KR20100032703A - Organic light-emitting device and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An organic light-emitting device and a manufacturing method thereof are provided to form a suitable slim sealing structure suitable for a flexible display by successively laminating a protection film, an organic film and an inorganic shield. CONSTITUTION: An organic electroluminescent system(2~4) is formed on a substrate(1). An inorganic shield(5) is formed on an organic electroluminescent system. The inorganic shield covers up the side of the organic electroluminescent system. An organic film(6) is formed on the inorganic shield. A protection film(7) is formed on an organic film. A protection film is a macromolecular film or a metal foil. The organic film is from a material with an adhesive characteristic.

Description

Organic Light-Emitting Device And Manufacturing Method Thereof}

The present invention relates to an organic light emitting device and a method of manufacturing the same.

Liquid crystal display (LCD), which is the most widely used at present, is a non-light emitting display device, which consumes little power and is light. However, the device driving system is complicated and characteristics such as response time and contrast are not satisfactory. Therefore, researches on organic light emitting diodes (OLEDs), which are recently attracting attention as next-generation flat panel displays, are being actively conducted. The organic light emitting device is a self-luminous device and has various advantages such as excellent brightness, driving voltage, and response speed, and no viewing angle dependency, compared to the liquid crystal display.

In the organic light emitting diode (OLED), as shown in FIG. 1, a transparent electrode 20 such as ITO and IZO is generally used as an anode on a glass substrate 10, and then the organic material 30 emitting light is stacked. The cathode 40 is deposited and produced thereon. In the display, finely patterned anodes are separated by an insulating film or the like to form thousands to millions of pixels, and light emission is made with different brightness according to the signal applied to each pixel to form a screen. On the other hand, since the organic light emitting device for lighting should emit the same in a large area, the pattern is formed to be a light emitting device having a large large area instead of patterning for a fine pixel, thereby having one or several light emitting regions.

The organic light emitting device thus manufactured performs a sealing process. Since the organic light emitting device is very vulnerable to moisture and oxygen, it is necessary to protect the organic light emitting device from moisture and oxygen. The encapsulation technology of the organic light emitting device may be classified into three types, a method using a cap 60, a method of depositing a thin film, or a hybrid method using a combination of the two methods. However, most of the methods of manufacturing the organic light emitting device are mostly made by using a cap. In the encapsulation technology using the cap, the cap is made of glass or metal and forms a joint to prevent direct contact with the device, and the inner part is dug or stamped to make a step. Sealant 70 is applied to the junction, which serves to bond the cap to the substrate on which the organic light emitting device is made and to block the penetration of moisture and oxygen from the outside. This process is carried out in an inert gas atmosphere such as vacuum or N2 to reduce the effects on moisture and oxygen, but the inside of the cap to block the penetration of sealant or the effect of moisture oxygen adsorbed on the inside. Apply or paste getter (50) on the

The organic light emitting device encapsulation technology using a cap that is currently mainly applied has a disadvantage that the overall thickness of the panel is increased due to the thickness of the glass or metal (SUS) cap, and it is difficult to apply to a large area substrate. In addition, the cap of glass or metal is hard to apply to the flexible display because it is impossible to deform itself. In addition, the cap and the substrate glass are bonded with a sealant, UV curable epoxy, etc. At this time, there is a problem in that the stability of the sealant is lowered at a sudden temperature change due to thermal expansion coefficient between materials.

In order to solve the above problems, the present invention considered a method of depositing an aqueous layer alternately an inorganic film and an organic film on the organic light emitting device. This method has the advantage of being thinner and applicable to flexible substrates, but it requires several vacuum chambers for encapsulation, which increases the process cost and increases the tact time. There is a disadvantage that is not easy to apply.

Accordingly, the present invention further provides an organic light emitting device having a structure of a protective film, an organic film, and an inorganic barrier film, having a simple and thin structure, and having an encapsulation structure that is easy to apply to a large area or a flexible display and lighting. The purpose.

In addition, by encapsulating using a vacuum bag (air) to prevent the air remaining between the organic light emitting element and the encapsulation film or trapped air in the organic film and the like, by applying heat or UV to dry by even heat transfer and rapid thermal shock An object of the present invention is to provide a method for manufacturing an organic light emitting device that can prevent damage to the light emitting device.

