KR20100006127A - Jig, apparatus and method for inspecting semiconductor chip, and manufacturing method of semiconductor device - Google Patents

Abstract

PURPOSE: A jig, an apparatus and a method for inspecting a semiconductor chip, and a manufacturing method of a semiconductor device are provided to maintain that a carrier tape is absorbed on a pressurized surface by making an adsorption hole in a vacuum. CONSTITUTION: A jig(10) for inspecting a semiconductor chip performs inspection by pressurizing a carrier tape, which has a device region and a non-device region, on a probe. In the device region, a semiconductor chip and a conductor pattern electrically connected to the semiconductor chip are repetitively positioned in the traveling direction. In the non-device region which is formed on the side of the device region, sprocket holes are arranged in a row in the traveling direction. The jig for inspecting the semiconductor chip comprises an opening of the adsorption hole.

Description

JIG for inspection of semiconductor chip, inspection apparatus and inspection method, and manufacturing method of semiconductor device {JIG, APPARATUS AND METHOD FOR INSPECTING SEMICONDUCTOR CHIP, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE}

The present invention relates to a jig for inspection of a semiconductor chip, an inspection apparatus and an inspection method, and a manufacturing method of a semiconductor device.

BACKGROUND ART In recent years, semiconductor products in which semiconductor chips are mounted on carrier tapes called TAB (Tape Automated Bonding) tapes have been used for driver circuits of liquid crystal displays. In the electrical property test of this kind of semiconductor chip, it is common to carry out in the state which mounted many semiconductor chips in the long carrier tape. In the carrier tape, conductor patterns are arranged in the longitudinal direction in advance and repeatedly formed, and a plurality of semiconductor chips are mounted on the conductor patterns, respectively.

As a result of the inspection of the electrical characteristics, the semiconductor chip judged as good quality is cut out from the TAB tape, and separated into a TAB-attached semiconductor device and mounted on a liquid crystal panel or the like.

The inspection of the good and defective products of electrical characteristics is carried out with a carrier tape attached to a probe that sends an inspection signal to and from a semiconductor chip. As one of the tools used for such an inspection, there exists an inspection jig called an adsorption plate.

The suction plate is a jig for vacuum-adsorbing and positioning the carrier tape and for electrically connecting a test pad connected to a semiconductor chip to the probe.

Regarding such inspection jig, the pressure plate 201 shown in FIG. 7 is known (refer patent document 1 below). In the pressure plate 201, suction holes 212 are formed around device holes 202-206 formed at predetermined intervals, respectively. And the carrier tape can be adsorb | sucked and held with respect to the pressure surface 207-209 by making the adsorption hole 212 into a vacuum.

The pressure plate 201 does not form an adsorption hole around the device hole 204 to be added to the semiconductor chip to be inspected, and is formed in the device holes 202, 203, 205, and 206 before and after. The suction holes 212 are formed around each other.

Patent Document 1: Japanese Unexamined Patent Publication No. 2006-250855

However, in the pressure plate 201 described in the patent document 1, the suction hole is not formed around the device hole 204 corresponding to the semiconductor chip to be inspected. For this reason, in the vicinity of the said semiconductor chip, the adsorption force of the carrier tape was weak, and there existed a problem that the contact of a test pad and a probe was not performed well.

On the other hand, in the pressure plate 201, even when the adsorption holes 212 are formed in the same way around the device hole 204, there is a possibility that a poor contact may occur between the test pad and the probe. This is due to the fact that the adsorption holes 212 were formed just above the test pad of the carrier tape. That is, during vacuum suction of the carrier tape, the test pad of the semiconductor chip to be inspected is sucked up, the contact state with the probe is changed, and the exchange of the test signal becomes uneven.

On the other hand, the conventional inspection jig needed to be designed exclusively for each carrier tape according to the shape and dimensions of the semiconductor chip and the conductor pattern. This is because, when the conductive pattern including the test pad is adsorbed, the contact state between the probe and the test pad is changed as described above, so that the semiconductor chip of good quality may be judged as defective.

For this reason, the adsorption hole of the conventional inspection jig needed to be designed individually for each kind of carrier tape from which a design differs. Therefore, in addition to the design and manufacturing cost of the jig itself, a large number of jig management costs, an operation cost of replacing the jig every time the electrical characteristics of different carrier tapes are inspected, and the like become enormous.

