KR20100003614A - Method for coating metallic ceramic film of cellular phone casing - Google Patents

Method for coating metallic ceramic film of cellular phone casing Download PDF

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KR20100003614A
KR20100003614A KR1020080063600A KR20080063600A KR20100003614A KR 20100003614 A KR20100003614 A KR 20100003614A KR 1020080063600 A KR1020080063600 A KR 1020080063600A KR 20080063600 A KR20080063600 A KR 20080063600A KR 20100003614 A KR20100003614 A KR 20100003614A
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chamber
resin
metal
film
ceramic film
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KR1020080063600A
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Korean (ko)
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이재열
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이재열
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3471Introduction of auxiliary energy into the plasma
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/46Sputtering by ion beam produced by an external ion source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons

Abstract

PURPOSE: A metal ceramic film coating method of a mobile phone case is provided to simplify the coating process by forming a transparent protective layer on the metal ceramic film after attaching a metal ceramic film without the primer coating. CONSTITUTION: A metal ceramic film coating method of a mobile phone case comprises the steps for closing a chamber door and selectively preheating a vacuum pump ventilation device after pre-processing a case material(c) without the primer coating and mounting the selected metal on a target; attaching the metal ceramic; and forming a transparent protective layer(a) by painting one of vinyl resin, emulsion resin, alkyd resins, amino-alkyd resin, polyurethane resin, acrylic resin, fluorine resin, aqueous resin, and ultra violet paint epoxy resin on the ceramic layer(b).

Description

휴대폰 케이스의 금속 세라믹막 코팅방법{method for coating metallic ceramic film of cellular phone casing}Method for coating metallic ceramic film of cellular phone casing}

본 발명은 성형하여 1차표면가공이 완료된 금속제 휴대폰케이스(카메라케이스,MP3케이스,네비게이션케이스,전자사전케이스,노트북케이스포함)표면에 하도 작업 없이 금속막 증착을 위한 전처리 작업을 실시하고 이어서 금속세라믹증착코팅을 실시한 후 그 표면에 투명보호막을 형성하여 이루어지는 것으로 내구성과 내수성을 높이고 지문자국이 남지 않고 표면발수, 발유효과를 지속적으로 발휘할 수 있는 우수한 제품이 되게 한 것이다.The present invention is a metal cell phone case (camera case, MP3 case, navigation case, electronic dictionary case, laptop case, etc.) formed by molding the first surface processing is carried out to the pretreatment for the deposition of the metal film without any work after the metal ceramics It is made by forming a transparent protective film on the surface after the deposition coating to improve the durability and water resistance, and to make excellent products capable of continuously exerting surface water repellency and oil repellent effect without fingerprint fingerprints remaining.

종래의 휴대폰 내,외장 케이스는 폴리카보네이트(PC) 소재로 되어 그 표면에 안료, 염료를 첨가한 유브이(UV)도장을 하거나, Conventional mobile phone inner and outer cases are made of polycarbonate (PC) material and coated with UV coating with pigments and dyes on their surfaces,

열경화성 도료로 마감처리하거나 Finished with a thermoset paint or

폴리카보네이트 소재 표면에 초벌 도장을 하고 알루미늄(Al), 써스(SUS),주석(Sn)중에서 선택한 금속물질을 증착하여 보호도장으로 마감하거나 Apply the initial coating on the surface of polycarbonate material and finish the protective coating by depositing a metal material selected from aluminum (Al), sus (SUS) and tin (Sn).

케이스를 마그네슘,알루미늄,아연 소재중에서 선택한 금속으로 제조하고 그 표면에 전기도금,화성처리, 인산염피막처리, 크로메이트 처리 후 고온 소부형 도료로 도포하여 마감하는 수단으로 상품화하고 있다.The case is made of metal selected from magnesium, aluminum, and zinc materials and commercialized as a means of finishing by applying high-temperature small-type paint after electroplating, chemical conversion, phosphate coating, chromate treatment.

그러나 이러한 종래의 제품은 내구성이 부족하고 표면긁힘에 취악하여 내구성을 가지면서 슬림화, 경량화로 되고 다양한 디자인을 요구하는 소비자의 욕구를 만족시킬 수 없으므로 계속적인 연구가 필요하며 이를 위한 차별화된 기술과 원가절감이란 목표를 달성해야 하는 어려움이 있다.However, these conventional products lack durability and are vulnerable to surface scratches, which are durable, slim, and lightweight, and cannot satisfy the consumer's desire for various designs. Reduction has the difficulty of achieving the goal.

본 발명은 금속제로 제조되어 소재표면에 퍼핑 작업 또는 1차가공을 완료한 휴대폰 케이스 표면에 하도 도장 없이,바로 금속세라믹막을 증착하고 그 위에 투명보호막을 형성함으로써 하도 도장공정을 생략할 수 있고 내구성과 표면경도가 우수하며 지문자국이 남지 않는 우수한 제품을 만들고자 하는 것이다.The present invention can be omitted by coating a metal ceramic film and forming a transparent protective film thereon without coating on the surface of the mobile phone case is made of a metal, the puffing work or the primary processing is completed on the material surface and can be omitted It is to make an excellent product with excellent surface hardness and no fingerprint marks.

본 발명은 금속제 케이스를 성형하여 표면가공을 한 소재표면에 하도 도장을 생략한 상태에서 증착코팅을 위한 전처리 작업을 하고 이온플레이팅 공법으로 금속세라믹막을 증착시킨 후 그 외면에 투명 보호막을 형성하여 내구성과 내수성을 높이고 지문자국이 남지 않으며 표면발수, 발유효과가 지속적으로 발휘되는 우수한 제품을 보다 염가로 제조할 수 있게 한 것이다.According to the present invention, the metal case is molded and subjected to pretreatment for deposition coating in a state where surface coating is omitted, and the metal ceramic film is deposited by ion plating method to form a transparent protective film on the outer surface for durability. In addition, it is possible to manufacture cheaper products with higher water resistance, no fingerprint marks, and excellent surface water / oil repelling effects.