In addition, it is possible to apply a uniform pressure to the front surface of the panel by applying a pressure by using a vacuum bag for close contact, and the organic light emitting device that can protect the organic light emitting device due to less pressure applied to the device as compared to the laminating method. It is an object to provide a method for manufacturing a device.

In addition, it is an object of the present invention to provide a technology for applying the encapsulation method as a method of device protection in a flexible display, solar cell, and the like.

Claims of the present invention Each claim may achieve one or more of the above objects, and those skilled in the art will readily appreciate the detailed description of the present invention even for purposes not described.

As a means for achieving the above object,

The present invention comprises the steps of forming an organic light emitting system on a substrate; Depositing an inorganic barrier film on the organic light emitting system; Coating an organic layer on the inorganic barrier layer; And adhering a protective film on the organic film, wherein the adhering the protective film on the organic film comprises placing the organic light emitting device in a vacuum bag. After the air in the vacuum bag is removed to create a vacuum state, a vacuum bag provides a method for manufacturing an organic light emitting device, characterized in that for pressing and bonding the organic light emitting device.

In addition, the step of adhering the protective film on the organic film provides a method of manufacturing an organic light emitting device, characterized in that additional heat.

In addition, the method of manufacturing an organic light-emitting device, characterized in that after the step of coating the organic film on the inorganic barrier film, the organic film is semi-cured by applying heat or ultraviolet rays, and after the step of adhering the protective film.

In addition, the inorganic barrier film provides a method for manufacturing an organic light emitting device, characterized in that the deposition on the side of the organic light emitting system to be covered.

In addition, the organic film provides a method of manufacturing an organic light emitting device, characterized in that formed to cover the side of the inorganic barrier film.

In addition, after the step of adhering the protective film on the organic film, it provides a method of manufacturing an organic light emitting device, characterized in that it further comprises the step of forming a sealant layer to cover the side of the organic film.

The invention also provides an organic light emitting system formed on a substrate; An inorganic barrier film formed on the organic light emitting system; An organic layer formed on the inorganic barrier layer; It provides an organic light-emitting device comprising a; and a protective film formed on the organic film.

In addition, the organic film provides an organic light emitting device, characterized in that the adhesive film is bonded to the protective film using a material having an adhesive property.

In addition, the inorganic barrier layer is at least one selected from SiO ₂ , SiON _x , Si ₃ N ₄ , Al ₂ O ₃ , MgF ₂ , CsCl, LiF, LiBO ₂ , ZrO ₂ , the organic layer is a liquid and cured by ultraviolet or heat It provides an organic light emitting device, characterized in that at least one selected from silicon, epoxy, urethane-based resins and derivatives thereof.

In addition, the protective film provides an organic light-emitting device, characterized in that at least one selected from a polymer film such as PET, PI, PES, PC, PEN or a metal foil such as Al, Cu, Sus.

In addition, the organic film provides an organic light-emitting device, characterized in that the absorbent is contained in an amount of 0.1 to 20% by weight based on 100% by weight of the total solid.

In addition, the moisture absorbent is selected from at least one of BaO, CaO, SrO, and provides an organic light emitting device, characterized in that the average particle diameter is 50nm or less.

In addition, the inorganic barrier film is formed so as to cover the side of the organic light emitting system, the organic film provides an organic light emitting device characterized in that formed to cover the side of the inorganic barrier film.

In addition, the organic light emitting device is characterized in that the sealant layer is formed to cover the side of the organic film.

