KR20100028631A - Process for manufacturing connector - Google Patents

Process for manufacturing connector Download PDF

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Publication number
KR20100028631A
KR20100028631A KR1020107000240A KR20107000240A KR20100028631A KR 20100028631 A KR20100028631 A KR 20100028631A KR 1020107000240 A KR1020107000240 A KR 1020107000240A KR 20107000240 A KR20107000240 A KR 20107000240A KR 20100028631 A KR20100028631 A KR 20100028631A
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KR
South Korea
Prior art keywords
contact
socket
carrier
connector
resin
Prior art date
Application number
KR1020107000240A
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Korean (ko)
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KR101083987B1 (en
Inventor
시노부 타케우치
Original Assignee
가부시키 가이샤 타케우치 기쥬쯔 켄큐쇼
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Publication of KR20100028631A publication Critical patent/KR20100028631A/en
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Publication of KR101083987B1 publication Critical patent/KR101083987B1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24Assembling by moulding on contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

A process for manufacturing a connector that attains increasing of connector production speed and reduces wasting of contacts. Socket (10) of connector (1) is formed through two separate steps consisting of a primary molding step and a secondary molding step. In the primary molding step, socket body base part (12) and resin carrier (25) are integrally molded. Socket contact (30) can be disposed at desired position of the socket body base part (12) by assembling metal carrier (35) with the socket contact (30) coupled thereto into the resin carrier (25). Subsequently, the assembled member is set in secondary molding metal mold (70), and insert molding is carried out. As it is not needed to directly dispose the socket contact (30) in the secondary molding metal mold (70), there can be attained enhancement of working efficiency and increasing of connector production speed. Further, as it is not needed to discard part of the socket contact (30) as different from the prior art, the problem of contact wasting can be solved.

Description

Manufacturing method of connector {PROCESS FOR MANUFACTURING CONNECTOR}

The present invention relates to a method for manufacturing a connector.

Background Art Conventionally, connectors such as those in Japanese Patent Laid-Open No. 2004-55463 are known as connectors for connecting a connector such as a hard printed wiring board and a flexible flexible printed wiring board to each other. have. This kind of connector consists of a socket and a header. The socket is composed of a resin socket body and a metal socket contact. The header is composed of a header body made of resin and a header contact made of metal. In this type of connector, the contact (pitch) between the contacts is very narrow, about 0.4 mm, and the height when the socket and the header are connected is very low, about 0.9 mm.

On the other hand, as a manufacturing method of the connector which consists of a resin material and a metal material, inserting (inserting) and forming a contact at the time of forming a body is generally performed. For example, in the connector disclosed in Japanese Patent Laid-Open No. 2004-55463, a header is manufactured by insert molding a header contact and a header body.

However, in the case of a connector with a narrow pitch between each contact, it was difficult to position a plurality of contact groups in a mold to be molded, so that it was difficult to increase the production speed of the connector. Here, conventionally, as a manufacturing method of this kind of connector, as shown in Figs. 11A to 11C, a contact 81 is formed by punching a contact 81 from a long metal plate 80. In this case, the pitch between the contacts 81 is the same pitch as that of the contact in the connector, and a contact group in which each contact 81 is integrated with the metal carrier 82 is used. A method of performing insert (insert) molding is used. In the conventional method for manufacturing a connector, the contact 81a used for the connector within the group of contacts 81 connected to the metal carrier 82 is left in the metal carrier as it is, and between the connectors. The contact 81b positioned at the portion of is cut off and discarded.

In addition, as for such a contact, expensive plating, such as gold plating, is normally applied. Conventionally, since the contact 81b which is known to be discarded in advance is not required to be plated, it is conceivable to apply plating to each contact after cutting the unnecessary contact 81b. However, since the space | interval between each contact 81 will be in a different state after cut | disconnecting an unnecessary part, when plating is applied in such a state, there exists a problem that a stain will generate | occur | produce in plating. Theretotofore, in order to prevent this plating stain, a method of applying plating to a contact known to be discarded in advance is performed without cutting unnecessary portions. However, the expensive plating part is also useless in such a method, and as a result, there is a problem that the cost of the connector as a product increases.

