KR20170010722A - Electric shock protection device and mobile electronic device with the same - Google Patents

Abstract

An electric shock protection device and a mobile electronic device having the same are provided. According to an embodiment of the present invention, the electric shock protection device comprises: an element in which a plurality of sheet layers are stacked; a resistor arranged inside the element, and electrically connected to first and second external electrodes; and a ground electrode arranged to face at least a part of the resistor, and electrically connected to a third external electrode. Accordingly, since thermal damages due to overheating can be prevented, resistance on an electric shock can be improved, and a user and an inner circuit can be protected from an electric shock by a power source.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electric shock protection device and a portable electronic device having the electric shock protection device.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electric shock protection device, and more particularly, to an electric shock protection device capable of effectively dissipating heat generated by an electric shock to improve resistance, and a portable electronic device having the same.

Generally, electric overstress (EOS) occurs in a variety of environments, such as, for example, charging, transforming, and motor drive circuits, in the form of an inrush current, or a starting current. At this time, an abnormal voltage increase causes a spark in the system, causing damage to components, components, and systems.

Such electrical overloads are typically discharged for several microseconds (μs) to seconds (s) due to electrical shocks, such as abnormal transients or transients, due to leakage currents and voltages of the equipment using the power source.

On the other hand, the electric overload is relatively low voltage as compared with the electrostatic discharge (ESD), but it is applied for a relatively long time, which may cause destruction of the insulating layer of the internal circuit, It is necessary to shut down.

Surge is also a transient waveform of electrical current, voltage, or power that rapidly increases in a short time in a wire or electric circuit, which is a factor causing insulation breakdown of the component or electronic device.

In addition, EMI (Electro Magnetic Interference) occurs during operation of an electronic device, and acts as noise to other electronic devices, resulting in malfunction.

Such electrostatic discharge, electromagnetic interference, surge, and electrical overload adversely affect the inside of the electronic device due to external electrical factors, and are collectively referred to as an electric shock in the present specification.

In order to protect against electric shock generated in the main circuit, a device such as a TVS (Transient Voltage Suppressor) or a varistor is used. However, since it has a function of simply bypassing an electric shock, Additional resistors are used. At this time, the resistor is formed on the surface of the protection device according to the manufacturing cost and process convenience, and is covered with an insulator such as overglazing.

However, when the resistor is heated by heat due to electric shock, particularly, when the resistor is overheated, the thermal conductivity of the insulator such as overglazing is low, so that the generated heat is not radiated to the outside. Therefore, the resistor is thermally damaged by overheating, and the insulator coated on the resistor is also damaged. Moreover, the thermal damage caused by overheating of such a resistor may cause a serious injury to the user.

Accordingly, there is a need for a method for effectively bypassing an electric shock and preventing thermal damage due to energy consumption.

KR 2012-0068212 A (June 26, 2012 open)

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electric shock protection device capable of improving resistance by effectively dispersing heat generated by an electric shock.

It is another object of the present invention to provide an electric shock protection device capable of further increasing resistance by consuming energy by an electric shock.

It is another object of the present invention to provide an electric shock protection element that can effectively protect an internal circuit from an electric shock according to a use by having a switching element suitable for an application.

Still another object of the present invention is to provide a portable electronic device having an electric shock protection function that can effectively block an electric shock generated from a power supply or a signal line.

In order to solve the above-described problems, the present invention provides a semiconductor device comprising: a body having a plurality of sheet layers stacked; A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And a ground electrode which is arranged to face at least a part of the resistor and is electrically connected to the third external electrode.

According to a preferred embodiment of the present invention, the ground electrode may be disposed on either the upper portion or the lower portion of the resistor.

On the other hand, the present invention provides a honeycomb structure comprising: a body having a plurality of sheet layers stacked; A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; A first inner electrode electrically connected to one of the first outer electrode and the second outer electrode; And a ground electrode which is arranged to face at least a part of the first internal electrode and is electrically connected to the third external electrode.

