KR20100029980A

KR20100029980A - Board assembly

Info

Publication number: KR20100029980A
Application number: KR1020080088709A
Authority: KR
Inventors: 김성환
Original assignee: 엘지전자 주식회사
Priority date: 2008-09-09
Filing date: 2008-09-09
Publication date: 2010-03-18

Abstract

The present invention relates to a substrate assembly. More specifically, when a large amount of heat and electromagnetic waves are generated in a circuit component mounted on a PCB circuit board, it maximizes heat generation performance and effectively shields electromagnetic waves, and is wasteful to install components for heat dissipation and electromagnetic shielding on the PCB circuit board. The invention relates to a substrate assembly that can minimize the area of the PCB circuit board.

Description

Board Assembly {BOARD ASSEMBLY}

In general, a chip or the like as a circuit component installed in an electronic product generates a large amount of heat during operation. If the heat is continuously maintained without heat dissipation in the chip, the chip not only generates heat but also affects other adjacent and heat-sensitive components, causing malfunction or failure of the electronic product.

In particular, this heat generation is more concentrated in the circuit components that perform a specific function than the substrate itself.

Therefore, in order to prevent this, there is a need for a heat radiation device that absorbs high temperature heat generated during driving and radiates to the outside.

In order to install a separate heat dissipation device on a circuit component having a high heat generation, a fastening hole is formed in a circuit board on which the circuit parts are mounted, and the heat dissipation device is mounted on the board in contact with the circuit parts.

The circuit component having a large amount of heat is electrically connected to peripheral components to perform data processing. The fastening hole for coupling the heat dissipation device wastes an area of a board having a high degree of integration of circuit components.

In particular, since the mounting position of the parts with a lot of data processing and high heat generation is a high integration portion of the substrate, it is difficult to provide a mounting place for mounting the heat dissipation device. In addition, even if a mounting place is provided, since the mounting work for mounting the heat dissipation device is performed in a narrow place, the work efficiency may be reduced.

The recent trend is to reduce the volume and size of the electronics themselves, and the size of the board on which the circuit components mounted therein are also intended to reduce the size by efficiently changing the integration and placement of the circuit components.

Therefore, forming the fastening holes for mounting the heat dissipation device on the substrate on which the circuit components are mounted results in waste of the substrate.

In addition, components mounted in digital products generate not only heat but also a considerable amount of electromagnetic waves. Such electromagnetic waves generate electromagnetic noise or electromagnetic interference (EMI).

Recently, as the clock frequency used for a chip increases, the intensity of electromagnetic noise or electromagnetic interference radiated through the chip surface also increases.

The electromagnetic disturbance adversely affects not only the electronic products that emit them, but also electronic products and users such as communication equipment, control equipment, and computer equipment exposed to the electromagnetic waves.

In the case of electromagnetic interference directly radiated from a circuit component, such amplification may be amplified by a heat radiating device provided to radiate heat generated from the circuit component, and its strength may be enhanced to radiate to the outside.

In addition, the method of mounting the electromagnetic shielding device for shielding the electromagnetic wave on the substrate also has the disadvantage that wastes the area of the substrate on which the circuit component is mounted, similarly to the heat dissipation device.

The present invention was created to solve the above problems, and effectively radiates heat generated from circuit components mounted on a substrate to the outside, effectively shields electromagnetic waves generated from circuit components, and radiates heat to the substrate on which the circuit components are mounted. The technical problem to be solved to provide a substrate assembly that can minimize the area of the substrate is wasted in order to mount the device and the electromagnetic shielding device.

In order to solve the above problems, the present invention provides a substrate on which a circuit component is mounted, a heat dissipation device positioned on the upper or lower portion of the substrate, and the heat dissipation device coupled to the heat dissipation device to accommodate the heat dissipation device, covering the upper and lower portions of the substrate. It provides a substrate assembly comprising an electromagnetic shielding housing.

The electromagnetic shielding housing may include an upper housing and a lower housing covering the upper and lower portions of the substrate, and the upper housing and the lower housing may be fixed to each other while receiving the substrate and the heat dissipation device.

