CN105578794A - Positioning tool for electronic element - Google Patents
Positioning tool for electronic element Download PDFInfo
- Publication number
- CN105578794A CN105578794A CN201410542729.1A CN201410542729A CN105578794A CN 105578794 A CN105578794 A CN 105578794A CN 201410542729 A CN201410542729 A CN 201410542729A CN 105578794 A CN105578794 A CN 105578794A
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- China
- Prior art keywords
- electronic component
- localization tool
- support plate
- location notch
- plate
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The invention relates to a positioning tool for an electronic element. The positioning tool comprises a carrying plate and an adjusting plate. A plurality of positioning grooves are formed in the top surface of the carrying plate to accommodate all electronic elements. The adjusting plate is arranged on the carrying plate in a moving mode and is provided with a plurality of positioning holes corresponding to the positioning grooves one by one. Moreover, when being accommodated into the positioning grooves of the carrying plate, all electronic elements protrude from the top surface of the adjusting plate. When solder pastes are printed on the electronic elements, the adjusting plate is moved and thus all electronic elements move towards the same direction and then are localized into the positioning grooves; and then the solder pastes are printed. Therefore, the electronic elements can be localized regularly, thereby reducing a phenomenon of random excursion of electronic elements during solder paste printing.
Description
Technical field
The present invention relates to paste solder printing technology, particularly a kind of positioning electronic components that is used for is to carry out the tool of paste solder printing.
Background technology
Compared to traditional FR-4 substrate or aluminium base, ceramic substrate has excellent high-fire resistance, high mechanical properties and can resist the characteristics such as adverse circumstances, and therefore ceramic substrate is widely used in high-brightness LED or as in the product such as automobile-used circuit board.
Please refer to Fig. 1, when electronic component is with monolithic kenel print solder paste, traditional practice first prepares the support plate 71 that is provided with several location notchs 72, and then use fetching device (pickandplacedevice) to move individual electronic element 73, each electronic component 73 is placed in the location notch 72 of support plate 71 respectively, republishes tin cream.In order to allow fetching device successfully be seated in location notch 72 by electronic component 73, the size of location notch 72 must slightly larger than the size of electronic component 73.But such design easily derives the problem that tin cream skew occurs when print solder paste electronic component 73, and the situation of skew does not normally have fixing rule in random distribution.For solving the problem, two-sided tape can be used traditionally to fix electronic component 73, if but electronic component 73 uses to make from hard and crisp materials such as ceramic substrates, although can use two-sided tape fixed electronic element 73, is difficult to without damage take off ceramic substrate from double faced adhesive tape.Like this, the problem of tin cream skew may cause the situation that workpiece missing solder occurs during follow-up piece, and then has influence on the yield of overall electronic components fabrication.
Summary of the invention
In view of this, main purpose of the present invention is the localization tool providing a kind of electronic component, so that on electronic component during print solder paste, can reduce the situation that tin cream random offset occurs.
To achieve these goals, the invention provides a kind of localization tool of electronic component, it includes support plate and adjustment plate, and wherein, the end face of support plate offers multiple location notch, and each location notch is used for accommodating each electronic component; The end face of support plate is located at by adjustment plate in the mode that can move in parallel, and adjusts plate and have and each location notch multiple location hole one to one; And the degree of depth summation of each location notch and each location hole is less than or equal to the height of each electronic component.
Thus, when will on electronic component during print solder paste, can first move after adjustment plate makes each electronic component move in the same direction is positioned in location notch, and then print solder paste, each electronic component so can be made to be located regularly, reduce the situation that random offset occurs when paste solder printing electronic component.
Accompanying drawing explanation
Fig. 1 is the vertical view of traditional localization tool.
Fig. 2 is the decomposing schematic representation of the localization tool of first embodiment of the invention.
Fig. 3 is the partial enlarged drawing of Fig. 2.
Fig. 4 is the cutaway view after the localization tool combination of first embodiment of the invention.
Fig. 5 is the vertical view that the localization tool of second embodiment of the invention has combined.
Fig. 6 is that the localization tool of second embodiment of the invention has combined and moved the vertical view after adjusting plate.
Fig. 7 is the schematic diagram that the present invention adjusts another execution mode of plate.
(symbol description)
1... localization tool 10... support plate
11... the first location notch 12... second location notch
13... the 3rd location notch 14... the 4th location notch
15... the straight internal face of location notch 16...
