KR20100036778A - Plastic circuit board assembly - Google Patents

Plastic circuit board assembly Download PDF

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Publication number
KR20100036778A
KR20100036778A KR1020080096160A KR20080096160A KR20100036778A KR 20100036778 A KR20100036778 A KR 20100036778A KR 1020080096160 A KR1020080096160 A KR 1020080096160A KR 20080096160 A KR20080096160 A KR 20080096160A KR 20100036778 A KR20100036778 A KR 20100036778A
Authority
KR
South Korea
Prior art keywords
heat sink
circuit board
printed circuit
power
power element
Prior art date
Application number
KR1020080096160A
Other languages
Korean (ko)
Inventor
임지숙
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to KR1020080096160A priority Critical patent/KR20100036778A/en
Publication of KR20100036778A publication Critical patent/KR20100036778A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board assembly, comprising: a printed circuit board, at least two or more power elements mounted on one surface of the printed circuit board and having different heights in a mounted state; A heat sink arranged in contact with and parallel to one surface of a power element (hereinafter referred to as a "first power element") and a power element other than the heat sink and the first power element (hereinafter referred to as "second power element"). And a heat sink bar arranged to support the heat sink in parallel to the printed circuit board, thereby providing stability of electronic products.

Figure P1020080096160

Power element, heat sink, heat sink bar, static electricity, printed circuit board

Description

Printed Circuit Board Assembly {Plastic Circuit Board Assembly}

The present invention relates to a printed circuit board assembly, and more particularly, a printed circuit capable of preventing heat generation and preventing static electricity by connecting one heat sink to a plurality of power elements mounted with different thicknesses on a printed circuit board. It relates to a substrate assembly.

In recent digital electronics, a pulse width modulated power amplifier (PWM Power Amplifier) is widely used to supply power. In such a power amplifier, power elements 10 and 15 for supplying power in a switching operation are used to reduce the size and weight thereof.

As shown in FIG. 1, the power devices 10 and 15 for supplying power by switching in the power amplifier are mounted on the printed circuit board 5 as described above. As shown, various elements for configuring a power amplifier are mounted on one side of the printed circuit board 5. Among them, power devices 10 and 15 for supplying power through a switching operation are mounted on one surface of the printed circuit board 5.

Side surfaces of the power elements 10 and 15 are provided with mounting legs 11 and 16 for mounting on the printed circuit board 5. The power devices 10 and 15 serve to supply power for digital electronic products together with the components provided in the printed circuit board 5.

The power devices 10 and 15 generate a lot of heat during the switching operation process, and if the heat generated is not properly cooled, malfunctions of the electronic products frequently occur due to the generated heat.

In order to solve such a problem, conventionally, heat sinks 20 and 25 are disposed to be in direct contact with the front ends of the power devices 10 and 15 to dissipate heat transferred from the power devices 10 and 15. . As shown in FIG. 1, the heat sinks 20 and 25 may be respective heat sinks separately provided in one power element, and may be simultaneously contacted with a plurality of power elements 10 and 15. It may be one heat sink provided.

However, the conventional printed circuit board assembly configured as described above has the following problems.

In general, a plurality of power elements 10 and 15 as described above are provided according to each electronic product, and the size (volume) and capacity of the power elements 10 and 15 are different from each other. Therefore, when mounted on one surface of the printed circuit board 5 it is natural that the height of the tip is different.

Therefore, when a plurality of power elements 10, 15 are provided with one heat sink in contact with each other, there is a concern that the heat sinks may have poor contact due to different specifications or specifications of the plurality of power elements 10, 15, respectively. In this case, there is a problem in that the heat dissipation function of the power device 10, 15 using the heat sink is reduced.

Meanwhile, as illustrated in FIG. 1, when the heat sinks 20 and 25 are disposed in contact with each of the plurality of power elements 10 and 15, the above-described problems or specifications do not occur. According to the difference in the amount of heat transferred from the power device (10, 15) and the difference in the voltage value of the power device (10, 15) there is a problem of generating static electricity, which is a problem of malfunction of electronic products.

The solution of the static electricity problem as described above should secure a proper insulation distance to the static electricity, but this problem of ensuring the insulation distance will lead to a design problem on the printed circuit board (5).