The present invention aims at improving the manufacturing method of a connector, and more particularly, in order to solve the above problems, it is possible to increase the production speed of the connector and to provide a method for producing the connector which can be used without waste of contact. For the purpose of

In order to achieve the above object, the connector manufacturing method of the present invention is a connector comprising a resin body and a metal contact fixed in parallel to a contact mounting portion provided on the body at predetermined intervals. In the manufacturing method of the said body, the said body is shape | molded by dividing into a primary shaping | molding process and a secondary shaping | molding process, and the said contact is plurality by the same number and spacing as the number and space | interval which are fixed to the said contact attachment part. The metal carrier is supplied in parallel with the metal carrier, and in the first molding process, the metal carrier is arranged such that the contact is disposed at a predetermined position in the vicinity of the body base and a plurality of body bases. And a resin carrier having a contact fixing part for temporarily fixing the molded body is integrally formed, and the metal carrier is attached to the contact fixing part of the resin carrier before the secondary molding process. And a positioning step of placing the contact at a predetermined position of the body base by temporarily fixing the air. In the secondary molding step, the body base and the contact positioned by the positioning step are divided into two. Positioning in the cavity of the molding die, and by injecting the molten resin into the cavity is characterized in that the body fixing portion which is integral with the body base to form the body.

In the manufacturing method of the connector of this invention, the said body is divided into primary shaping | molding process and secondary shaping | molding process, and shaping | molding is performed. In the primary molding step, the resin carrier is molded together with the body base. In the positioning step, the contact is placed at a predetermined position of the body base part by temporarily fixing the metal carrier to the fixing part of the resin carrier. In the secondary molding step, the contact of the resin carrier is placed in the secondary molding mold while the metal carrier is temporarily fixed by the fixing part. In this way, since the contact is arranged at a predetermined position of the body base by temporarily fixing the metal carrier to the fixing portion of the resin carrier integrally formed with the body base, within the secondary molding mold. It is not necessary to place the contact at a predetermined position. For this reason, when assembling the contact to the body base, even when assembling automatically by an assembling apparatus or even when assembling by human hand, the second molding mold is not hindered, so the workability is good. .

Further, the contacts are supplied in a state of being connected to the metal carriers in parallel in a number and interval equal to the number and interval when fixed to the contact mounting portion. That is, the number required for each connector is connected to the metal carrier and supplied. For this reason, since the said metal carrier may be cut by the required number after embossing the said contact from a metal plate and plating is performed, it is not necessary to discard a plated contact.

Moreover, in the manufacturing method of the connector of this invention, the said metal carrier is provided with the latching tank which protrudes toward the contact fixing part of the said resin carrier, and the latching tank is attached to the contact fixing part of the said resin carrier. It is preferable to include a to-be-engaged part to be latched, and to hold the said locking tank and the said to-be-engaged part in the said positioning process. Thus, by providing the locking cage and the latched portion, the operation is facilitated when the metal carrier is placed at a predetermined position of the resin carrier, thereby enabling accurate positioning.

Moreover, in the manufacturing method of the connector of this invention, the said metal carrier has the through-hole which penetrates the front and back, and the said resin carrier fits the through-hole of the said metal carrier to the said contact fixing part. It is preferable to provide a fitting protrusion to be combined, and to fit the said through-hole and the said fitting protrusion in the said positioning process. In this manner, even when the through hole and the fitting protrusion are provided, the operation is facilitated when the metal carrier is placed at a predetermined position of the resin carrier, thereby enabling accurate positioning.

According to the connector manufacturing method of the present embodiment, in the contact forming step, it is possible to use all the contacts without discarding the plated contacts as in the prior art. Therefore, as compared with the conventional manufacturing method of the connector, it is possible to reduce the manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS Explanatory drawing which shows the connector manufactured by the manufacturing method of this embodiment.
2 is an explanatory view showing a socket body of the connector socket of FIG.
3 is an explanatory view showing a connector socket of FIG.
4 is an explanatory diagram showing a socket contact used in the present invention.
5 is an explanatory diagram showing a state of a contact in a contact forming step;
6 is an explanatory view showing a molded article in a primary molding step;
7 is an explanatory diagram showing a state of each member in the positioning step;
8 is a bottom view showing an upper mold of a secondary molding mold in a secondary molding process.
9 is a plan view showing a lower mold of the secondary molding mold in the secondary molding process.
10 is an explanatory diagram showing a molded article in a secondary molding step;
11 is an explanatory diagram showing a method for manufacturing a conventional contact.