이와 같이 된 본 발명은 금속으로 된 휴대폰 케이스의 표면에 퍼핑작업 또는 패턴가공을 한 후 하도 도장 없이, 증착코팅을 위한 전처리 작업을 하고 이어서 금속세라믹막을 증착함으로써 하도 도장 공정을 생략할 수 있고 이로인해 하도 도장불량을 원천적으로 제거하여 능률적인 생산이 가능케 되며 According to the present invention as described above, after the puffing or pattern processing on the surface of the metal mobile phone case, the coating process can be omitted by performing pretreatment for deposition coating without depositing the coating and then depositing the metal ceramic film. It removes paint defects at the base and makes efficient production.

하도 도장이 생략된 소재에 증착코팅을 위한 전처리 작업을 하고 이어서 이온플레이팅 공법으로 질화티타늄(TiN),카본티타늄(TiC),질화카본티타늄(TiCN),질화알루미늄티탄(TiAlN),크롬(Cr),질화크롬(CrN)과 같은 금속세라믹막(b)을 증착시키고, 그 표면에 투명보호막(a)을 형성하여 마감처리함으로써 내구성, 내수성, 표면발수, 표면발유가 우수한 제품을 얻을 수 있어 표면긁힘이나 지문자국이 남지 않는 제품을 만들 수 있고 경량화 슬리화로 신개발디자인이 가능케 되며 성능시험 결과 아래표면과 같은 성능을 얻을 수 있었다.After pretreatment for deposition coating on the material without coating, the titanium plating (TiN), carbon titanium (TiC), carbon titanium (TiCN), titanium nitride (TiAlN), and chromium (Cr) ), By depositing a metal ceramic film (b) such as chromium nitride (CrN), and forming a transparent protective film (a) on the surface to finish the product can be obtained a product excellent in durability, water resistance, surface water repellent, surface oil repellent The product can be made without scratches or fingerprint marks, and the newly developed design is made possible by the light weight slimming, and the performance test shows the following performance.

Figure 112008047635939-PAT00001
Figure 112008047635939-PAT00001

* 상기 성능 시험에서 시험항목기준은 아래와 같다.* The criteria of test items in the performance test are as follows.

1) 촉진내광성 시험 기준:카본아크 촉진내광 시험기로(CARBON ARC) 200시간후 변색, 퇴색이 없어야 하고 GRAY SCALE 3급 이상이며, 부착성의 경우 (M-2.5)이상이어야 함1) Accelerated Light Resistance Test Standard: Carbon Arc Accelerated Light Tester (CARBON ARC) should be free from discoloration and fading after 200 hours, GRAY SCALE Grade 3 or higher, and adhesion (M-2.5) or higher.

2) 내열사이클 시험 기준:적외선(80℃(표면)및75℃(분위기)×3Hr) -> 실온(1hr) .-> -40℃×2Hr를 1Cycle로 2Cycle후 표면결함 없고 바둑판눈금 시험에서 박리 없을 것2) Heat cycle test standard: Infrared (80 ℃ (surface) and 75 ℃ (atmosphere) × 3Hr)-> Room temperature (1hr) .-> -40 ℃ × 2Hr with 1Cycle after 2Cycle No

3) 내열노화 시험 기준:80±2℃×200Hr후 현저한 변색, 부풀음, 갈라짐, 주름, 백화등이 없고, 바둑판눈금 테이프 시험에서 박리없을 것. 3) Heat aging test standard: No significant discoloration, swelling, cracking, wrinkles or whitening after 80 ± 2 ℃ × 200Hr, and no peeling on the checkerboard tape test.

4) 초기부착성 시험 기준:1㎜ 간격으로 X-CUTTING 후 SCOTCH TAPE를 붙인 후 급격히 떼어낸다(5회) 바둑판 눈금(1mm)시험에서 박리가 없을 것(10×10)4) Initial adhesiveness test standard: After X-cutting at intervals of 1㎜, attach the tape tape and remove it sharply (5 times) No peeling in the checkerboard scale (1mm) test (10 × 10)

5) 내마모 시험 기준:종이 테이프(PAPER)에 280g하중인가(33회/min)도장면:40회5) Abrasion resistance test standard: 280g load on paper tape (33 times / min)

6) 내열탕 시험 기준:90±2℃에서 30분침전 상온에서 4hr방치후 2mm간격 바둑판시험 6) Heat-resistant hot water test standard: 2mm interval checkerboard test after 4hr stand at room temperature for 30 minutes at 90 ± 2 ℃

본 발명은 금속제로 되어 표면 패턴가공 또는 퍼핑가공과 같은 1차가공이 완료된 휴대폰 케이스 소재표면에 하도를 생략하고 증착코팅을 위한 전처리 작업을 실시한 후 이온 플레이팅공법으로 금속세라믹막을 증착하고 그 표면에 투명 보호막 을 형성하는 방법으로 이루어진다.The present invention is made of a metal, the surface pattern processing or the puffing process of the surface of the mobile phone case is completed, the bottom coating is omitted, and after performing a pre-treatment for the deposition coating metal ceramic film is deposited by the ion plating method and on the surface It is made by a method of forming a transparent protective film.