The inspection jig of the present invention is a device region in which all of the semiconductor chip and the conductor pattern electrically connected to the semiconductor chip, which are formed in a band shape, are repeatedly arranged in the traveling direction, and are formed on the side of the device region to form a plurality of sprockets ( an inspection jig for pressing a carrier tape having a non-device region formed with a sprocket hole arranged in the travel direction to inspect a characteristic of the semiconductor chip by pressing a probe, the pressing jig having a pressing surface for pressing the carrier tape; At the same time, the pressing surface has an opening of an adsorption hole for adsorbing the carrier tape at a position facing the region where the sprocket hole is not formed as the non-device region.

In the said invention, a running direction is the longitudinal direction of a carrier tape. Moreover, a side means the direction which cross | intersects with respect to a running direction.

In addition, the device region and the non-device region are regions extending in a band shape in the traveling direction of the carrier tape, respectively.

In the present invention, the device region means a band-shaped region having a minimum width including a semiconductor chip and a conductor pattern repeatedly arranged. In addition, a non-device area means the area | region except a device area | region in carrier tape.

Specifically, in the case where the semiconductor chips or the conductor patterns are arranged in a row on the carrier tape and are arranged repeatedly, the device regions are formed in one band shape, and the non-device regions extend in one side or both sides of the device region. It is formed into a shape. In the case where semiconductor chips or conductor patterns are arranged in a plurality of rows on a carrier tape, the device regions are formed in a plurality of strips. The non-device regions are formed in one or two or more strips between the device regions or on the end side in the width direction.

The inspection jig of the present invention may be formed as a more specific embodiment in which a plurality of the openings are arranged side by side at equal intervals in the traveling direction.

Moreover, the inspection jig of this invention is a more specific embodiment, Comprising: The said some opening part is lined up in the said travel direction, and is formed in a straight line, The straight line which the said opening part is arranged, and the straight line which the said sprocket hole is arranged facing is formed, You may be.

Moreover, as a specific embodiment, the inspection jig of this invention may be formed facing the intermediate position of the said sprocket holes which adjoin each other in the said running direction.

In the said invention, the intermediate position of the adjacent sprocket hole does not necessarily mean the exact center of the line segment which connects the centers of the said sprocket holes, and includes the predetermined area around it as long as the effect of this invention is exhibited. .

Moreover, as a specific embodiment, the inspection jig of this invention may be formed only in the position which the said opening part opposes the area | region in which the said sprocket hole was not formed as the said non-device area | region in the said press surface.

Moreover, the inspection jig of this invention may have a device hole in the position which the said pressing surface opposes the said semiconductor chip as more specific embodiment.

Moreover, the test | inspection apparatus of the semiconductor chip of this invention is equipped with the said test jig, the sprocket which aligns a rotation value with the said sprocket hole, and conveys the said carrier tape to the said travel direction, and the said test jig to the said carrier The lifting device which lifts and drives the tape, the suction device which vacuum- suctions the said adsorption hole, and adsorb | sucks the said carrier tape to the said opening part, and the said carrier tape adsorb | sucked by the said test jig, touches with the said semiconductor chip, It is provided with a probe for sending and receiving a test signal.

In the said invention, vacuum-suctioning a suction hole means making the inside of a suction hole into the negative pressure below atmospheric pressure, The vacuum degree is not specifically limited.

Moreover, the test | inspection method of the semiconductor chip of this invention is a device area | region in which both the semiconductor chip and the conductor pattern electrically connected with the said semiconductor chip formed in strip shape were repeatedly arrange | positioned in the travel direction, and it is formed in the side of the said device area, An inspection method for inspecting the semiconductor chip using a carrier tape having a non-device region in which sprocket holes are formed in the traveling direction, wherein the non-device region and the region in which the sprocket hole is not formed are vacuum suctioned. And an adsorption step of positioning the carrier tape, and an inspection step of pressing the positioned carrier tape against a probe to inspect the characteristics of the semiconductor chip.

In the said invention, vacuum adsorption means adsorb | sucking a carrier tape using a negative pressure, The vacuum degree is not specifically limited.

Moreover, the manufacturing method of the semiconductor device of this invention is a carrier tape which has the device area | region formed by strip | belt-shaped all in which the conductor pattern was repeatedly arrange | positioned, and the non-device area | region formed on the side of the said device area | region, and the sprocket hole was repeatedly arrange | positioned. A mounting step of bonding the semiconductor chip to the conductor pattern, and an adsorption step of positioning the carrier tape by vacuum adsorption of a region of the non-device region and in which the sprocket hole is not formed in the carrier tape; And an inspection step of pressing the positioned carrier tape against the probe to inspect the characteristics of the semiconductor chip, and a cutting step of cutting the inspected semiconductor chip and the conductor pattern bonded to the semiconductor chip from the carrier tape. Include.