In this case, a first heat dissipation pad may be further provided between the substrate and the heat dissipation device.

Here, a second heat dissipation pad may be further provided between the heat dissipation device and the electromagnetic shielding housing.

The heat dissipation device and the electromagnetic shielding housing may be fastened by separate fastening members.

In addition, the fastening member may be fastened to the heat dissipation device through the electromagnetic shielding housing.

In this case, the heat dissipation device may have at least one heat dissipation fin.

Here, the housing may be formed integrally with one of the upper housing and the lower housing, and may include at least one fastening arm fixed to the other housing through the substrate.

In addition, the fastening arm may be fixed by penetrating or bending after passing through the other housing.

In this case, the fastening arm may penetrate a portion of the substrate having a low integration degree.

According to the substrate assembly according to the present invention, it is possible to effectively radiate heat generated from the circuit components mounted on the substrate to the outside, and effectively shield electromagnetic waves generated from the circuit components.

In addition, according to the substrate assembly according to the present invention, to provide a substrate assembly capable of minimizing the area of the substrate wasted in order to mount the heat dissipation device and the electromagnetic shielding device on the substrate on which the circuit component is mounted. do.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art. Like numbers refer to like elements throughout.

1 is an exploded perspective view of one embodiment of a substrate assembly according to the present invention.

The substrate assembly according to the present invention is coupled with the heat dissipation device 200 and the heat dissipation device 200 located on the substrate 100, the heat dissipation device 200 located above or below the substrate 100, and the heat dissipation device 200. And an electromagnetic shielding housing 300 covering the upper and lower portions of the substrate 100.

In the embodiment shown in Figure 1, the size of the substrate on which the circuit component is mounted and the size of the electromagnetic shield housing is shown similarly, but this is for the effective description of the invention, the size of the substrate can be greatly expanded.

Since the heat dissipation device 200 is fastened to the electromagnetic shielding housing 300, a waste area of the substrate 100 for directly mounting the heat dissipation device 200 to the substrate 100 may be minimized.

In the substrate 100 constituting the substrate assembly, various circuit components are mounted on the PCB substrate 100 or the like. The generation of heat and electromagnetic waves among the components mounted on the substrate 100 may occur intensively in a circuit component in the form of a chip 110.

The chip 110 generates electromagnetic waves and heat while receiving and processing data and other components electrically connected thereto, and transmitting the processed data to the other components.

First, a heat dissipation device 200 for effectively radiating heat generated from the substrate 100 is provided above or below the substrate 100. The heat dissipation device 200 may be mounted on the upper or lower portion of the substrate 100 according to the heat generation characteristics of the circuit component mounted on the substrate 100. In consideration of the heat generation characteristics of the substrate 100, when the amount of heat is generated at both the top and the bottom of the substrate 100, the heat dissipation device 200 may be provided at both the top and the bottom of the substrate 100.

In addition, the heat dissipation device 200 may be mounted in contact with the substrate 100 or the chip 110 mounted on the substrate 100. This is for effectively absorbing heat generated from the substrate 100.

In addition, the substrate assembly according to the present invention includes an electromagnetic shielding housing 300 coupled to the heat dissipation device 200 to receive the heat dissipation device 200 and covering the upper and lower portions of the substrate 100.

The electromagnetic shielding housing 300 accommodates the heat dissipation device 200. Since the heat dissipation device 200 may amplify the electromagnetic waves generated from the substrate 100, the heat dissipation device 200 is configured to be the electromagnetic shielding housing 300, not the heat dissipation device 200.

As shown in FIG. 1, the electromagnetic shielding housing 300 includes an upper housing 300a and a lower housing 300b covering the upper and lower portions of the substrate 100. The upper housing 300a and the lower housing 300b are fastened or bonded to each other in a state in which the substrate 100 and the heat dissipation device 200 are accommodated.

The substrate 100 has a plate shape, and the heat dissipation device 200 mounted on the upper or lower portion of the substrate 100 may have a predetermined thickness because heat dissipation fins 210 may be provided to enlarge the heat dissipation area. .

