KR20100000847A - Liquid crystal display device and fabricating method of the same - Google Patents

Abstract

PURPOSE: A liquid crystal display device and a manufacturing method thereof are provided to replace a glass substrate which a polarizing film, thereby reducing weight and thickness. CONSTITUTION: A thin film transistor is arranged in the inner side of a substrate(100). Color filter layers(120a,120b,120c) are arranged on the thin film transistor. A pixel electrode(134) is arranged on the color filter layer. A common electrode(135) is arranged on the color filter layer. A polarizing film(200) is spaced from the substrate and bonded by sealant(300). A liquid crystal layer is interposed between the substrate and the polarizing film. An anti-glare layer is arranged in the outer surface of a base film.

Description

Liquid crystal display and its manufacturing method {LIQUID CRYSTAL DISPLAY DEVICE AND FABRICATING METHOD OF THE SAME}

The present invention relates to a liquid crystal display device, and more particularly, to a light weight thin liquid crystal display device and a method for manufacturing the same by replacing a conventional glass substrate with a polarizing film.

In the liquid crystal display, a thin film transistor array substrate and a color filter array substrate are spaced apart from each other by a predetermined interval, and liquid crystal is injected between the two substrates. Here, electrodes are formed on the inner surfaces of the two substrates, and the voltage is applied to the two electrodes to drive the liquid crystal, thereby controlling the transmittance of the light passing through the liquid crystal to represent an image.

The substrate must be able to transmit light and have a constant supporting force so as not to move during the process of the liquid crystal display or to have excessive warping during the deposition process. Usually the substrate has been using a glass substrate.

In recent years, the liquid crystal display device has a strong demand for light weight thinning in order to be applied to a portable display device or to increase spatial utilization. Accordingly, the substrate not only has a light and thin advantage over the glass substrate, but also tries to replace it with a flexible film having a low cost without being easily broken.

However, as the film is formed of a plastic whose heat resistance, bearing capacity and chemical resistance are weaker than those of the glass substrate, the film is deformed and damaged in a process, that is, a process of forming a device and a color filter layer including a thin film transistor. .

The present invention is to replace the at least one substrate constituting the liquid crystal display with a polarizing film, to reduce the cost and to provide a lightweight thin liquid crystal display device and a manufacturing method thereof.

In order to achieve the above technical problem, an aspect of the present invention provides a liquid crystal display device. The liquid crystal display device includes a thin film transistor disposed on an inner side of a substrate, a color filter layer disposed on the thin film transistor, a pixel electrode disposed on the color filter layer, and disposed on the color filter layer to form a transverse electric field. A common electrode, a polarizing film spaced apart from the substrate and bonded by a sealant, and a liquid crystal layer interposed between the substrate and the polarizing film.

Another aspect of the present invention to achieve the above technical problem provides a method of manufacturing a liquid crystal display device. The manufacturing method includes the steps of forming a thin film transistor on a substrate, forming a color filter layer on the thin film transistor, disposed on the color filter layer, and electrically connected to the thin film transistor, the pixel electrode, and a transverse electric field. Forming a common electrode for forming a film, forming a liquid crystal layer on the substrate including the pixel electrode and the common electrode, and bonding the polarizing film to the substrate by a sealant with the liquid crystal layer interposed therebetween. Steps.

In the liquid crystal display device according to the embodiment of the present invention, by replacing the conventional glass substrate with a polarizing film, it was possible to achieve a lighter and thinner liquid crystal display device.

In addition, the liquid crystal display device may form a thin film transistor and a color filter layer on one substrate, thereby minimizing damage to the polarizing film.

In addition, as the polarizing film has a polarizing function, the process of attaching the polarizing member separately may be reduced, thereby simplifying the manufacturing process and reducing the manufacturing cost of the process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of the liquid crystal display. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view of a liquid crystal display device according to a first embodiment of the present invention.

Referring to FIG. 1, the liquid crystal display of the present invention faces each other and is bonded between the substrate 100 and the polarizing film 200, which are bonded by the sealant 300, and between the substrate 100 and the polarizing film 200. The interposed liquid crystal layer 400 is included.

