KR20100030118A - Insert of apparatus of semiconductor package - Google Patents

Abstract

PURPOSE: The apparatus of a semiconductor package insert is provided to prevent a semiconductor package and the package insert from damaging due to the misalignment of the semiconductor package using a lateral side package guide. CONSTITUTION: A semiconductor package insert includes a package insert(100), a latch(130) and a latch open cover(200). A guide hole(120) is formed on the both side of the surface of the package insert. A package loading groove(110) is formed on the center of the package insert. The guide hole guides the guidepost of a pusher unit. The latch is installed to be rotated around a hinge pin(131) on the inner wall of the package loading groove and is opened while a semiconductor package is transferred.

Description

Semiconductor package insert {insert of apparatus of semiconductor package}

The present invention relates to a semiconductor package insert, and more particularly, when the semiconductor package produced through the semiconductor production process is supplied to the package insert to test whether it is properly manufactured in a high temperature or high voltage and low temperature environment, it is stably seated in a fixed position The present invention relates to a semiconductor package insert for preventing electrical breakage and detachment of a semiconductor package when the semiconductor package is attached to or detached from the semiconductor insert.

In general, the manufacturing process of the semiconductor package will be added little by little depending on the semiconductor device to be manufactured, but is basically manufactured by a common process of 18 steps.

The first stage is a single crystal growth stage, in which a single crystal silicon rod is grown while contacting and rotating the seed crystals with a highly purified silicon melt, and the second stage is a uniform silicon rod grown by silicon rod cutting. Step 3 is a step of polishing a thin wafer to make a mirror surface by polishing one side of the wafer, and forming a circuit pattern on the polished surface. In the circuit design stage, a CAD (Computer Aided Design) system is used to design circuit patterns to be drawn on electronic circuits and actual wafers.

The fifth step is to make a mask by drawing a circuit pattern designed as a mask manufacturing step on a glass plate, and the sixth step is an oxidation process step. Reacting to form a thin and uniform silicon oxide film (SiO2), Step 7 is a photo-resist coating step to apply a light-sensitive material (PR) evenly to the surface of the wafer, Step 8 An exposure process is a step in which a circuit pattern is photographed on a wafer on which a photoresist film is formed by passing light through a circuit pattern drawn on a mask using an exposure machine.

In addition, Step 9 is a development process to develop a film of the lighted part on the wafer surface, and Step 10 is an etching process to use a chemical or reactive gas to form a circuit pattern. Process step for selectively removing unnecessary parts, step 11 is ion implantation process step to accelerate the impurities in the form of fine gas particles in the part connected to the circuit pattern to penetrate the inside of the wafer to make the characteristics of the electronic device The impurity implantation is also performed by a diffusion process in which impurity particles are diffused into a wafer in a high temperature electric furnace.

The chemical vapor deposition (CVD) process is carried out in 12 steps. The process of depositing particles formed by chemical reaction between reaction gases on the wafer surface forms an insulating film or a conductive film. In step 13, metallization is performed. The process step of connecting each circuit formed on the wafer surface with aluminum wire as a process step, and the step 14 is an automatic wafer selection (EDS test) step. Step 15 is a wafer cutting step to transfer a wafer using a diamond saw to separate a large number of chips on the wafer, and step 16 is an EDS test of chips separated in a die bonding step. In step 17, the chip, which is judged to be a good product, is attached to the lead frame, and the step 17 is a wire bonding step. And the process steps to connect the connection terminal to the lead frame by a thin gold wire, a process that the resin is sealed with a chemical semiconductor device is finally completed in order finally to protect the gold wire connected to the portion 18 forming dangyeeun (Molding) step.

The semiconductor package produced through such a complicated process must pass the process of testing whether it meets the specified conditions in a high temperature or high voltage and low temperature environment. In order to receive such a test, the semiconductor package is carried out by a vacuum adsorption picker, which is a transport device. Supplied as a package insert.

The package insert is an article for moving the semiconductor package to the test zone by the driver so that the lead of the supplied semiconductor package is in electrical contact with the probe pin of the test socket when the semiconductor package is supplied.

In addition, the pusher unit is a mechanism for preventing the semiconductor package from flowing during the test of the semiconductor package by pressing the semiconductor package seated on the package insert with the pusher.

1 to 4 are diagrams schematically showing a general structure of a conventional package insert and a pusher unit.