In addition, the various components of this invention do not need to be independent of each other, the some component is formed as one member, the one component is formed by the several member, and some structure The element may be part of another component, a part of a certain component and a part of another component may be duplicated, and the like.

In the description of the method for inspecting a semiconductor chip and the method for manufacturing a semiconductor device according to the present invention, a plurality of processes may be described in order. Except where specified, the order described is a process. It does not necessarily limit the order of execution. In addition, a plurality of processes are not limited to being individually executed at different timings except as specified, and different processes are generated during execution of a process, part of the execution timing of a process and part of the execution timing of another process. To all may overlap. For example, the process of adsorb | sucking a carrier tape with a test jig and the process of pressurizing a carrier tape with a probe with a test jig may be performed before and behind a process or simultaneously.

According to the present invention, there are provided a jig for inspecting a semiconductor chip, an inspection apparatus and an inspection method, and a method for manufacturing a semiconductor device that can be commonly used for a plurality of types of carrier tapes having different designs. As a result, the design, manufacture, and management costs of the inspection jig and the operation cost during the electrical property inspection are greatly reduced.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. In all the drawings, the same components are denoted by the same reference numerals, and description thereof is omitted as appropriate.

FIG. 1: (a) is a top view which shows an example of the inspection jig 10 which concerns on embodiment of this invention, and FIG. 1 (b) is its B-B sectional drawing.

2 is a plan view of the carrier tape 50 used with the inspection jig 10 of the present embodiment.

First, the outline | summary of the inspection jig 10 and the carrier tape 50 is demonstrated.

The carrier tape 50 is a device in which the semiconductor chip 60 and the conductor pattern 62 electrically connected to the semiconductor chip 60, all of which are formed in a band shape, are repeatedly arranged in the traveling direction (left and right directions in FIGS. 1 and 2). The area D and the non-device area ND formed in the side of the device area D, and the several sprocket holes 52 arranged in the running direction are provided.

On the other hand, the inspection jig 10 presses the carrier tape 50 to the probe 70 (refer FIG. 4), and performs the characteristic test of the semiconductor chip 60. FIG.

The inspection jig 10 includes a pressing surface 20 for pressing the carrier tape 50, and the pressing surface 20 is not provided with a sprocket hole 52 as the non-device region ND. The opening 22 of the adsorption hole 21 which adsorb | sucks the carrier tape 50 is located in the position (public part opposing area | region FCA) which opposes the area | region (public part CA) which is not.

Next, the carrier tape 50 and the inspection jig 10 of this embodiment are demonstrated in detail.

<Carrier tape>

The carrier tape 50 is a flexible board | substrate with which the conductor pattern 62 was formed in the surface of the flexible resin film 66 in which the inner lead was wired inside. The conductor pattern 62 includes a bonding pad to which the bump electrodes 64 of the semiconductor chip 60 are bonded, and a test pad to which the probe 70 of the inspection apparatus 100 (see FIG. 4) touches.

It is common that polyimide is used for the resin film 66 and copper is used for the conductor pattern 62.

The test pad may be formed on the front side and the back side of the semiconductor chip 60 mounted on the carrier tape 50.

3 is a schematic diagram showing the positional relationship between the carrier tape 50 and the semiconductor chip 60.

FIG. 3A is a so-called COF (Chip 0n Film) structure, and the bump electrode 64 of the semiconductor chip 60 is mounted on the conductor pattern 62 formed on the upper surface of the resin film 66. That's the way.

In the case of carrying out the characteristic inspection on the semiconductor chip 60 of the COF structure, the conductor pattern 62 (test pad) is formed on the mounting surface side of the semiconductor chip 60, and is above in Fig. 3A. The probe 70 is brought into contact with the carrier tape 50 from the side.

3 (b) and 3 (c) are called a so-called TCP (Tape Carrier Package) structure. 3 (b) is called a face down type and FIG. 3 (c) is called a face up type. In the case of the TCP structure, the bonding pad part of the conductor pattern 62 is a flying lead which is not supported by the resin film 66. The semiconductor chip 60 mounted on the bonding pad is resin encapsulated with the flying lead.

In the case of the face down type TCP structure, the probe 70 for characteristic inspection touches the carrier tape 50 from the upper side of Fig. 3 (b) which is the mounting surface side of the semiconductor chip 60.

On the other hand, in the case of the face-up type TCP structure, the probe 70 comes into contact with the carrier tape 50 from the upper side of Fig. 3 (c) which is the non-mounted surface side of the semiconductor chip 60.

Therefore, in the case of the COF structure and the face down type TCP structure, the inspection jig 10 which vacuum-adsorbs the carrier tape 50 will contact this surface side of the semiconductor chip 60. On the other hand, with respect to the carrier tape 50 of the face-up type TCP structure, the inspection jig 10 comes into contact with the surface side of the semiconductor chip 60.