Since the polarizing film 200 is made of a polymer, the polarizing film 200 has a low heat resistance, chemical resistance, and bearing capacity as compared to a glass substrate used as an upper substrate of a conventional liquid crystal display device. Therefore, when the device for driving the liquid crystal layer 400 and the color filter layers 120a, 120b, and 120c for realizing full color are formed on the polarizing film 200, the polarizing film 200 is deformed. Or damaged. Therefore, the device and the color filter layers 120a, 120b, and 120c are disposed on the substrate 100 having greater heat resistance, chemical resistance, and support force than the polarizing film 200. In this case, the substrate 100 may be a glass substrate.

Specifically, a plurality of wirings for providing signals to a plurality of pixels are disposed on the substrate 100. For example, the plurality of interconnections may include a gate interconnection 101 and a data interconnection 102 that are insulated from each other with the gate insulating layer 110 interposed therebetween to define a pixel region. In addition, the semiconductor device may further include a common line 103 to provide a common signal to each pixel.

The thin film transistor Tr is disposed in each pixel area. The thin film transistor Tr is electrically connected to the gate line 101 and the data line 102, so that the thin film transistor Tr is connected to a pixel selected by a selection signal provided from the gate line 101. The scan signal provided by the data line 102 is provided.

The thin film transistor Tr includes a semiconductor pattern 121 and a semiconductor pattern overlapping the gate electrode 111 with the gate electrode 111 branched from the gate wiring 101, the gate insulating layer 110 interposed therebetween. A source electrode 131 disposed on 121 and electrically connected to the data line 102, and a drain electrode 141 disposed on the semiconductor pattern 121 and spaced apart from the source electrode 131. The semiconductor pattern 121 may include an active pattern 121a formed of an amorphous silicon pattern and an ohmic contact pattern 121b formed of an amorphous silicon pattern including impurities and disposed on the active pattern 121a. .

In addition, the thin film transistor Tr includes a channel protection pattern 132 interposed between a portion of the ohmic contact pattern 121b and the active pattern 121a. As a result, the channel region corresponding to the separation space between the source electrode 131 and the drain electrode 141 facing each other is prevented from being contaminated. In particular, the channel protection pattern 132 may be prevented from being contaminated by the color filter layers 120a, 120b, and 120c, which will be described later. In addition, the channel protection pattern 132 not only protects the channel region, but also acts as an etch stop layer to prevent the active pattern 121a from being over-etched in the process of manufacturing the thin film transistor Tr. .

In addition, the liquid crystal display may further include pad parts P1 and P2 positioned at an outer portion of the substrate 100 and connected to an external circuit part. Here, the pad portions P1 and P2 may be gate pad portions P1 electrically connected to the respective gate wires 101, data pad portions P2 electrically connected to the respective data wires 102, and are illustrated in the drawings. Although not shown, each common wiring 103 may include a common voltage pad formed by extending. The gate pad portion P1 covers the first gate pad electrode 104 and the gate pad electrode 104 disposed at one end of the gate wiring 101, and is formed of the same conductive material as the pixel electrode 134. It includes a second gate pad electrode 105 made of. In addition, the data pad part P2 covers the first data pad electrode 106 and the first data pad electrode 106 disposed at one end of the data line 102, and the pixel electrode 134. It includes a second data pad electrode 107 made of a conductive material such as.

In this case, although not shown in the drawings, the pads may be electrically connected to each other by a printed circuit board (PCB), which is an external circuit unit, and a tape automated bonding (TAB) method using a tape carrier package (TCP). have.

In addition, the semiconductor device may further include a storage electrode 108 overlapping the common wiring 103 with the gate insulating layer 110 therebetween to form a storage capacitor.

The color filter layer 120 is disposed on the substrate 100 including the thin film transistor Tr. The color filter layers 120a, 120b, and 120c may include at least another color disposed in each pixel area, for example, a red color filter 120a, a green color filter 120b, and a blue color filter 120c.

The color filter layers 120a, 120b, and 120c may include contact holes exposing the drain electrode 141 of the thin film transistor Tr and a part of the common wiring 103, respectively.

The pixel electrode 134 electrically connected to the drain electrode 141 and the common electrode 135 electrically connected to the common wiring 103 are disposed on the color filter layers 120a, 120b, and 120c through the contact holes. It is.

The pixel electrodes 134 are electrically connected to each other and branched into a plurality of pixels. For example, the pixel electrode 134 may have a comb shape. In addition, the common electrodes 135 are electrically connected to each other, and are divided into a plurality of branches. For example, the common electrode may have a comb shape. The branched common electrode 135 may be alternately disposed with the branched pixel electrode 134 to form a transverse electric field with respect to the substrate 100.

