WO2021087511A1

WO2021087511A1 - Direct-to-substrate coating process, and associated system and parts

Info

Publication number: WO2021087511A1
Application number: PCT/US2020/070705
Authority: WO
Inventors: Rick Rexford TAYLOR; David Earl RANKIN, Jr.
Original assignee: Nanogate Technologies, Inc.
Priority date: 2019-11-01
Filing date: 2020-10-28
Publication date: 2021-05-06

Abstract

A process for producing a part includes optionally surface treating a substrate, and applying, in sequence and directly on the substrate, a Cr adhesion layer, a first SiO₂ layer, an appearance metal layer, a second SiO₂ layer, and optionally an organic top coat layer. The application of the Cr layer, SiO₂ layers, appearance metal layer, and top coat layer may be applied via physical vapor deposition (PVD) in separate chambers of an apparatus separated by seals or interlocks to prevent cross-contamination. Some layers may be applied via reactive PVD whereas other layers may be applied with non-reactive PVD.

Description

DIRECT-TO-SUBSTRATE COATING PROCESS, AND ASSOCIATED SYSTEM AND PARTS

[0001] The present application claims the priority benefit of U.S. Provisional Patent Application Serial No. 62/929,150, filed November 1 , 2019, the disclosure of which is incorporated by reference herein.

BACKGROUND

[0002] Physical vapor deposition (PVD) is useful for applying aesthetic and functional layers to a substrate in order to produce various parts. One common area of PVD parts relates to various automotive parts for both internal and external mounting on a vehicle, although this disclosure is not limited to the automotive industry and may find suitable application in a wide variety of industries and end uses. However, multilayer parts often exhibit poor interlayer adhesion and other deficiencies that could be attributable to a wide variety of reasons such as steps of manufacture, materials used in the process/part manufacture or assembly, exposure to temperature, moisture, pressure/forces, ultraviolet light exposure, chemicals (e g., solvents, salts, detergents, etc.), although this list is merely exemplary and not deemed to be exhaustive.

[0003] It would be desirable to develop new PVD systems and methods for producing parts which overcome one or more of these deficiencies, or still other unmentioned deficiencies or challenges.

[0004] The systems and methods of the present disclosure enable numerous advantages. Non-limiting examples of such advantages include cost reduction, enhanced corrosion resistance, increased design flexibility, and/or weight reduction. In some embodiments, parts produced using the systems and methods of the present disclosure are suitable alternatives to conventional chromium and/or steel parts. Such parts may be referred to as chromium replacement or steel replacement parts.

BRIEF DESCRIPTION

[0005] The present disclosure relates to physical vapor deposition (PVD) processes, apparatuses, and parts. In the processes, multiple layers are applied to a substrate via PVD. The layers are preferably applied in separate chambers of a PVD apparatus where the chambers are separated by interlocks. In a first chamber (but not necessarily the first chamber of the apparatus), a first layer (e.g., a Cr adhesion layer) is applied directly to the substrate in the absence of a reactive gas. In a second chamber, a second layer (e.g., a silicon dioxide layer) is applied in the presence of a reactive gas.

[0006] Disclosed, in some embodiments, is a method for producing a part. The method includes providing a plastic substrate to a first chamber of a physical vapor deposition (PVD) apparatus; optionally surface treating the plastic substrate to achieve a desired surface energy in the first chamber; applying a metal adhesion layer directly to the substrate via PVD in a second chamber of the PVD apparatus in the absence of oxygen gas, wherein the first chamber is separated from the second chamber by a first seal and wherein the metal adhesion layer is provided directly to the substrate; applying a first S1O2 layer via reactive PVD in a third chamber of the PVD apparatus, wherein the second chamber is separated from the third chamber by a second seal; applying an appearance layer comprising at least one metal element and/or at least one metalloid element via PVD in a fourth chamber of the PVD apparatus in the absence of oxygen gas, wherein the third chamber is separated from the fourth chamber by a third seal; and applying a second S1O2 layer via reactive PVD in a fifth chamber of the PVD apparatus, wherein the fourth chamber is separated from the fifth chamber by a fourth seal.