이를 위해 본 발명은 1차가공이 완료된 휴대폰 케이스를 챔버외부 또는 챔버내부에 넣어 증착을 위한 전처리 작업을 하고 챔버내에 장치된 지그폴대(3)에 소재(4)를 장치하여 타켓(10)에 티타늄, 크롬, 지르코늄, 티타늄과 혼용된 금속중에서 선택된 금속을 장착한 후 챔버문을 닫고 진공펌프 배기장치(9)를 가동시켜 챔버내의 진공도를 10-6~10-5 Torr 까지 유지시킨 후(챔버내의 진공의 필요성은 예 : 2H + O =H2O,Na + Cl =NaCl,Fe + O =FeO ,Fe2O3등 일반적인 화학반응을 예로 들 수 있는데 물리적인 상쇄간섭뿐 아니라 화학반응을 하기 위함과 원활한 증착을 위해 필요하다) 히팅코일(5)에 전류를 공급하여 소재(4) 온도를 60~700℃까지 선택적으로 가열하고 회전모터(1)로 지그폴대(3)를 회전시켜서 알곤가스와 반응성가스(반응성 가스는 질소,산소,이산화탄소,메탄,이산화질소,아세틸렌중에서 선택)(8)를 일정비율로 혼합시켜 챔버(11) 내로 50~450 Sccm로 투입하고 진공도를 10-4~10-2 Torr로 유지하여 타켓(10) 케소드(6)에 아크를 발생시켜 알곤가스와 반응성가스를 이온화시켜 플라즈마를 발생시켜 타켓(10)으로 부터 금속또는 그 화합물을 아크 증발시키면 기상원자는 플라즈마 내에서 전리되어 이온화 되는데 이때 소재(4)에 음전압(12)를 걸어 주면 소재표면을 격열하게 휘젓어서 막성상을 이룩하여 습식도금 경도의 50~100배 경로를 갖는 금속세라믹 증착이 달성된다.To this end, the present invention puts the cell phone case of the first processing is completed outside the chamber or inside the chamber for pre-treatment for deposition and by mounting the material (4) on the jig pole base (3) installed in the chamber titanium on the target 10 After selecting a metal selected from metals mixed with chromium, zirconia and titanium, close the chamber door and start the vacuum pump exhaust system (9) to maintain the vacuum in the chamber to 10 -6 ~ 10 -5 Torr (in the chamber The necessity of the vacuum is, for example, general chemical reactions such as 2H + O = H 2 O, Na + Cl = NaCl, Fe + O = FeO, Fe 2 O 3 . It is necessary for a smooth deposition) by supplying a current to the heating coil (5) to selectively heat the material (4) temperature to 60 ~ 700 ℃ and by rotating the jig pole pole (3) with a rotary motor (1) Reactive gas (reactive gas is nitrogen, oxygen, carbon dioxide, methane, Quality cattle, selected from acetylene) 8 Kane the target (10, mixed in a predetermined ratio to put in 50 ~ 450 Sccm into the chamber 11 and maintain the degree of vacuum to 10 -4 ~ 10 -2 Torr) methods (6) When an arc is generated to ionize argon gas and a reactive gas to generate a plasma, and arc evaporation of a metal or a compound thereof from the target 10, the vapor phase atom is ionized by ionization in the plasma. 12), the surface of the material is stired violently to form a film to achieve metal ceramic deposition with a path of 50 to 100 times the wet plating hardness.

이와 같이 금속세라믹막 증착이 완료되면 증착세라믹막(b)위에 비닐수지, 에멜젼수지, 알키드수지, 아미노알키드수지, 폴리우레탄수지, 아크릴수지, 불소수지, 수용성수지, 유브이도료중에서 선택한 도료를 소재로 하는 도장공법으로 투명보호도장을 실시하거나 산화물 증착수단으로 투명보호막도장을 형성하여 세라믹코팅을 완료한다.When the deposition of the metal ceramic film is completed, the coating material selected from vinyl resin, emulsion resin, alkyd resin, amino alkyd resin, polyurethane resin, acrylic resin, fluorine resin, water soluble resin, and UV paint is deposited on the deposited ceramic film (b). The ceramic coating is completed by performing a transparent protective coating by a coating method or by forming a transparent protective coating by an oxide deposition means.

한편, 본 발명에서 실시하는 이온플레이팅 공법은 On the other hand, the ion plating method carried out in the present invention

a) 전자빔이온플레이팅(Electron Beam Ion plating)a) Electron Beam Ion Plating

b) 스퍼터링이온플레이팅시스템(Sputtering Ion plating System)b) Sputtering Ion Plating System

c) 아크이온플레이팅시스템(Arc Ion plating System)c) Arc Ion plating System

d) 멀티아크이온플레이팅(multi-arc ion plating)d) multi-arc ion plating

e) 에치씨디이온플레이팅( 중공 열음극 HCD ion plating (hollow cathod discharge))법을 사용할 수 있다.e) HCD ion plating (hollow cathod discharge) method may be used.

이 방법들이 공통적으로 물리기상증착(PVD)에 묶일 수 있는 이유는 증착시키려는 물질이 피도물에 증착될 때 기체상태에서 고체상태로 바뀌는 과정이 물리적인 변화이기 때문이다.These methods are commonly tied to physical vapor deposition (PVD) because the process of changing from gas to solid when the material to be deposited is deposited on the workpiece is a physical change.

이온플레이팅은 진공상태10 -5 ~10 -3 Torr에서 증발된 원자,분자입자가 플라즈마 영역을 지나면서 이들의 이온화가 이루어지고,스퍼터링과 같은 강한 에너지를 갖게된다.In ion plating, atoms and molecular particles evaporated in a vacuum state of 10 -5 to 10 -3 Torr are ionized while passing through a plasma region, and have strong energy such as sputtering.

이는 단순 증발되어 피도물에 성장되는 퇴적물 현태를 갖는 진공증착법에 비해 이온화된 입자가 증착 성막을 형성하므로,피도물 표면을 격열하게 휘젓으면서 막 성장이 형성된다.This is because the ionized particles form a deposition film as compared to the vacuum evaporation method which has a deposit state that is simply evaporated and grown on the object, so that the film growth is formed while vigorously stirring the surface of the object.

그러므로 단순 증착된 면보다,단단하고 치밀한 막을 형성하므로 이온플레이팅 공법이, 일반 증착법과 다른 점이라 할 수 있다.Therefore, the ion plating method is different from the general deposition method because it forms a harder and dense film than a simple deposited surface.

따라서 본 발명은 아크이온 플레이팅 방법을 사용하여 금속세라믹막을 증착하고 그 표면에 보호막을 형성하여 목적달성이 성취되는 것이다.Therefore, the present invention is to achieve the object by depositing a metal ceramic film using the arc ion plating method and forming a protective film on the surface.

전처리 공정Pretreatment process

본 발명의 전처리 공정은 금속제로 된 케이스가 증착코팅단계에서 열응력 및 변태응력의 발생을 억제하여 변형을 최소화하기 위해서 행하고 또, 피도물 내부 아웃게싱(Out gsaaing)으로 목적하는 진공도달 시간이 길어져 작업공정이 늘어나는 현상을 단축시키기 위한 것이다.The pretreatment process of the present invention is performed to minimize the deformation by suppressing the occurrence of thermal stress and transformation stress in the metal case during the deposition coating step, and the desired vacuum delivery time is increased by out gsaaing inside the workpiece. This is to shorten the phenomenon of increasing the process.

