KR20100004486U - LED Illumination Module - Google Patents

Abstract

LED lighting module is provided.

The present invention is at least one light emitting source for generating light when the power is applied; A substrate having a pattern circuit to which the light emitting sources are electrically connected; It extends a certain height from the bottom portion in contact with the bottom surface of the substrate, the left and right edges of the substrate is inserted into a pair of side wall portions formed in the inner surface of the substrate assembly groove, the substrate is inserted in the longitudinal direction along the substrate assembly groove A heat dissipation housing disposed; And a closure member assembled to each of the inlet and outlet ends of the heat dissipation housing to seal the open inlet and outlet ends of the heat dissipation housing.

According to the present invention, it is possible to obtain a uniform brightness by placing in the surface light source lighting device in a photometric manner, and to minimize the power consumption by reducing the number of installations compared to the same area, to improve energy efficiency, and to reduce the thickness of the lighting device At the same time, it is possible to increase the size of the lighting device and to extend the life of the product due to its excellent heat dissipation characteristics.

Light Emitting Diode, Lighting, Board, Heat Dissipation, Plug

Description

LED Illumination Module

The present invention relates to an LED lighting module, more specifically, it can be arranged in a surface light source lighting device in a photometric manner to obtain a uniform brightness, to minimize the power consumption by reducing the number of installations compared to the same area to improve energy efficiency The present invention relates to an LED lighting module capable of reducing the thickness of the lighting device and reducing the thickness thereof and at the same time increasing the size of the lighting device and extending the life of the product due to its excellent heat dissipation characteristics.

In general, light emitting diodes (LEDs) are smaller than light sources such as fluorescent lamps and incandescent lamps, and have a long lifespan and low energy consumption because electrical energy is directly converted into light energy. It has high, high brightness and fast response. Accordingly, various lighting apparatuses using such LEDs as light emitting sources have been developed.

In addition, the lighting device using the LED as a light emitting source is safe in the future in response to various environmental regulations and climate change conventions, unlike incandescent and fluorescent lamps, and does not use filament or mercury at all, and there is no restriction on the use of harmful substances. As there is no obligation to collect electronics and there is no CO2 emission restriction, the importance of the lighting industry is increasing.

On the other hand, the lighting module having such an LED is fastened so as to be arranged in a photometric or direct type to the lighting device is provided with a structure in which a plurality of small LEDs in the longitudinal direction on the substrate.

The Republic of Korea Utility Model Registration No. 0440817 (2008.6.27. Registered Date) is a PCB board printed with a connection circuit connecting the header pin terminal, and the LED which is attached to the front and emits light by power and signal transmitted through the connection circuit. And bar-shaped LED lighting module including a relay for controlling the light emission of the LED is disclosed.

However, when the conventional LED lighting module is disposed at the periphery of the lighting device to reduce the number of installation while reducing the thickness of the surface light source lighting device, the brightness and uniformity provided by the surface light source are poor, so that uniform illumination can be obtained. It was difficult to perform its function as a lighting device for signboards and displays.

Accordingly, the LED lighting module had to be provided in a direct manner arranged in a plane below the diffuser plate of the surface light source lighting device. However, when the LED lighting module is provided in a direct manner, the number of installation of the LED light source should be increased in order to reduce the spots generated between the LED light source and the adjacent LED light source, thereby reducing energy efficiency due to high power consumption. In addition, the manufacturing cost of the lighting device is increased, the thickness of the lighting device is increased, which entails design constraints, and there is a problem in increasing the size of the lighting device.

In addition, when the LED light source adopts a high output LED in order to increase the light efficiency, it acts as a factor of shortening the product life by deteriorating the peripheral parts by the high heat generated during light emission.

Therefore, the present invention is to solve the problems as described above, the purpose is to be arranged in the surface light source illumination device to obtain a uniform brightness, and to minimize the power consumption by reducing the number of installation compared to the same area energy To improve efficiency, reduce the thickness of the lighting device to reduce the thickness and at the same time to increase the size of the lighting device, and excellent heat dissipation characteristics to provide an LED lighting module that can extend the product life.