[0007] In some embodiments, the method further includes: applying an organic top coat layer after the part is removed from the PVD apparatus.

[0008] Disclosed, in other embodiments, is a method for producing a part. The method includes applying a first layer to a substrate in a first chamber via physical vapor deposition (PVD) in the absence of reactive gas; and applying a second layer to the substrate in a second chamber via PVD in the presence of reactive gas. One of the first layer and the second layer is applied directly to the substrate.

[0009] Parts produced using the apparatuses, methods, and systems of the present disclosure are also disclosed.

[0010] These and other non-limiting characteristics of the disclosure are more particularly disclosed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is a flow chart illustrating a physical vapor deposition (PVD) process in accordance with some embodiments of the present disclosure.

[0012] FIG. 2 is a first part produced via a PVD process in accordance with some embodiments of the present disclosure.

[0013] FIG. 3 is a second part produced via a PVD process in accordance with some embodiments of the present disclosure.

[0014] FIG. 4 is a flow chart illustrating a physical vapor deposition (PVD) process in accordance with some embodiments of the present disclosure.

[0015] FIG. 5 is a cross-sectional view of a part produced via a PVD process in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

[0016] The present disclosure may be understood more readily by reference to the following detailed description of desired embodiments included therein. In the following specification and the claims which follow, reference will be made to a number of terms which shall be defined to have the following meanings.

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In case of conflict, the present document, including definitions, will control. Preferred methods and materials are described below, although methods and materials similar or equivalent can be used in practice or testing of the present disclosure. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. The materials, methods, and articles disclosed herein are illustrative only and not intended to be limiting.

[0018] The singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise.

[0019] As used in the specification and in the claims, the term “comprising” may include the embodiments “consisting of” and “consisting essentially of.” The terms “comprise(s),” “include(s),” “having,” “has,” “can,” “contain(s),” and variants thereof, as used herein, are intended to be open-ended transitional phrases that require the presence of the named ingredients/steps and permit the presence of other ingredients/steps. However, such description should be construed as also describing compositions, mixtures, or processes as “consisting of and “consisting essentially of” the enumerated ingredients/steps, which allows the presence of only the named ingredients/steps, along with any impurities that might result therefrom, and excludes other ingredients/steps. [0020] Unless indicated to the contrary, the numerical values in the specification should be understood to include numerical values which are the same when reduced to the same number of significant figures and numerical values which differ from the stated value by less than the experimental error of the conventional measurement technique of the type used to determine the particular value.

[0021] All ranges disclosed herein are inclusive of the recited endpoint and independently combinable (for example, the range of “from 2 to 10” is inclusive of the endpoints, 2 and 10, and all the intermediate values). The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value; they are sufficiently imprecise to include values approximating these ranges and/or values.

[0022] As used herein, approximating language may be applied to modify any quantitative representation that may vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about” and “substantially,” may not be limited to the precise value specified, in some cases. The modifier “about” should also be considered as disclosing the range defined by the absolute values of the two endpoints. For example, the expression “from about 2 to about 4” also discloses the range “from 2 to 4.” The term “about” may refer to plus or minus 10% of the indicated number. For example, “about 10%” may indicate a range of 9% to 11%, and “about 1” may mean from 0.9-1.1.

[0023] For the recitation of numeric ranges herein, each intervening number there between with the same degree of precision is explicitly contemplated. For example, for the range of 6-9, the numbers 7 and 8 are contemplated in addition to 6 and 9, and for the range 6.0-7.0, the number 6.0, 6.1, 6.2, 6.3, 6.4, 6.5, 6.6, 6.7, 6.8, 6.9, and 7.0 are explicitly contemplated.