According to a preferred embodiment of the present invention, the first internal electrode is disposed between the resistor and the ground electrode, or the ground electrode is disposed between the resistor and the first internal electrode, or between the ground electrode and the first internal electrode The electrode may be disposed on either the upper or lower portion of the resistor.

The electrical shock protection device may further include a second internal electrode electrically connected to the other of the first external electrode and the second external electrode and disposed to face at least a part of the ground electrode. Here, the second internal electrode and the ground electrode may further include a switching element such as a varistor.

The second internal electrode may be disposed on the same plane as the first internal electrode. Here, the two switching elements can be provided in the same sheet layer, so that it is possible to miniaturize even though the two switching elements are provided.

The first external electrode and the second external electrode may be disposed on a side surface perpendicular to the third external electrode.

The first external electrode, the second external electrode, and the resistor may be made of the same material. Therefore, an increase in contact resistance due to a different thermal expansion coefficient between the first external electrode and the second external electrode and the resistor can be suppressed.

In addition, the same material may be a liquid containing at least one of a conductive metal and a ceramic and having a viscosity.

The resistor may be made of a paste containing at least one of a conductive metal and a ceramic, and may include at least one of the conductive metal and the ceramic.

The ceramic body may be any one of a glass, a varistor, a positive temperature coefficient (PTC) thermistor, and a negative temperature coefficient (NTC) thermistor. have.

In addition, the electrical shock may be any one of electrical overload (EOS), electrostatic discharge (ESD), surge, and electromagnetic interference (EMI).

Further, the same material may be at least one or more of Ag and Pd.

Further, the resistance body is made of a Ag / Pd paste, Pd capacity of 20 to 97 and% by weight, ZnO, Al ₂ O _3, Pr, Bi, Sb, Ni, Cr, and one or more public fortune (共材) of Cu . ≪ / RTI > Here, the addition of the porcelain is intended to increase the resistivity of the resistor.

The addition amount of the above-mentioned raw material may be 1 to 50% by weight.

Also, the resistor may have a pattern having a length equal to or greater than a distance between the first external electrode and the second external electrode, and a resistance value may be determined according to the length and the width of the pattern. Here, the pattern may be provided in various shapes such as a spiral shape and a zigzag shape.

In addition, the body is ZnO, BaTiO _3, and SrTiO, and include one or more of the _3, Pr, Bi, Ni, Mn, Cr, Co, Sb, Nd, Si, Ca, La, Mg, Al, Ti Sn, Nb , And Y may be contained as a dopant.

On the other hand, the present invention provides a honeycomb structure comprising: a body having a plurality of sheet layers stacked; A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And a switching element having a first electrode electrically connected to one of the first external electrode and the second external electrode, and a second electrode electrically connected to the third external electrode. do.

According to a preferred embodiment of the present invention, the switching element may include at least one of a varistor, a suppressor, a diode, and a gas tube.

According to another aspect of the present invention, A pad unit into which one of a power source and a signal is input; Internal circuitry; And an electric shock protection element having a first outer electrode and a second outer electrode electrically connected to the pad portion and the inner circuit portion, respectively, and a third outer electrode electrically connected to the ground portion, A portable electronic device having a protection function is provided. Here, the electric shock protection box may include: a body having a plurality of sheet layers stacked; A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And a switching element having a first electrode electrically connected to one of the first external electrode and the second external electrode, and a second electrode electrically connected to the third external electrode.

According to the present invention, since a resistor for interrupting an electric shock and consuming energy is embedded in a protective element to effectively dissipate heat generated in the resistor by energy consumption, thermal breakdown of resistance due to overheating can be prevented, The resistance against the electric shock can be improved.

The present invention also provides a method of manufacturing a semiconductor device in which the resistance material and the external electrode are made of the same material so that the contact resistance by the thermal expansion coefficient is reduced and the heat generated by the resistor is effectively dispersed Therefore, the resistance against electric shock can be further improved.

