JPH10214045A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To absorb heat generated by a semiconductor as to COG(chip-on glass) of a flat plate display. SOLUTION: In the figure, 1 is 1st glass of the display and 2 is 2nd glass of the display. Further, 3 is a driver circuit and connected by COG technology on a pattern formed on the surface of the glass 2 so that an integrated circuit formation surface is in contact with the glass. Then 4 is a metallic front case and a heat-conductive sheet 5 is fitted at the position where the said driver 3 is pressed inside. A heat radiation plate 6 is fitted so as to suppress a rise in the temperature of the panel, a pattern is formed on the rear surface of the glass 1 as well as above, and a driver chip 7 is connected by COG technology. Consequently, the heat of the driver chip is radiated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting of an integrated circuit (driver) for driving an LCD (Liquid Crystal Display), PDP (Plasma Display) and heat radiation.

[0002]

2. Description of the Related Art In a liquid crystal display device, mounting of a semiconductor integrated circuit (chip) by a COG (chip-on-glass) technique has been conventionally performed. However, a semiconductor integrated circuit for a driving circuit of a plasma display has a low power consumption. Is not mounted on glass by the COG technique. A configuration example of a conventional plasma display will be described with reference to the drawings.

FIG. 6 is a configuration diagram showing a connection between a plasma display panel and its driving circuit. As shown in FIG. 6, reference numeral 12 denotes a printed circuit board on which a drive circuit is mounted. On the printed circuit board 12, a semiconductor integrated circuit 13 for performing drive control for displaying an image on a plasma display panel is mounted. The radiation fins 14 are mounted on the semiconductor integrated circuit 13 to cool the semiconductor integrated circuit 13. The output pins of the semiconductor integrated circuit 13 are connected via a pattern on a printed circuit board 15, and further connected via a board-to-board connector 16 and a flexible cable 17.
Panel electrodes. The panel electrode 18 is controlled to display an image on the plasma display panel.

[0004]

As described above, in the plasma display, the semiconductor integrated circuit (driver) is not mounted on the glass of the panel by the COG technique. Cannot be performed, so that the junction guarantee temperature of the semiconductor cannot be satisfied.

[0005] In view of the above problems, the present invention provides a heat dissipation structure for a semiconductor integrated circuit (driver).
It is an object of the present invention to provide an image display device having a panel structure based on COG technology, eliminating a flexible cable as in the above-described conventional example, and improving the reliability by reducing the number of connection portions.

Further, the problem that the adhesion between the glass and the heat radiating plate is deteriorated (because the glass plate and the heat radiating plate are bent) is solved with the enlargement of the plasma display, and an image display having a structure with a high heat radiating effect is solved. An apparatus is provided.

[0007]

According to the present invention, there is provided an image display apparatus provided with a display in which two glass plates are bonded to each other, wherein the two glass plates have portions protruding from a bonded projection portion, and each of the two glass plates has a portion protruding therefrom. The present invention relates to an image display device, wherein a semiconductor chip for driving a display is formed on a protruding glass plate, and the chip is brought into contact with a metal case via a heat conductive sheet. Accordingly, by providing the semiconductor integrated circuit on a glass plate, the connection portion between the driving circuit (driver) and the panel can be significantly reduced, and the reliability can be improved by reducing the connection portion.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An image display device according to the present invention includes a display display in which two glass plates are laminated.
The two glass plates have portions protruding from the bonded projection portion, and a semiconductor chip for driving a display is formed on each protruding glass plate, and the chips are brought into contact with a metal case via a heat conductive sheet. The feature is that the connection between the driving semiconductor chip (driver) and the panel can be greatly reduced, the reliability of the semiconductor chip can be improved by reducing the number of connection, and the semiconductor chip can efficiently radiate heat. It is.

[0009] In addition to the above structure, the present invention provides an image display in which a depression and a projection are provided on the inside of a metal case so as to match the outer shape of the glass plate, and the depression and the projection which come into contact with the glass plate are provided with a buffer. It concerns the device.