Therefore, the electromagnetic shielding housing 300 has a space for accommodating the heat dissipation device 200 therein.

The upper housing 300a and the lower housing 300b constituting the electromagnetic shielding housing 300 of the substrate assembly according to the present invention are fastened to the heat dissipation device 200 accommodated therein.

In the embodiment shown in Figure 1, the heat dissipation device 200 is provided on the upper portion of the substrate 100, the heat dissipation device 200 is fastened to the upper housing (300a). A fastening hole 220 is formed on the heat dissipation fin 210 of the heat dissipation device 200, and a fastening member 400 inserted into the fastening hole 220 through the upper housing 300a is used. Bolting member may be used as the fastening member 400.

A fastening arm may be fastened to the upper housing 300a and the lower housing 300b so as to be coupled with the substrate 100 interposed therebetween.

In the embodiment shown in FIG. 1, the fastening arm is shown integrally extending with the upper housing 300a.

The fastening arm simply penetrates through the substrate 100 to be fastened or bonded to the lower housing 300b.

If it is not fastened with the substrate 100 and simply penetrates, the waste area of the substrate 100 may be minimized. An area in which heat and electromagnetic waves are concentrated in the substrate 100 is the chip 110 mounted on the substrate 100 and its periphery. Therefore, when the heat dissipation device 200 and the electromagnetic shielding housing 300 are independently mounted for heat dissipation and electromagnetic wave shielding of the specific chip 110, the degree of integration of components near the chip 110 mounted on the substrate 100 is integrated. There is a problem of wasting a large area.

However, as shown in the embodiment shown in FIG. 1, the fastening arm penetrates or bonds to the lower housing 300b through the edge of the substrate 100. Bonding of the upper housing 300a and the lower housing 300b may be fixed by soldering or the like without a separate fastening member.

2 shows another embodiment of a substrate assembly according to the invention. In the embodiment shown in FIG. 2, the substrate assembly further includes a first heat radiation pad 150 provided between the substrate 100 and the heat dissipation device 200.

The first heat dissipation pad 150 is a soft rubber or liquid material, and quickly absorbs heat generated from the substrate 100 to uniformly transfer heat from the contact surface with the heat dissipation device 200. Have

The substrate 100 is equipped with various circuit components and chips 110, and in particular, the amount of heat generated by the various chips 110 among the circuit components is considerable. However, when the heat dissipation device 200 is mounted on the substrate 100 on which the chip 110 is mounted without a separate heat dissipation pad, heat is transferred only from the protruding chip 110 of the substrate 100. The endothermic performance may drop. In the embodiment shown in Figure 2, the heat dissipation device 200 has a size that can cover the entire substrate (100).

Therefore, in order to maximize the heat dissipation performance of the heat dissipation device 200, it is preferable that the first heat dissipation pad 150 be provided to enlarge the contact area between the substrate 100 and the heat dissipation device 200.

Other configurations are common to those described with reference to FIG. 1, and thus descriptions thereof will be omitted.

3 shows another embodiment of a substrate assembly according to the invention. In the embodiment illustrated in FIG. 3, the second heat dissipation pad 250 is further provided on the heat dissipation device 200.

The heat dissipation device 200 also includes a heat dissipation fin 210 to expand the heat dissipation area, but is further provided with a second heat dissipation pad 250 to further accelerate the heat dissipation speed and further expand the heat dissipation area. can do.

Since the second heat radiation pad 250 is penetrated by the fastening member 400, an opening 255 is formed.

4 shows an assembled state of a substrate assembly according to the invention.

Specifically, FIG. 4A illustrates a state in which the upper housing 300a of the substrate assembly is assembled. In the state in which the upper housing 300a is assembled, the fastening arm protrudes downward through the edge of the substrate 100.

4B illustrates a state in which the upper housing 300a and the lower housing 300b are bonded to each other. The substrate assembly may be completed by forming a through hole through which the fastening arm can pass in the lower housing 300b, and then assembling, and fixing the lower housing 300b and the fastening arm after assembly.