17... horizontal internal face 20... adjusts plate
25... location hole 26... inwall
27... end face 28... elastic component, elastic arm
71... support plate 72... location notch
73... electronic component A... region
D... electronic component D1... first direction
D2... second direction M... magnet
L1, L2... length W1, W2... width
Embodiment
In order to more understand feature place of the present invention, the localization tool for electronic component of the present invention provides two embodiments, and accompanying drawings is as follows, please refer to Fig. 2 to Fig. 7.Below in an example, as an example, and element identical in each embodiment all uses identical element number to the electronic component D made with ceramic substrate, with conveniently recognized.
Please first referring to figs. 2 to Fig. 4, electronic component D is hollow form, and end face is provided with the region A of four tin creams to be printed, but the present invention does not limit kind and the form of electronic component D, and the quantity of the region A of tin cream to be printed and shape.The main element of the localization tool 1 of electronic component of the present invention includes support plate 10 and adjustment plate 20, and details are as follows for the structure of each element and mutual relation.
Support plate 10 uses nonferromugnetic material to make, such as aluminium.On support plate 10, mill out multiple location notch 15 with the degree of depth in the mode of intermetallic composite coating downwards from the end face of support plate 10, with the accommodating each electronic component D of difference, electronic component D is placed on location notch 15.Location notch 15 has one group of parallel each other straight internal face 16 horizontal internal face 17 parallel each other with a group respectively, wherein, straight internal face 16 is perpendicular to horizontal internal face 17, and the spacing of these two straight internal faces 16 is haply slightly larger than the width W 1 of electronic component D, the spacing of these two horizontal internal faces 17 is haply slightly larger than the length L1 (as Fig. 3) of electronic component D.
Be that to arrange four location notchs 15 be example in the present embodiment, also can change the more location notchs 15 of setting according to actual conditions into.In addition, the bottom of support plate 10 is optionally embedded with several magnet M.
Go back to Fig. 2, adjustment plate 20 uses permeability magnetic material to make, and is steel in the present embodiment.Adjustment plate 20 is provided with the location hole 25 square with four of the identical number of location notch 15 on support plate 10, the width W 2 of location hole 25 is in fact the spacing of two the straight internal faces 16 equaling or be comparable to this location notch, the length L2 of location hole 25 is in fact the spacing of two the horizontal internal faces 17 equaling or be comparable to this location notch, further, the setting position of each location hole 25 is that one_to_one corresponding is in each location notch 15.
Adjustment plate 20 is can the mode of movement be arranged at above support plate 10, when above it is superimposed on support plate 10, the location hole 25 of adjustment plate 20 and the height of the degree of depth summation of the location notch 15 of support plate 10 a little less than electronic component D, therefore, when electronic component D is placed in the location notch 15 of support plate 10, the end face of electronic component D protrudes the end face 27 of adjustment plate 20, in order to the follow-up end face print solder paste at electronic component D, as shown in Figure 4.
Use, first superimposed support plate 10 and adjustment plate 20, make adjustment plate 20 under the magnetic effect being subject to magnet M closely and be superimposed on above support plate 10 abreast, then piece machine is used to capture each electronic component D, and mobile each electronic component D, and each electronic component D is placed on support plate 10 with the location notch 15 of adjustment plate 20.Then make adjustment plate 20 to be parallel to the first direction D1 of support plate 10 end face and to move perpendicular to the second direction D2 of first direction D1 then.Now, be placed in each electronic component D of location notch 15, can be synchronously and then mobile under the promotion of adjustment plate 20.Finally, fixed adjustment plate 20, and in the end face print solder paste of each electronic component D.
Because electronic component D synchronously moves in the same direction under the promotion of adjustment plate 20, each electronic component D is located regularly.Therefore, when print solder paste, the situation of tin cream random offset can be reduced, and then the situation of workpiece missing solder, displacement when reducing follow-up piece occurs.
In addition, due to the size difference of each electronic component D itself, the displacement of individual electronic element D may be made to differ.For solving the problem, present invention also offers the second embodiment, please refer to Fig. 5 to Fig. 7.
Compared to the first embodiment, the second embodiment has support plate 10 and adjustment plate 20 equally, and its main difference is two inwalls 26 adjacent in each location hole 25 are also respectively equipped with elastic component 28, and elastic component 28 is semicircle salient point in the present embodiment.
As shown in Figure 5, due to the size difference of each electronic component D itself, therefore when Use Adjustment plate 20, when being positioned over first and second location notch 11, the electronic component D of 12 has touched location notch 11, 12 inwall time, if the electronic component D being positioned over the 4th location notch 14 not yet touches the inwall of the 4th location notch 14, now just sustainable movement towards first direction D1 and second direction D2 adjusts plate 20 and compression elastic piece 28, until the electronic component D being placed on the 4th location notch 14 touches the inwall of the 4th location notch 14, each electronic component D is located regularly.