[0024] The term “physical vapor deposition” (PVD) refers to coating processes wherein material is physically removed from a source (e.g., sputtering target) by evaporation or sputtering. The removed material is transported through a vacuum or partial vacuum by the energy of the vapor particles and condensed as a film on the surface(s) of one or more substrates. In standard sputtering, the source contains or approximates the desired composition for the coating. A plasma such as a non-reactive gas is directed toward a target formed of the material that is to be deposited as a thin film on the substrate surface(s). Particularly, atoms of the target material are ejected or removed by the plasma or gas, and then deposited on the substrate to form the thin film. In reactive sputtering, a gas containing a desired reactant is introduced. The reactant gas reacts with the source material to form the desired coating composition. For example, a metal source material may react with oxygen gas to form a metal oxide coating.

[0025] Non-limiting examples of PVD processes include diode sputtering, triode sputtering, magnetron sputtering (e.g., planar or cylindrical), direct current sputtering, radio frequency sputtering, electron beam evaporation, activated reactive evaporation, and arc evaporation.

[0026] Phases in PVD processes can include emission from a vapor source, vapor transport in a vacuum, and condensation of a substrate to be coated.

[0027] Disclosed, in some embodiments, is a PVD system to make a molded plastic substrate having a galvanic plated decorative finish using PVD coatings. This process is appropriate for any number of various plastics (e.g., thermoset plastics).

[0028] FIG. 1 schematically illustrates a physical vapor deposition (PVD) method 100 in accordance with some embodiments of the present disclosure. The method 100 includes forming a plastic substrate 110 but it is also contemplated that the plastic substrate could be a component formed separate and apart from the PVD method, and may be manufactured and/or supplied by a different manufacturer or supplier. The plastic substrate may be made of a thermosetting polymer composition. The plastic substrate may be formed, for example, via a molding process. Non-limiting embodiments of molding include rotational molding, injection molding, blow molding, compression molding, extrusion molding, and thermoforming.

[0029] Non-limiting examples of substrate materials useful in forming the plastic substrate include reinforced thermosetting polymers. Non-limiting examples of polymers that may be used as the thermosetting polymers include polyesters, polyimides, vinyl ester polymers, epoxy polymers, benzoxazine polymers, acrylic polymers, and phenol formaldehyde polymers (e.g., Novolac).

[0030] Non-limiting examples of reinforcing materials include fibers and other fillers. The substrate compositions may contain more than one type and/or size of fibers. Additionally, the fiber(s) may be used alone or in combination with one or more other types of fillers. Non-limiting examples of reinforcing fibers include glass fibers and carbon fibers.

[0031] In some embodiments, the substrate contains a fiber-reinforced plastic.

[0032] In some embodiments, the substrate is formed from a composition containing a bulk molding compound (BMC). The BMC may contain chopped glass fibers, styrene, an initiator, an inert filler, and an unsaturated thermoset resin. The glass fibers may be included in an amount of about 20 wt% to about 40 wt%, including about 30 wt%. The filler may be included in an amount of about 15 wt% to about 35 wt%, including about 25 wt%. The resin, styrene, and initiator may be included in a total amount of from about 35 wt% to about 55 wt%, including about 45 wt%. The fibers may have a length in the range of about 1/32” to about ½” or from greater than 1/8” to less than 2”.

[0033] In some embodiments, the substrate is formed from a composition containing a sheet molding compound (SMC). The SMC may be a glass fiber-reinforced polyester. The fibers may have a length in the range of from greater than ½” to about 2” or greater than 1”.

[0034] The substrate may be smooth or textured. In some embodiments, one or more textured surfaces are generated during moulding. For example, the substrate may have one or more brushed surfaces.

[0035] In some embodiments, the substrate material is suitable for vacuum processes and temperature-resistant up to approximately 80°C or higher.

[0036] Substrate formation 110 may be performed outside of a PVD apparatus. Optionally, the substrate is immediately transferred to the PVD apparatus. In other embodiments, the substrate may be stored prior to transfer to the PVD apparatus. It is also possible that the transfer of the substrate to the PVD apparatus is the beginning of the method. For example, the substrate may be purchased from another party and/or transferred to the facility housing the PVD apparatus. The substrate may be subjected to a cleaning or other operation prior to entering the PVD apparatus.