따라서 본 발명의 실시를 위한 전처리 공정은Therefore, the pretreatment process for the practice of the present invention

퍼핑광택 작업이 완료되고,패턴이 형성되는 등으로 1차가공이 완료된 소재(c)를 알콜,아이피에이,아세톤,탄화수소계 유기용제, 티씨이증기탈지,유기화합물에 침지하고 5~300KHz 초음파를 1~30분간 작동시켜서 소재 표면에 묻어 있는 오염 물질을 제거하고 After completion of the puffing work and the formation of the pattern, the material (c) with primary processing is immersed in alcohol, IP, acetone, hydrocarbon-based organic solvents, TC vapor degreasing, organic compounds, and ultrasonic waves of 5 ~ 300KHz. Operate for 1 ~ 30 minutes to remove contaminants on the surface of the material

소재(c)를 50~500℃까지 선택적으로 어닐링 하여 표면과 내부의 이상 기체를 제거하여 완료한다.The material (c) is optionally annealed to 50-500 ° C. to complete the removal of the ideal gas on the surface and inside.

한편 챔버내에서의 전처리 수단은 챔버의 지그폴대(3)에 소재를 장치하고 챔버내의 진공상태를 10-6~10-5 Torr로 만든후 아르곤가스를 챔버내로 200~300Sccm 투 입하여 챔버내의 진공상태를 10-4~10-2 Torr로 만들어서 글로우 방전을 시켜 아르곤가스를 이온화시키고Meanwhile, the pretreatment means in the chamber is equipped with a material on the jig pole 3 of the chamber, and the vacuum in the chamber is made into 10 -6 to 10 -5 Torr, and 200-300 Sccm of argon gas is introduced into the chamber. Make the state 10 -4 ~ 10 -2 Torr and glow discharge to ionize argon gas

이온화된 가스이온을 소재(4) 표면에 충돌시켜, 이온충돌(ion bombardment) 로 표면의 산화막,부동피막을 제거시킨다. 이를 이온스퍼터링(ion sputtering) 전처리라 한다The ionized gas ions collide with the surface of the material 4 to remove the oxide film and the floating film on the surface by ion bombardment. This is called ion sputtering pretreatment.

대기중에는 존재하는 기체를 보면 질소(Nitrogen)-78%,산소(Oxygen)-21%,알곤(Argon)-0.9%이산화탄소(Carbon dioxide) 0.03% ,네온(Neon)0.0018%,헬륨(Helium) 0.0005%, 클립톤(Krypton) 0.0001%가스 들이 존재한다.In the atmosphere, Nitrogen-78%, Oxygen-21%, Argon-0.9% Carbon dioxide 0.03%, Neon0.0018%, Helium 0.0005 %, Krypton 0.0001% gases are present.

이러한 기체들은 진공시 적정하게 배출되지만, 물체표면에 물 또는 이슬점이 있을경우 진공에 큰 영향을 주므로 반드시 제거해야 한다.These gases are properly evacuated in the vacuum, but must be removed if there is water or dew point on the surface of the object, which will greatly affect the vacuum.

이러한 인자 들은 진공시간,막성장에 영향을 준다.These factors affect vacuum time and film growth.

진공공정Vacuum process

소재(c)표면에 퍼핑 작업이 완료되고, 패턴 작업이 완료된 피도물인 금속제 휴대폰케이스를 챔버내의 소재 장착용 지그폴대(3)에 거치하고 타겟(10)에 티타늄,크롬,지르코늄,티타늄과 혼용된 금속 중 선택한 금속을 장착한 후After the puffing work is completed on the surface of the material (c), the metal cell phone case, which is a patterned work, is mounted on the jig pole for mounting the material in the chamber, and the target 10 is mixed with titanium, chromium, zirconium, and titanium. After mounting the selected metal

소재(4)장착이 완료되면 챔버문을 닫고 진공펌프 배기장치(9)를 가공시켜서 챔버(11)내의 공기를 강제 배출시키므로써 진공이 되고 이때 진공도는 10-6~10-5Torr를 유지한다.After installation of the material (4) is completed, the chamber door is closed and the vacuum pump exhaust device 9 is processed to forcibly evacuate the air in the chamber 11, whereby the vacuum is maintained. At this time, the vacuum degree is maintained at 10 -6 to 10 -5 Torr. .

챔버내 진공의 필요성은 The need for vacuum in the chamber

예 : 2H + O =H2O,Na + Cl =NaCl,Fe + O =FeO ,Fe2O3등 일반적인 화학반응을 예로 들수있는데 물리적인 상쇄 간섭뿐만 아니라,원치 않은 화학반응을 예방하기 위함과,원활한 증착을 위해 진공상태가 필요하다.Examples include general chemical reactions such as 2H + O = H 2 O, Na + Cl = NaCl, Fe + O = FeO, Fe 2 O 3 , to prevent unwanted chemical reactions as well as physical offset interference. Vacuum is required for smooth deposition.

다시 말하면, 진공장착공법은 증착시키려는 물질을 기체상태로 만들어서 날려보내는 것이므로 챔버내의 진공은 필수적이다.In other words, since the vacuum mounting method is to blow the material to be deposited into a gaseous state, vacuum in the chamber is essential.

진공이 완료되면 소재(4) 온도를 60~700℃까지 선택적으로 올릴 수 있는 히팅코일(5)에 전류를 공급하여 소재(4)를 가열하게 되고 회전모터(1)의 회전축(2)과 연결된 소재 장착용 지그폴대(3)를 회전시켜 소재를 회전시키게 된다.When the vacuum is completed, by supplying a current to the heating coil (5) which can selectively raise the temperature of the material (4) up to 60 ~ 700 ℃ to heat the material (4) and connected to the rotary shaft (2) of the rotary motor (1) Rotating the material by rotating the material mounting jig pole (3).