The pixel electrode 134 and the common electrode 135 may be made of a transparent conductor to increase the aperture ratio. For example, the transparent conductor may be ITO or IZO.

In addition, the color filter protective layer 130 may be further disposed on the color filter layers 120a, 120b, and 120c. In this case, the pixel electrode 134 and the common electrode 135 are disposed on the color filter protective layer 130. The color filter protective layer 130 may prevent the color filter layers 120a, 120b, and 120c from being damaged or contaminated in the process of forming the pixel electrode and the common electrode. In addition, the color filter protective layer 130 may be formed by weak adhesion between the color filter layers 120a, 120b, and 120c, the pixel electrode 134, and the common electrode 135. It may serve to prevent the peeling of (135). To this end, the color filter protective layer 130 may be an inorganic insulating film, such as a silicon oxide film or a silicon nitride film.

In the first embodiment of the present invention, the pixel electrode 134 is described as being disposed on the color filter layers 120a, 120b, and 120c. However, the pixel electrode 134 is the color filter layer 120a, 120b, and 120c. Can be placed underneath. That is, the pixel electrode 134 may overlap the common electrode 135 with the color filter layers 120a, 120b, and 120c interposed therebetween, thereby forming a transverse electric field. In this case, the pixel electrode may not have a comb shape, and in another embodiment, may have a shape of the pixel area, for example, a rectangular shape.

The light blocking layer 140 is disposed on the color filter protection layer 130 corresponding to the thin film transistor Tr and the plurality of wires to prevent light leakage.

The light blocking layer 140 may include stacked first and second conductive patterns 140a and 140b. The first conductive pattern 140a may be made of the same material as the common electrode 135. In addition, the second conductive pattern 140b may be formed of a material capable of blocking light, such as Mo, Cr, and Al. As a result, the light blocking layer 140 and the common electrode 135 may be formed through one mask.

Although not shown in the drawing, a polarizing member may be disposed on the other side of the substrate 100. The polarizing member serves to control the polarization state of light.

Accordingly, elements including a high temperature environment and a process environment using a solvent, such as a thin film transistor (Tr), a pixel electrode 134, and a common electrode 135, the color filter layer on the substrate 100. By providing both the 120a, 120b, and 120c and the light blocking layer 140, at least the upper substrate may be deformed by heat and solvent, etc., but it is lighter and thinner than the glass substrate and has a low price. ) Can be used. That is, in the liquid crystal display device, at least one substrate may be replaced with a polarizing film, thereby reducing the thickness and weight of the liquid crystal display device.

In order to maintain a cell gap between the substrate 100 and the polarizing film 200, a spacer 155 may be further provided between the substrate 100 and the polarizing film 200. The spacer 155 may be disposed on the substrate 100 corresponding to the light blocking layer 140. The spacer 155 may be a columnar pattern formed of an organic material.

Hereinafter, with reference to the drawings will be described in more detail a polarizing film according to an embodiment of the present invention.

2 is a cross-sectional view of a polarizing film of a first embodiment applied to a liquid crystal display according to an embodiment of the present invention.

Referring to FIG. 2, the polarizing film 200 according to the exemplary embodiment of the present invention includes a base film 211, an antiglare layer 212, an adhesive layer 213, a polarizing layer 214, a support layer 215, and an orientation. Layer 216 may be included.

The base film 211 may transmit light, and may be formed of a material having a supporting force for maintaining a predetermined distance from the substrate 100. For example, the base film 211 may be made of polycarbonate (polycarborbonate) or polyethyl sulfone. In addition, the base film 211 serves to support the polarizing layer 214 to be described later.

An anti glare (212) layer is disposed on an outer surface of the base film 211. The antiglare layer 212 may diffuse reflection of light incident from the outside to prevent glare. To this end, the antiglare layer 212 may have a curved surface. Curvature of the antiglare layer 212 may be formed through beads or surface etching.

An adhesive layer 213 is disposed on an inner side surface of the base film 211. The adhesive layer 213 serves to attach the polarizing layer 214 to be described later on the base film 211. An example of a material used as the adhesive layer 213 may be a pressure sensitive adhesive (PSA), that is, an acrylic resin.

