KR20100009661A - Flexible printed circuit board - Google Patents
Flexible printed circuit board Download PDFInfo
- Publication number
- KR20100009661A KR20100009661A KR1020080070392A KR20080070392A KR20100009661A KR 20100009661 A KR20100009661 A KR 20100009661A KR 1020080070392 A KR1020080070392 A KR 1020080070392A KR 20080070392 A KR20080070392 A KR 20080070392A KR 20100009661 A KR20100009661 A KR 20100009661A
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- KR
- South Korea
- Prior art keywords
- copper
- copper layer
- led
- circuit board
- printed circuit
- Prior art date
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- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A flexible printed circuit board having improved heat dissipation structure is disclosed. Such a flexible printed circuit board is a flexible printed circuit board (FPCB) in which an LED package is mounted, and a plurality of LED packages are mounted and each of which is electrically independent. A first copper layer composed of a copper plate; A flexible base layer having insulating properties; And a second copper layer formed on the opposite side of the first copper layer, wherein the plurality of copper plates are paired by two, and any one of the paired copper plates serves as an anode connecting plate of the LED. The other copper plate is configured to serve as a cathode connecting plate of the LED, and one of the connecting plates is formed with a via hole for conducting and heat transfer of copper plating as an electrical conductive path with the second copper layer.
Description
TECHNICAL FIELD The present invention relates to the field of printed circuit boards, and more particularly, to a flexible printed circuit board on which an LED package as a backlight unit of a small notebook PC is mounted. The unique structure of the flexible printed circuit board adopted according to the present invention induces rapid heat dissipation of heat generated from the LED (LED) to maximize the luminous efficiency of the LED.
In general, since the TFT-LCD cannot emit light by itself, it is necessary to supply an external light source to emit light. The device that provides this light is a back light unit (BLU). Light sources used in the backlight unit include a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp (EEFL), a surface light source (FFL), a light emitting diode (LED) lamp and the like. In recent years, the adoption of LED lamps, which have the advantages of long life, low power consumption, eco-friendliness and thinning, has been increasing in the light source market led by cold cathode fluorescent lamps.
LED lamps have the advantages described above, but have low light efficiency. LED light efficiency is about 20 ~ 30%. The power consumption per LED is about 1W, and when the light efficiency is 30% at the power consumption of 1W, the power consumption generated by heat is about 70%. The number of LED lamps used in the LED backlight unit of the 32-inch TFT-LCD is about 400, and the heat generated is about 280W. If the LED cannot handle the heat generated in the printed circuit board, the temperature inside the LED and the printed circuit board mounted may increase, which may cause the LED lamp to be inoperable and operate the associated electronic circuit. It may lower the reliability. In addition, thermal stress may be generated in parts or cases due to internal temperature differences, which may cause deformation of the product.
The present invention has been made to solve the problems of the prior art, and an object of the present invention is to provide a printed circuit board, particularly a flexible printed circuit board on which an LED (Light Emitting Diode, LED) package is mounted, while making the LED package light and small The present invention provides a flexible printed circuit board having a structure capable of efficiently releasing heat generated therefrom and ultimately maximizing the luminous efficiency of the LED.
In order to achieve the above objects and other objects that will be apparent to those skilled in the art, one aspect of the present invention,
As a Flexible Printed Circuit Board (FPCB) on which an LED (Light Emitting Diode, LED) package is mounted,
A first copper layer having a plurality of LED packages mounted thereon, the first copper layer being composed of a plurality of copper plates each of which is electrically independent;
A flexible base layer having insulating properties; And
A second copper layer formed opposite the first copper layer,
The plurality of copper plates are paired by two, and one of the copper plates of the pair is configured to serve as the anode connecting plate of the LED, and the other copper plate serves to serve as the cathode connecting plate of the LED. And one of the connecting plates is provided with a via hole for conducting and heat-transfering copper plating as an electrical conductive path to the second copper layer.
As a further aspect of the present invention, the other one of the pole connecting plate is further formed via the copper plating heat transfer via hole electrically and thermally communicated with the second copper layer, in this case, the second connected to the heat transfer via hole The copper layer portion is configured to be electrically isolated from the via and heat transfer via holes.