증착공정Deposition Process

챔버(11)내 히팅코일(5)로 소재(4)를 60~700℃까지 선택적으로 가열시키고 알곤(Ar)가스와 반응성가스(8)를 일정비율로 혼합시켜 챔버(11)내로 50~450Sccm정도로 투입한다.The material 4 is selectively heated to a heating coil 5 in the chamber 11 to 60 to 700 ° C., and the argon (Ar) gas and the reactive gas 8 are mixed at a predetermined ratio, and then 50 to 450 Sccm into the chamber 11. Put in enough.

반응성 가스로는 질소(N2),산소(O2),이산화탄소(CO2),메탄(CH2),아산화질소(N2O),아세틸렌(C2H2)를 선택적으로 사용할 수 있다.As the reactive gas, nitrogen (N 2), oxygen (O 2), carbon dioxide (CO 2), methane (CH 2), nitrous oxide (N 2 O), and acetylene (C 2 H 2) may be selectively used.

이때의 진공도는 10-4~10-2Torr대로 유지하며 마이너스 전원이 인가된 타겟(10) 케소드(6)에,플러스 촉발매체로 인해 아크발생이되고, 알곤(Ar)가스와 반응성 가스가 이온화되어 플라즈마가 동시에 발생된다.At this time, the degree of vacuum is maintained at 10 -4 to 10 -2 Torr, and arc generation occurs due to the plus trigger medium, and the argon (Ar) gas and the reactive gas are applied to the target 10 cathode (6) to which negative power is applied. It is ionized to generate plasma simultaneously.

타겟(10)으로부터 금속(또는 그 화합물)을 아크 증발시키면 기상원자는 플라즈마 내에서 전리되어 이온화된다. 이온화된 증발원자는 높은 에너지를 얻게되고 증착 시키고자하는 소재(4)에 음전압(12)을 걸어주면, 소재(4)에 표면을 격열하게 휘젓으면서 막 성장이 된다. 이때 성장된 박막은 습식도금 경도의 50~100배의 경도를 갖는다.Arc evaporation of a metal (or a compound thereof) from the target 10 causes ionization of the vapor phase atoms in the plasma. The ionized evaporation atom obtains high energy, and when negative voltage 12 is applied to the material 4 to be deposited, the film is grown while vibrating the surface of the material 4. The grown thin film has a hardness of 50 to 100 times the wet plating hardness.

보호막 도장Protective coating

금속세라믹막이 증착된 증착면은 내경도는 우수하나 내지문성과 유분성분에 매우 취약하여 증착 공정만으로 마감 처리하기에는 문제가 있어,보호막의 형성이 필수적이다.The deposition surface on which the metal ceramic film is deposited is excellent in internal hardness, but is very vulnerable to fingerprints and oil components, so there is a problem to finish only by the deposition process, thus forming a protective film.

보호막은 외부로 부터의 열차단, 열흡수, 온도표시, 얼음부착방지, 결노방지, 전파차단, 마찰계수변화, 곰팡이 방지, 곤충방지, 소리흡수의 역할을 하며 이러한 물성유지는 보호막성질에 따라 좌우된다.The protective film acts as a heat shield from outside, heat absorption, temperature display, ice adhesion prevention, anti-aging, radio wave blocking, friction coefficient change, mold prevention, insect prevention and sound absorption. do.

본 공법에 사용할 수 있는 보호막은 도료에 의한 도장보호막과 산화물에 의한 증착보호막으로 구분된다.The protective film which can be used for this process is divided into the coating protective film by coating material and the deposition protective film by oxide.

도료에 의한 도장보호막의 경우 도료는 비닐수지(염화비닐,초산비닐 공중합체와 비릴부틸란)를 사용한 도료 ,에멀젼수지(아크릴,스치렌,비닐아세테이트)도료, 알키드수지로 폴리에스테르(다가알콜+다염기산 혼합한)에 지방산으로 변성한수지 도료 아미노 알키드수지로 알키드(단유성)와 아미노기(Amide,Amine,Imide)를 가진 아미노수지의 혼합물로 가열건조 타입의 도료, 소부형 도료로 에폭시수지,아크 릴수지,폴리우레탄수지,실리콘수지,불소 수지도료,수용성수지로 이루어지는 도료 폴리우레탄 수지도료 이소시아네이트기(-N=C=O)를 가진 프리폴리머(Prepolymer)와 히드록시기(-OH)를 관능기로 함유하고 우레탄 결합(-NHCOO-)을 가지는 도료. 아크릴 수지도료로 아크릴 모노머(아크릴산 에테르 ,메타크릴산 에테르)를 사용하여 라디칼중합으로 합성한 수지, 불소수지도료(불소수지 C-F결합을 도료화 함) 수용성수지도료(알키드,아크릴,에폭시,아미노알키드를 수용화 함), 유브이(UV)도료 자외선(200~380nm)과 X선 영역인 전자선의 열에너지에 의해 경화되는 도료로 에폭시 타입,우레탄 타입,불포화폴리에스테르 타입으로 만들어진다.In the case of coating protective film by paint, paint is made of vinyl resin (vinyl chloride, vinyl acetate copolymer and butylbutyllan), emulsion resin (acrylic, styrene, vinyl acetate) paint, alkyd resin and polyester (polyalcohol + polybasic acid). in a mixture) alkyd modified hansuji paint amino alkyd resin with a fatty acid (short-oil) and an amino group (Amide, Amine, Imide) an epoxy resin, an arc reel resin as coating material, baking-type coating material of a type heat-drying of a mixture of an amino resin having a , Polyurethane resin, silicone resin, fluorine resin, water-soluble resin. Polyurethane resin paint Prepolymer having isocyanate group (-N = C = O) and hydroxyl group (-OH) as functional group and urethane bond Paint with (-NHCOO-). Resin synthesized by radical polymerization using acrylic monomer (acrylic acid ether, methacrylic acid ether) as acrylic resin paint, fluororesin paint (painting fluorine resin CF bond) water soluble resin paint (alkyd, acrylic, epoxy, amino alkyd) Soluble ), UV paint It is a paint cured by ultraviolet rays (200 ~ 380nm) and thermal energy of electron beams, which are X-rays, and is made of epoxy type, urethane type, and unsaturated polyester type.