[0037] The optionally cleaned substrate is then transferred into a first chamber of the PVD apparatus. In the first chamber, the substrate may be treated to have the proper surface energy 120. The treatment may include a plasma treatment, a corona treatment, and/or a glow-discharge treatment. An improper surface energy can reduce adhesion and cause surface delamination. Air and/or argon may be used in the process gas during the treatment 120. In some embodiments, a glow discharge process involving a plasma is used to clean the surface of the substrate and remove any moisture that may be present. The treatment process leaves behind a clean surface for adhesion and optimizes surface tension.

[0038] Next, a thin metal (e.g., Cr and/or Ti) adhesion layer is applied to the active surface 130 in a second PVD chamber which may be separated from the first chamber by an interlock or seal. An inert gas (e.g., a noble gas such as argon gas) may be used as the process gas in this step of the PVD process. In some embodiments, no reactive gas is present in the second chamber. The adhesion layer may have a thickness in the range of from about 1 nm to about 60 nm, including from about 5 nm to about 50 nm, from about 6 to about 40 nm, from about 8 to about 20 nm, and from about 10 to about 15 nm. In particular embodiments, the adhesion layer has a thickness of about 15 nm or about 30 nm. The adhesion layer ensures that layers subsequently applied have good adhesion to the substrate.

[0039] Next, a first S1O2 layer is applied 140 via reactive PVD in a third PVD chamber. Again, the third chamber is preferably separated from the second PVD chamber by a second seal or interlock. The S1O2 layer may have a thickness in the range of from about 50 nm to about 150 nm, including from about 70 nm to about 130 nm, from about 80 nm to about 120 nm, and about 100 nm. The first S1O2 layer may be deposited using mid frequency power supplies in a reactive atmosphere. The process gases may include argon and oxygen. This hard or S1O2 layer acts as a very hard surface on which to deposit the “appearance” layer of metal (to be described below). The application of this hard layer adds to the scratch resistance of the appearance layer. [0040] The first S1O2 layer may be applied 140 in multiple steps in multiple chambers. For example, the first S1O2 layer may be applied 140 in two chambers wherein approximately half of the thickness of the first S1O2 layer is applied in each chamber. The use of multiple chambers to apply one layer in multiple steps may be beneficial where achieving the desired thickness in a single step in a single chamber would take longer than the other steps in the process 100. Using multiple chambers to achieve a desired thickness may allow for continuous processing. In some embodiments, an interface may be detectable between adjacent S1O2 sublayers that were applied in distinct chambers. The first S1O2 layer may provide a hard surface upon which an appearance layer can be subsequently applied. The first S1O2 layer may also help to keep the stress of the entire stack in line.

[0041] In some embodiments, the first S1O2 layer is omitted.

[0042] Next, an appearance layer is applied at process step 150 via PVD. In a preferred arrangement, a fourth PVD chamber may be separated from the third PVD chamber by a third seal or interlock. In some embodiments, the process gas includes at least one noble gas (e.g., argon). The appearance layer may be a reflective metal layer. This layer can be made of any number of metals or metalloids. The appearance layer may contain at least one metal element and/or at least one metalloid element. The metal(s) may be selected from Al, Ti, V, Cr, Mn, Co, Ni, Cu, Zn, Ga, Zr, Mo, Ag, In, Sn, Ta, W, Au, Bi. The metalloid(s) may be selected from B, Si, and Ge. In some embodiments, the appearance layer contains copper and/or stainless steel. Stainless steel and/or chromium sputtering targets may be used. In particular embodiments, the appearance layer contains stainless steel.