Next, an example of embodiment of the connector manufacturing method of this invention is demonstrated with reference to FIGS. 1 is an explanatory diagram showing a connector manufactured by the manufacturing method of the present embodiment. 2 is an explanatory view showing a socket body of the connector socket of FIG. 3 is an explanatory view showing a connector socket of FIG. 1. 4 is an explanatory diagram showing a socket contact of a socket for a connector used in the present invention. 5 is an explanatory view showing a state of a contact in a contact forming step. 6 is an explanatory view showing a molded article in the primary molding step. 7 is an explanatory diagram showing a state of each member in the positioning step. 8 is a bottom view showing an upper mold of a secondary molding mold in the secondary molding process. 9 is a plan view showing the lower mold of the secondary molding mold in the secondary molding process. 10 is an explanatory view showing a molded article in a secondary molding step.

The connector 1 manufactured by the manufacturing method of this invention is comprised from the socket 10 and the header 40 shown in FIG. 1, and attaches detachably the printed wiring board which is not shown, and a flexible wiring board. . Here, the manufacturing method is demonstrated using the socket 10 of this connector 1 as an example. In Fig. 1, reference numeral 41 denotes a resin header body, and reference numeral 60 denotes a metal header contact.

As shown in FIG. 1, the socket 10 includes a socket body 11 made of resin and a socket contact 30 made of metal. The socket body 11 is comprised from the socket body base part 12 shown in FIG. 2 and FIG. 3, and the socket body fastening part 13 shown in FIG. As for the raw material of the socket body base part 12 and the socket body fixing | fixed part 13, the resin (the liquid crystal polymer in this embodiment) of the same all is used. In addition, the socket body fixing portion 13 is temporarily fixed to the socket body base portion 12 previously formed in the primary molding process described later, and the socket contact 30 is temporarily fixed to the socket body base portion 12 in the positioning process. In the secondary molding step, the insert (insert) molding is performed in the secondary molding mold to form it.

The socket body base portion 12 is formed in a flat rectangular shape as a whole, as shown in Figs. 2A to 2C. In addition, as shown in Fig. 2 (d), the socket body base portion 12 includes a thin plate-shaped bottom plate portion 14, a standing portion 15 standing up from the center portion of the bottom plate portion 14, and this standing portion. It has the plate-shaped restriction | limiting part 16 which protruded from the part 15 to the width direction outer side. The space surrounded by the bottom plate portion 14, the standing portion 15, and the restricting portion 16 serves as the escape groove 17 of the socket contact 30. Moreover, the engagement hole 18 which penetrates to the thickness direction outer side of the bottom plate part 14 in the thickness direction is provided. As shown in Fig. 2 (f), the locking hole 18 is a locking portion 19 in which the rear surface side protrudes in the long direction. Moreover, in this embodiment, the socket contact positioning groove 20 is provided so that 12 socket contacts 30 may be provided in parallel to the side of the socket body base part 12 in the long direction. have.

The socket body fixing part 13 is formed so as to surround the circumference | surroundings of the socket body base part 12, and protrude in the thickness direction, as shown to FIG. 3 (d)-(f). A portion of the socket body fixing portion 13 is a covering portion 21 covering the surface of the socket contact 30 as shown in Figs. 3A and 3D. In addition, the socket body fixing part 13 is inserted (inserted) and integrally formed with the socket contact 30, as shown in FIG. 3 (d), so that a part of the socket contact 30 is fixed and held. It has a mounting part 22. In addition, as shown in FIG. 3 (f), the socket body fixing portion 13 includes a locking portion in which molten resin is injected into and solidified in the target portion 19 provided in the socket body base portion 12 ( 23) In addition, as shown in FIGS. 3A and 3E, the socket body fixing portion 13 guides the header body 41 when the header 40 is mounted to determine the position of the guide wall 24. Has)

As shown in FIGS. 3D and 4, the socket contact 30 includes a contact portion 31 which contacts the header contact 60 (see FIG. 1), and a contact mounting portion of the socket body fastening portion 13. A fixed portion 32 held at 22 and a soldering portion 33 soldered to lands of a wiring board (not shown) are provided. As shown in FIG.4 (c), the contact part 31 is formed in substantially U shape from the side, and is processed so that the upper end part 31a may protrude inward. The to-be-fixed part 32 is bent in substantially inverted U shape, as shown to FIG. 4 (c). The soldering part 33 is bent so that it may protrude from the to-be-fixed part 32 to the outer side of the socket body 11, as shown to FIG. 4 (c).