Further, since the present invention includes an arbitrary switching unit for bypassing an electric shock, it is possible to selectively use a protection element suitable for an application, thereby providing an electric shock protection function optimized for use.

Further, according to the present invention, since the electric shock protection element is provided between the power supply or the signal line and the internal circuit, the user and the internal circuit can be protected from the electric shock by the power supply.

1 is a perspective view illustrating an electric shock protection device according to an embodiment of the present invention;
Figure 2a shows the separation diagram of Figure 1,
FIG. 2B is a sectional view of FIG. 1,
Fig. 3 is an equivalent circuit diagram of Fig. 1,
4A to 4D illustrate various patterns of a resistor in an electric shock protection device according to an embodiment of the present invention,
5A and 5B are a perspective view and an end view, respectively, of an electric shock protection device according to an embodiment of the present invention.
6 is a sectional view showing still another example of the electric shock protection element according to an embodiment of the present invention,
7 is another equivalent circuit diagram of the electric shock protection device according to the embodiment of the present invention,
8 is a sectional view of an example corresponding to the equivalent circuit diagram of Fig. 7 in the electric shock protection element according to the embodiment of the present invention, Fig.
FIG. 9 is a cross-sectional view of another example corresponding to the equivalent circuit diagram of FIG. 7 in the electric shock protection element according to the embodiment of the present invention,
10 is a sectional view of still another example corresponding to the equivalent circuit diagram of FIG. 7 in the electric shock protection element according to the embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

The electric shock protection element 100 according to an embodiment of the present invention includes the bodies 110, 120 and 130, the resistor 122, and the ground electrode 132, as shown in FIGS. 1 and 2B.

The element body is formed by stacking a plurality of sheet layers 110, 120 and 130. Here, the first sheet layer 110 is the uppermost layer of the elementary body, the second sheet layer 120 is disposed below the first sheet layer 110, and the resistor 122 may be provided. have. The third sheet layer 130 is disposed below the second sheet layer 120 and may include the ground electrode 132. At this time, each of the sheet layers 110, 120, and 130 is formed to have the same thickness in the drawing, but the present invention is not limited thereto.

Each of the sheet bodies 110, 120 and 130 may be made of a material having a high thermal conductivity so as to disperse heat generated from the resistor 122.

For example, the body may include a ceramic material capable of mitigating electrical shock in the body. Here, the ceramic material may be any one of a glass, a varistor, a PTC (Positive Temperature Coefficient) thermistor, and a NTC (Negative Temperature Coefficient) thermistor. At this time, the electric shock may be any one of electric overload (EOS), electrostatic discharge (ESD), surge, and electromagnetic interference (EMI).

Alternatively, the body is ZnO, BaTiO _3, and SrTiO, and include one or more of the _3, Pr, Bi, Ni, Mn, Cr, Co, Sb, Nd, Si, Ca, La, Mg, Al, Ti Sn , Nb, and Y may be included as a dopant.

The resistor 122 is disposed inside the elementary body. That is, the resistor 122 is disposed between the first sheet layer 110 and the second sheet layer 120. The resistor 122 may be formed long in the longitudinal direction on the first sheet layer 110 so as to be electrically connected to the first external electrode 102 and the second external electrode 104, respectively.

As described above, since the resistor 122 is not disposed outside the elementary body but disposed inside the elementary body, that is, between the first sheet layer 110 and the second sheet layer 120, When energy is consumed by the resistor 122 due to the influx of the electric shock to generate heat, heat can be dispersed in the adjacent first sheet layer 110 and the second sheet layer 120, which are excellent in thermal conductivity. have. Therefore, even when the resistor 122 is overheated due to electrical shock, thermal damage can be suppressed, and resistance to electrical shock can be improved.

In addition, since the resistor 122 is disposed inside the body, the resistor 122 is supported on both sides by the first sheet layer 110 at the upper portion and the second sheet layer 120 at the lower portion , And a constant strength can be maintained.