[0043] The appearance layer has a preferred thickness in the range of about 10 nm to about 120 nm, including from about 20 nm to about 100 nm, from about 30 nm to about 90 nm, from about 40 nm to about 60 nm, from about 60 nm to about 80 nm, about 50 nm, and about 70 nm. Optionally, nitrogen is incorporated (e.g., from about 5% to about 15%) in this metal layer for reducing stress, added hardness, and abrasion resistance. The nitrogen may be added by including N2 gas in the process gas. For example, the process gas may include a mixture of argon and nitrogen. The layer may be deposited by means of an IPT cathode. In some embodiments, the appearance layer is applied 150 in multiple steps in multiple chambers. The use of multiple chambers is advantageously employed to match cycle times in each chamber so that parts can advance to subsequent chambers simultaneously. When multiple chambers are used, it is possible that the appearance layer contains two or more distinct sublayers. The sublayers may differ in their composition and/or thickness, although in the preferred arrangement, the separate layers are the same material and about the same thickness as noted above.

[0044] Next, a second S1O2 layer is applied 160 via reactive PVD in a fifth PVD chamber. Once again, the fifth chamber is distinct and sealed by an interlock seal from the adjacent fourth chamber - i.e, the fifth chamber may be separated from the fourth PVD chamber by a fourth seal or interlock. The preferred process gas may contain argon and nitrogen. This layer acts as a very hard protective wear resistant layer to protect the previous “appearance layer”. The second S1O2 layer may have a thickness in the range of from about 5 nm to about 25 nm, including from about 10 nm to about 20 nm, and about 15 nm. The first and second S1O2 layers may be the same or different.

[0045] In some embodiments, each PVD step or element is sputtering.

[0046] If the part is for an interior or low wear applications, the process 100 may be complete based on the above description of the process. If intended for exterior or high wear applications, an organic top coat may be applied 170 before or after the part is removed from the PVD apparatus. For example, a top coat layer may be applied in final chamber of the PVD apparatus. The part may be cleaned prior to the application of the top coat but this is not necessarily a required step. The need for a cleaning step before the application of a protective top coat may depend on the length of time that passes before the top coat is applied. It is also possible that the top coat is applied 170 in a sixth chamber (e.g., via PECVD), e.g., immediately after completion of the second S1O2 layer in the fifth chamber. The top coat may have a thickness in the range of about 1 nm to about 200 nm, including about 5 nm to about 150 nm, and about 10 to about 100 nm. [0047] In some embodiments, the part has a stainless steel color and the organic top coat layer is omitted.

[0048] Non-limiting examples of suitable top coat materials include an acrylic polymer, a copolymer of an acrylic monomer and methacryloxysilane, a copolymer of a methacrylic monomer and an acrylic monomer having a benzotriazole group or a benzophenone group, an organo-silicon, an acrylic, a urethane, a melamine, and an amorphous SiOxCyHz. The organo-silicon polymer may be produced by curing a composition containing one or more of the following compounds: trialkoxysilanes or triacyloxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltrimethoxyethoxysilane, methyltriacetoxysilane, methyltripropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltracetoxysilane, vinyltrimethoxyethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriacetoxysilane, gamma-chloropropyltrimethoxysilane, gamma-chloropropyltriethoxysilane, gamma-chloropropyltripropoxysilane, 3,3,3- trifluoropropyltrimethoxysilane gamma-glycidoxypropyltrimethoxysilane, gamma- glycidoxypropyltriethoxysilane, gamma-(beta-glycidoxyethoxy)propyltrimethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, beta-(3,4- epoxycyclohexyl)ethyltriethoxysilane, gamma-methacryloxypropyltrimethyoxysilane, gamma-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma- meraptopropyltrimethoxysilane, gamma-mercaptopropyltriethoxysilane, N- beta(aminoethyl)-gamma-aminopropyltrimethoxysilane, beta-cyanoethyltriethoxysilane and the like; as well as dialkoxysilanes or diacyloxysilanes such as dimethyldimethoxysilane, phenylmethyldimethoxysilane, dimethyldiethoxysilane, phenylmethyldiethoxysilane, gamma-glycidoxypropylmethyldimethoxysilane, gamma- glycidoxypropylmethyldiethoxysilane, gamma-glycidoxypropylphenyldimethoxysilane, gamma-glycidoxypropylphenyldiethoxysilane, gamma- chloropropylmethyldimethoxysilane, gamma-chloropropylmethyldiethoxysilane, dimethyldiacetoxysilane, gamma-methacryloxypropylmethyldimethoxysilane, gamma- metacryloxypropylmethyldiethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, gamma-mercaptopropylmethyldiethoxysilane, gamma- aminopropylmethyldimethoxysilane, gamma-aminopropylmethyldiethoxysilane, methylvinyldimethoxysilane, methylvinyldiethoxysilane and the like.