That is, as shown in FIGS. 1 and 2, guide posts 41 for guiding a position when lifting and lowering the package insert 10 protrude downward from both ends of the pusher unit 40, and pushers as shown in FIG. 3. The center portion of the bottom surface of the unit 40 is provided with a pusher for pressing the semiconductor package 30 placed on the package insert 10.

In the conventional package insert 10, guide holes 12 for guiding the guide posts 41 of the pusher unit 40 are formed at both ends of the surface, and a package seat in which the semiconductor package 30 is inserted is placed at the center of the surface. A groove 11 is formed, and latches 13 are installed on both inner walls of the package seating groove 11 to prevent the semiconductor package 30 from being separated. Toggles for operating the latch 13 on the upper surfaces of both inner walls are provided. This protrusion is provided.

In addition, a latch open cover 20 is installed on the top surface of the package insert 10 to open the latch 13 by pressing a toggle, and the semiconductor package 30 is fixed at the bottom four corners of the package seating groove 11. Side guides are formed to guide positioning and guidance to be seated in position.

Such a conventional package insert has a latch opening while the latch open cover presses a toggle when the vacuum packaged semiconductor package is inserted into the package seating groove in a vacuum adsorption picker (not shown in the drawing) to test the semiconductor package. When the spring is compressed and opened, the semiconductor package guided by the package guide is seated on the bottom of the package seating groove.

When the force that presses the latch open cover is released, the toggle is raised. At this time, the latch is restored to its original position immediately under the tension of the spring, so as to hold both ends of the seated semiconductor package, an external shock is applied during the test process. Also, the semiconductor package will not be separated.

In addition, if the latch open cover is pressed after the test is completed, the latch is pushed back and opened while compressing the spring, thereby removing the semiconductor package.

Then, the pusher of the pusher unit which is lifted on the package insert presses the semiconductor package placed in the package seating groove of the package insert by the guide post guided by the guide hole so that the semiconductor package does not flow during the test.

However, in the conventional package insert, when the semiconductor package is inserted into the package seating groove, the side guides formed on all sides of the package seating groove are not accurately seated, and one end of the semiconductor package is placed in another part beyond the side guide position. Poor positioning results in poor yields during testing.

In other words, if the supply of the semiconductor package is poor or the position correction is poor, the semiconductor package cannot be inserted under the latch even if both latches are opened, and the package is placed over the latch. There is a lot of tendency to deviate from the insert.

In addition, if the semiconductor package is unstable and placed in an unstable position, the contact between the semiconductor package and the test socket is not stable in the test zone, thereby causing electrical contact problems, thereby deteriorating test stability and precision.

In addition, if the semiconductor package is not placed in an unstable position and is unstable, the semiconductor package and the package insert that are unstable when pressed into the pusher of the pusher unit are damaged, thereby degrading the safety of the test equipment.

In addition, if the shape of the package insert is changed, there is no compatibility of the pusher unit being used in the existing line, so it is not used as it is, and it must be replaced with a new pusher unit, which is a significant cost increase factor.

An object of the present invention is to supply and position the semiconductor package seated on the package insert is performed well to prevent the semiconductor package from falling off during a small impact or during the movement process, and also the electrical contact is stable to test It is to provide a semiconductor package insert that can increase precision.

Another object of the present invention is to prevent the breakage of the semiconductor package when pressing the semiconductor package seated on the package insert with the pusher, and to prevent the phenomenon that the package insert moves along the pusher when the pusher is raised to the top for detaching the semiconductor package In addition, even if the shape of the package insert is changed, it is to provide a semiconductor package insert that can achieve cost savings through the compatibility of equipment that can utilize the pusher unit used in the existing line as it is.

As described above, the present invention includes a package insert having guide holes for guiding the guide posts of the pusher unit at both ends of the surface, and having a package seating groove in which the semiconductor package is placed at the center thereof; A latch installed at both inner walls of the package seating groove so as to rotate about the hinge pin, the latch being opened when the semiconductor package is supplied and withdrawn; A latch open cover which is lifted on the package insert and opens the latch when it is lowered. In constructing the semiconductor package insert, a hinge pin and a pair of hinge pins are formed on both side inner walls perpendicular to both inner walls on which the latches of the package insert are installed. It characterized in that to form a package guide mounting portion provided with a spring support.

In the package guide mounting portion, a side package guide for guiding the semiconductor package to the correct position of the package seating groove is installed on the hinge pin by the hinge hole and installed in a rotatable manner so that the package guide is mounted toward the package seating groove. A pair of spring housings in which the coil springs are installed is provided on the side package guides so that the side package guides are rotated elastically toward the package seating grooves by the tension of the coil springs supported by the upper ends of the spring support parts. It is characterized in that the socket guide for guiding that the package guide is released to the package seating groove.