Here, the first outer electrode 102 and the second outer electrode 104 may be disposed on a side perpendicular to the third outer electrode 106, as shown in FIG. Here, the second external electrode 104 is electrically connected to an internal circuit (not shown) in a portable electronic device, and the first external electrode 102 is electrically connected to a power line or a signal line (not shown) (Not shown) electrically connected to the first external electrode 106, and the third external electrode 106 may be connected to the ground of the circuit board. Here, the pad unit receives power or a signal to be applied to an internal circuit unit (not shown). The pad unit may be an interface terminal for connection to the outside of the internal circuitry such as a USB (Universal Serial Bus) terminal, an IEEE 1394 terminal, a serial port terminal, a parallel port terminal, and an e-SATA terminal.

In order to reduce the contact resistance, the first external electrode 102 and the second external electrode 102 may be formed of a material having a different thermal expansion coefficient from that of the external electrodes 102 and 104, (104).

For example, the resistor 122, the first external electrode 102, and the second external electrode 104 may include at least one of a conductive metal and a ceramic, and the viscosity may be a liquid.

At this time, the resistor 122 may be made of a paste containing at least one of conductive metal and ceramic. Here, the resistor 122 may include at least one of the conductive metal and the ceramic as a solid solution.

Alternatively, the resistor 122, the first external electrode 102, and the second external electrode 104 may be made of the same material including at least one of Ag and Pd.

At this time, the resistor 122 may be made of Ag / Pd paste. Here, the resistor 122 may have a high Pd content of 20 to 97% by weight.

On the other hand, the resistive body 122 can increase the specific resistance of the paste to achieve a resistance value for blocking an electric shock. That is, the resistor 122 may use a common material to increase the resistivity of the paste.

In one example, the resistor 122 may include at least one of the conductive metal and the ceramic. Here, in the resistor 122, the amount of the additive may be 1 to 50 wt%.

Alternatively, the resistor 122 may include ZnO, Al ₂ O _3, Pr, Bi, Sb, Ni, Cr, and one or more public fortune of Cu. Here, in the resistor 122, the amount of the additive may be 1 to 50 wt%.

At this time, the resistor 122 may be made of a material having a good thermal conductivity in order to disperse heat to the elementary body. Particularly, the resistor 122 may be made of the same ZnO material as that of the prism body.

Such a resistor 122 may be provided in various patterns on the second sheet layer 120 so as to have a resistance of a size suitable for blocking an electric shock and consuming its energy.

4A and 4B, the resistors 122-1 and 122-2 are formed on the first sheet layer 110 in such a manner that the distance between the first external electrode 102 and the second external electrode 104 And can be provided in a large length. That is, the resistors 122-1 and 122-2 may have a larger length in a zigzag pattern between the first external electrode 102 and the second external electrode 104. Also, as shown in FIG. 4B, the zigzag patterns may be provided at different intervals.

As shown in FIG. 4C, the resistor 122-3 may have a length equal to the distance between the first external electrode 102 and the second external electrode 104. That is, the resistor 122-3 may be arranged linearly between the first external electrode 102 and the second external electrode 104, and a plurality of patterns may be disposed.

As shown in FIG. 4D, the resistor 122-4 may be formed in a substantially "C" shape between the first external electrode 102 and the second external electrode 104. At this time, in order to reduce the contact resistance with the external electrodes 102 and 104, the connection portions of the external electrodes 102 and 104 may be formed to be wider than other patterns.

As described above, the resistor 122 may be provided in various patterns, and the resistance value may be determined according to the length of the pattern and the width of the pattern. Here, the resistor 122 shields the electric shock from flowing into the internal circuit (not shown) and consumes the energy of the electric shock applied thereto, and is a path through which electric shock first flows.

