheet 130, an electrode pattern 131 is formed in the center of the sheet 130 so as to vertically cross both end portions in the longitudinal direction of the sheet 130. In the sheet 150, an electrode pattern 151 is formed in the center portion to vertically cross both end portions in the longitudinal direction of the sheet 150.

Thereafter, the sheet 160 is the lowest layer, and the sheet 150 is laminated thereon, and then the sheet 140 is laminated thereon. Subsequently, after the discharge medium 142 is filled in the second discharge space portion of the sheet 140, an electrode pattern 141 is formed on the sheet 140. One end of the electrode pattern 141 is exposed to one end of the sheet 140 in the width direction, and the other end covers an upper portion of the second discharge space. The other end of the electrode pattern 141 covering the upper portion of the second discharge space may be referred to as a gap electrode part. Then, the sheet 130 is laminated thereon, and then the sheet 120 is laminated thereon. Subsequently, after filling the discharge medium 122 in the first discharge space portion of the sheet 120, an electrode pattern 121 is formed on the sheet 120. One end of the electrode pattern 121 is exposed to one end of the sheet 120 in the width direction, and the other end covers an upper portion of the first discharge space. The other end of the electrode pattern 121 covering the upper portion of the first discharge space may be referred to as a gap electrode part. The electrode patterns 121 and 141 are conductive patterns. Then, the sheet 110 is laminated on the sheet 120, and then the sheet 100 is laminated thereon. The electrode patterns 131 and 151 may be referred to as ground electrode patterns. Here, when the other end of the electrode pattern 121 and the central portion of the electrode pattern 131 are stacked with the sheets 120 and 130, the electrode patterns 121 are positioned to overlap each other with the discharge medium 122 of the first discharge space portion interposed therebetween. When the other end of 141 and the center of the electrode pattern 151 are stacked with the sheets 140 and 150, the discharge media 142 of the second discharge space portion is disposed to overlap each other. In FIG. 9A, the sheets 140 and 150 may be removed. This is because if the electrode pattern 121 is connected to an external terminal connected to the touch key side, since an overvoltage component such as ESD is mainly input through the touch key, the ESD pattern can be sufficiently attenuated before being applied to the integrated circuit unit 7 side. to be.

As such, when the stacking of the sheets 100, 110, 120, 130, 140, 150, and 160 is completed, the stack is formed. Use a pressure of approximately 500 to 2000 psi for stacking. After lamination, the laminate is compressed. Use a pressure of approximately 500 to 3000 psi for crimping. The compacted stack is cut to the appropriate size. When the laminate is cut periodically, the laminate is cut into a plurality of single chips. That is, a plurality of stacks in the form of a single chip as shown in FIG. 9B are generated.

Thereafter, a plurality of laminates in the form of a single chip are subjected to a degreasing and firing process. The degreasing process is performed at about 300 ° C. and then calcined at about 800 ° C. to 900 ° C. When the firing is completed, the gap between the electrode pattern 121 and the electrode pattern 131 overlapped vertically with the discharge medium 122 inside the body interposed therebetween, and the top and bottom overlapped with the discharge medium 142 inside the body therebetween. The gap between the electrode pattern 141 and the electrode pattern 151 is about 10 μm. The fired laminate is referred to as the body.

Then, external terminals 171, 172, 173, and 174 are formed on the outer surface of the body by using a conventional termination system as shown in FIG. 9C. The external terminal 171 is connected to the first connection pattern 101 and the electrode pattern 121, and the external terminal 172 is connected to the second connection pattern 102 and the electrode pattern 141. The external terminals 173 and 174 are connected to the electrode patterns 131 and 151. Here, the external terminals 171 and 172 are input / output terminals. For example, the external terminal 171 may be referred to as an input terminal and the external terminal 172 may be referred to as an output terminal. External terminals 173 and 174 are used as ground terminals.

The external terminals 171 to 174 are baked at a predetermined temperature to couple the bodies.