As a specific means for achieving the above object, the present invention is at least one light emitting source for generating light when power is applied; A substrate having a pattern circuit to which the light emitting sources are electrically connected; It extends a certain height from the bottom portion in contact with the bottom surface of the substrate, the left and right edges of the substrate is inserted into a pair of side wall portions formed in the inner surface of the substrate assembly groove, the substrate is inserted in the longitudinal direction along the substrate assembly groove A heat dissipation housing disposed; And a plug member assembled to the inlet and outlet ends of the heat dissipation housing to seal the open inlet and outlet ends of the heat dissipation housing.

Preferably, the light emitting source is electrically connected to the pattern circuit of the substrate, the package body having a lead frame wire-bonded with the LED chip, and the package body to cover the upper lens formed on the upper surface of the package body; It includes an optical guider that is assembled.

More preferably, the package body is a high-output LED package, the optical guider has a radiation angle of 30 degrees in the longitudinal direction orthogonal to the longitudinal direction of the substrate, 60 to 100 degrees in the horizontal direction parallel to the longitudinal direction of the substrate The pattern is provided to have a square.

Preferably, the substrate is made of a metal PCB, the pattern circuit is printed on the upper surface, and containing any one of aluminum or iron alloy.

Preferably, the substrate further comprises a control unit for controlling the light emission of the light emitting source, the control unit includes a constant current switching driver circuit for converting the current supplied to the light emitting source into a constant current to maintain a constant value.

Preferably, the bottom portion of the heat dissipation housing includes at least one contact portion protruding a predetermined height so as to locally contact the bottom surface of the substrate.

Preferably, the side wall portion of the heat dissipation housing is provided with a plurality of grooves on the outer surface to widen the heat dissipation surface area.

Preferably, the apparatus further includes a transparent plate covering an open top of the heat dissipation housing, wherein the transparent plate is inserted and assembled along the transparent plate assembly groove formed on the upper inner surface of the side wall portion.

Preferably, the closure member has a plurality of guiders including a support hole is inserted into the power cable is electrically connected to one end of the pattern circuit of the substrate.

Preferably, the closure member is provided with a plurality of elastic pieces in the lower end, the elastic piece is elastically coupled to the assembly step formed in the inlet and outlet end of the heat dissipation housing.

According to the present invention, there is provided a heat dissipation housing in which a substrate is assembled in a sliding manner so as to form a heat dissipation path by interfacing with a lower surface of the substrate and having a substrate electrically connected to a light emitting source that is emitted when power is applied; By having a stopper member assembled to seal the exit end, it can be arranged in a surface light source lighting device by metering to obtain uniform brightness, and can improve energy efficiency by minimizing power consumption by reducing the number of installations compared to the same area. In addition to reducing the thickness of the lighting device, it is possible to reduce the thickness and at the same time to increase the size of the lighting device.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is an overall perspective view showing an LED lighting module according to a preferred embodiment of the present invention, Figure 2 is a plan view showing an LED lighting module according to a preferred embodiment of the present invention, Figure 3 is a preferred embodiment of the present invention An exploded perspective view of the LED lighting module according to the present invention.

The LED lighting module 100 of the present invention, as shown in Figures 1 to 3, includes a light emitting source 110, a substrate 120, a heat dissipation housing 130 and the closure member 140.

The light emitting source 110 is provided with at least one LED package for generating light when the power is applied.

As shown in FIGS. 4 and 5 (a), (b) and (c), the light emitting source 110 is assembled to a package body 111 including an LED and an upper surface of the package body 111. The light guider 113 is included.

The package main body 111 includes a main body 111a having a pair of lead frames 111b soldered to be electrically connected to a pattern circuit formed on an upper surface of the substrate 120 to protrude from both sides. An upper lens 111c is provided separately or integrally formed on the upper surface of the 111a, and the package body 111 is a high power light emitting diode package having a radiation angle of 70 to 150 degrees, preferably 120 to 135. It may be provided.