Moreover, the pressing part 34 extended obliquely downward is provided in the front end side (center side of the socket body 11) of the contact part 31. As shown in FIG. As shown in Fig. 3 (d), the tip side of the pressing portion 34 extends in the escape groove 17 of the socket body base portion 12, and the tip end portion of the bottom plate portion of the socket body base portion 12 is shown. (14) is in contact. In addition, as shown in FIG.4 (d), the solder part 33 is chamfered so that the shape seen from the axial direction may become an octagon. In this embodiment, the pitch between the some socket contact 30 is 0.4 mm in FIG.3 (a). In addition, gold plating is applied to the surfaces of the contact portions 31 and the solder portions 33 of the socket contacts 30.

In the step before the socket contact 30 is attached to the socket body 11, as shown in FIGS. 4 (f) and 4 (g), the socket contact 30 is connected to a plurality of plate-shaped metal carriers 35. In this embodiment, twelve socket contacts 30 are connected to one metal carrier 35. This is equal to the number of socket contacts 30 disposed on the side of the socket body 11. In addition, the space | interval between each socket contact 30 becomes the same as the space | interval of each socket contact 30 of the socket 10 which is a completed product. As shown in FIG. 4 (f), the metal carrier 35 is provided with six circular through holes 36 penetrating the front and back in the arrangement direction of the socket contact 30. In addition, the metal carrier 35 is provided with six engagement tanks 37 protruding downward in FIG. 4G in the arrangement direction of the socket contact 30.

Next, the manufacturing method of the said socket 10 is demonstrated with reference to FIGS. The manufacturing method of the socket 10 includes a socket contact forming step of forming the socket contact 30, a primary molding step of forming the socket body part 12, and a socket contact 30 in the socket body part 12. Assembly process for assembling the mold, and the assembled socket body part 12 and the socket contact 30 are positioned and fixed in the mold, and the molten resin is injected into the mold to mold the socket body fixing part 13. The process and the cutting process of cutting off the unnecessary part from the socket 10 which became secondary molding.

The socket contact forming step includes a press step of punching the socket contact 30 and the metal carrier 35 from the metal plate 38 to form the shape of the socket contact 30 in a press, and a necessary portion of the socket contact 30. The plating process of applying gold plating and the socket contact group 30 and the metal carrier 35 of long lengths separate the socket contact group 30 and the metal carrier 35 of predetermined units. It includes a dividing step to divide.

First, in the pressing step, as shown in FIGS. 5A and 5B, the long metal plate 38 is punched to form a portion of the socket contact 30 and the metal carrier 35. The part which becomes) is connected. As shown in FIG. 5 (b), the plurality of socket contacts 30 are processed so that the respective intervals are equal to the intervals of the respective socket contacts 30 when the gaps are inserted into the sockets 10. . In this embodiment, the space | interval of the said socket contact 30 is 0.4 mm. Next, by pressing, bending is performed so that the cut out portion is in the shape of the socket contact 30.

Next, in the plating process, gold plating is applied to the required location of the socket contact 30. In the present embodiment, plating is performed so that plating is applied to at least the contact portion 31 and the soldering portion 33 of the socket contact 30. In the present embodiment, gold plating is performed while the socket contacts 30 are held on the metal carrier 35 at regular intervals, so that the plating treatment is uniformly performed without generating plating unevenness.

Next, as shown in FIG. 5C, the plurality of socket contacts 30 connected to each other by the metal carrier 35 is divided into a predetermined number by a cutter (not shown) in the dividing step. In this embodiment, the socket contact 30 is arrange | positioned at the socket 10 by 2 rows of 1 row by each side. In each column, the number of socket contacts 30 is 12, and a total of 24 socket contacts 30 are disposed. For this reason, in this embodiment, the metal carrier 35 is segmented so that 12 socket contacts 30 may be connected to one metal carrier 35 according to the number of columns.