An organic light emitting device and a method of manufacturing the same according to the present invention provide the following effects. First, it is possible to make the structure simple and thin with the structure of protective film, organic film and inorganic barrier film, and it is easy to apply to large area or flexible display and lighting. Second, by encapsulating by using a vacuum bag (bag) to prevent air remaining between the organic light emitting element and the encapsulation film or trap the air trapped in the organic film or the like and dried by applying heat or UV to the organic by even heat transfer and rapid thermal shock Damage to the light emitting device can be prevented. Third, it is possible to apply a uniform pressure to the front surface of the panel by applying a pressure using a vacuum bag for close contact, and it is possible to protect the organic light emitting device because the pressure applied to the device is less than the laminating method. Fourth, the present encapsulation method can be applied as a method of device protection in a flexible display, a solar cell, and the like.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

2 is an organic light emitting device according to an embodiment of the present invention, the organic light emitting system (2, 3, 4) formed on the substrate 1, the inorganic barrier film (5) formed on the organic light emitting system, the inorganic It characterized in that it comprises an organic film 6 formed on the blocking film 5, and a protective film 7 formed on the organic film (6). As an encapsulation structure, it has a structure of a protective film, an organic film, and an inorganic barrier film, so that the structure is simple and can be made into a thin film, which is easier to apply to a large area or a flexible display and lighting.

The present invention provides a method of manufacturing an organic light emitting device, comprising the steps of: forming an organic light emitting system on a substrate, depositing an inorganic barrier film on top of the organic light emitting system, coating an organic film on the inorganic barrier film, and The method of manufacturing an organic light emitting device comprising the step of adhering a protective film on the organic film, the step of adhering the protective film on the organic film, the vacuum after placing the organic light emitting device in a vacuum bag (bag) The present invention provides a method for manufacturing an organic light emitting device, wherein the vacuum bag presses and adheres the organic light emitting device by removing the air in the bag to create a vacuum state.

Hereinafter, the organic light emitting diode of the present invention and a method of manufacturing the same will be described together in detail, and a detailed description thereof will be omitted for the contents well known in the art.

The organic light emitting system includes any system that emits an organic material by applying an electric field, and a well-known configuration may be adopted, and the organic light emitting system is not limited.

An example is as follows. As shown in FIG. 1, the organic light emitting system may have an anode 2, an organic material layer 3, and a cathode 4 as a basic configuration, and the organic material layer may further include a hole transport layer, an electron transport layer, and the like based on the light emitting layer. Can be configured.

Examples of the anode material include metal oxides or metal nitrides such as ITO, IZO, tin oxide, zinc oxide, zinc aluminum oxide, and titanium nitride; Metals such as gold, platinum, silver, copper, aluminum, nickel, cobalt, lead, molybdenum, tungsten, tantalum and niobium; Alloys of these metals or alloys of copper iodides; Conductive polymers such as polyaniline, polythiopine, polypyrrole, polyphenylene vinylene, poly (3-methylthiopine), and polyphenylene sulfagard, and the hole transport layer is 4,4'-bis [N- (1-naphthyl) -N-phenyl-amino] -biphenyl (NPD) or N, N'-diphenyl-N, N'-bis (3-methylphenyl) -1,1'-biphenyl-4, Materials such as 4'-diamine (TPD) can be used. The material of the organic light emitting layer is a material that emits blue, red, green, respectively, is well known in the art and can be easily purchased on the market. The electron transport layer may comprise an aryl substituted oxadiazole, aryl-substituted triazole, aryl-substituted phenanthroline, benzoxazole, or benzthiazole compound, for example 1,3-bis ( N, Nt-butyl-phenyl) -1,3,4-oxadiazole (OXD-7); 3-phenyl-4- (1'-naphthyl) -5-phenyl-1,2,4-triazole (TAZ); 2,9-dimethyl-4,7-diphenyl-phenanthroline (vasocuproin or BCP); Bis (2- (2-hydroxyphenyl) -benzoxazolate) zinc; Or bis (2- (2-hydroxyphenyl) -benz thiazolate) zinc; As the electron transporting material, (4-biphenyl) (4-t-butylphenyl) oxadiazole (PDB) and tris (8-quinolinato) aluminum (III) (Alq3) can be used, preferably Tris ( 8-quinolinato) aluminum (III) (Alq3) is good, and the negative electrode may be a metal having a low work function such as Al, Ca, Mg, Ag.

The substrate is not limited as long as it is a substrate used in the art, preferably a glass substrate.