Here, the main body 111a includes a light emitting chip (not shown) wire-bonded with the pair of lead frames, and the light emitting chip is mounted on an upper surface of a heat radiating member (not shown) mounted inside the main body. The heat dissipation member is fixed to be in contact with the upper surface of the substrate 120 to facilitate the heat dissipation through the substrate 120.

The upper lens 111c is provided in a dome shape having an external curvature of a predetermined size so that light generated when the light emitting chip emits light can be radiated to a wide radiation angle to the outside.

In addition, the optical guider 113 is a separate lens member assembled to the upper surface of the package body 111 to guide the light generated by the package body 111 to the outside.

The optical guider 113 includes a guider body 113a including a cavity having an inner diameter widening toward the light output direction, a transparent resin material 113b filled in the cavity 113a, and the guider body 113a. A reflective layer 113c formed of a reflective material applied to a predetermined thickness on an inner inclined surface and a lens arrangement groove 113d on which the upper lens 111c is disposed are provided.

In addition, the lower end of the guider body 113a is preferably provided with a cutting groove 113e to be assembled without interference with the lead frame 111b of the main body 111a.

Accordingly, the light generated from the package body enters the optical guider 113 through the upper lens 111c, and the light in the optical guider 113 is reflected on the reflective surface 113c or passes through the cavity. Will be radiated to the outside.

Here, the optical guide 113 has a radiation angle β of a predetermined angle of 30 degrees in the longitudinal direction orthogonal to the longitudinal direction of the substrate 120 and 60 degrees in the horizontal direction parallel to the longitudinal direction of the substrate 120. It is preferable to provide a pattern so as to have a radiation angle α of 100 degrees.

The reflective layer 113c is made of a reflective material made of any one of aluminum, silver, or an alloy containing these metals, and may be any of thermal evaporation, sputtering deposition, or plating. It can be provided in one way.

The substrate 120 has at least one light emitting source 110 mounted thereon, and includes a pattern circuit at an upper surface thereof so as to be electrically connected to a lead frame of the mounted light emitting source 110. It should also be electrically connected to the power cable 125 to supply current to the 110).

The substrate 120 is preferably made of a metal PCB containing a material having excellent thermal conductivity, such as aluminum or iron alloy so that the light emitting source 110 can transmit and release heat generated when the light is emitted.

Both ends of the substrate may be provided with assembly jaw 123 is coupled to the stopper member 140, respectively.

In addition, the substrate 120 may include a controller 125 that controls the power supplied to the light source 110 to control the light emission of the light source 110 that is emitted when the power is applied, such a controller 129 ) Is preferably provided as a constant current switching driver circuit for converting the current supplied to the light emitting source 110 into a constant current to maintain a constant value.

The heat dissipation housing 130 is a heat dissipation member contacting the substrate 120 to dissipate heat generated when the light emitting source 110 emits light to the substrate 120 to the outside.

The heat dissipation housing 130 includes a bottom portion 131 which is in contact with the bottom surface of the substrate 120, and a pair of side wall portions 132 extending substantially at a right angle from both ends of the bottom portion 131. By doing so, the heat dissipation housing 130 is opened and closed before and after the inlet end and the outlet end, the left and right sides are sealed by the side wall portion 132, and is provided with a structure of the substantially 'c' cross-section open in the light exit direction and At the same time, it is made of a heat-dissipating member that is compression molded of a material such as aluminum having excellent heat transfer efficiency.

The upper surface of the bottom portion 131 protrudes the contact surface 133 of a predetermined height so as to be in contact with the bottom surface of the substrate 120 as a whole or locally to transfer heat transferred to the substrate 120 to the heat dissipation housing. do.

The pair of side wall parts 132 includes a substrate assembly groove 134 in which left and right edges of the substrate 120 are inserted and assembled on an inner side surface facing the light emitting source 110, thereby providing one side of the heat dissipation housing. The substrate 120 entering the open inlet end is inserted into the substrate assembly groove 134 and disposed in parallel with the bottom portion 131.

In addition, the upper side of the inner side of the pair of side wall portion 132 is provided with a transparent plate assembly groove 135 assembled with the transparent plate 150 to be described later.

In addition, the pair of side wall portions 132 may include a plurality of grooves 132a to widen the heat dissipation surface for dissipating heat transferred to the outer surface to the outside.