At this time, if the resistance value of the resistor 122 is too large, the electric shock can be sufficiently blocked, but the input signal can be attenuated more than necessary. Also, if the resistance value of the resistor 122 is too low, it is not possible to block the influx of the electric shock, and the internal circuit portion (not shown) may be damaged by a high current. Therefore, it is preferable that the resistor 122 is not broken by an electric shock, and that the signal applied to the pad portion has a resistance value capable of blocking an electric shock without unduly attenuating. That is, the resistor 122 can achieve a suitable resistance value by adjusting the length and width of the pattern as described above, and appropriately adjusting the addition amount of the paste contained in the paste.

Referring to FIG. 2A, the ground electrode 132 is disposed against at least a part of the resistor 122.

At this time, the ground electrode 132 is electrically connected to the third external electrode 106. That is, the ground electrode 132 may be disposed on the third sheet layer 130 in a straight line perpendicular to the resistor 122.

At this time, if the ground electrode 132 is stacked so as to face the resistor 122, its position is not limited. That is, the ground electrode 132 may be stacked on one of the upper and lower portions of the resistor 122.

As shown in FIG. 3, the electric shock protection device 100 constructed as described above can be represented by a switching device such as a varistor and an equivalent circuit of a resistor R.

That is, the electric shock protection element 100 is an element having three terminals (or external electrodes), and the first terminal (or the first external electrode 102) is connected to one side of the switching element and the resistor R (Or the second external electrode 104) is connected to the other side of the resistor R and the third terminal (or the third external electrode 106) It can be connected to the other side of the device and connected to ground.

In this case, the switching element may be formed between the resistor 122 and the ground electrode 132, as shown in FIGS. 1 and 2B. That is, the resistor 122 and the ground electrode 132 may be positive single-phase switches.

In addition, the resistor R may be formed by the resistor 122. At this time, the resistor R may substantially correspond to a portion of the resistor 122 except the portion facing the ground electrode 132. At this time, the resistor 122 may be provided in a pattern in which the length of the resistor R substantially becomes longer.

According to this configuration, when the electric shock is introduced from the outside, the resistor R blocks the electric shock applied thereto and consumes the energy, and at the same time, the electric shock applied to the bypass through the switching element bypasses (Not shown) electrically connected to the rear end of the electric shock protection element 100 can be protected.

5A to 6, in order to achieve a sufficient resistance value by the resistor 122, the first and second internal electrodes 200 and 200 ' (142). That is, the electric shock protection element 200 includes a body, a resistor 122, the ground electrode 132, and the first internal electrode 142.

Here, the element body includes a first sheet layer 110, a second sheet layer 120 having the resistor 122, and a third sheet layer 130 having the ground electrode 132, And a fourth sheet layer 140 having internal electrodes 142. The fourth sheet layer 140 may be formed of the same material as the first sheet layer 110, the second sheet layer 120, and the third sheet layer 130.

At this time, the first internal electrode 142 is electrically connected to either the first external electrode 102 or the second external electrode 104. That is, the first internal electrode 142 may be electrically connected to the second external electrode 104, as shown in FIG. 5B. Alternatively, the first internal electrode 142 may be electrically connected to the first external electrode 102.

The ground electrode 132 is stacked on at least a part of the first internal electrode 142 and is electrically connected to the third external electrode 106.

3, the resistor R of the equivalent circuit is composed solely by the resistor 122, and the switching element of the equivalent circuit is connected between the first internal electrode 142 and the ground electrode 132 As shown in FIG. That is, the first internal electrode 142 and the ground electrode 132 may be positive single-walled.

At this time, the switching element may be disposed independently of the resistor R. That is, when the first internal electrode 142 is connected to one of the external electrodes 102 and 104, the positions of the first internal electrode 142 and the ground electrode 132 are not limited.

For example, the first internal electrode 142 and the ground electrode 132 may be disposed under the resistor 122, as shown in FIG. 5B. Alternatively, the first internal electrode 142 may be disposed on the resistor 122.