[0049] In some embodiments, the top coat is formed from a hard UV-cured organic layer or hexamethyldisiloxane (Glipoxan).

[0050] The top coat layer may have a thickness in the range of from about 5 to about 50 pm, including from about 10 to about 30 pm, and from about 12 to about 25 pm. [0051] The part may be surface treated after the application of the outermost layer. This surface treatment may be performed in an exit chamber of the PVD apparatus. Non limiting examples of treatments include a plasma treatment and treatments to alter one or more of the textures, color, hydrophilic/hydrophobic degree, etc.

[0052] The part may be treated to alter the texture, color, hydrophilic/hydrophobic degree, etc.

[0053] To achieve the greatest level of material adhesion, the overall residual surface energy should be in a slight compression or neutral. Various aspects of the overall stresses and the difference between layers are discussed in U.S. Pat. No. 9,176,256 to Hall et al., issued Nov. 3, 2015; the contents of which are incorporated by reference herein.

[0054] The methods of the present disclosure may be performed in an apparatus with a plurality of separated chambers to prevent cross process contamination. The product may be transferred on rotating cylindrical fixtures through each processing station. The individual stations may run concurrently so that the process from beginning to completion is continuous and therefore efficient. Each individual station is separated by station interlocks. For example, a plurality of interior interlocks may be configured to open and close in a desired sequential pattern or at the same time such that a plurality of parts can be processed quickly, efficiently, and simultaneously in separate chambers and advance to a subsequent chamber substantially simultaneously. This would enhance the overall processing speed by eliminating the downtime. A partial vacuum is preferably maintained throughout the whole system to decrease pump down time in each station, further increasing throughput. Each chamber advantageously contains a separate vacuum pump for the required precise control of each portion of the process. The use of separate sealed chambers separated by interlocks and in which the individual chambers or stations that implement the separate process steps results in an efficient, step-wise process of advancing the components/parts through the system. Upon completion of the multiple station process, the parts on the cylindrical fixture are complete, or the parts may be transported to an organic top coat line to give the final part further protection and weatherability. [0055] It is preferred that opening and closing of the outer chambers may be staggered relative to the interior chambers.

[0056] In the multi-chambered apparatus, the chambers and substrate fixture may be oriented vertically. The chambers may be made of any suitable material this is impervious to the processing parameters, and is steel (e.g., mild steel) in the preferred embodiment. Dynamic sputtering deposition steps may be used to apply various layers of different materials onto substrates mounted on fixtures (e.g., rotating fixtures).

[0057] FIG. 2 illustrates a coated part 201 in accordance with some embodiments of the present disclosure. The coated part 201 includes a substrate 210 made of a base material (e.g., plastic), an adhesion layer 230, a first S1O2 layer 240, an appearance layer 250, and a second S1O2 layer 260. The second S1O2 layer 260 may define an outermost layer of the part 201. In some embodiments, the part 201 is useful for interior and/or low wear applications.

[0058] FIG. 3 illustrates a coated part 301 in accordance with other embodiments of the present disclosure. The coated part 301 includes a substrate 310 made of a base material (e.g., plastic), an adhesion layer 330, a first S1O2 layer 340, an appearance layer 350, a second S1O2 layer 360, and a top coat 370 (e.g., an organic top coat). In some embodiments, the part 301 is useful for interior and/or low wear applications; however, the addition of the top coat 370 makes the final product particularly more adaptable to more stringent applications, e.g., exterior and/or high wear applications. In preferred embodiments, the top coat is hydrophobic.