As shown in FIG. 2, the semiconductor chip 60 and the conductor pattern 62 are repeatedly arrange | positioned in the center of the width direction (up-down direction of the same figure) in the carrier tape 50 used by this embodiment. That is, the carrier tape 50 has the device region D in the center of the width direction, and has the non-device region ND on both sides.

In the non-device region ND, a plurality of sprocket holes 52 are drilled along the traveling direction of the carrier tape 50.

The sprocket hole 52 rotates with the rotation value of the sprocket 72 (refer FIG. 4) mentioned later, and conveys the carrier tape 50 with the semiconductor chip 60 to a traveling direction.

In the present embodiment, the intermediate positions of the sprocket holes 52 adjacent to each other in the travel direction of the carrier tape 50 are adsorbed by the inspection jig 10.

<Inspection jig>

The inspection jig 10 has a device hole 24 and an adsorption hole 21 repeatedly formed in a predetermined direction in the insulating base 26, and the side facing the carrier tape 50 (FIG. 1 (b)). The flat pressing surface 20 is formed in the lower side of the inside).

And the opening part 22 of the suction hole 21 is formed in the pressurizing surface 20, and the device hole 24 is formed in the position which opposes the semiconductor chip 60. As shown in FIG.

The repeating direction of the device hole 24 and the suction hole 21 coincides with the traveling direction of the carrier tape 50 so that the pressing surface 20 approaches the carrier tape 50, and the suction hole 21 is sucked with negative pressure. By doing so, the carrier tape 50 can be adsorbed and held on the pressing surface 20.

The inspection jig 10 width dimension (up-down direction of FIG. 1 (a)) is formed equal to or more than the width dimension of the carrier tape 50 adsorb | sucked to this.

Therefore, the whole surface of the carrier tape 50 can be adsorbed-held on the pressurized surface 20 of the inspection jig 10.

As shown in FIG. 1, FIG. 2, the device opposing area | region FD is virtually located in the pressurizing surface 20 at the position which opposes the device area | region D containing the semiconductor chip 60 and the conductor pattern 62. FIG. It is formed. The device facing area | region FD of this embodiment contains the one part or all part of the device hole 24 for evacuating the semiconductor chip 60, when the carrier tape 50 is adsorbed-held on the press surface 20. FIG.

On both sides in the width direction of the device opposing region FD, a non-device opposing region FND that is opposite to the non-device region ND (see FIG. 2) is virtually formed (see FIG. 1).

In addition, in this embodiment in which the width dimension of the carrier tape 50 and the width dimension of the press surface 20 are equal, the non-device opposing area | region FND is formed in the edge part of the width direction of the press surface 20. As shown in FIG. And the non-device opposing area | region FND overlaps with respect to the non-device area ND of the carrier tape 50 at the time of a characteristic test. In addition, when the carrier tape 50 is adsorbed to the inspection jig 10, the sprocket hole 52 abuts against the non-device opposing region FND of the pressing surface 20. In other words, the pressing surface 20 of this embodiment is formed in the width dimension which covers the sprocket hole 52 of the carrier tape 50.

On the other hand, when the width dimension of the carrier tape 50 is smaller than the width dimension of the press surface 20, the excess area | region which does not contact the carrier tape 50 arises in the edge part of the width direction of the press surface 20. As shown in FIG. In this case, the area | region in the press surface 20 which opposes the non-device area ND is called non-device opposing area | region FND. The surplus region virtually formed at the end portion in the width direction of the pressing surface 20 does not belong to the non-device opposing region FND nor to the device opposing region FD.

The opening part 22 of the suction hole 21 is formed in this non-device opposing area | region FND in the pressurizing surface 20. As shown in FIG. As a result, when the carrier tape 50 is adsorbed and held by the inspection jig 10, the suction position 54 can be formed inside the non-device region ND of the carrier tape 50.

Moreover, the opening part 22 is formed in the non-device opposing area | region FND of the pressing surface 20 facing the non-formation area | region of the sprocket hole 52 in the carrier tape 50. As shown in FIG.

This is because when the suction position 54 interferes with the sprocket hole 52, ambient air flows in from the sprocket hole 52 with respect to the suction hole 21, so that the inside of the suction hole 21 can not be vacuum sucked. Because it becomes.

Therefore, in the inspection jig 10 of this embodiment, the opening part 22 is formed in the inside of shared part opposing area | region FCA.