Another image display apparatus of the present invention comprises a display having two glass plates attached to each other, wherein the two glass plates have a portion protruding from a bonded projection portion, and a display is provided on the protruding portion. Forming a driving semiconductor chip, the chip is brought into contact with a metal case via a heat conductive sheet, and one of the glass plates is brought into contact with a heat sink, and the heat sink is provided with a depression radiating from the center, At the center of the depression, a through-hole penetrating the heat sink is provided.

[0011] In addition to the structure of the above-mentioned other image display device, the present invention seals the end where the glass plate and the heat radiating plate come into contact with a sealing material, and sucks air from a through hole formed at the center of the heat radiating plate. Further, the present invention relates to an image display device characterized in that the through hole is sealed.

(Embodiment 1) An embodiment of the present invention will be described with reference to the drawings.

FIGS. 1, 2 and 3 are views showing a heat radiation structure of an image display device according to one embodiment of the present invention. FIG.
FIG. 2 is a front view of the present embodiment, and FIG. 2 is a diagram showing a structure in which the display panel of FIG. 1 is covered with a metal front case.
FIG. 3 is a cross-sectional view of the display panel shown in FIG.

In FIG. 1, reference numeral 1 denotes a first glass plate of a display panel, and reference numeral 2 denotes a second glass plate of the display panel. 3
Is a driving semiconductor chip (driver circuit) for displaying an image on the display panel, and is formed by a COG technique on a conductive pattern formed on the surface of the glass plate 2 so that the integrated circuit forming surface is in contact with the crow. It is connected.

In FIG. 2, reference numeral 4 denotes a metal front case which is connected so as to cover a panel made of a glass plate, and is located at a position where a semiconductor chip (driver circuit) 3 is pressed against the inside thereof. , 5 heat conductive sheets are attached. That is, FIG. 2 is a diagram showing the inside of the metal front case.

In FIG. 3, reference numeral 6 denotes a heat radiating plate, which is attached for the purpose of suppressing a rise in the temperature of the display panel. Similar to the above, a conductive pattern is formed on the back surface of one glass plate. The semiconductor chip 7 is connected thereon by the GOC technique. The semiconductor chip 7 comes into contact with the heat radiating plate 6 so that the heat of the semiconductor chip 7 is radiated.

As described above, there is provided a portion which does not overlap with the glass plate 1 and the glass plate 2 constituting the display panel, that is, a portion which protrudes from the bonded projection portion.
By providing the panel driving semiconductor chips 3 and 7 in that portion, the connecting portion between the driving semiconductor chip (driver) and the panel can be greatly reduced, and the reliability can be improved by reducing the connecting portion.

Further, by connecting the semiconductor chips 3 and 7 to the metal case 4 on the front surface via the heat conductive sheet 5 or to the heat radiating plate 6 on the rear surface, the semiconductor chips 3 and 7 can efficiently radiate heat. be able to.

(Embodiment 2) Another embodiment of the present invention will be described with reference to the drawings.

FIG. 4 shows an embodiment of the present invention, and is a side sectional view of a display panel. The same components as those shown in FIG. 3 described above are denoted by the same reference numerals.

At the inner end of the metal front case 4 is provided a recess (or projection) 8 which is added to the configuration of FIG. 3, and a cushioning material 9 is provided in contact with the recess. These depressions 8 and cushioning material 9 support the glass plates 1 and 2 of the display panel. Further, a radiator plate 6 is provided so as to be in contact with the glass plate 2, and has a structure in which the glass plates 1 and 2 are sandwiched together with the metal front case 4. Therefore, with this structure, the glass 1 and the glass plate 2 are sandwiched between the front metal case 1 and the heat radiating plate 6, and the heat radiating effect can be improved.