Next, the primary shaping | molding process of shaping | molding the socket body base part 12 is demonstrated. In the primary molding step, the molten resin is injected into the primary molding mold (not shown) to form the socket body base portion 12 and the resin carrier 25 shown in Figs. 6A and 6B. . FIG. 6B is an enlarged view of a portion of the socket body base portion 12 and the resin carrier 25 enclosed by one-dot chain lines shown in FIG. 6A. As shown in Figs. 6A and 6B, a contact fixing part 25a for temporarily fixing the metal carrier 35 in the positioning step is formed on the resin carrier 25, respectively. A pair is provided in the left and right both sides (up and down in FIG. 6) of (12). As for the socket body base part 12, the both side surfaces of a short direction are connected to the resin carrier 25 by the primary runner 25b. Reference numeral 25c added to the resin carrier 25 denotes a positioning projection to which the through hole 36 of the socket contact 30 metal carrier 35 fits. Two positioning projections 25c are disposed on the contact fixing portions 25a which face each socket body portion 12 in the lateral direction.

Reference numeral 25d denotes an engagement hole into which the engagement tank 37 of the metal carrier 35 is engaged. The pair of engagement holes 25d is provided in pairs of six in the lateral direction of the socket body portions 12, respectively. Reference numeral 25e denotes secondary fitting holes 25e and 2nd fittings for fitting the resin carrier 25 to the positioning pins 77 of the secondary molding mold 70 described later. The secondary fitting holes 25e are provided with nine upwards and eight downwards in FIG. 6A, and are not provided in the lower left portion in the same drawing. Reference numeral 25f denotes the position of the primary gate through which the molten resin is injected.

Next, an assembly process is demonstrated. In this assembling step, a step of assembling the socket contact 30 and the metal carrier 35 formed in the socket contact forming step, and the socket body base portion 12 and the resin carrier 25 formed in the primary molding step. to be.

In this assembly process, the metal carrier 35 is temporarily fixed to the contact fixing part 25a of the socket body base part 12 shown to FIG. 7 (b). At this time, the through hole 36 of the metal carrier 35 is fitted to the positioning projection 25c provided in the contact fixing portion 25a, and the metal is fitted into the engagement hole 25d of the contact fixing portion 25a. The engagement tank 37 of the carrier 35 is engaged. Thus, by temporarily fixing the metal carrier 35 to the contact fixing part 25a, the socket contact 30 is correctly positioned in the socket contact positioning groove 20 provided in the socket body part 12. As shown in FIG. do.

Next, the secondary molding process will be described. This secondary molding step is performed using the secondary molding mold 70 shown in FIGS. 8 and 9. The secondary molding mold 70 includes a secondary upper mold 71 shown in Fig. 8 and a secondary lower mold 72 shown in Fig. 9. As shown in FIG. 8, the secondary phase die 71 is provided with a secondary runner 74 for guiding a resin for forming the socket body fixing portion 13 into the cavity 73. As shown in FIG. The secondary runners 74 are provided at two positions on both sides of the cavity 73 in FIG. 8. In Fig. 8B, reference numeral 75 denotes a groove into which the primary runner 25b connecting the socket body portion 12 and the resin carrier 25 is fitted. Reference numeral 76 denotes a secondary gate in which molten resin is injected in the secondary molding mold 70. In FIG. 9B, reference numeral 77 denotes a positioning pin for fitting the secondary fitting hole 25e of the resin carrier 25.

In the secondary molding step, the socket body base 12 and the socket contact 30 assembled in the assembly step are positioned together with the resin carrier 25 and the metal carrier 35 in the secondary molding mold 70. Fix it. At this time, the secondary fitting hole 25e of the resin carrier 25 is fitted to the positioning pin 77 of the secondary molding mold 70. As a result, the resin carrier 25 is positioned at the correct position in the secondary molding mold 70. In addition, the socket body portion 12 and the socket contact 30 are positioned at the correct position in the cavity 73. At this time, as shown in Fig. 9A, the positioning pin 77 is not provided at the lower left portion in the drawing as in the secondary fitting hole 25e of the resin carrier 25, so that the resin carrier ( 25) Positioning date is not wrong.