In the inside of the common part opposing area | region FCA, the arrangement position and number of the opening part 22 are not specifically limited. The arrangement pattern of the opening portion 22 is not particularly limited, such as a linear shape or a zigzag shape.

In the inspection jig 10 of this embodiment, as shown to FIG. 1 (a), the some opening part 22 is formed in a row at equal intervals in the running direction of the carrier tape 50. FIG. In addition, in the inspection jig 10 of the present embodiment, a plurality of openings 22 are arranged in a straight line in the running direction, and a straight line in which the openings 22 (adsorption positions 54) are arranged and a sprocket are arranged. The straight lines in which the holes 52 are listed are formed to face each other (see FIG. 2).

In addition, the opening part 22 of this embodiment is formed in the carrier tape 50 facing the intermediate position of the sprocket holes 52 which adjoin each other in a travel direction. Therefore, the adsorption | suction position 54 in the carrier tape 50 becomes an intermediate position of the sprocket hole 52 which adjoins in a column direction.

In addition, in this embodiment, the opening part 22 opposes the common part CA (refer FIG. 2) in which the sprocket hole 52 is not formed as a non-device area | region ND in the carrier tape 50. As shown in FIG. It is formed only in the secondary opposing area FCA.

In addition, the opening part 22 may be formed in the device hole 24 or over the device hole 24. In this case, the suction device 90 (refer to FIG. 4) sucks the air inside the suction hole 21 and the air inside the device hole 24, thereby pressing the carrier tape 50 to the pressing surface 20. Can be adsorbed.

<Inspection device>

4 is a schematic diagram of an inspection apparatus 100 including an inspection jig 10.

The inspection apparatus 100 includes the inspection jig 10 of the present embodiment, a sprocket 72 for moving the carrier tape 50 in the travel direction by engaging the rotation value with the sprocket hole 52, and the inspection jig 10. ), The lifting device 96 for elevating and driving the carrier tape 50 with respect to the carrier tape 50, the suction device 90 for suctioning the suction hole 21 under vacuum to suck the carrier tape 50 into the opening 22, and for inspection. The carrier tape 50 adsorbed to the jig 10 is provided with a probe 70 that sends an inspection signal to and from the semiconductor chip 60.

In this embodiment, as shown in the figure, the carrier tape 50 of the TCP structure of a face up type is used. The carrier tape 50 is wound in a roll shape on a supply reel (not shown) and provided to the property test. And the carrier tape 50 is adsorbed by the test jig 10 and pressed by the probe 70 over the predetermined length containing one or more (three in FIG. 4) semiconductor chip 60. As shown in FIG.

The probe 70 protrudes from the upper surface of the signal processing apparatus 80 mounted in the base 82, and is formed in many numbers. When the tip of the probe 70 touches each test pad of the conductor pattern 62, the signal processing device 80 inputs the generated test signal to the semiconductor chip 60. Moreover, the predetermined output signal is input from the probe 70 to the signal processing apparatus 80, and the electrical characteristic test of the semiconductor chip 60 is performed.

The probe 70 may be formed in the plurality of signal processing apparatuses 80 so that the test signals can be simultaneously transmitted to and received from the plurality of semiconductor chips 60.

The suction device 90 includes a cover 92 covering the upper surface of the inspection jig 10 and a suction pipe 94 communicating with each of the suction holes 21 through the cover 92. The suction pipe 94 has flexibility and can vacuum-suck the inside of the suction hole 21 without depending on the height position of the inspection jig 10 for raising and lowering driving.

The sprocket 72 is formed before and after the inspection jig 10 with respect to the running direction of the carrier tape 50. In the case of this embodiment, corresponding to the sprocket hole 52 formed in the width direction both sides of the carrier tape 50, the sprocket 72 by two types is arrange | positioned before and after the inspection jig 10. .

In the inspection apparatus 100 of this embodiment, the electrical characteristics inspection of the semiconductor chip 60 can be performed by implementing the following process.

<Inspection Method of Semiconductor Chip>

The inspection method according to the present embodiment includes an adsorption step of vacuum adsorption of the common part CA which is the non-device region ND and on which the sprocket hole 52 is not formed, and positioning the carrier tape 50, And an inspection step of pressing the positioned carrier tape 50 to the probe 70 and conducting a characteristic inspection of the semiconductor chip 60.

In the adsorption step, first, the sprocket 72 is driven to rotate, and the long carrier tape 50 on which the semiconductor chip 60 is mounted is moved by a predetermined length in the travel direction. And the carrier tape 50 is located with respect to the pressing surface 20 so that the device hole 24, the semiconductor chip 60, the opening part 22, and the adsorption | suction position 54 may respectively overlap with predetermined position precision. Decide

Next, the suction device 90 is operated and the suction hole 21 is vacuum-sucked while operating the lifting device 96 to move the inspection jig 10 closer from the upper side of the carrier tape 50. Thereby, the upper surface of the carrier tape 50 is adsorbed-held by the press surface 20, and the carrier tape 50 is positioned with respect to the jig 10 for inspection.