As shown in FIG. 4 (b), the bonding portion A is a portion where the fastening arm and the lower housing 300b are joined by soldering or the like. Of course, the method of bonding the upper housing 300a and the lower housing 300b may be variously modified. That is, a separate fastening member may be used, and a method of bending the fastening arm may be used.

Therefore, the length of the fastening arm projecting out of the housing may be such that soldering or bending is possible.

The fastening arm is integrally formed with one of the upper housing 300a and the lower housing 300b. The housings may be manufactured by bending metal plates.

Therefore, in order to minimize the area where the fastening arm penetrates the substrate 100, the cross section of the fastening arm may be formed of a plate having a “−” character.

Therefore, the method of joining or bending the upper housing 300a and the lower housing 300b may be simpler than a method of using a separate fastening member.

5 is a cross-sectional view of a substrate assembly in accordance with the present invention. Specifically, it is sectional drawing of the completion state of the board | substrate assembly shown in FIG.

As shown in the cross-sectional view of FIG. 5, the upper housing 300a is directly fastened to the heat dissipation device 200, and is not fastened to the substrate 100 and the fastening member.

The first heat dissipation pad 150 interposed between the substrate 100 and the heat dissipation device 200 efficiently absorbs heat generated from the substrate 100, and the substrate 100 and the heat dissipation device 200. ) To enlarge the contact area of the This is because the first heat dissipation pad 150 may be made of a flexible material.

The heat dissipation pad made of a flexible material cancels the height difference of the substrate 100 due to the circuit components installed on the substrate 100, and enlarges the contact area with the substrate 100 to enable an effective endothermic process. The heat absorbed can be quickly transferred to the heat dissipation device 200.

The heat dissipation pad for expanding the heat transfer acceleration function and the contact area may be interposed between the upper portion of the heat dissipation device 200 and the electromagnetic shielding housing 300 in addition to the substrate 100 and the heat dissipation device 200.

Although the present specification has been described with reference to preferred embodiments of the invention, those skilled in the art may variously modify and change the invention without departing from the spirit and scope of the invention as set forth in the claims set forth below. It could be done. Therefore, it should be seen that all modifications included in the technical scope of the present invention are basically included in the scope of the claims of the present invention.

2 shows another embodiment of a substrate assembly according to the invention.

3 shows another embodiment of a substrate assembly according to the invention.

4 shows an assembled state of a substrate assembly according to the invention.

5 is a cross-sectional view of a substrate assembly in accordance with the present invention.

** Description of symbols for the main parts of the drawing **

100: substrate 150: the first heat radiation pad

200: heat dissipation device 210: heat dissipation fin

250: second heat radiation pad 300: electromagnetic shielding housing

300a: upper housing 300b: lower housing

400: fastening member

Claims

A board on which circuit components are mounted;

A heat dissipation device positioned above or below the substrate; And,

And an electromagnetic shielding housing coupled to the heat dissipation device to receive the heat dissipation device and to cover an upper portion and a lower portion of the substrate.

The method of claim 1,

The electromagnetic shielding housing includes an upper housing and a lower housing covering upper and lower portions of the substrate, wherein the upper housing and the lower housing are fixed to each other while receiving the substrate and the heat dissipation device. .

The method of claim 1,

And a first heat dissipation pad between the substrate and the heat dissipation device.

The method of claim 3,

And a second heat dissipation pad between the heat dissipation device and the electromagnetic shielding housing.

The method of claim 1,

And the heat dissipation device and the electromagnetic shielding housing are fastened by separate fastening members.

The method of claim 5,

And the fastening member is fastened to the heat dissipation device through the electromagnetic shielding housing.

The method of claim 1,

And the heat dissipation device has at least one heat dissipation fin.

The method of claim 2,

And at least one fastening arm formed integrally with one of the upper housing and the lower housing and fixed to the other housing through the substrate.

The method of claim 8,

And the fastening arm is fixed in a manner of being soldered or bent after passing through the other housing.

The method of claim 8,

The fastening arm is a substrate assembly, characterized in that penetrating through the portion of the low integration degree of the circuit component.