In the organic light emitting device of the present invention, the inorganic barrier film 5 and the organic film 6 are formed on the organic light emitting device to block external moisture and oxygen. First, an inorganic barrier film is directly deposited on the organic light emitting device to form a film. At this time, the inorganic barrier film used may be SiO ₂ , SiON _x , Si ₃ N ₄ , Al ₂ O ₃ , MgF ₂ , CsCl, LiF, LiBO ₂ , ZrO _2, etc., and are deposited using CVD, sputtering, evaportaion . At this time, the thickness of the inorganic barrier film is suitable between 100nm ~ 3000nm.

The organic layer 6 may be selected from at least one of silicon, epoxy, urethane-based resins and derivatives thereof that are liquid and cured by ultraviolet rays or heat.

The organic film is formed on the inorganic barrier film and may use liquid silicone, epoxy, urethane and derivatives thereof. The process of forming the organic layer from the liquid phase is preferably performed in a glove box filled with an inert gas or in an atmosphere in which oxygen and moisture are removed to prevent infiltration of oxygen and moisture during the process. As for the thickness of the organic film formed into a film, about 0.5 micrometer-about 100 micrometers are suitable. When the organic film formed is too thin, the blocking ability of oxygen or water is low and too high may cause stress on the lower film, increase drying or curing time, and difficulty in discharging residual organic solvent to the outside.

The organic film 6 is coated on the organic light emitting element and the substrate by spin coating, bar coating, slit coating, flexographic printing, gravure printing, offset printing, and cured by applying heat or UV. At this time, in the case where the organic film is cured by applying heat, the characteristics of the organic light emitting device may be lowered during curing at a high temperature, so the drying temperature is preferably 120 ° C. or lower.

In the present invention, the primary drying at this time is found that the adhesive force may be lowered when the protective film is adhered after the complete drying, and is dried at a level where many organic solvents are not released during the protective film process.

The present invention is also characterized in that the organic film 6 is bonded with the protective film 7 using a material having an adhesive property. The organic film can perform the adhesive function without the need for a separate adhesive to bond the protective film. For this purpose, a resin that is cured with heat or / and light may be used, and a curable resin used as a sealant may be used.

In order to perform the manufacturing process more effectively and give an adhesive function, after the step of coating the organic film on the inorganic barrier film, the organic film is semi-cured by applying heat or ultraviolet rays, and completely cured after the step of adhering the protective film. It is important. By semi-curing to suppress the fluidity of the organic film to prevent the organic film loss and non-uniformity in the process of placing the protective film on the organic film and to increase the adhesive strength by completely curing after the step of adhering the protective film.

The present invention is also characterized in that the inorganic barrier film 5 also covers the side surface of the organic light emitting system, and more preferably, the organic membrane 6 also covers the side surface of the inorganic barrier film 5.

That is, the size of the inorganic barrier film deposited on the organic light emitting system is formed to be 0.1mm to 3mm wider than the organic light emitting system to cover the organic light emitting system sufficiently, and similarly, the range of the organic film covering is 0.1mm to 3mm than the inorganic blocking film. To form more widely.

Meanwhile, a material capable of absorbing moisture may be added when necessary to form an organic layer, and BaO, CaO, and SrO may be used as such a material. BaO, CaO, SrO is a powder state of 50nm or less to mix in the organic film forming solution within 0.1 ~ 20% range to distribute evenly in the organic film after film formation. At this time, the moisture absorbent should be uniformly distributed in the organic film in the form of a powder, and its size is preferably 50 nm or less. More than this size and concentration may cause a dark spot or a lifespan phenomenon in the organic light emitting device. By adding the hygroscopic material, it is possible to remove moisture remaining in the process and to block moisture from the outside more effectively.

The protective film 7 may be positioned on the organic layer 6, and at least one selected from polymer films such as PET, PI, PES, PC, and PEN, or metal foils such as Al, Cu, and Sus may be used. The thickness of the film is suitably in the range of 20 µm to 200 µm.

Hereinafter, a method of adhering the protective film using a vacuum bag, which is one of the great features of the present invention, will be described in more detail.