Next, the secondary upper die 71 and the secondary lower die 72 are closed to form a cavity 73, and molten resin is injected from the secondary gate 76 into the cavity 73. Thereby, as shown in FIG. 10, the socket 10 is shape | molded in the state connected to the resin carrier 25 and the metal carrier 35. As shown in FIG. Next, the socket 10, the resin carrier 25, and the metal carrier 35 in the state shown in FIG. 10 are cut at the points indicated by broken lines in FIG. 10 (b). As a result, the socket 10 shown in FIGS. 1 and 3 is formed.

Thus, according to the manufacturing method of the connector of this embodiment, in the contact formation process, it is possible to use all the contacts, without discarding the plated contact like conventionally. Therefore, as compared with the conventional manufacturing method of the connector, it is possible to reduce the manufacturing cost.

In addition, according to the connector manufacturing method of the present embodiment, the resin carrier 25 is molded together with the socket body portion 12 in the primary molding step, and the socket body portion 12 and the socket contact 30 are formed. It is possible to assemble the socket body portion 12 and the socket contact 30 in advance before placing them in the secondary molding mold 70. Therefore, since the assembly of the socket body base portion 12 and the socket contact 30 can be performed without the restriction of the secondary molding die 70, the work efficiency is improved. As a result, in the case of automating the assembly, the design of the assembly apparatus can be designed so that the design of the assembly apparatus (not shown) can be performed regardless of the size of the mold opening of the secondary molding mold 70 and the like. It becomes easy. In addition, even when the assembly is performed by hand work, the secondary molding die 70 does not interfere, and thus the work efficiency is improved.

In addition, since it is possible to assemble the socket body base portion 12 and the socket contact 30 separately from the secondary molding process, even if the secondary molding die 70 is broken, the primary molding process and It is possible to collect the inventory by performing the assembly process in advance. Therefore, when the secondary molding mold 70 is recovered, the socket 10 is rapidly formed by the secondary molding mold 70 using the stocked socket body portion 12 and the socket contact 30. It is possible.

In addition, in the said embodiment, although the manufacturing method of the socket 10 was demonstrated as an example, the manufacturing method of the header 40 is shape | molded by dividing into the primary shaping | molding process and the secondary shaping | molding process similarly to the above, The resin carrier may be formed in the primary molding step, the metal carrier may be assembled into the resin carrier in the granulation step, and the insert (insert) molding may be performed in the secondary molding step. In addition, the connector manufacturing method of the present invention can be applied not only to connectors connecting boards but also to connectors that are widely different, such as connectors connecting boards and wirings. In addition, in the said embodiment, each dimension etc. are an example and are not limited to these dimensions.

Moreover, in the said embodiment, although the method of inserting (inserting) the socket contact 30 into the resin carrier 25 was demonstrated, the other member (for example, the socket 10) is shown in the resin carrier 25. As shown in FIG. Inserts (inserts) and the like may be attached to the circuit boards to be fixed to the circuit board. In addition, in the said embodiment, although the shaping | molding is performed using the same raw material as the socket body base part 12 and the socket body fixing | fixed part 13, it is not limited to this, It inserts using different material in both (insert) You may shape | mold.

1 connector 10 socket
11: Socket body (body) 12: Socket body base (body base)
13: Socket body fixing part (body fixing part) 22: Contact mounting part
25: resin carrier 25a: contact temporary government
30: socket contact (contact) 35: metal carrier
70: secondary molding mold 73: cavity

Claims (3)