[0059] The same or a different fixture may be used in each PVD chamber and/or PVD step. The fixture may be stationary or rotary (optionally with planetary motion). The fixture may ensure that at least one surface to be coated is exposed while shielding at least one surface that is not to be coated. The substrate may be cleaned prior to any or all PVD steps. Cleaning may remove contaminants that would potentially reduce adhesion between layers.

[0060] The machine may be modular such that the number of chambers/modules can be changed by adding or subtracting chambers/modules (e.g., from a common frame). This may be particularly useful when the machine is used for different applications. Seals, such as O-rings, may contain fluorocarbon elastomers (e.g., VITON®) and provide an effective seal between the different chambers.

[0061] The multilayer coating may satisfy one or more of the following standards:

• Abrasion Resistance: SAE J948, Taber method, 500 g load, CS-10 wheels, wherein the coating shall show no abrasion through to the substrate;

• Crock meter: FLTM BN 107-01 , 10 cycles, AATCC Evaluation Procedure 2, with rating 4 min;

• Resistance to Scuffing: SAE J365, smooth plaque, 1000 cycles plus an additional 1000 cycles per 25 pm of coating with no wear through of the coating to the substrate;

• Scratch Resistance: FLTM BO 162-01 , visual inspection of surface, 1 mm scratch pins;

• Scratch Resistance for Scratch Resist Coatings: FLTM BN 107-01 , 150 cycles, dry with no visual scratch;

• Mar Resistance: FLTM Bl 161-01 , 2 and 10 double strokes, 70% gloss retention and no visual mar at all angles; and

• Abrasion and Wear Resistance Using the Abrex Machine: FLTM BN 155-01 , AATCC Procedure 1 , load 5 N, 30,000 cycles, AATCC color change 4 min, no coating wear through.

[0062] The direct-to-substrate processes of the present disclosure may produce parts with a comparable outward appearance while providing additional design flexibility and weight savings.

[0063] FIG. 4 is a flow chart illustrating a physical vapor deposition (PVD) process 400 in accordance with some embodiments of the present disclosure. The method 400 includes forming a plastic substrate 410, cleaning the substrate 420, loading the substrate in a chamber 430, applying a surface treatment 440, applying an appearance layer 450, removing the part from the chamber 460, and applying an organic topcoat 470. The formation 410 may include molding BMC into a desired shape. The cleaning 420 may involve anti-static blow-off and/or CO2 cleaning. The cleaned substrate is loaded into a metalizing chamber 430. In a first step within the chamber, the substrate may subjected to a glow discharge process (e.g., using Ar gas) or other surface treatment 440. In a second step within the chamber, the substrate is vacuum metalized 450. In some embodiments, the vacuum metalization utilizes stainless steel or chrome, Ar gas, and planar targets. The appearance layer may have a thickness in the range of from about 70 to about 100 nm. The metalized part is then removed from the chamber 460 and an organic topcoat may be applied 470. In some embodiments, the organic topcoat is either Neptune or black steel organic topcoat.

[0064] FIG. 5 is a cross-sectional view of a part 501 produced via a PVD process in accordance with some embodiments of the present disclosure. The part 501 includes a substrate 510, an appearance layer 560, and an organic topcoat 570.

[0065] The applied coating may exhibit a pencil hardness grading, measured according to ASTM D3363, of at least HB, at least F, at least H, at least 2H, at least 3H, at least 4H, at least 5H, at least 6H, at least 7H, at least 8H, or 9H.