According to the present invention, a plurality of power elements having different specifications or specifications, respectively, may be mounted on one surface of a printed circuit board, and a heat dissipation function may be faithfully performed by one heat sink disposed to be in contact with the plurality of power elements at the same time. It is an object of the present invention to provide a printed circuit board assembly.

The printed circuit board assembly according to the present invention includes a printed circuit board, at least two or more power elements mounted on one surface of the printed circuit board and having different heights in a mounted state, and having a larger height among the power elements. A heat sink arranged in contact with and parallel to one surface of a power element (hereinafter referred to as a "first power element"), and a power element other than the heat sink and the first power element (hereinafter referred to as "second power element") And a heat sink bar disposed between the support plates to support the heat sink in parallel to the printed circuit board.

In addition, the thickness of the heat sink bar may have a length corresponding to the separation distance between the second power element and the heat sink.

In addition, the heat sink bar may have one surface applied and adhered to the second power element by a coating material, and the other surface may be applied and adhered to the heat sink by a coating material.

In addition, the heat sink bar may be formed of the same material as the heat sink.

In addition, the heat sink and the heat sink bar is characterized in that the metal material having a high thermal conductivity.

The printed circuit board assembly according to the present invention has the effect of reducing the unit cost of the product because it can perform the heat dissipation function of the plurality of power elements with one heat sink.

In addition, the present invention has the advantage of solving the design problems of the printed circuit board assembly because there is less concern about the generation of static electricity than when using a plurality of heat sinks.

In addition, the present invention has the advantage that the product can be used because the distance between the plurality of power elements and the heat sink can be corrected by using a heat sink bar of the same material as the heat sink.

Hereinafter, a preferred embodiment of a printed circuit board assembly according to the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 illustrate a preferred embodiment of a printed circuit board assembly according to the present invention. 2 is a cross-sectional view showing a preferred embodiment of a printed circuit board assembly according to the present invention, Figure 3 is an exploded view showing the configuration of FIG.

Referring to FIG. 2, the printed circuit board assembly according to the present invention includes at least two or more printed circuit boards 105 and one or more printed circuit boards 105 having different heights in a mounted state. Power elements 110, 115).

Each of the power devices 110 and 115 is provided with mounting legs 111 and 116 for mounting on the printed circuit board 105. The power devices 110 and 115 together with the components provided on the printed circuit board 105 serve to supply power for digital electronic products. The plurality of power elements 110 and 115 may be mounted on the printed circuit board 105. In this case, the specifications and specifications thereof may be different from each other. In particular, in a preferred embodiment of the printed circuit board assembly according to the present invention, the plurality of power elements (110, 115) on the premise that they have different specifications or specifications, but the volume (or height even if the same specifications) ) Is based on the technical spirit of the present invention that may be equally applicable to other cases.

Meanwhile, the present invention further includes a heat sink 120 disposed in contact with and parallel to one surface of the power device 110 having a large height among the plurality of power devices 110 and 115. The heat sink 120 is disposed to be in contact with the power device 110 to receive heat generated from the power device to radiate heat to the outside. One surface of the heat sink 120 is integrally formed with a plurality of heat dissipation fins 121 that increase a heat transfer area so that heat transferred to the heat sink 120 is easily radiated.

Here, the present invention is characterized in that the heat sink 120 is provided with one heat sink 120 for simultaneously dissipating heat transferred from the plurality of power elements 110 and 115.

Hereinafter, for convenience of description, a power element having a relatively high height among the plurality of power elements 110 and 115 to which one heat sink 120 is contacted is referred to as a “first power element 110”. Shall be. For the convenience of description, power elements other than the first power element 110 will be referred to as "second power element 115".

In the present invention, for convenience of description, as illustrated in FIGS. 2 and 3, the plurality of power elements are assumed to be described as having two power elements 110 and 115, but the technical features of the present invention are described. The idea is not necessarily limited thereto, and it is obvious that the scope of the present invention should be grasped, including all three or more power elements.

The first power element 110 and the second power element 115 are basically different in height from the tip portion in the state in which the printed circuit board 105 is mounted. Therefore, when one heat sink 120 is arranged to be in contact with the front end portions of the first power element 110 and the second power element 115 at the same time, the heat sink 120 is inclined to the printed circuit The heat dissipation function may be deteriorated due to a poor contact with the second power device 115 or disposed on the substrate 105.