In the manufacturing method of the connector provided with the resin body and the metal contact fixed in parallel multiple times at predetermined intervals in the contact mounting part provided in the said body,
The body is formed by dividing into a primary molding process and a secondary molding process,
The contacts are supplied in a state of being connected to the metal carrier in a plurality of parallel in the same number and interval as the number and interval when fixed to the contact mounting portion,
In the primary molding step, a plurality of body bases and a contact fixing part for temporarily fixing the metal carrier so that the contact is disposed at a predetermined position in the vicinity of the body bases are provided. The resin carrier is integrally molded,
And a positioning step of arranging the contact at a predetermined position of the body base by temporarily fixing the metal carrier to the contact fixing part of the resin carrier before the secondary molding step,
In the secondary molding step, the body base and the contact positioned by the positioning step are positioned in the cavity of the secondary molding mold, and the molten resin is injected into the cavity to be integrated with the body base. The method of manufacturing a connector, characterized in that for forming a body fixing portion of the body.
The method of claim 1,
The metal carrier includes a locking jaw protruding toward the contact fixing portion of the resin carrier, and a locking portion on which the locking jaw is latched on the contact fixing portion of the resin carrier. and,
The manufacturing method of a connector, characterized in that for holding the engagement tank and the to-be-engaged portion in the positioning step.
The method according to claim 1 or 2,
The metal carrier has a through hole penetrating the front and back,
The resin carrier has a fitting protrusion for fitting the through hole of the metal carrier to the contact fixing portion,
And the through hole and the fitting projection are fitted in the positioning step.
KR1020107000240A 2007-06-26 2007-06-26 Process for manufacturing connector KR101083987B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/062797 WO2009001436A1 (en) 2007-06-26 2007-06-26 Process for manufacturing connector

Publications (2)

Publication Number Publication Date
KR20100028631A true KR20100028631A (en) 2010-03-12
KR101083987B1 KR101083987B1 (en) 2011-11-16

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Country Link
JP (1) JP4839492B2 (en)
KR (1) KR101083987B1 (en)
CN (1) CN101689742B (en)
WO (1) WO2009001436A1 (en)

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KR20200080793A (en) * 2018-12-27 2020-07-07 (주)우주일렉트로닉스 Carrier Structure of Connector Apparatus

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Publication number Priority date Publication date Assignee Title
JP6153443B2 (en) * 2013-10-08 2017-06-28 Jx金属株式会社 Manufacturing method of band member with terminal row, band member with terminal row and mold
JP6105019B1 (en) * 2015-10-06 2017-03-29 株式会社フジクラ Electronic component manufacturing method and manufacturing apparatus
CN107359494A (en) * 2017-07-14 2017-11-17 东莞市进茂电子有限公司 A kind of highdensity high speed connector manufacture method
KR102077162B1 (en) * 2017-11-28 2020-02-13 (주)산쇼코리아 Injection apparatus for manufacturing a connector
TWI694916B (en) * 2018-05-04 2020-06-01 于國基 Metal tape for aiding insert molding process
JP2022182230A (en) * 2021-05-28 2022-12-08 日本航空電子工業株式会社 Connector and manufacturing method of connector

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111286A (en) * 1982-12-15 1984-06-27 ソニー株式会社 Connector and method of producing same
FR2647468B1 (en) * 1989-05-29 1992-03-13 Solvay CHASSIS FOR PRESSURE FILTER TYPE ELECTROLYSIS AND PRESSURE FILTER TYPE ELECTROLYSERS
US5915976A (en) * 1997-02-06 1999-06-29 Hon Hai Precision Ind. Co., Ltd. High speed connector
JP2000058166A (en) * 1998-07-31 2000-02-25 Fujitsu Takamisawa Component Ltd Connector and its manufacture
JP2001035571A (en) * 1999-07-16 2001-02-09 Meio Kasei:Kk Narrow pitch terminal connector and molding method therefor
JP3493379B2 (en) * 2000-04-14 2004-02-03 日本航空電子工業株式会社 SMT connector and method of manufacturing the same
JP3969229B2 (en) * 2002-07-23 2007-09-05 松下電工株式会社 connector
KR100511180B1 (en) * 2003-02-19 2005-08-30 재영솔루텍 주식회사 Production method of electric-connector
JP2006202644A (en) * 2005-01-21 2006-08-03 Jst Mfg Co Ltd Shell for electrical connector, electrical connector, and method of manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200080793A (en) * 2018-12-27 2020-07-07 (주)우주일렉트로닉스 Carrier Structure of Connector Apparatus

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KR101083987B1 (en) 2011-11-16
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CN101689742B (en) 2011-11-30
JPWO2009001436A1 (en) 2010-08-26
JP4839492B2 (en) 2011-12-21

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