Finally, as shown in (d) of FIG. 9, a heat treatment after further laminating a protective sheet 175 for pattern protection or an insulating sheet capable of performing the same or similar functions to the top of the laminated sheet. do. Of course, the protective sheet 175 may be laminated together in the sheet stacking process. Alternatively, when the resistor pattern 103 is formed after sheet stacking, the protective sheet 175 is to be laminated before forming the resistor patterns 103 on the top of the body and before forming the external terminals 171 to 174. You may also

This completes the composite device of the fifth embodiment.

When the composite device of the fifth embodiment thus completed is installed in the touch key circuit, the external terminal 171 is connected to the touch key side and the external terminal 172 is connected to the internal terminal side of the integrated circuit unit 7. External terminals 173 and 174 are grounded. Thus, for example, the ESD flowing through the touch key is applied to a suppressor layer (that is, a region in which an electrode pattern overlapped with the discharge medium inside the body is formed between the discharge medium inside the body). It is blocked by gap discharge.

In the fifth embodiment described above, a gap discharge is made in the gap between the electrode patterns overlapping up and down inside the body with the discharge medium in the body interposed therebetween. Since the fifth embodiment faces the surface between the overlapping electrode patterns, the capacitance between the overlapping gap electrode portion and the ground gap electrode portion is slightly increased as compared with the case of the first to fourth embodiments described above. It is built in and has the advantage of being strong against physical shocks.

In addition, the three-terminal structure has the advantage that the circuit arrangement is easy.

On the other hand, the present invention is not limited only to the above-described embodiment, but can be modified and modified within the scope not departing from the gist of the present invention, the technical idea to which such modifications and variations are also applied to the claims Must see

1 is a diagram illustrating a digital TV with a conventional touch key installed.

2 is a view schematically illustrating a connection between a touch pad unit and an integrated circuit unit employed in a conventional digital TV.

3 is a circuit diagram of a touch key circuit having an electrostatic protection circuit according to the present invention.

4 is a view for explaining the configuration and manufacturing process of the composite device according to the first embodiment of the present invention.

5 is a view for explaining the configuration and manufacturing process of the composite device according to a second embodiment of the present invention.

6 and 7 are views for explaining the configuration and manufacturing process of the composite device according to a third embodiment of the present invention.

8 is a view for explaining the configuration and manufacturing process of the composite device according to a fourth embodiment of the present invention.

9 is a view for explaining the configuration and manufacturing process of the composite device according to a fifth embodiment of the present invention.

Claims (19)

