KR20100006493A - An apparatus for array and electron parts - Google Patents

Abstract

PURPOSE: A chip aligning apparatus for aligning an electrode component is provided to reduce scratch due to contact with an alignment plate and the deformation due to operation pressure of a cylinder. CONSTITUTION: A plurality of alignment plates are stacked on a table. A plurality of alignment holes(41,51) are formed on the alignment plates. An elastic support piece is elastically deformed in contact with the electronic component and is extended from the body of the alignment plate. The electronic component has a rectangular parallelepiped shape. The alignment holes have a square shape with a large cross section in comparison with the electronic component. A first elastic support piece(42) supporting one side of the electronic component is extended to the alignment hole of the halted alignment plate. A second elastic support piece(52) supporting the other side of the electronic component is extended to the alignment hole of the moving alignment plate.

Description

Chip alignment device for aligning electronic components

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip aligning device for aligning chip type electronic parts that can align small chip type electronic parts at the same time. A chip aligning device for aligning electronic components.

In general, as shown in FIG. 1, a chip-type electronic component is connected by coating, drying, and sintering a paste containing silver, silver-palladium, copper, etc. at an end thereof for the purpose of connecting with an internal electrode or an internal conductor. It has a structure in which an electrode is formed.

In recent years, chip-type electronic components have also been miniaturized according to the thinning and miniaturization of electronic products, and chip alignment devices that can be efficiently aligned for improving their assemblability have been used.

Such a chip aligning device is disclosed in Korean Patent Application No. 2008-6251 filed by the present applicant, an example of which is shown in FIGS. 2 to 4.

Referring to FIG. 2A, the apparatus supplies a plurality of chip-shaped electronic components 300 to the upper surface of the third alignment plate 230 in a state where the alignment holes 201, 202, 203 are aligned, and the second cylinder. When the vibration table 100 is reciprocated by operating the 130, the chip-shaped electronic components 300 enter and are accommodated in the alignment holes 201, 202, and 203 as shown in FIG. 2B. Remove the parts.

Subsequently, as shown in FIGS. 2C, 3, and 4B, when the first alignment plate 210 is moved by operating the first cylinder 140, the two surfaces of the chip type electronic component 300 may have the first alignment plate 210. The two surfaces of the chip-shaped electronic component 300 are in close contact with the two surfaces of the alignment holes 202 and 203 of the second and third alignment plates 220 and 230. Will be.

Subsequently, a vacuum suction force is provided through the first and second suction ports 110 and 120 to maintain the flatness by closely contacting the first, second and third alignment plates 210, 220 and 230.

Subsequently, referring to FIG. 2C, the vacuum suction force of the second suction port 120 is released, and the third alignment plate 230 is removed through the suction head (not shown). In this case, as shown in FIG. 2D, the upper end of the chip type electronic component 300 protrudes to the upper portion of the second alignment plate 220.

Subsequently, as shown in FIG. 2D, the carrier plate 400 is lowered and attached to the adhesive 420 while allowing the chip-shaped electronic components 300 protruding into the respective receiving holes 411 to enter.

Ends of the chip-shaped electronic components 300 accommodated in the carrier plate 400 are protruded, and then connection terminals are applied by dipping the ends of the chip-shaped electronic components 300 in a dipping tank.

However, in the alignment device as described above, the alignment holes 201, 202, 203 of the alignment plates 210, 220, 230 simply have a rectangular structure, and thus, in FIGS. 3, 2C, and 4B. When one alignment plate 210 is moved with respect to the stationary alignment plates 220 and 230 stopped as described above, the electronic components 300 are aligned with holes 201, 202, and 203 when the electronic components 300 are aligned. It is aligned while pressing close to the edge of the field, in which the electronic parts are in close contact with the edges of the alignment holes 201, 202, 203 by the operating pressure of the operation of the first cylinder 140, the scratches are generated or deformed There is a problem.

In addition, the size of the electronic component 300 according to the manufacturing error is different, in this case is to be moved by the alignment plate 210 when aligning each electronic component 300 at the same time by the movement of the alignment plate (210). Among the electronic components 300, an electronic component 300 which does not come into close contact with other alignment plates 220 and 230 is generated. Accordingly, there is a problem in that the alignment of the electronic component 300 is poor.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip aligning device for aligning chip-type electronic components, which is created to solve the above problems and to improve the degree of alignment of electronic components.

Another object of the present invention is to provide a chip aligning device for aligning chip-shaped electronic components so as to prevent absorption or deformation damage when the small chip-shaped electronic components are aligned on a coplanar alignment plate.

The present invention which achieves the above object is provided with a plurality of alignment plates stacked so as to be seated on the table and each of the alignment holes in which the chip-like electronic components are accommodated so as to be movable freely to correspond to each other, any one of the plurality of alignment plates In a chip aligning device for aligning electronic components by stopping the alignment plate of the other and moving the other alignment plate,

Each of the alignment holes of at least one alignment plate of the plurality of alignment plates is characterized in that the elastic support piece that is elastically deformed upon contact of the electronic component extends from the body of the alignment plate.

In addition, in the apparatus of the present invention, the electronic component has a rectangular parallelepiped shape, and each of the alignment holes of the plurality of alignment plates is formed in a rectangular shape having a larger cross-sectional area than the electronic component.

The first elastic support piece supporting one side of the electronic component extends in an alignment hole of the stationary alignment plate of the stacked alignment plates, and the other of the electronic component is arranged in the alignment hole of the movable alignment plate. The second elastic support piece for supporting the side is characterized in that the extension.