The polarizing layer 214 is attached to the base film 211 by the adhesive layer 213. The polarization layer 214 may have a vertical polarization axis perpendicular to the polarization axis of the polarization member. An example of a material for forming the polarizing layer 214 may be poly vinyl alcohol.

A support layer 215 is provided on the polarization layer 214 to support and protect the polarization layer 214. An example of a material formed of the support layer 215 may be TriAcetyl Cellulose (TAC).

An alignment layer 216 for initial alignment of the liquid crystal layer is disposed on the support layer 215. Examples of the material for forming the alignment layer 216 may be made of polyimide resin or the like.

As such, when the at least one substrate, that is, the upper substrate, of the liquid crystal display device is replaced with the polarizing film in the glass substrate, the weight and thickness of the liquid crystal display device can be reduced and the attaching process of the polarizing film is not performed separately. There is no need to simplify the process.

3 is a cross-sectional view of a polarizing film according to a second embodiment that may be applied to a liquid crystal display according to an embodiment of the present invention. Here, except for further comprising an additional support layer has the same configuration as the polarizing film according to the first embodiment described above. Accordingly, for convenience of description, the above description and repeated contents will be omitted, and the same reference numerals will be given to the same components.

Referring to FIG. 3, a polarizing film according to an exemplary embodiment of the present invention may include a base film 211, an antiglare layer 212, an adhesive layer 213, a polarizing layer 214, a support layer 215, and an alignment layer 216. ).

The polarizing film may further include an additional supporting layer 217 between the adhesive layer 213 and the polarizing layer 214. The additional support layer 217 further assists in supporting the polarization layer 214. In addition, the additional support layer 217 may serve to protect the polarization layer 214 from the adhesive layer 213.

4 is a cross-sectional view of a polarizing film according to a third embodiment that may be applied to a liquid crystal display according to an embodiment of the present invention. Here, except having a compensation layer has the same configuration as the polarizing film of the first embodiment described above. Accordingly, for convenience of description, the above description and repeated contents will be omitted, and the same reference numerals will be given to the same components.

Referring to FIG. 4, the polarizing film according to the exemplary embodiment of the present invention may include a base film 211, an antiglare layer 212, a polarizing layer 214, an adhesive layer 213, a compensation layer 218, and an alignment layer. And 216.

The polarization layer 214 may be disposed on the base film 211. The polarization layer 214 may be formed on the base film 211 by a coating method.

The adhesive layer 213 serves to attach the compensation layer 218 to be described later on the polarizing layer 214.

The compensation layer 218 improves a narrow viewing angle of the liquid crystal display by birefringence of the liquid crystal. In this case, the compensation layer 218 may include an A plate 218a and a C plate 218b. The A plate 218a is a film having a thickness retardation value of almost zero and a planar retardation value having a positive value. The A plate 218a may be a uniaxially stretched cycloolefin membrane. In addition, the C plate 218b has a planar retardation value of almost zero, and a retardation value in the thickness direction is a film having a positive value. The C plate 218b may be used as a vertically aligned liquid crystal film.

The compensation layer 218 may further include an alignment layer for initial alignment of the liquid crystal of the liquid crystal layer.

As a result, the polarizing film may further provide a light compensation function in addition to the polarization function, thereby improving the viewing angle as well as reducing the thickness of the liquid crystal display device.

In addition, the support layer 215 may be further provided between the polarizing layer 214 and the adhesive layer 213. The support layer 215 may support the polarization layer 214 and prevent the polarization layer 214 from being contaminated by the adhesive layer 213.

5 to 19 are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a second exemplary embodiment of the present invention.

Referring to FIG. 5, first, a substrate 100 is provided. The material of the substrate 100 may be glass. However, the embodiment of the present invention is not limited thereto.

After depositing a conductive material on the substrate 100 to form a first conductive film, the first conductive film is etched to form a gate wiring 101, a gate electrode 111, a common wiring 103, and a first gate pad electrode. 106, a first common voltage pad electrode (not shown) is formed at the same time. For example, the first conductive layer may be a single layer formed of at least one selected from the group consisting of Al, Mo, Cu, MoW, MoTa, MoNb, Cr, W, and AlNd. In addition, the first conductive film may be a double film further including any one of an ITO film and an IZO film formed of a conductive material having corrosion resistance.

The gate wiring 101, the gate electrode 111, and the first gate pad electrode 104 may be electrically connected to each other, and may be integrally formed.