A touch key circuit comprising a touch pad unit having a touch key and an integrated circuit unit having an internal terminal connected to the touch key and sensing whether the touch key is operated. A resistor provided between the touch key and an internal terminal of the integrated circuit unit connected thereto; And And an electrostatic protection element grounded at at least one end of the resistor connected to the touch key. The method according to claim 1, The electrostatic protection device is a touch key circuit, characterized in that the suppressor having a gap electrode. The method according to claim 1, The resistor is a touch key circuit, characterized in that having a resistance value of 50 ~ 200Ω. The method according to any one of claims 1 to 3, The resistance and the electrostatic protection element is a touch key circuit, characterized in that formed integrally. A composite device for electrostatic protection in a touch key circuit including a touch pad part having a touch key and an integrated circuit part having an internal terminal connected to the touch key and sensing whether the touch key is manipulated. A body in which a plurality of sheets are stacked; A first external terminal formed in the body and connected to the touch key; A second external terminal formed in the body and connected to the internal terminal; A resistor pattern formed on the body, one end of which is connected to the first external terminal via a first connection pattern and the other end of which is connected to the second external terminal via a second connection pattern; A first electrode pattern formed on a sheet inside the body and having a gap electrode portion exposed to the outside of the body and connected to the first external terminal; And A second electrode pattern formed on a sheet inside the body and having a ground gap electrode portion exposed to the outside of the body, And the first electrode pattern and the second electrode pattern are formed on different sheets and laminated. The method according to claim 5, And the gap electrode portion of the first electrode pattern and the ground gap electrode portion of the second electrode pattern overlap with each other to form a gap by a thickness of a sheet interposed therebetween. The method according to claim 5, A third electrode pattern formed on a sheet inside the body and having a gap electrode portion exposed to the outside of the body and connected to the second external terminal; And A fourth electrode pattern formed on the sheet inside the body, the fourth electrode pattern having a ground gap electrode portion exposed to the outside of the body; And the third and fourth electrode patterns are formed on different sheets to be stacked on one another, and are spaced apart from the first and second electrode patterns. The method according to claim 7, And the gap electrode portion of the third electrode pattern and the ground gap electrode portion of the fourth electrode pattern overlap with each other to form a gap by a thickness of a sheet interposed therebetween. The method according to claim 7, The first electrode pattern and the fourth electrode pattern are formed to be spaced apart from each other on the same sheet, and the second electrode pattern and the third electrode pattern are formed to be spaced apart from each other on the same sheet electrostatic in the touch key circuit Protective composite device. The method according to claim 5, The ground gap electrode portion of the second electrode pattern is exposed at both ends in the width direction of the sheet, A composite for electrostatic protection in a touch key circuit further comprising a third electrode pattern formed on a sheet inside the body and having a gap electrode portion exposed to the outside of the body and connected to the second external terminal. device. The method according to claim 10, The ground gap electrode portion of the second electrode pattern overlaps the gap electrode portions of the first and third electrode patterns, respectively, and forms a gap by the thickness of the sheet interposed between the overlapped ground gap electrode portion and the gap electrode portion. Composite device for electrostatic protection in the touch key circuit, characterized in that. The method according to claim 10, The first to third external terminals are formed to be spaced apart from each other on the first outer side of the body, and the first to third external terminals are spaced apart from each other on the second outer side of the body opposite to the first outer side. Formed, And the third external terminal is formed at the center of the corresponding outer surface. The method according to any one of claims 5 to 12, Further comprising first and second electrode pads spaced apart from each other on the bottom of the body, And the first electrode pad is connected to the first external terminal, and the second electrode pad is connected to the second external terminal. 14. The method of claim 13, And the gap electrode portion and the ground gap electrode portion are covered with a discharge medium. A composite device for electrostatic protection in a touch key circuit including a touch pad part having a touch key and an integrated circuit part having an internal terminal connected to the touch key and sensing whether the touch key is manipulated. A body in which a plurality of sheets are stacked; A first external terminal formed in the body and connected to the touch key; A second external terminal formed in the body and connected to the internal terminal; A first electrode pattern formed on the body and connected to the first external terminal and having a gap electrode portion; A second electrode pattern formed on the body and connected to the second external terminal; A resistor pattern formed on the body, one end of which is connected to the first external terminal and the other end of which is connected to the second electrode pattern; And And a ground electrode pattern formed to be spaced apart from the gap electrode portion on the body. The method according to claim 15, And the second electrode pattern further comprises a gap electrode part spaced apart from the ground electrode pattern to form a gap. A composite device for electrostatic protection in a touch key circuit including a touch pad part having a touch key and an integrated circuit part having an internal terminal connected to the touch key and sensing whether the touch key is manipulated. A first external terminal connected to the touch key; A second external terminal connected to the internal terminal; A first sheet including a resistor pattern having one end connected to the first external terminal through a first connection pattern and the other end connected to the second external terminal through a second connection pattern; A second sheet including a first electrode pattern formed at a center thereof, one end of which is connected to the first external terminal, and the other end of which covers an upper portion of the first discharge space; And A third sheet including a second electrode pattern contacting and grounded to a lower portion of the first discharge space, The first sheet, the second sheet and the third sheet of the electrostatic protection composite device in a touch key circuit, characterized in that laminated. The method according to claim 17, A fourth sheet including a third electrode pattern formed at a center thereof, one end of which is connected to the second external terminal, and the other end of which covers an upper portion of the second discharge space; And a fifth sheet including a fourth electrode pattern which is in contact with and grounded to the lower portion of the second discharge space. The method according to any one of claims 15 to 18, And the gap electrode portion and the ground gap electrode portion are covered with a discharge medium.

Images