The protective film 7 may be bonded using a vacuum bag to block air from entering. In order to completely remove the air in the organic light emitting device and the air between the device and the protective film, the organic film having the adhesive property on the substrate is coated through the above method, and then air is passed through the hole of the bag in the bag for vacuum encapsulation. By removing, the protective film is glued from one side so that the entire surface can be slowly bonded. During this process, the pressure for adhesion between the organic film and the protective film on the substrate is controlled through vacuum pressure. After closely contacting the organic film and the protective film, the substrate and the protective film may be bonded to each other by completely curing the organic film by applying heat or UV. Heat is uniformly applied above and below the vacuum bag, and the temperature is preferably 120 ° C. or lower to prevent deterioration of the characteristics of the organic light emitting device.

The present invention can prevent damage to the organic light emitting device due to even heat transfer and rapid thermal shock by drying by applying heat or UV as described above.

3 is an organic light emitting diode according to another exemplary embodiment of the present invention, wherein a sealant layer 8 is formed on a side surface of the organic layer 6. If necessary, in order to completely seal the device after drying, the side surface between the substrate and the protective film is sealed with a sealant layer using a UV curing agent so that the organic film is covered, thereby more effectively blocking the moisture and air that may enter from the side surface. Will be able to protect.

1 is a cross-sectional structure of an organic light emitting device encapsulation applied to the prior art,

2 is a novel encapsulation structure of an organic light emitting device according to an embodiment of the present invention

3 is an encapsulation structure including a side seal according to another embodiment of the present invention.

** Description of the main symbols in the drawings **

1: substrate

2: anode

3: organic layer

4: cathode

5: weapons barrier

6: organic membrane

7: protective film

8: sealant layer

Claims (15)

Forming an organic light emitting system on the substrate; Depositing an inorganic barrier film on the organic light emitting system; Coating an organic layer on the inorganic barrier layer; And A method of manufacturing an organic light-emitting device comprising a; attaching a protective film on the organic layer. The bonding of the protective film on the organic layer may include placing the organic light emitting device in a vacuum bag and then removing the air in the vacuum bag to create a vacuum state, such that the vacuum bag presses and adheres the organic light emitting device. The manufacturing method of the organic light emitting element made into. The method of claim 1, wherein the bonding of the protective film on the organic layer further comprises applying heat. The method of claim 1, wherein after the coating of the organic layer on the inorganic barrier layer, the organic layer is semi-cured by applying heat or ultraviolet rays and completely cured after adhering the protective film. . The method of claim 1, wherein the inorganic barrier layer is deposited to cover a side surface of the organic light emitting system. The method of claim 4, wherein the organic layer is formed to cover a side surface of the inorganic barrier layer. The method of claim 1, further comprising forming a sealant layer to cover the side surface of the organic layer after attaching the protective film to the upper portion of the organic layer. An organic light emitting device manufactured by the method according to any one of claims 1 to 6. An organic light emitting system formed on the substrate; An inorganic barrier film formed on the organic light emitting system; An organic layer formed on the inorganic barrier layer; And And a protective film formed on the organic layer. The organic light emitting device of claim 8, wherein the organic layer is bonded to the protective film using a material having adhesive properties. The method of claim 8, wherein the inorganic barrier layer is selected from at least one of SiO ₂ , SiON _x , Si ₃ N ₄ , Al ₂ O ₃ , MgF ₂ , CsCl, LiF, LiBO ₂ , ZrO ₂ , and the organic layer is liquid and UV. Or at least one selected from silicon, epoxy, urethane-based resins and derivatives thereof cured by heat. The organic light emitting device of claim 8, wherein the protective film is selected from at least one selected from polymer films such as PET, PI, PES, PC, and PEN, or metal foils such as Al, Cu, and Sus. The organic light-emitting device as claimed in claim 8, wherein the organic film contains 0.1 to 20 wt% of a moisture absorbent based on 100 wt% of the total solid content. The organic light-emitting device as claimed in claim 12, wherein the moisture absorbent is selected from at least one of BaO, CaO, and SrO, and an average particle diameter thereof is 50 nm or less. The organic light emitting device of claim 8, wherein the inorganic barrier layer is formed to cover the side surface of the organic light emitting system, and the organic layer is formed to cover the side surface of the inorganic barrier layer. The organic light emitting device according to any one of claims 8 to 14, wherein a sealant layer is formed to cover a side surface of the organic film.

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