The closure member 140 is a sealing member assembled to the inlet and outlet ends of the heat dissipation housing 130 so as to seal the open inlet and outlet ends of the heat dissipation housing 130, respectively.

The plug member 140 is an injection resin having a plurality of guiders 142 including a support hole 141 is inserted into the power cable 125 is electrically connected to one end of the pattern circuit of the substrate 120. Is done.

The power cable is inserted into and supported by the guider 142 to prevent shaking and detachment of the power cable 125 after the assembly of the lighting module is completed, thereby preventing short circuits with the pattern circuit, thereby increasing the reliability of the product. .

In addition, the closure member 140 is provided with a plurality of elastic pieces 143 at the lower end, as shown in Figure 6, the elastic piece 143 is at the inlet end and the outlet end of the heat dissipation housing 140, respectively By being elastically coupled to the assembled jaw 123 is formed, it is possible to easily and quickly perform the task of assembling the stopper member 140 coupled to the heat dissipation housing and the substrate. .

And, the lower end and the upper end of the stopper member 140, the lower cutting groove 144 and the transparent plate assembly groove 135 is disposed, the insertion surface and the contact surface 133 is disposed with the elastic piece 143. Each of the upper incision groove 145 is provided.

Accordingly, the closure member 140 may be combined with the substrate 120, the power cable 125, and the heat dissipation housing 130.

On the other hand, the heat dissipation housing 130 may include a transparent plate 150 made of a transparent material to cover the open top to prevent foreign matter from flowing in from the outside while protecting the internal parts from the poor external environment. The transparent plate is inserted and assembled along the transparent plate assembly groove 135 formed on the upper inner surface of the pair of side wall portions 132.

Assembling the LED lighting module having the above configuration is, as shown in Figure 7 (a), first prepare a substrate 120 on which a plurality of package body 111 is mounted with a predetermined interval on the upper surface, The optical guider 113 is packaged to cover the upper lens 111a of the package body 111 by the optical guider 113 on the upper portion of the package body 111 so as not to interfere with the lead frame 111c. By assembling the light emitting source 110 to generate light when the power is applied to complete.

Here, although illustrated and described as three light emitting sources 110 on the substrate 120 is not limited thereto.

Subsequently, as shown in FIG. 7B, a pair of elastic pieces 143 formed at the lower end of the closure member 140 is elastically mounted on the assembly jaw 123 formed at one end of the substrate 120. By inserting and assembling, the closure member 140 is assembled to one end of the substrate 120.

At this time, the support hole 141 of the guider 142 formed on the plug member 140 supports the power cable without shaking by inserting a power cable 125 having one end electrically connected to the pattern circuit of the substrate 120. Done.

Subsequently, the substrate 120 having the plug member 140 assembled at one end thereof has a substrate assembly groove 134 formed in the side wall portion 132 of the heat dissipation housing 130 as shown in FIG. Inserted into the thermal housing 130 in a sliding manner is assembled, and accordingly, the plug member 140 is disposed on any one side of the open inlet and outlet end of the heat dissipation housing 130.

At this time, the substrate 120 assembled to the heat dissipation housing 130 is integrally coupled to each other by a fastening member (not shown).

And, as shown in Figure 7 (d), the open upper portion of the heat dissipation housing 130, the transparent plate 150 made of a transparent material as a transparent plate assembly groove 135 formed in the pair of side wall portion 132. ) Is assembled in a sliding manner similar to the insertion method of the substrate.

In addition, as shown in FIG. 7E, the remaining stopper member 140 of the pair of stopper members 140 has a pair of elastic pieces 143 formed at a lower end of the pair of stopper members 140 at the other end of the substrate 120. By assembling by inserting elastically into the formed jaw 123, the stopper member 140 is assembled to the other end of the substrate 120 and at the other end of the remaining open outlet end or inlet end of the heat dissipation housing 130. By completing the assembly to the LED lighting module 100 is completed assembly.