In the inspection step, first, the elevating device 96 continuously lowers the inspection jig 10 toward the probe 70, and moves the test pad of the conductor pattern 62 to the tip of the probe 70 at a predetermined pressing force. To reach.

Next, a test signal is exchanged between the signal processing device 80 and the semiconductor chip 60 through the probe 70, and defect inspection of the semiconductor chip 60 is performed.

<Method for Manufacturing Semiconductor Device>

The manufacturing method of the semiconductor device which concerns on this embodiment is a mounting process which joins the semiconductor chip 60 to the conductor pattern 62 of the said carrier tape 50, each said process regarding electrical property test, and the test | inspected And a cutting step of cutting the semiconductor chip 60 and the conductor pattern 62 bonded thereto from the carrier tape 50.

In a mounting process, the bump electrode 64 of the semiconductor chip 60 is bonded by what is called a gold bump with respect to the bonding pad of the conductor pattern 62.

The adsorption step and the inspection step are as described above.

Then, the semiconductor chip 60 determined as defective is removed from the carrier tape 50, leaving only the semiconductor chip 60 determined as good as a result of the property inspection. The carrier tape 50 in which only good semiconductor chips 60 are left is conveyed in a state wound in a roll shape. And in the cutting process in the assembly line of a liquid crystal panel, for example, the roll-shaped carrier tape 50 is stretched flat and long again. And together with the conductor pattern 62 and the resin film 66 containing this, the semiconductor chip 60 is cut | disconnected from the carrier tape 50 and individualized as a semiconductor device.

The effect of the inspection jig 10 of this embodiment is demonstrated.

In the inspection jig 10 of the present embodiment, the pressing surface 20 is a region in which the sprocket hole 52 is not formed as the non-device region ND in the carrier tape 50 (public portion CA). The opening 22 of the adsorption hole 21 which adsorb | sucks the carrier tape 50 is located in the position (public part opposing area | region FCA) opposite to)). By this structure, the inspection jig 10 can vacuum-adsorb the non-device region ND of the carrier tape 50, and can position this. Therefore, the inspection jig 10 can be generalized also about the carrier tape 50 which differs in the design of the device area | region D which is an area | region unique to a variety.

Moreover, since the opening part 22 is formed in the non-device opposing area | region FND which opposes the non-device area ND, it does not adsorb | suck the conductor pattern 62 of the carrier tape 50. FIG. Therefore, the electrical contact between the conductor pattern 62 and the probe 70 does not become poor, and the electrical characteristic inspection of the semiconductor chip 60 is performed satisfactorily.

Moreover, since the opening part 22 is formed facing the non-formation area | region of the sprocket hole 52, when adsorb | sucking the carrier tape 50, ambient air does not flow into the opening part 22 through the sprocket hole 52. FIG. Do not. Therefore, the carrier tape 50 does not become poorly adsorbed locally or as a whole.

In addition, in this embodiment, the opening part 22 is formed in the running direction at equal intervals. For this reason, the adsorption hole 21 is equally arrange | positioned also in the vicinity of the semiconductor chip 60 used as the object of a characteristic test | inspection, and the pressing surface 20 and the carrier tape 50 are closely contacted in a balanced manner.

Moreover, in this embodiment, the opening part 22 is formed in the same straight line as the position which opposes the sprocket hole 52 arranged in the travel direction, respectively. Thereby, the position of the adsorption | suction position 54 which opposes the opening part 22 can be spaced apart from the sprocket hole 52 and the conductor pattern 62 in a balanced manner.

In addition, the device region D of the carrier tape 50 increases and decreases in its width dimension by a variety-specific design, and in the case of the maximum, close to the sprocket hole 52. However, since the device region D does not extend to the inner side of the formation region of the sprocket hole 52 arranged in the running direction, the suction position 54 is made to be on the same straight line as the sprocket hole 52. It can correspond to the device area | region D of all the width dimensions.

In addition, when carrying out a characteristic test by changing the carrier tape 50 into multiple types, as the carrier tape 50, the pitch of the sprocket hole 52 arrange | positioned in a travel direction, and the sprocket hole 52 which oppose to the width direction It is preferable that the space | interval between comrades is common.