In order to solve this problem, in the printed circuit board assembly according to the present invention, the heat sink 120 and the second power element 115 are disposed between the heat sink 120 and the printed circuit board 105. It further comprises a heat sink bar 130 for supporting in parallel to).

The heat sink bar 130 is preferably formed such that its thickness (height) has a length corresponding to the separation distance between the second power element 115 and the heat sink 120. More preferably, the heat sink bar 130 may have a thickness corresponding to a difference value obtained by subtracting the height of the tip of the second power device 115 from the height of the tip of the first power device 110.

The heat sink bar 130 may be additionally arranged / repaired to correct the difference value when the height of the tip end of the first power element 110 and the height of the tip end of the second power element 115 are different from each other. It becomes the technical characteristic only of this invention which becomes. As described above, the printed circuit board assembly according to the present invention has the advantage that the heat sink bar 130 can be used in the design of the product by correcting the difference in the height value of the front end portion of the plurality of power elements.

As shown in FIG. 3, the heat sink bar 130 is bonded to one end of the second power element 115 by an adhesive material 135 applied by the coating material 140, and the other surface of the heat sink bar 130. The heat sink 120 may be bonded with an adhesive material 135 applied by the coating material 140. The adhesive material 135 performs a function of adhering the heat sink bar 130 to the heat sink 120 or the second power element 115, and heat generated from the second power element 115 It is provided with a material having a good thermal conductivity so that it can be transmitted to the heat sink 120 through the heat sink bar 130 more.

On the other hand, the heat sink bar 130 is formed of the same material as the heat sink 120 so that the thermal conductivity with the heat sink 120 is the same. Preferably, the heat sink 120 and the heat sink bar 130 may be formed of a metal material having high thermal conductivity.

As such, the printed circuit board assembly according to the present invention is capable of simultaneously dissipating heat transmitted by the plurality of power elements 110 and 115 having different heights from one end to one heat sink 120 at the same time. By minimizing the generation of static electricity there is an advantage that can implement the stability of the product.

1 is a cross-sectional view showing a printed circuit board assembly according to the prior art,

2 is a cross-sectional view showing a preferred embodiment of a printed circuit board assembly according to the present invention,

3 is an exploded view showing the configuration of FIG. 2.

<Explanation of symbols on main parts of the drawings>

105: printed circuit board 110: first power device

111, 116: mounting leg 115: second power element

120: heat sink 121: heat dissipation fin

130: Heatsink Bar 135: Adhesive

140: coating material

Claims (5)

A printed circuit board; At least two power elements mounted on one surface of the printed circuit board and having different heights in a mounted state; A heat sink arranged in contact with and parallel to one surface of a power element having a greater height among the power elements (hereinafter, referred to as a "first power element"); A printed circuit board including a heat sink bar disposed between the heat sink and a power element other than the first power element (hereinafter referred to as a "second power element") to support the heat sink in parallel to the printed circuit board. Assembly. The method according to claim 1, The thickness of the heat sink bar has a length corresponding to the separation distance between the second power element and the heat sink. The method according to claim 1, The heat sink bar, One surface is applied and bonded to the second power element by a coating material, Printed circuit board assembly, the other side is applied to the heat sink by a coating material. The method according to claim 1, The heat sink bar is a printed circuit board assembly formed of the same material as the heat sink. The method according to claim 4, The heat sink and the heat sink bar is a printed circuit board assembly of a high thermal conductivity metal material.
KR1020080096160A 2008-09-30 2008-09-30 Plastic circuit board assembly KR20100036778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080096160A KR20100036778A (en) 2008-09-30 2008-09-30 Plastic circuit board assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080096160A KR20100036778A (en) 2008-09-30 2008-09-30 Plastic circuit board assembly

Publications (1)

Publication Number Publication Date
KR20100036778A true KR20100036778A (en) 2010-04-08

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KR1020080096160A KR20100036778A (en) 2008-09-30 2008-09-30 Plastic circuit board assembly

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101307273B1 (en) * 2012-12-28 2013-09-11 엘아이지넥스원 주식회사 Printed circuit board and housing thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101307273B1 (en) * 2012-12-28 2013-09-11 엘아이지넥스원 주식회사 Printed circuit board and housing thereof

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