On the other hand, Figure 8 is a graph showing the luminous flux of the light guide provided in the LED lighting module according to a preferred embodiment of the present invention, a) is a longitudinal radiation angle and a horizontal radiation angle of the optical guide is provided with 60 degrees each B) is the case where the longitudinal radiation angle of the optical guide is provided at 30 degrees and the horizontal radiation angle is 60 degrees, and c) is the longitudinal direction of the optical guide at 30 degrees and the horizontal radiation angle at 100 degrees. This is the case.

 In this case, when the package body 111 coupled to the light guide 113 is provided as a high output LED package having a radiation angle of 120 to 135 degrees, and the luminous flux of light generated from the light emitting chip is constantly provided at 120lm, 60 The light flux measured in the optical guide having the longitudinal and horizontal radiation angles of degrees × 60 degrees is represented as 1.53 lm at 1 m, 0.38 lm at 2 m, and 0.17 lm at 3 m, as shown in FIG. 8 (a). The overall light efficiency of the light source combined with the guide and the package body can be obtained as 186.6lm at 1m, 45.6lm at 2m and 20.4lm at 3m by the product of the luminous flux of the light emitting chip and the luminous flux of the light guide.

On the other hand, since the luminous flux measured in the light guide having a radiation angle of 30 degrees x 60 degrees is shown as 4.71 lm at 1 m, 1.18 lm at 2 m, and 0.52 lm at 3 m, as shown in FIG. The overall light efficiency of the light emitting source combined with the guide and the package body can be obtained as 565.2m in 1m, 141.lm in 2m and 62.4lm in 3m by the product of the luminous flux of the light emitting chip and the luminous flux of the light guide.

In addition, since the luminous flux measured in the optical guide having a radiation angle of 30 degrees x 100 degrees is represented by 3.53 lm at 1 m, 0.88 lm at 2 m, and 0.39 lm at 3 m, as shown in FIG. The overall light efficiency of the light emitting source combined with the package body can be obtained as 423.2m at 1m, 105.6.lm at 2m, and 46.8.4lm at 3m by the product of the luminous flux of the light emitting chip and the luminous flux of the light guide.

That is, the light flux measured in the light guide having a radiation angle of 30 degrees × 60 degrees and the light guide having a radiation angle of 30 degrees × 100 degrees is relatively superior to the light flux measured in the light guide having a radiation angle of 60 degrees × 60 degrees. Able to know.

Accordingly, when the LED lighting module including the light guide having a radiation angle of 60 degrees × 60 degrees is provided in the lighting apparatus in a direct manner, a spot is generated between the lighting module and the adjacent lighting module, thereby providing a uniform surface light source. In order to obtain a uniform surface light source, the number of installation of the lighting module must be increased.

In addition, when the LED lighting module is arranged in a photometric type, the luminous flux of the surface light source desired by the customer cannot be obtained, so it is not suitable for use for photometric signs and advertisements, and there is a limit to the enlargement of the lighting device.

However, when the LED lighting module including the light guide having a radiation angle of 30 degrees × 60 degrees or the light guide having a radiation angle of 30 degrees × 100 degrees is provided directly on the lighting apparatus, the luminous flux provided by the lighting module is sufficient. Therefore, it is possible to provide a uniform surface light source without spot generation, and to increase the size of the direct lighting system.

In addition, as shown in Figure 9 (a) (b), the LED lighting module 100 is at least one or more by a bonding method using a conductive adhesive or a fastening method using a fastening member to the vertical panel 201 of the lighting device. In the case of implementing the lighting device 200 by placing or metering on the vertical panel 201 facing each other, it is possible to obtain sufficient luminous flux and luminous intensity of the surface light source desired by the user without the need of a separate light guide plate. Can be used for advertising, can reduce the thickness of the light metering lighting device 200, and can increase the size of the lighting device, while minimizing the power consumption by reducing the number of installation of the lighting module, it can reduce the manufacturing cost .

Although the present invention has been shown and described with respect to specific embodiments, it is conventional in the art that the present invention may be variously modified and changed without departing from the spirit or the scope of the present invention provided by the following claims. I would like to know that those who have knowledge of Easily know.