Moreover, in this embodiment, the opening part 22 is formed facing the intermediate position of the sprocket hole 52 which adjoins each other in a travel direction. By this structure, the suction position 54 on the carrier tape 50 can also be spaced apart from the sprocket hole 52 and the conductor pattern 62 in balance with respect to a running direction.

Moreover, in this embodiment, the opening part 22 is only in the position which opposes the area | region (public part opposing area | region FCA) in which the sprocket hole 52 is not formed as the non-device area | region ND in the pressing surface 20. As shown in FIG. ) Is formed. By this structure, the opening part 22 does not exist in the device area | region D which differs in design for every kind of carrier tape 50, and generalization of the inspection jig 10 is attained as much as possible.

Moreover, in this embodiment, the pressing surface 20 has the device hole 24 in the position which opposes the semiconductor chip 60. With such a configuration, even when the semiconductor chip 60 protrudes from the upper surface pressed on the pressing surface 20 in the carrier tape 50 (face up type of the TCP structure: see FIG. 3 (c)), the device This can be retracted by the hole 24. Thereby, the adsorption | suction of the adsorption | suction position 54 by the opening part 22, and the pressurization of the carrier tape 50 by the pressurizing surface 20 are attained.

Moreover, according to the pressing surface 20 which has the device hole 24, when the semiconductor chip 60 protrudes on the surface side opposite to the pressing surface 20 among the carrier tapes 50 (COF structure or TCP structure), The face down type of (see Fig. 3 (a) and Fig. 3 (b)), the adsorption and pressurization of the carrier tape 50 is similarly possible.

Therefore, the back side of the inspection jig 10 which has the device hole 24 in the pressing surface 20 can further improve versatility.

Moreover, in the inspection method of the semiconductor chip of this embodiment, and the manufacturing method of the semiconductor device containing this, the area | region (public part CA) which is a non-device region ND and in which the sprocket hole 52 is not formed is shown Adsorption step of positioning the carrier tape 50 by vacuum adsorption. Thereby, positioning can also be performed common to the carrier tape 50 from which the design of the device area | region D which is a cultivation | region specific area | region is different.

In addition, this invention is not limited to embodiment mentioned above, It also includes aspects, such as various deformation | transformation, improvement, etc. as long as the objective of this invention is achieved.

5 is a plan view showing a first modification of the inspection jig. This inspection jig 12 differs from the inspection jig 10 shown in FIG. 1 in that the device hole 24 is not formed in the pressing surface 20, and the device opposing region FD is a flat surface. Do.

In other words, the inspection jig 12 is used to inspect the electrical characteristics of the semiconductor tape 60 mounted on the carrier tape 50 of the COF structure or the carrier tape 50 of the facedown type TCP structure.

Also for the inspection jig 12, the device facing area FD and the non-device facing area FND are virtually divided into the pressing surface 20 in response to the device area D of the carrier tape 50 to be adsorbed. Is formed. And the opening part 22 is formed in the common part opposing area | region FCA in which the sprocket hole 52 is not formed in the opposing position of the pressing surface 20 among the non-device opposing area | regions FND.

6 is a plan view illustrating a second modification of the inspection jig. This inspection jig 14 does not oppose the straight line which the several opening part 22 arranged in the running direction arrange | positioned, and the straight line which the sprocket hole 52 arranged. In other words, when the inspection jig 14 is viewed in a plan view, the opening 22 and the sprocket hole 52 are arranged on straight lines different from each other in parallel.

Specifically, the opening part 22 is formed in the outer side of the width direction rather than the opposing position of the sprocket hole 52. That is, the straight line in which the opening part 22 was arranged in the inspection jig 14 and the straight line in which the sprocket hole 52 was arranged in the carrier tape 50 do not overlap.

By forming the opening part 22 in such a position, the inspection jig 14 has the sprocket hole 52 and the adsorption position 54 in the carrier tape 50 compared with the inspection jig 10 shown in FIG. The carrier tape 50 can be stably adsorbed to the pressing surface 20 in the traveling direction while further separating the distance of.

In addition, in the inspection jig 10, 12, 14, all the opening part 22 is formed in the same pitch with the sprocket hole 52, but this invention is not limited to this, The opening part 22 of the opening part 22 arranged in the running direction is not limited to this. The pitch and the pitch of the sprocket holes 52 may be different. In this case, the pitch of the opening portion 22 (adsorption position 54) may be an integer multiple of the pitch of the sprocket hole 52 so that the suction position 54 and the sprocket hole 52 do not interfere.

In addition, ribs for guiding the carrier tape 50 extend in the traveling direction and are formed on one side or both sides in the width direction of the pressing surface 20 in the inspection jig 10, 12, 14. You may be.