The position of the first internal electrode 142 and the ground electrode 132 is not limited as long as the ground electrode 132 is stacked so as to face at least a part of the first internal electrode 142.

For example, as shown in FIG. 5B, the first internal electrode 142 may be stacked between the resistor 122 and the ground electrode 132. Alternatively, as shown in FIG. 6, the ground electrode 132 may be disposed between the resistor 122 and the first internal electrode 142.

The first internal electrode 142 is provided separately from the resistor 122 in order to form the switching element, thereby realizing an appropriate resistance value for shielding and consuming the electric shock.

At this time, the switching element is in the form of a varistor including the element body and the first internal electrode 142 and the ground electrode 132, but it is not limited thereto and various switching elements may be implemented in the fourth sheet layer 140 .

For example, when the switching element is implemented in a form of a surgeon, a gap may be formed between the first internal electrode 142 and the ground electrode 132. The switching device may be any one of a diode and a gas tube having the first internal electrode 142 and the ground electrode 132 at both ends. That is, the switching elements may be arranged in various forms in the fourth sheet layer 140.

Meanwhile, as shown in FIGS. 7 to 10, the electrical shock protection devices 400, 400 ', 400 "according to the embodiment of the present invention may further include a separate switching device.

That is, the electric shock protection devices 400, 400 ', and 400' may include a switching device such as a varistor connected to ground at both ends of the resistor R. [

The electric shock protection element 400 includes a body, a resistor 122, a ground electrode 132, a first inner electrode 142, and a second inner electrode 152, as shown in FIG.

Here, the element body includes a first sheet layer 110, a second sheet layer 120 having the resistor 122, a third sheet layer 130 having the ground electrode 132, And a fifth sheet layer 150 having the second internal electrode 152 in addition to the fourth sheet layer 140 having the electrode 142. The fifth sheet layer 150 may be formed of the same material as the first sheet layer 110, the second sheet layer 120, the third sheet layer 130 and the fourth sheet layer 140 Lt; / RTI >

At this time, the first internal electrode 142 is electrically connected to one of the first external electrode 102 and the second external electrode 104, and the second internal electrode 152 is electrically connected to the first external electrode 102 102) and the second external electrode (104). 8, the first internal electrode 142 is electrically connected to the first external electrode 102, the second internal electrode 152 is electrically connected to the second external electrode 104, As shown in FIG. Alternatively, the first internal electrode 142 may be electrically connected to the second external electrode 104, and the second internal electrode 152 may be electrically connected to the first external electrode 102 .

Here, each of the first internal electrode 142 and the second internal electrode 152 is stacked so as to face at least a part of the ground electrode 132.

7, the resistor R of the equivalent circuit is constituted by the resistor 122, the switching element of the equivalent circuit is connected between the first internal electrode 142 and the ground electrode 132, And may be formed between the second internal electrode 152 and the ground electrode 132, respectively. That is, the first internal electrode 142 and the ground electrode 132 are both ends of a switching element provided at a front end of the resistor R, and the second internal electrode 152 and the ground electrode 132 And the amount of the switching element provided at the rear end of the resistor R may be a single value.

At this time, the two switching elements may be disposed independently of the resistor R. That is, when the first internal electrode 142 and the second internal electrode 152 are connected to one of the external electrodes 102 and 104, the first internal electrode 142 and the second internal electrode 152 And the position of the ground electrode 132 are not limited.

For example, the ground electrode 132, the first inner electrode 142, and the second inner electrode 152 may be disposed under the resistor 122, as shown in FIG. Alternatively, the ground electrode 132, the first inner electrode 142, and the second inner electrode 152 may be disposed on the resistor 122.

At this time, if the first internal electrode 142 and the second internal electrode 152 are stacked so as to face at least a part of the ground electrode 132, their positions are not limited.