In particular, the hinge hole of the side package guide is formed to be a long hole in the vertical direction so that when the side package guide subjected to the tension of the coil spring is advanced toward the package seating groove, it protrudes while descending, and the side package guide retreats toward the package guide mounting portion. When the side package guide 140 is formed to be raised and entered, and provided with projections at the bottom of both sides of the side package guide 140, when the side package guide protrudes or enters the package guide mounting portion, it forms a space between the side package guide and the package guide mounting portion In order to reduce the friction between the side package guide and the package guide mounting portion, the object of the present invention can be achieved.

The present invention as described above is because when the semiconductor package is supplied to the package insert for testing, it is always stably seated in the correct position of the package seating groove by the side package guide, so when the pusher presses the seated semiconductor package, it is incorrectly placed as before. The semiconductor package and the package insert are prevented from being damaged, and the friction time between the pusher and the side package guide is minimized to prevent the package insert from moving when the pusher is raised.

In addition, the semiconductor package can always be seated in the determined position of the package insert, thereby maintaining stable contact with the test socket, thereby maintaining the stability and precision of the test, thereby increasing the yield in the test as much as possible, and the existing pusher unit. Because it can be used as it is, it can reduce the cost of equipment, thereby improving the quality and reducing the cost.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

That is, FIG. 5 is an exploded perspective view showing a structure of a semiconductor package insert according to the present invention, FIG. 6 is an exploded perspective view showing a semiconductor package mounted on a semiconductor package insert according to the present invention, and FIG. 7 is a semiconductor according to the present invention. 8 and 9 are cross-sectional views showing the operation of the side package guide of the semiconductor package insert according to the present invention.

Therefore, in the present invention, a guide hole 120 for guiding the guide post 410 of the pusher unit 400 is formed at both ends of the surface, and a package insert having a package seating groove 110 in which the semiconductor package 300 is placed in the center portion thereof. 100); A latch 130 installed pivotally around the hinge pins 131 at both inner walls of the package seating recess 110 and opened when the semiconductor package 300 is supplied and withdrawn; A latch open cover 200 which is lifted on the package insert 100 and opens the latch 130 when lowered; In configuring the semiconductor package insert, hinge pins 141 and a pair of spring support parts 151 are provided on both sides of the inner wall of the package insert 100 in the direction perpendicular to both inner walls on which the latch 130 of the package insert 100 is installed. Characterized in that to form a package guide mounting portion 150.

In addition, the package guide mounting portion 150 has a side package guide 140 for guiding the semiconductor package 300 to the correct position of the package seating groove 110 to be installed on the hinge pin 141 by the hinge hole 142. It is installed in a rotatable manner so as to be settled toward the seating groove 110, but the upper side is provided with a pair of spring receiving portion 148 in the side package guide 140, the coil spring 145 is installed inside the upper side is opened The side package guide 140 is elastically rotated toward the package seating groove 110 by the tension of the coil spring 145 supported by the support 151, the side package guide 140 at the bottom of the package insert 100 It is characterized in that the socket guide 500 is installed to guide the wandering toward the package seating groove 110.

Particularly, when the hinge hole 142 of the side package guide 140 is formed as a long hole in the vertical direction, the side package guide 140 receiving the tension of the coil spring 145 is advanced toward the package seating groove 110. It is characterized by being protruded while descending.

Then, when the side package guide 140 is reversed toward the package guide mounting portion 150, it is characterized in that it enters while rising.

In addition, both side lower ends of the side package guide 140 is provided with protrusions 149, when the side package guide 140 protrudes or enters from the package guide mounting portion 150, the side package guide 140 and the package guide mounting portion Forming a space between the 150, characterized in that to reduce the friction between the side package guide 140 and the package guide mounting portion 150.

That is, the feature of the present invention, a pair of side package guides rotated around the hinge pins 141 on both side walls in the direction orthogonal to both inner walls on which the latch 130 of the package seating groove 110 is installed ( 140 is provided to face each other inclinedly.

At this time, the side package guide 140 is installed in each of the package guide mounting portion 150, in which the hinge pin 141 and a pair of spring paper 151 is formed on the package guide mounting portion 150.