Thus, unevenness | corrugation may be formed in the pressurizing surface 20 as long as the inspection jig 10, 12, 14 does not prevent the adsorption | suction of the carrier tape 50 by the pressurizing surface 20. FIG.

In addition, in this embodiment, you may provide the adsorption | suction position 54 not only inside the common part CA but about some adsorption | suction position 54 in the inside of the device area | region D. As shown in FIG. In this case, the versatility of the inspection jig 10, 12, 14 is reduced, but the carrier tape 50 is adsorbed better and the positional accuracy can be improved.

1 (a) is a plan view showing an example of an inspection jig according to an embodiment of the present invention, and FIG. 1 (b) is a B-B cross-sectional view thereof.

2 is a plan view of a carrier tape used in the present embodiment.

3 (a) to 3 (c) are schematic diagrams showing the positional relationship between a carrier tape and a semiconductor chip.

4 is a schematic view of an inspection apparatus including the inspection jig of this embodiment.

5 is a plan view showing a modification of the inspection jig.

6 is a plan view showing another modification of the inspection jig.

7 is a perspective view of a conventional inspection jig.

* Description of the symbols for the main parts of the drawings *

10, 12, 14: Inspection jig

20: pressure surface

21: adsorption hole

22: opening

24: device holes

26: description

50: carrier tape

52: sprocket hole

54: adsorption position

60: semiconductor chip

62: conductor pattern

64: bump electrode

66: resin film

70: probe

72: sprocket

80: signal processing unit

82: expectation

90: suction device

92: cover

94: suction tube

96: lifting device

100: inspection device

D: device area

FD: device facing area

ND: non-device area

FND: non-device facing area

CA: Common

FCA: commons facing area

Claims (9)

All formed in a band shape, A device region in which a semiconductor chip and a conductor pattern electrically connected to the semiconductor chip are repeatedly arranged in a travel direction; A non-device area formed on the side of the device area and formed with a plurality of sprocket holes arranged in the running direction. An inspection jig for pressurizing a carrier tape having a probe to a probe to inspect the characteristics of the semiconductor chip, While having a pressing surface for pressing the carrier tape, An inspection jig, wherein said pressing surface has an opening of an adsorption hole for adsorbing said carrier tape at a position opposite said region where said sprocket hole is not formed as said non-device region. The method of claim 1, The inspection jig, wherein the plurality of openings are formed in a row at equal intervals in the travel direction. The method of claim 1, A plurality of the openings are formed in a straight line arranged in the running direction, The jig for inspection, wherein the straight line in which the opening is listed and the straight line in which the sprocket hole is listed are formed to face each other. The method of claim 3, wherein The opening jig is formed to face an intermediate position of the sprocket holes adjacent to each other in the travel direction. The method of claim 1, The said opening part is an inspection jig | tool formed only in the position which opposes the area | region in which the said sprocket hole is not formed as the said non-device area | region in the said press surface. The method of claim 1, The pressing surface has a device hole at a position opposite to the semiconductor chip. An inspection jig according to any one of claims 1 to 6, A sprocket which feeds the carrier tape in the traveling direction by engaging a rotational value with the sprocket hole; An elevating device for elevating and driving the inspection jig with respect to the carrier tape; A suction device for vacuum suctioning the suction hole to suck the carrier tape into the opening; And a probe which touches the carrier tape adsorbed on the inspection jig and sends an inspection signal to and from the semiconductor chip. All formed in a band shape, A device region in which a semiconductor chip and a conductor pattern electrically connected to the semiconductor chip are repeatedly arranged in a travel direction; A non-device area formed on the side of the device area so that a plurality of sprocket holes are arranged in the running direction. An inspection method for inspecting the semiconductor chip using a carrier tape having a, An adsorption step of positioning the carrier tape by vacuum adsorption of the non-device region and the region where the sprocket hole is not formed; An inspection step of pressing the positioned carrier tape against a probe to inspect the characteristics of the semiconductor chip. Including, the inspection method of a semiconductor chip. All formed in a band shape, A device region in which conductor patterns are repeatedly arranged; A non-device region formed on the side of the device region, the sprocket hole is repeatedly arranged A mounting step of bonding a semiconductor chip to each of the conductor patterns of the carrier tape having a; An adsorption step of positioning the carrier tape by vacuum adsorption of the non-device region and the sprocket hole not formed in the carrier tape; An inspection step of pressing the positioned carrier tape against a probe to inspect the characteristics of the semiconductor chip; A cutting step of cutting the inspected semiconductor chip and the conductor pattern bonded to the semiconductor chip from the carrier tape A manufacturing method of a semiconductor device comprising a.

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