8, the first internal electrode 142 is disposed on the ground electrode 132, and the second internal electrode 152 is disposed on the lower portion of the ground electrode 132. [ As shown in FIG. Alternatively, the first internal electrode 142 may be disposed below the ground electrode 132, and the second internal electrode 152 may be disposed above the ground electrode 132.

In this way, by further including a separate switching element at the rear end of the resistor R, a path for bypassing an electric shock to ground can be additionally provided, thereby further enhancing resistance to an electric shock.

At this time, the two switching elements are connected to the varistor including the main body and the first internal electrode 142 and the ground electrode 132, or the varistor and the second internal electrode 152 and the ground electrode 132, Various switching elements may be implemented in the fourth sheet layer 140 and the fifth sheet layer 150. For example,

For example, when the two switching elements are implemented in the form of a surgeon, the first internal electrode 142 and the ground electrode 132, and between the second internal electrode 152 and the ground electrode 132 Respectively. As shown in FIG. The two switching elements are either a diode or a gas tube having both the first internal electrode 142 and the ground electrode 132 and the second internal electrode 152 and the ground electrode 132 respectively It can be one. That is, each of the switching elements may be disposed in various forms in the fourth sheet layer 140 and the fifth sheet layer 150. Furthermore, the two switching elements may be implemented in different forms.

At this time, the first internal electrode 142 and the second internal electrode 152 may be disposed on the same plane as shown in FIGS.

The first and second internal electrodes 162 and 164 are provided on one sheet layer 160 of the electric shock protection devices 400 'and 400'.

The first internal electrode 162 and the second internal electrode 164 are disposed on the same plane and connected to the external electrodes 102 and 104, When stacked, the position is not limited.

For example, the first internal electrode 162 and the second internal electrode 164 may be stacked between the resistor 122 and the ground electrode 132, as shown in FIG. Alternatively, as shown in FIG. 10, the ground electrode 132 may be disposed between the first internal electrode 162 and the second internal electrode 164 and the resistor 122.

According to such a configuration, since the electric shock protection elements 400 'and 400' 'can be implemented on one sheet layer without having to add a separate sheet layer in order to have two switching elements, Can be reduced in size as compared with the electric shock protection element 400 in which the electric shock protection element 400 is stacked.

The present invention will now be described more specifically with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

As shown in the following Table 1, Pb contained in the resistor and ZnO as a material are changed to form an electric shock protection element as shown in Figs. 2A and 2D, (EOS), and the resistance of the electrical shock protection device was observed.

Pb (% by weight) (% By weight) tolerance Example 1 35 5 Good Example 2 35 15 Good Example 3 35 30 Good Example 4 35 50 Good Example 5 50 One Good Example 6 50 15 Good Example 7 50 30 Good Example 8 50 40 Good Comparative Example 1 35 3 damage Comparative Example 2 35 55 damage Comparative Example 3 50 0.5 damage Comparative Example 4 50 45 damage

As can be seen from the above Table 1, when the resistors in Examples 1 to 8 contain an appropriate amount of the common material, the resistivity increases, so that the energy for the electric overload applied inside the electric shock protection device can be sufficiently consumed , The heat generated by the increased resistance is effectively transferred to the inside of the body, so that the resistance of the electric shock protection element is good.

On the other hand, when the resistor contains a small amount of the common material as in Comparative Example 1 and Comparative Example 3, the resistor is not thermally damaged due to insufficient energy for the applied electrical overload, and as in Comparative Example 2 and Comparative Example 4, If a large amount of vacancies is involved, the function of bypassing to ground is poor, and the electrical overload applied adds more energy to the resistor and the resistor is thermally damaged.