상기 수지로 이루어진 도료로 우레탄 도료,유브이(UV)도료,소부형 도료,수용성 도료로 마감처리 하며 도장 방법으로는 오토건에 의한 로보트 도장,스핀들 도장,레시프로게이트 도장 방법으로 스프레이 도장하고 도장 브스는 1차,2차 3차,4차로 나누어 젖은 상태에서 연속 도장(wet on wet)을 통해 이루어진다.The paint is made of urethane paint, UV paint, UV paint, small paint, water-soluble paint, and the coating method is spray coating by robot coating, spindle coating, and recipe gate coating by auto gun. The seal is divided into 1st, 2nd, 3rd, and 4th through wet on wet.

한편, 산화물증착 보호막은 인(In),주석(Sn), 인-주석 산화물(ITO),아연(Zn),산화아연(ZnO),산화주석(SnO2), 산화알류미늄(Al2O3),이산화규소(SiO2),산화티탄(TiO2),지르코니아(ZrO2)Sn-Sb,SnO2-Sb2O3,ZnO+Al2O3,Ta2O5, Y2O3, AlN, Si3N4,SiAlON, Si, C, MgH2를 1~2로 혼합하여 세라믹막 표면에 연속하여 증착함으로써 보호막을 만들 수 있다.On the other hand, the oxide deposition protective film is phosphorus (In), tin (Sn), phosphorus-tin oxide (ITO), zinc (Zn), zinc oxide (ZnO), tin oxide (SnO2), aluminum oxide (Al2O3), silicon dioxide ( SiO2), titanium oxide (TiO2), zirconia (ZrO2) Sn-Sb, SnO2-Sb2O3, ZnO + Al2O3, Ta2O5, Y2O3, AlN, Si3N4, SiAlON, Si, C, MgH 2 A protective film can be formed by depositing continuously on a surface.

따라서 금속세라믹 증착 표면에 형성되는 보호 막은 도료 타입보호막과,투명 산화물질증착보호막을 선택적으로 사용하여 금속세라믹보호막을 보호할 수 있는 것 이다.Therefore, the protective film formed on the metal ceramic deposition surface can protect the metal ceramic protective film by selectively using a paint type protective film and a transparent oxide film deposition protective film.

실시례Example (1) (One)

표면에 퍼핑광택 작업 또는 패턴이 형성이 되어 1차 가공이 완료된 금속으로된 휴대폰 케이스 내,외장재 소재(c)에 하지도장 공정을 생략하고,이온플레이팅 공법으로 금속세라믹증착막(b)을 형성함으로써 질화티타늄(TiN),카본티타늄(TiC),질화카본티타늄(TiCN),질화알루미늄티탄(TiAlN),크롬(Cr),질화크롬(CrN))세라믹과 같은 질화성금속피막, 산화성금속피막과 같은 금속세라믹막을 증착시키고 그 표면에 도료로 된 보호막(a)을 형성하여 제품화하였다.Puffing work or pattern is formed on the surface of the cell phone case made of metal, the first processing is completed, the base material is omitted in the exterior material (c), by forming a metal ceramic deposition film (b) by the ion plating method Nitride metal films such as titanium nitride (TiN), carbon titanium (TiC), carbon titanium titanium (TiCN), aluminum titanium nitride (TiAlN), chromium (Cr), chromium nitride (CrN)) ceramics, and metal oxide films A metal ceramic film was deposited, and a protective film (a) made of paint was formed on the surface thereof to produce a product.

이때 사용한 케이스소재는 휴대폰케이스 MP3케이스 카메라케이스, 전자사전케이스, 노트북케이스를 대상으로 하였고The case materials used were mobile phone case MP3 case camera case, electronic dictionary case, and laptop case.

실시례의 상세한 내역은 아래표와 같다.The details of the examples are shown in the table below.

Figure 112008047635939-PAT00002
Figure 112008047635939-PAT00002

실시례Example (2)(2)

표면에 퍼핑광택 작업 또는 패턴이 형성이 되어 1차 가공이 완료된 금속으로된 휴대폰 케이스 내,외장재 소재(c)에 하지 도장 공정을 생략하고, 전처리하여 이온플레이팅 공법으로 금속세라믹증착막(b)을 형성함으로써 질화티타늄(TiN),카본티타늄(TiC),질화카본티타늄(TiCN),질화알루미늄티탄(TiAlN),크롬(Cr),질화크롬(CrN)세라믹과 같은 질화성금속피막, 산화성금속피막과 같은 금속세라믹막을 증착시키고 그 표면에 인-주석산화물, 아연, 산화아연, 산화주석과 같은 산화물을 증착시켜서 보호막(a)을 형성하여 제품화하였다.The metal ceramic deposition film (b) is pre-treated by ion plating method by omitting the base coating process in the interior and exterior materials (c) of the mobile phone case made of metal, which is formed with a puffing gloss work or pattern on the surface. Forming, such as titanium nitride (TiN), carbon titanium (TiC), carbon titanium (TiCN), aluminum titanium nitride (TiAlN), chromium (Cr), chromium nitride (CrN) ceramics, and oxidative metal coatings A protective metal film was formed by depositing the same metal ceramic film and depositing oxides such as phosphorus-tin oxide, zinc, zinc oxide, and tin oxide on the surface thereof.

이때 사용한 케이스소재는 휴대폰케이스 MP3케이스 카메라케이스, 전자사전케이스, 노트북케이스를 대상으로 하였다.The case materials used were mobile phone case MP3 case camera case, electronic dictionary case, notebook case.

도 1은 본 발명의 구성층 단면도1 is a cross-sectional view of the component layer of the present invention

도 2는 본 발명의 공정 예시도2 is a process illustration of the present invention

도 3은 본 발명의 증착장치(이온 플레이팅) 예시도Figure 3 is an exemplary deposition apparatus (ion plating) of the present invention

도 4는 본 발명의 증착층 확대사진이다.Figure 4 is an enlarged photograph of the deposited layer of the present invention.