[0066] The exemplary embodiment has been described with reference to the preferred embodiments. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the exemplary embodiment be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

CLAIMS:

1. A method for producing a part, the method comprising in sequence: providing a plastic substrate to a first chamber of a physical vapor deposition (PVD) apparatus; applying a metal adhesion layer directly to the substrate via PVD in a second chamber of the PVD apparatus in the absence of oxygen gas, wherein the first chamber is separated from the second chamber by a first seal; applying a first S1O2 layer via reactive PVD in a third chamber of the PVD apparatus, wherein the second chamber is separated from the third chamber by a second seal; applying an appearance layer comprising at least one metal element and/or at least one metalloid element via PVD in a fourth chamber of the PVD apparatus in the absence of oxygen gas, wherein the third chamber is separated from the fourth chamber by a third seal; and applying a second S1O2 layer via reactive PVD in a fifth chamber of the PVD apparatus, wherein the fourth chamber is separated from the fifth chamber by a fourth seal; wherein the substrate comprises a reinforced thermosetting polymer.

2. The method of claim 1 , wherein the reinforced thermosetting polymer comprises a bulk molding compound (BMC) or a sheet molding compound (SMC).

3. The method of any one of claims 1 and 2, further comprising: applying an organic top coat layer after the part is removed from the PVD apparatus.

4. The method of any one of the preceding claims, further comprising: surface treating the part in a sixth chamber, wherein the fifth chamber is separated from the sixth chamber by a fifth seal.

5. The method of any one of the preceding claims, wherein the appearance layer further comprises from about 5% to about 15% nitrogen.

6. The method of any one of the preceding claims, wherein each of the first chamber, the second chamber, the third chamber, the fourth chamber, and the fifth chamber is associated with a different pump.

7. A part produced by the method of any one of the preceding claims.

8. The part of claim 7, wherein the part is a decorative automotive part.

9. A method for producing a part, the method comprising: applying a first layer to a substrate in a first chamber via physical vapor deposition (PVD) in the absence of reactive gas; and applying a second layer to the substrate in a second chamber via PVD in the presence of reactive gas; wherein one of the first layer and the second layer is applied directly to the substrate; and wherein the substrate comprises a reinforced thermosetting polymer.

10. The method of claim 9, wherein the reinforced thermosetting polymer comprises a bulk molding compound (BMC) or a sheet molding compound (SMC).

11 . The method of claim and one of claims 9 and 10, wherein the first layer is applied before the second layer is applied; and wherein the first layer is located between the substrate and the second layer.

12. The method of any one of claims 9 and 10, wherein the second layer is applied before the first layer is applied; and wherein the second layer is located between the substrate and the first layer.

13. The method of any one of claims 9-12, further comprising: surface treating the substrate prior to the application of the first layer and the application of the second layer.

14. The method of claim 13, wherein the surface treatment comprises a plasma treatment.

15. The method of claim 13, wherein the surface treatment comprises a corona treatment.

16. The method of any one of the claims 9-15, further comprising: applying an organic top coat layer after the application of the first layer and the application of the second layer.

17. A part produced by the method of any one of claims 9-16.

18. The part of claim 17, wherein the part is a decorative automotive part.

19. A part comprising: a plastic substrate comprising a reinforced thermosetting resin; and a coating deposited on a first surface of the substrate, said coating comprising in sequence: a metal adhesion layer in direct physical contact with the substrate; a first S1O2 layer; an appearance layer; and a second S1O2 layer.

20. The part of claim 19, wherein the reinforced thermosetting resin comprises a bulk molding compound (BMC) or a sheet molding compound (SMC).

21 . The part of claim 20, wherein the coating further comprises an outermost top coat layer.

22. The part of any one of claims 20 and 21 , wherein the metal adhesion layer comprises chromium.

23. The part of any one of claims 19-22, wherein the appearance layer comprises stainless steel.

24. The part of any one of claims 19-23, wherein the adhesion layer has a thickness in the range of from about 1 nm to about 60 nm.

25. The part of any one of claims 19-24, wherein the first S1O2 layer has a thickness in the range of from about 50 nm to about 150 nm.

26. The part of any one of claims 19-25, wherein the appearance layer has a thickness in the range of from about 10 nm to about 120 nm.

27. The part of any one of claims 19-26, wherein the second S1O2 layer has a thickness in the range of from about 5 nm to about 25 nm.