Since the electronic parts aligning device of the present invention is aligned while the electronic parts are elastically pushed by the elastic support pieces, the degree of alignment of the electronic parts can be improved even when the electronic parts are different in size.

In addition, the device of the present invention extends the elastic support pieces in the alignment holes of the alignment plates, so that the electronic parts 10 are aligned while being buffered and supported by the elastic support pieces 42 and 52, so that the working pressure of the cylinder 30 is increased. It is possible to reduce the damage caused by deformation and the collection damage due to contact with the alignment plate 40, 50.

In the chip-type electronic component to which the present invention is applied, a connecting electrode is formed at an end portion for the purpose of connecting with an internal electrode or an internal conductor of the chip-type electronic component, and the connecting electrode includes a paste containing silver, silver-palladium, copper, or the like. By coating, drying and sintering, they are molded at the end of the chip-shaped electronic component.

The apparatus of the embodiment of the present invention is a step before forming the connection electrode as described above, and the small chip-shaped electronic components are aligned on the same plane and accommodated in the carrier plate, thereby simplifying the forming process of the connection electrode.

Hereinafter, an alignment device for aligning chip electronic components according to an embodiment of the present invention will be described.

Referring to FIGS. 5A and 5B, the alignment device is stacked and seated on the table 20 so that the plurality of alignment holes 41 and 51 corresponding to each of the chip-shaped electronic components 10 are movably received therein correspond to each other. It is provided with a plurality of alignment plates 40, 50 formed.

The electronic component 10 has a rectangular parallelepiped shape, and each of the alignment holes 41 and 51 of the plurality of alignment plates 40 and 50 is formed in a quadrangular shape having a larger cross-sectional area than that of the electronic component 10. .

The table 20 is vibrated by vibrating means (not shown) or rolling means (not shown) to enter each of the alignment holes 41 and 51 as the electronic components 10 inserted into the alignment plate 40 vibrate. To help.

The alignment plate 50 at the bottom of the alignment plates 40 and 50 stacked up and down is reciprocated by the cylinder 30 as shown in FIGS. 5 and 7, and the alignment plate 40 at the top thereof. Remains stationary.

Accordingly, the electronic component 10 that enters the two alignment holes 41 and 51 corresponding to the vertical direction is aligned to one side of the alignment holes 41 and 51 as shown in FIG. 7B.

Meanwhile, as a characteristic configuration of the present invention, referring to FIG. 6, the electronic component 10 is arranged in the alignment hole 41 of the stationary alignment plate 40 of the alignment plates 40 and 50 that are stacked and seated. The first elastic support piece 42 supporting one side of the elongated body is formed, and the second elastic support for supporting the other side of the electronic component 10 is formed in the alignment hole 51 of the moving alignment plate 50. The support piece 52 has an extended structure.

In the exemplary embodiment of the present invention, the elastic support pieces 42 and 52 are all formed on the upper and lower alignment plates 40 and 50, but only the alignment plate of any one of the upper and lower alignment plates 40 and 50 is elastic. Forming a support piece is sufficient to achieve the object of the present invention.

In the chip aligning device having the above-described configuration, as shown in FIGS. 5A and 7A, after applying the vibrating means to enter the alignment holes 41 and 51, the cylinder ( When the lower alignment plate 50 is moved to one side by operating 30, the electronic components 10 are pushed to the second elastic support piece 52 to be moved to one side to be supported by the first elastic support piece 42. As the chip-shaped electronic component 10 is aligned.

At this time, since the electronic parts 10 are elastically pushed by the second elastic support piece 52 and moved to one side, the electronic parts 10 may be aligned, so that the degree of alignment may be increased even if the size of each electronic part 10 varies depending on a manufacturing error. do.

In addition, since the electronic parts 10 are aligned by being buffered and supported by the elastic support pieces 42 and 52, the electronic parts 10 may be deformed due to the operating pressure of the cylinder 30 and contact with the alignment plates 40 and 50. It is possible to reduce the damage caused by the absorption.

1 is a perspective view showing a conventional chip-shaped electronic component,

2a to 2d is an operation diagram showing the operating state of the alignment device of the present applicant filed,

3 is a schematic plan view of FIG. 2A;

4A and 4B are schematic views illustrating an alignment state of a chip electronic component using the alignment device of FIG. 3;

5a and 5b is an operating state of the alignment device of the embodiment of the present invention,

Figure 6 is a perspective view of the main portion showing the structure of the alignment plate employed in the device of the present invention,

7A and 7B are schematic views for explaining an alignment state of a chip electronic component using the alignment device of the present invention.

Claims (2)

A plurality of alignment plates, which are stacked on a table and each of which has a plurality of alignment holes in which chip-shaped electronic components are accommodated so as to be freely movable, correspond to each other, thereby stopping any one of the plurality of alignment plates and In a chip aligning device for aligning electronic components by moving one alignment plate, At least one of the alignment plates 40 and 50 of each of the alignment plates is aligned with an electronic component, wherein an elastic support piece that is elastically deformed upon contact of the electronic component extends from the body of the alignment plate. Chip sorter. The electronic component 10 has a rectangular parallelepiped shape, and each of the alignment holes 41 and 51 of the plurality of alignment plates 40 and 50 has a larger cross-sectional area than the electronic component 10. Is formed in the shape of a square, The first elastic support piece 42 supporting one side of the electronic component extends in the alignment hole 41 of the stationary alignment plate 40 among the stacked alignment plates 40 and 50. And a second elastic support piece (52) extending from the alignment hole (51) of the moving alignment plate (50) to support the other side of the electronic component.

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