As a result, it can be seen that the resistance of the electric shock protection element can be improved by including 1 to 50% by weight of the material in the resistor in consideration of the formation pattern of the resistor, the composition of the internal electrode and the ground electrode, and the content of Pb .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100, 200, 200 ', 400, 400', 400 ": electric shock protection element
102, 104, 106:
110, 120, 130, 140,
122, 122-1, 122-2, 122-3,
132: ground electrode
142, 152, 162, 164:

Claims (20)

A body formed by stacking a plurality of sheet layers;
A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And
And a ground electrode electrically connected to the third external electrode in a stacked manner so as to face at least a part of the resistor. The method according to claim 1,
Wherein the ground electrode is stacked on one of the upper and lower portions of the resistor. A body formed by stacking a plurality of sheet layers;
A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively;
A first inner electrode electrically connected to one of the first outer electrode and the second outer electrode; And
And a ground electrode laminated on at least a part of the first internal electrode and electrically connected to the third external electrode. The method of claim 3,
Wherein the first internal electrode is stacked between the resistor and the ground electrode,
Wherein the ground electrode is stacked between the resistor and the first internal electrode,
Wherein the ground electrode and the first internal electrode are stacked on one of the upper and lower portions of the resistor. The method of claim 3,
Further comprising a second internal electrode electrically connected to the other of the first external electrode and the second external electrode, and stacked on at least a part of the ground electrode. 6. The method of claim 5,
And the second internal electrode is disposed on the same plane as the first internal electrode. The method according to claim 1 or 3,
Wherein the first external electrode and the second external electrode are disposed on a side surface perpendicular to the third external electrode. 8. The method of claim 7,
Wherein the first external electrode, the second external electrode, and the resistor are made of the same material. 9. The method of claim 8,
Wherein the same material comprises at least one of a conductive metal and a ceramic and is a liquid having a viscosity. 9. The method of claim 8,
Wherein said resistor comprises a paste comprising at least one of a conductive metal and a ceramic, and comprising at least one of said conductive metal and ceramic. 8. The method of claim 7,
Wherein said elementary body includes a ceramic material capable of mitigating an electric shock in said elementary body,
Wherein the ceramic material is one of a glass, a varistor, a PTC (Positive Temperature Coefficient) thermistor, and a NTC (Negative Temperature Coefficient) thermistor. 12. The method of claim 11,
Wherein the electrical shock is any one of an electrical overload (EOS), an electrostatic discharge (ESD), a surge, and an electromagnetic interference (EMI). 9. The method of claim 8,
Wherein the same material is at least one of Ag and Pd. 14. The method of claim 13,
The resistor is made of an Ag / Pd paste and has a high Pd content of 20 to 97% by weight and contains at least one of ZnO, Al ₂ O ₃ , Pr, Bi, Sb, Ni, Cr, An electrical shock protection element. 15. The method of claim 14,
Wherein the amount of the additive is 1 to 50 wt%. 8. The method of claim 7,
Wherein the resistor has a pattern having a length equal to or greater than a distance between the first external electrode and the second external electrode, and a resistance value is determined according to the length and the width of the pattern. 8. The method of claim 7,
The body is ZnO, BaTiO _3, and SrTiO, and include one or more of the _{3, Pr, Bi, Ni,} Mn, Cr, Co, Sb, Nd, Si, Ca, La, Mg, Al, Ti Sn, Nb, and Y as a dopant. A body formed by stacking a plurality of sheet layers;
A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And
And a switching element having a first electrode electrically connected to one of the first external electrode and the second external electrode, and a second electrode electrically connected to the third external electrode. 19. The method of claim 18,
Wherein the switching element comprises at least one of a varistor, a suppressor, a diode, and a gas tube. A grounding portion of the circuit board;
A pad unit into which one of a power source and a signal is input;
Internal circuitry; And
And an electric shock protection element having a first outer electrode and a second outer electrode electrically connected to the pad portion and the inner circuit portion, respectively, and a third outer electrode electrically connected to the ground portion,
The above-
A body formed by stacking a plurality of sheet layers;
A resistor disposed inside the body and electrically connected to the first external electrode and the second external electrode, respectively; And
And a switching element having a first electrode electrically connected to one of the first external electrode and the second external electrode, and a second electrode electrically connected to the third external electrode, A portable electronic device.

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