FIG. 5 shows an example of the structure of a heat radiating plate for improving the heat radiating effect. In the heat radiating plate 6 shown in FIG. 5, the groove 1 is placed on the surface overlapping with the glass plate 2 in FIG.
1 and a through hole 10 is provided at the center of the heat sink 6. The grooves 11 may be provided radially from the center of the heat radiating plate 6, and are not limited to two as shown in FIG.

Such a heat radiating plate 6 is overlapped with the glass plate 2 so that the overlapping end portions, 4 in the present embodiment, are overlapped.
The sides are sealed with a sealing material and the through hole 10 is sealed after the air is sucked out from the surface of the heat radiating plate 6 where the grooves 11 are not present. increase. By providing the through holes 10 and the grooves 11 provided radially from the through holes 10 in the heat radiating plate 6 as described above, the heat radiating effect is improved, and the heat radiation of the semiconductor chip provided on the glass plate of the display panel is achieved. To form an image display device that is not affected by heat.

[0024]

According to the image display device of the present invention, the semiconductor chip for driving the display panel is mounted on the non-overlapping portions of the two glass plates constituting the display panel by the COG technique, so that the semiconductor chip and the semiconductor chip for driving the display panel are mounted. By significantly reducing the number of connection portions with the display panel, a more reliable image display device can be obtained.

In this configuration, the semiconductor chip is
With the configuration in which the metal front case is connected to the metal front case via the heat conductive sheet, the metal front case acts as a heat radiating mechanism for the semiconductor chip (driver), so that the junction temperature rise of the semiconductor integrated circuit can be suppressed at a certain temperature. .

Further, since the semiconductor chip provided on the other glass plate is radiated by contacting a heat radiating plate provided on the back surface, the junction of the semiconductor chip is performed in the same manner as the above-described configuration with the metal front case. It is possible to suppress the temperature rise.

The glass plate and the end of the heat sink are brought into contact with each other to seal them, and the air is exhausted. By improving the adhesion of the plate, the heat radiation effect can be improved.

[Brief description of the drawings]

FIG. 1 is a front view of an image display device according to a first embodiment of the present invention.

FIG. 2 is a rear view of a metal front plate provided in the image display device.

FIG. 3 is a side sectional view of the image display device.

FIG. 4 is a side sectional view of an image display device according to a second embodiment of the present invention.

FIG. 5 is a perspective view of a heat sink provided in the image display device.

FIG. 6 is a diagram showing a connection state between a driving circuit of a conventional plasma display and a panel.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 First glass of display display 2 Second glass of display display 3 Semiconductor integrated circuit (driver) 4 Front metal case 5 Heat conduction sheet 6 Heat sink 7 Driver chip 8 Addition and protrusion 9 from FIG. Buffer material 10 Through hole 11 Groove

Claims (4)

[Claims] 1. An image display apparatus comprising a display display in which two glass plates are bonded to each other, wherein said two glass plates include portions protruding from a bonded projection portion, and a display is provided on each of the protruding glass plates. An image display device comprising: a semiconductor chip for driving; and the chip is brought into contact with a metal case via a heat conductive sheet. 2. The image according to claim 1, wherein a depression and a projection are provided on the inside of the metal case so as to match the outer shape of the glass plate, and a buffer is provided on the depression and the projection that come into contact with the glass plate. Display device. 3. An image display device comprising a display display in which two glass plates are bonded to each other, wherein said two glass plates include a portion protruding from a bonded projection portion, and a display driving semiconductor is provided in the protruding portion. A chip is formed, the chip is brought into contact with a metal case via a heat conductive sheet, and one of the glass plates is brought into contact with a heat sink, and the heat sink is provided with a depression radially from the center, and the center of the depression is formed. An image display device provided with a through-hole penetrating through a heat sink. 4. An end where the glass plate and the radiator plate are in contact with each other is sealed with a sealing material, air is sucked out from a through-hole formed in the center of the radiator plate, and the through-hole is sealed. 3. The image display device according to 3.