It should be noted that, the form of elastic component 28 is not necessarily confined to the elastic component 28 of semicircular in shape as above, and it also can change into and arrange elastic arm 28, as Fig. 7.
Finally, what must again illustrate is, the composed component that the present invention is disclosed in the aforementioned embodiment, be only and illustrate, not be used for limiting the scope of the invention, every structural change that other are easily expected, or with the alternate variation of other equivalence elements, also should contain by claim of the present invention.
Claims (9)
1. a localization tool for electronic component, includes support plate, and the end face of described support plate offers multiple location notch, and with difference holding electronic element, the feature of the localization tool of described electronic component is:
The end face of described support plate is provided with the adjustment plate that can be parallel to described support plate top mobile, and described adjustment plate has and each described location notch multiple location hole one to one, and the degree of depth summation of each described location notch and each described location hole is less than or equal to the height of each described electronic component.
2. the localization tool of electronic component as claimed in claim 1, it is characterized in that, the size of described location hole equals in fact the size of described location notch.
3. the localization tool of electronic component as claimed in claim 2, it is characterized in that, described location hole is set to square.
4. the localization tool of electronic component as claimed in claim 1, it is characterized in that, the material of described adjustment plate is magnetic conductive material, and the material of described support plate is nonferromugnetic material.
5. the localization tool of electronic component as claimed in claim 4, it is characterized in that, the bottom surface of described support plate is provided with at least one magnet.
6. the localization tool of electronic component as claimed in claim 1, is characterized in that two inwalls adjacent in each described location hole also have elastic component respectively.
7. the localization tool of electronic component as claimed in claim 6, it is characterized in that, each described elastic component is salient point.
8. the localization tool of electronic component as claimed in claim 7, is characterized in that, each described salient point semicircular in shape.
9. the localization tool of electronic component as claimed in claim 6, it is characterized in that, each described elastic component is elastic arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410542729.1A CN105578794A (en) | 2014-10-15 | 2014-10-15 | Positioning tool for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410542729.1A CN105578794A (en) | 2014-10-15 | 2014-10-15 | Positioning tool for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105578794A true CN105578794A (en) | 2016-05-11 |
Family
ID=55888296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410542729.1A Pending CN105578794A (en) | 2014-10-15 | 2014-10-15 | Positioning tool for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578794A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109317368A (en) * | 2018-09-29 | 2019-02-12 | 沈阳富创精密设备有限公司 | A kind of brush nickel jig of abnormal workpieces |
| CN112543558A (en) * | 2019-09-20 | 2021-03-23 | 神讯电脑(昆山)有限公司 | Circuit board tin paste brushing device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |
| JP2005022093A (en) * | 2003-06-30 | 2005-01-27 | Matsushita Electric Ind Co Ltd | Apparatus and method for screen printing |
| KR20100006493A (en) * | 2008-07-09 | 2010-01-19 | 주식회사 진우엔지니어링 | An apparatus for array and electron parts |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN201898696U (en) * | 2010-12-09 | 2011-07-13 | 深圳顺络电子股份有限公司 | Device for chip component surface mounting |
| CN202721911U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Hand scrubber printing bench |
| CN103889162A (en) * | 2008-10-17 | 2014-06-25 | 林克治 | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture |
| CN104080276A (en) * | 2014-07-17 | 2014-10-01 | 中怡(苏州)科技有限公司 | Circuit board manufacturing method |
-
2014
- 2014-10-15 CN CN201410542729.1A patent/CN105578794A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |
| JP2005022093A (en) * | 2003-06-30 | 2005-01-27 | Matsushita Electric Ind Co Ltd | Apparatus and method for screen printing |
| KR20100006493A (en) * | 2008-07-09 | 2010-01-19 | 주식회사 진우엔지니어링 | An apparatus for array and electron parts |
| CN103889162A (en) * | 2008-10-17 | 2014-06-25 | 林克治 | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN201898696U (en) * | 2010-12-09 | 2011-07-13 | 深圳顺络电子股份有限公司 | Device for chip component surface mounting |
| CN202721911U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Hand scrubber printing bench |
| CN104080276A (en) * | 2014-07-17 | 2014-10-01 | 中怡(苏州)科技有限公司 | Circuit board manufacturing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109317368A (en) * | 2018-09-29 | 2019-02-12 | 沈阳富创精密设备有限公司 | A kind of brush nickel jig of abnormal workpieces |
| CN112543558A (en) * | 2019-09-20 | 2021-03-23 | 神讯电脑(昆山)有限公司 | Circuit board tin paste brushing device |
| CN112543558B (en) * | 2019-09-20 | 2022-04-15 | 神讯电脑(昆山)有限公司 | Circuit board tin paste brushing device |
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Application publication date: 20160511 |