The flexible printed circuit board according to the present invention does not require the installation of a separate heat sink, so that the printed circuit board on which the LED package is mounted, in particular, the flexible printed circuit board is made thin and short, while efficiently dissipating heat generated from the LED package. Has
In addition, the heat dissipation structure of the flexible printed circuit board enables not only to mount more LED packages on the flexible printed circuit board but also to maximize the LED light emitting efficiency of the mounted LED package.
As used herein, the term “copper board” may be separately attached to a printed circuit board (PCB), but those skilled in the printed circuit board field may primarily perform copper plating on one surface of a printed circuit board and then etch it in various ways including etching. It will be appreciated that they are configured to be electrically isolated from each other. In this specification, the partition space of the conductive layer, especially the copper layer, is used for the term copper plate for convenience.
When reading the following various embodiments of the present invention, one embodiment of the present invention includes one common circuit and a separate circuit, each of which has six strings connected in parallel, and nine of each string. Considering that the LED packages are connected in series is expected to be more helpful in understanding the present invention.
Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention is not limited to the accompanying drawings and the following description, and those skilled in the art will be able to consider various embodiments from the accompanying drawings and the following description.
1 is a cross-sectional view showing a part of an LED backlight unit to which the present invention can be adopted, and FIG. 1 shows a state immediately before the
Referring to FIG. 1, a flexible printed circuit board 1 according to a preferred embodiment of the present invention is laminated with a
The
Although not completely shown in FIG. 1, the
The
A
2 schematically illustrates a state in which the
Referring to FIG. 2, a plurality of
In the present embodiment, the heat generated from the
3 schematically illustrates a state in which the
Referring to FIG. 3, a plurality of
In the present embodiment, the heat generated from the
FIG. 4 schematically illustrates a state in which the
Referring to FIG. 4, a plurality of
In this embodiment, the heat generated from the
In the present invention, the individual circuit is a cathode when the common circuit is a positive electrode, the common circuit is a cathode (ground) when the individual circuit is a positive electrode.
In addition, in the present invention, each of the
Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated.
1 is a cross-sectional view of a flexible printed circuit board according to the present invention.
2 is a schematic view of a flexible printed circuit board according to an exemplary embodiment of the present invention.
3 is a schematic view of a flexible printed circuit board according to another exemplary embodiment of the present invention.
4 is a schematic view of a flexible printed circuit board according to another exemplary embodiment of the present invention.
<Explanation of symbols for the main parts of the drawings>
1: Flexible printed circuit board 10: Coverlay
20: first copper layer 30: base layer
40: second copper layer 60: backlight unit frame
100: LED package
H E / T : Via hole for both energization and heat transfer
H T : Heat Transfer Beer Hole
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080070392A KR100986214B1 (en) | 2008-07-21 | 2008-07-21 | Flexible Printed Circuit Board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080070392A KR100986214B1 (en) | 2008-07-21 | 2008-07-21 | Flexible Printed Circuit Board |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100009661A true KR20100009661A (en) | 2010-01-29 |
KR100986214B1 KR100986214B1 (en) | 2010-10-07 |
Family
ID=41817939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080070392A KR100986214B1 (en) | 2008-07-21 | 2008-07-21 | Flexible Printed Circuit Board |
Country Status (1)
Country | Link |
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KR (1) | KR100986214B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102060115B1 (en) * | 2018-09-13 | 2019-12-27 | 주식회사 피아이에스 | Led substrate with individually controllable of led module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100616680B1 (en) | 2005-05-13 | 2006-08-28 | 삼성전기주식회사 | Light emitting diode package and method for manufacturing the same |
KR101182301B1 (en) * | 2005-06-28 | 2012-09-20 | 엘지디스플레이 주식회사 | Printed circuit board mounted led |
KR100793338B1 (en) * | 2006-02-23 | 2008-01-11 | 삼성전기주식회사 | Light emitting diode module |
KR100878721B1 (en) | 2007-07-18 | 2009-01-14 | (주)유양디앤유 | Replaceable led back light unit |
-
2008
- 2008-07-21 KR KR1020080070392A patent/KR100986214B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100986214B1 (en) | 2010-10-07 |
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