* 도면의 주요부분에 대한 부호설명* Explanation of symbols on the main parts of the drawings

1 : 회전모터 2 : 회전축1: rotation motor 2: rotation axis

3 : 지그폴대 4 : 소재 5 : 히팅코일 6 : 케소드 8 : 반응성가스 9 : 배기장치 10 : 타켓 11 : 챔버 12 : 음전압DESCRIPTION OF SYMBOLS 3 Zig pole base 4 Material 5 Heating coil 6 Cathode 8 Reactive gas 9 Exhaust system 10 Target 11 Chamber 12 Negative voltage

Claims (5)

금속제로 되어 패턴과 퍼핑가공이 종료된 케이스 소재(C)를 하도 작업 없이 챔버 외부 또는 챔버 내부에서 전처리하고 전처리종료후 챔버내에 장치된 지그폴대(3)에 장치하여 타켓(10)에 티타늄, 크롬, 지르코늄, 티타늄과 혼용된 금속중에서 선택된 금속을 장착한 후 챔버문을 닫고 진공펌프 배기장치(9)를 가동시켜 챔버내의 진공도를 10-6~10-5 Torr 까지 유지시킨 후 히팅코일(5)을 작동시켜 챔버내의 소재(4) 온도를 60~700℃까지 선택적으로 예열하는 단계와 The case material (C), which is made of metal and has finished patterning and puffing, is pretreated outside or inside the chamber without any work, and is mounted on the jig pole (3) installed in the chamber after completion of pretreatment. After the metal selected from the mixed metals with zirconium and titanium is installed, close the chamber door and start the vacuum pump exhaust device (9) to maintain the vacuum degree in the chamber to 10 -6 ~ 10 -5 Torr and then the heating coil (5) Selectively preheating the material (4) temperature in the chamber to 60-700 ° C. by 회전모터(1)로 지그폴대(3)를 회전시키면서 알곤가스와 반응성가스(8)를 일정비율로 혼합시켜 챔버(11) 내로 투입하고 챔버내의 진공도를 10-4~10-2 Torr로 유지하여 타켓(10) 케소드(6)에 아크를 발생시켜 알곤가스와 반응성가스를 이온화시켜 플라즈마를 발생시키고 타켓(10)으로 부터 금속을 아크 증발시켜 기상원자를 플라즈마 내에서 전리 이온화 시키면서 소재(4)에 음전압(12)를 걸어 소재표면을 격열하게 휘저어 막성상을 이룩하는 금속세라믹 증착단계와 While rotating the jig pole stage 3 with the rotary motor 1, argon gas and reactive gas 8 are mixed at a predetermined ratio, and introduced into the chamber 11, and the vacuum degree in the chamber is maintained at 10 -4 to 10 -2 Torr. The target 10 generates an arc at the cathode 6 to ionize the argon gas and the reactive gas to generate a plasma, and arc-evaporates the metal from the target 10 to ionize the vapor phase atom in the plasma. A metal ceramic deposition step in which a negative voltage (12) is applied to the material surface to stir violently to form a film 증착세라믹막(b)위에 비닐수지, 에멜젼수지, 알키드수지, 아미노알키드수지, 폴리우레탄수지, 아크릴수지, 불소수지, 수용성수지, 유브이도료 에폭시수지중에서 선택한 도료를 일반 도장공법으로 도장하여 투명보호막(a)을 형성시키는 단계로 이루어지는 휴대폰 케이스의 금속 세라믹막 코팅방법On the evaporation ceramic film (b), a transparent protective film is selected from vinyl resin, emulsion resin, alkyd resin, amino alkyd resin, polyurethane resin, acrylic resin, fluorine resin, water soluble resin and UV paint epoxy resin by general coating method. Metal ceramic film coating method of the mobile phone case comprising the step of forming (a) 청구항 제1항에 있어서, 금속세라믹 증착공법은 The method of claim 1, wherein the metal ceramic deposition method a) 전자빔이온플레이팅(Electron Beam Ion plating)a) Electron Beam Ion Plating b) 스퍼터링이온플레이팅시스템(Sputtering Ion plating System)b) Sputtering Ion Plating System c) 아크이온플레이팅시스템(Arc Ion plating System)c) Arc Ion plating System d) 멀티아크이온플레이팅(multi-arc ion plating)d) multi-arc ion plating e) 에치씨디이온플레이팅( 중공 열음극 HCD ion plating (hollow cathod discharge)증착법 중에서 선택된 방법으로 실시하는 것을 포함하는 휴대폰 케이스의 금속 세라믹막 코팅방법e) coating method of metal ceramic film on a mobile phone case, which is carried out by a method selected from HCD ion plating (hollow cathod discharge) deposition method. 청구항 제1항에 있어서,The method of claim 1, 전처리 방법은 소재표면에 퍼핑 작업 또는 1차가공(습식 도금)이 완료된 케이스 소재(c)를 챔버 외부에서 알콜,아이피에이,아세톤,탄화수소계 유기용재,티씨이증기탈지,유기탈지화합물에 침지하고 5~300KHz 초음파를 1~30분간 작동시켜서 피도물 표면에 묻어 있는 오염 물질을 제거하고 소재(c)를 50~500℃까지 선택적으로 어닐링 하여 표면과 내부의 이상 기체를 제거하고,소재 열응력 및 변태응력의 발생을 억제하여 변형을 최소화하는 전처리 수단일 것을 포함하는 휴대폰 케이스의 금속 세라믹막 코팅방법The pretreatment method is to immerse the case material (c) which has completed puffing or primary processing (wet plating) on the surface of the material in alcohol, IP, acetone, hydrocarbon-based organic materials, TC vapor degreasing and organic degreasing compounds outside the chamber. Operate 5 ~ 300KHz ultrasonic wave for 1 ~ 30 minutes to remove contaminants on the surface of the workpiece, and selectively anneal the material (c) to 50 ~ 500 ℃ to remove surface gas and abnormal gas, and material thermal stress and transformation Metal ceramic film coating method of a mobile phone case comprising a pretreatment means to minimize the deformation by suppressing the occurrence of stress 청구항 제1항의 전처리 방법은 지그폴대(3)에 소재(4)를 장치하고 챔버내(11)진공상태(10-6~10-5Torr)에서 알르곤가스를 진공실내로(20~300Sccm) 투입하여 진공도(10-4~10-2Torr)에서 글로우 방전을 시켜 알르곤가스를 이온화시키고 이온화된 가스이온을 소재(4) 표면에 충돌시켜서 소재(4) 표면의 산화막,부동피막을 제거하는 식각 전처리 수단일 것을 포함하는 휴대폰 케이스의 금속세라믹막 코팅방법The pretreatment method according to claim 1 comprises arranging the