In addition, the side package guide 140 has a hinge hole 142 to which the hinge pin 141 of the package guide mounting unit 150 is coupled, and an upper end thereof is coupled to the spring support unit 151, and a lower end of the side package guide 140. Coil springs 145 fixed to the lower end are provided in the spring housing 148 provided at both ends.

As such, when the side package guide 140 protrudes into the package seating groove 110 by the elastic force of the coil spring 145, and the semiconductor package 300 is inserted into the package seating groove 110. The side package guide 140 is to be entered into each package guide mounting portion 150.

At this time, the hinge hole 142 formed in the side package guide 140 is formed as a long hole in the vertical direction, the semiconductor package 300 because the socket guide 500 is installed below the side package guide 140 When the side package guide 140 is inserted into the package seating groove 110 to enter the package guide mounting portion 150, the side package guide 140 is moved while moving upward.

When the side package guide 140 moves to the package guide mounting unit 150 while moving upward, the semiconductor package 300 is stably held on both sides until the semiconductor package 300 is fixed to the package mounting unit 110 to perform a stable operation. It can be.

In addition, by forming protrusions 149 on both side lower ends of the side package guide 140 to maintain a predetermined distance from the package guide mounting portion 150, the side package guide 140 protrudes from the package guide mounting portion 150 When entering, it can perform the correct operation without malfunction or vibration such as friction or jam.

1 is an exploded perspective view showing the structure of a conventional semiconductor package insert.

2 is a cross-sectional view showing the structure of a conventional semiconductor package insert.

3 is a cross-sectional view showing a state in which a semiconductor package is inserted into a conventional semiconductor package insert.

4 is a cross-sectional view showing a semiconductor package is incorrectly inserted into a conventional semiconductor package insert.

5 is an exploded perspective view showing the structure of a semiconductor package insert according to the present invention.

Figure 6 is an exploded perspective view showing the semiconductor package is mounted on the semiconductor package insert according to the present invention.

7 is a cross-sectional view showing a state of a semiconductor package insert according to the present invention.

8 and 9 are cross-sectional views showing the operation of the side package guide of the semiconductor package insert according to the present invention.

Explanation of symbols for the main parts of the drawings

100: package insert 110: package seating groove

130: latch 140: side package guide

141: hinge pin 142: hinge ball

145: spring 148: spring storage portion

150: package guide mounting portion 151: spring support

200: latch open cover 500: socket guide

Claims (3)

Package inserts 100 having guide holes 120 for guiding the guide posts 410 of the pusher unit 400, and a package seating groove 110 in which the semiconductor package 300 is placed in the center of the surface; A latch 130 installed pivotally around the hinge pins 131 at both inner walls of the package seating recess 110 and opened when the semiconductor package 300 is supplied and withdrawn; A latch open cover 200 which is lifted on the package insert 100 and opens the latch 130 when lowered; In constructing the semiconductor package insert, On both sides of the inner wall in a direction orthogonal to both inner walls on which the latch 130 of the package insert 100 is installed, a package guide mounting part 150 having a hinge pin 141 and a pair of spring supporting parts 151 is formed on an upper end thereof. and, The package guide mounting portion 150 has a side package guide 140 for guiding the semiconductor package 300 to the correct position of the package seating groove 110 on the hinge pin 141 by the hinge hole 142 to install the package seating groove. Install in a rotational manner so that it emerges toward (110) Coil spring 145 having the upper end is caught on the spring support 151 by having a pair of spring receiving part 148 in the side package guide 140 having the coil spring 145 installed therein in the upper side is opened. The side package guide 140 is elastically rotated toward the package seating groove 110 by the tension of the, At the bottom of the package insert 100, a socket guide 500 for guiding that the side package guide 140 is sunk toward the package seating groove 110 is installed. Semiconductor package insert, characterized in that. The method of claim 1, The hinge hole 142 of the side package guide 140 is formed as a long hole in the vertical direction When the side package guide 140, which receives the tension of the coil spring 145, is advanced toward the package seating groove 110, protrudes while descending. When the side package guide 140 is reversed toward the package guide mounting portion 150, the semiconductor package insert, characterized in that the rising as entered. The method according to claim 1 or 2, Both side lower ends of the side package guide 140 is provided with protrusions 149, When the side package guide 140 protrudes or enters from the package guide mounting unit 150, a space is formed between the side package guide 140 and the package guide mounting unit 150 to form a space between the side package guide 140 and the package guide mounting unit ( A semiconductor package insert, characterized in that to reduce the friction of 150).

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