1 is an overall perspective view of the LED lighting module according to a preferred embodiment of the present invention.

2 is a plan view showing an LED lighting module according to a preferred embodiment of the present invention.

3 is an exploded perspective view showing the LED lighting module according to a preferred embodiment of the present invention.

4 is an assembly view showing a light emitting source provided in the LED lighting module according to a preferred embodiment of the present invention.

Figure 5 (a) (b) (c) is a state diagram that the light emitting source provided in the LED lighting module according to a preferred embodiment of the present invention is mounted on the substrate.

Figure 6 is a detailed view showing a coupling state between the substrate and the plug member provided in the LED lighting module according to an embodiment of the present invention.

Figure 7 (a) (b) (c) (d) (e) is a process diagram of assembling the LED lighting module according to a preferred embodiment of the present invention.

8 is a graph showing the luminous flux of the light emitting source provided in the LED lighting module according to an embodiment of the present invention

(a) is the case where the radiation angle is 60 degrees × 60 degrees,

(b) is the case where the radiation angle is 30 degrees x 60 degrees,

(c) is a case where the radiation angle is 30 degrees x 100 degrees.

Figure 9 (a) (b) is a plan view showing a lighting device employing the LED lighting module according to a preferred embodiment of the present invention.

   Explanation of symbols on the main parts of the drawings

110: light emitting source 111: package body

113: light guide 120: substrate

123: assembly jaw 125: power cable

130: heat dissipation housing 131: bottom

132: side wall portion 133: contact surface

134: substrate assembly groove 135: transparent plate assembly groove

140: plug member 141: support hole

142: guider 143: elastic piece

Claims (10)

At least one light emitting source for generating light when power is applied; A substrate having a pattern circuit to which the light emitting sources are electrically connected; It extends a certain height from the bottom portion in contact with the bottom surface of the substrate, the left and right edges of the substrate is inserted into a pair of side wall portions formed in the inner surface of the substrate assembly groove, the substrate is inserted in the longitudinal direction along the substrate assembly groove A heat dissipation housing disposed; And And a plug member assembled to each of the inlet and outlet ends of the heat dissipation housing to seal the open inlet and outlet ends of the heat dissipation housing. The method of claim 1, wherein the light emitting source is electrically connected to the pattern circuit of the substrate, the package body having a lead frame wire-bonded with the LED chip, and to cover the upper lens formed on the upper surface of the package body LED lighting module comprising a light guider assembled with the package body. The method of claim 2, wherein the package body is a high-output LED package, the optical guider has a radial angle of 30 degrees in the longitudinal direction orthogonal to the longitudinal direction of the substrate, 60 to 100 in the horizontal direction parallel to the longitudinal direction of the substrate LED lighting module comprising a pattern to have a radiation angle of degree. The LED lighting module according to claim 1, wherein the substrate is formed of a metal PCB on which the pattern circuit is printed on an upper surface, and which comprises any one of aluminum and iron alloy. According to claim 1, wherein the substrate further comprises a control unit for controlling the emission of the light emitting source, the control unit includes a constant current switching driver circuit for converting the current supplied to the light emitting source into a constant current to maintain a constant value LED lighting module characterized in that. The LED lighting module of claim 1, wherein the bottom portion of the heat dissipation housing includes at least one contact portion protruding a predetermined height so as to locally contact the bottom surface of the substrate. The LED lighting module according to claim 1, wherein the side wall portion of the heat dissipation housing has a plurality of grooves on an outer surface thereof to widen the heat dissipation surface area. The LED lighting module of claim 1, further comprising a transparent plate covering an open upper portion of the heat dissipation housing, wherein the transparent plate is inserted and assembled along a transparent plate assembly groove formed on an upper inner surface of the side wall. . The LED lighting module according to claim 1, wherein the plug member includes a plurality of guiders including a support hole through which a power cable having one end electrically connected to the pattern circuit of the substrate is inserted. The LED lighting module according to claim 1, wherein the stopper member includes a plurality of elastic pieces at a lower end thereof, and the elastic pieces are elastically coupled to the assembly jaw formed at the inlet end and the outlet end of the heat dissipation housing.

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