material (4) in the jig pole (3) and argon gas in the vacuum (10 -6 to 10 -5 Torr) in the chamber (11) into the vacuum chamber (20 to 300 Sccm). Glow discharge at a vacuum degree (10 -4 to 10 -2 Torr) to ionize the argon gas and impinge ionized gas ions on the surface of the material (4) to remove the oxide film and the floating film on the surface of the material (4). Metal ceramic film coating method of a mobile phone case comprising an etching pretreatment means 금속제로 되어 패턴과 퍼핑가공이 종료된 케이스소재(4)를 하도 작업없이 챔버내에 장치된 지그폴대(3)에 장치하고 타켓에 티타늄,크롬,지르코늄,티타늄과 혼용된 금속중에서 선택된 금속을 장착하여 챔버문을 닫고 진공펌프 배기장치(9)를 가동시켜 챔버내의 진공도를 10-6~10-5 Torr 까지 유지시킨 후 히팅코일(5)을 작동시켜 챔버내의 소재(4) 온도를 60~700℃까지 선택적으로 예열하는 단계와 The case material 4 made of metal and finished with pattern and puffing is installed on the jig pole base 3 installed in the chamber without any work, and the target metal is selected from metals mixed with titanium, chromium, zirconium and titanium. Close the chamber door and operate the vacuum pump exhaust device (9) to maintain the vacuum level in the chamber from 10 -6 to 10 -5 Torr, and then operate the heating coil (5) to raise the temperature of the material (4) in the chamber to 60 to 700 ° C. Optional preheating steps and 회전모터(1)로 지그폴대(3)를 회전시키면서 알곤가스와 반응성가스(8)를 일정비율로 혼합시켜 챔버(11) 내로 투입하고 챔버내의 진공도를 10-4~10-2 Torr로 유지하여 타켓(10) 케소드(6)에 아크를 발생시켜 알곤가스와 반응성가스를 이온화시켜 플라즈마를 발생시켜 타켓(10)으로 부터 금속을 아크 증발시켜 기상원자를 플라즈마 내에서 전리 이온화시키고 소재(4)에 음전압(12)를 걸어 소재표면을 격열하게 휘젓어서 막성상을 이룩하는 금속세라믹 증착단계와 While rotating the jig pole stage 3 with the rotary motor 1, argon gas and reactive gas 8 are mixed at a predetermined ratio, and introduced into the chamber 11, and the vacuum degree in the chamber is maintained at 10 -4 to 10 -2 Torr. The target 10 generates an arc at the cathode 6 to ionize the argon gas and the reactive gas to generate a plasma to arc-evaporate the metal from the target 10 to ionize the gaseous atoms in the plasma, and the material (4) A metal ceramic deposition step of applying a negative voltage (12) to the surface of the material by vigorously stirring to form a film 증착세라믹막(b)위에 인(In),주석(Sn), 인-주석 산화물(ITO),아연(Zn),산화아연(ZnO),산화주석(SnO2), 산화알류미늄(Al2O3),이산화규소(SiO2),산화티탄(TiO2),지르코니아(ZrO2)Sn-Sb,SnO2-Sb2O3,ZnO+Al2O3,Ta2O5, Y2O3, AlN, Si3N4,SiAlON, Si, C, MaF2를 1개 또는 2개의 혼합물을 연속하여 코팅한 투명보호막을 형성하는 단계로 이루어지는 휴대폰 케이스의 금속 세라믹막 코팅방법Phosphorus (In), tin (Sn), phosphorus-tin oxide (ITO), zinc (Zn), zinc oxide (ZnO), tin oxide (SnO2), aluminum oxide (Al2O3), silicon dioxide on the deposited ceramic film (b) (SiO2), titanium oxide (TiO2), zirconia (ZrO2) Sn-Sb, SnO2-Sb2O3, ZnO + Al2O3, Ta2O5, Y2O3, AlN, Si3N4, SiAlON, Si, C, MaF 2 Metal ceramic film coating method of a mobile phone case comprising the step of continuously forming a transparent protective film
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101248061B1 (en) * 2011-05-20 2013-03-26 주식회사 에스제이테크 Surface treatment method of die-casting metal electronic devices exterior products.
KR101524509B1 (en) * 2014-03-12 2015-06-01 김진식 Manufacture method for color ic chip of drytype
WO2015116106A1 (en) * 2014-01-30 2015-08-06 Hewlett-Packard Development Company, L.P. Treating a substrate
WO2018199548A1 (en) * 2017-04-28 2018-11-01 삼성전자주식회사 Exterior material of home appliance, home appliance including same, and manufacturing method therefor
CN110468379A (en) * 2019-08-27 2019-11-19 中国科学院金属研究所 A kind of electric arc ion plating device configuring heated filament

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101248061B1 (en) * 2011-05-20 2013-03-26 주식회사 에스제이테크 Surface treatment method of die-casting metal electronic devices exterior products.
WO2015116106A1 (en) * 2014-01-30 2015-08-06 Hewlett-Packard Development Company, L.P. Treating a substrate
KR101524509B1 (en) * 2014-03-12 2015-06-01 김진식 Manufacture method for color ic chip of drytype
WO2018199548A1 (en) * 2017-04-28 2018-11-01 삼성전자주식회사 Exterior material of home appliance, home appliance including same, and manufacturing method therefor
CN110573655A (en) * 2017-04-28 2019-12-13 三星电子株式会社 Exterior material for home appliance, home appliance including the same, and method of manufacturing the same
US11655533B2 (en) 2017-04-28 2023-05-23 Samsung Electronics Co., Ltd. Exterior material of home appliance, home appliance including exterior material and manufacturing method of exterior material of home appliance
CN110468379A (en) * 2019-08-27 2019-11-19 中国科学院金属研究所 A kind of electric arc ion plating device configuring heated filament

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