In addition, the common line 104 and the first common voltage pad electrode may be electrically connected to each other, and further may be integrally formed.

Referring to FIG. 6, a gate is formed on a substrate 100 including the gate wiring 101, the gate electrode 111, the common wiring 103, a first gate pad electrode 106, and a first common voltage pad electrode. The insulating film 110, the first semiconductor layer 160, the insulating film 170, and the first photoresist pattern 180a are sequentially formed.

The gate insulating layer 110 and the first semiconductor layer 160 may be formed by chemical vapor deposition. The gate insulating layer 110 may be a silicon nitride film or a silicon oxide film. In addition, the first semiconductor layer 160 may be amorphous silicon.

The insulating layer 170 may be formed of an inorganic insulating layer or an organic insulating layer. In detail, the inorganic insulating film may be a silicon oxide film or a silicon nitride film. The organic insulating layer may be at least one selected from the group consisting of polyimide resin, acrylic resin, benzocyclobutene (BCB), and perfluorocyclobutene resin (PFCB).

Here, when the insulating film 170 is an inorganic insulating film, it may be formed by chemical vapor deposition. When the insulating film 170 is an organic insulating film, spin coating, dip coating, roll coating, bar coating, screen printing, or ink jet Can be formed in any way during printing

The first photoresist pattern 180a may be formed by forming a photosensitive film on the insulating layer 170, arranging a mask on the photosensitive film, and then performing an exposure and development process. The photosensitive film is formed by any one of spin coating, dip coating, roll coating, bar coating, screen printing or inkjet printing at least one selected from the group consisting of an acrylic resin, a polyimide resin, a polyamide resin, and a benzocyclobutene resin. can do

The mask may be a diffraction mask or a halftone mask that can adjust the intensity of light irradiated to the photosensitive film for each part. When the exposure and development processes are performed using the mask, the first photoresist pattern 180a having a step may be formed.

The insulating layer 160, the first semiconductor layer 160, and the gate insulating layer 110 are etched according to the first photoresist pattern 180a to expose a portion of the first gate pad electrode 106. 1 Contact hole C1 is formed. In this case, although not shown in the drawing, a contact hole exposing a part of the first common voltage pad electrode may be further formed.

An ashing process is performed on the first photoresist pattern 180a to form a second photoresist pattern 180b as shown in FIG. 7.

Using the second photoresist pattern 180b as an etch mask, the insulating layer 170 and the first semiconductor layer 160 are dry etched, and as shown in FIG. 8, the active pattern 121a and the active layer are etched. An insulating film pattern 170a positioned on the pattern 121a is formed.

Thereafter, an ashing process is performed until both sides of the second photoresist pattern 180b are partially removed, thereby forming the third photoresist pattern 180c. According to the third photoresist pattern 180c, the insulating layer pattern 170a is patterned to form a channel passivation layer 132. The channel passivation layer 132 may be disposed on the channel region to prevent contamination of the channel region due to the absence of the passivation layer.

Thereafter, the third photoresist pattern 140c is removed as shown in FIG. 10.

Referring to FIG. 11, a source electrode 131, a drain electrode 141, a data line 102, a first data pad electrode 106 and an ohmic contact are formed on a substrate 100 including the channel protection layer 132. The pattern 121b is formed.

In detail, the second semiconductor layer and the second conductive layer are sequentially formed on the substrate 100 including the channel protective layer 132. The second semiconductor layer may be formed by chemical vapor deposition, and the second conductive layer may be formed by vacuum deposition or sputtering. In this case, the second semiconductor layer may be formed of amorphous silicon doped with impurities. The second conductive film may be formed of at least one selected from the group consisting of Mo, Ti, Ta, MoTa, MoW, and MoNb.

The second semiconductor layer and the second conductive layer are collectively etched by using a photolithography process, so that the source electrode 131, the drain electrode 141, the data wiring 102, the first data pad electrode 106, and ohmic contact tech. The pattern 121b may be formed. The second semiconductor layer is etched until the channel protective layer 132 is completely exposed. The channel protective layer 132 prevents the active pattern 121a from being etched by performing an etching process until the second semiconductor layer on the channel region of the active pattern 121a is completely removed. It can act as an etch barrier. This is because if the second semiconductor layer 150 remains on the channel region, the on / off current value characteristic of the thin film transistor may be degraded.

Here, the ohmic contact pattern 121b and the data line 103 are collectively etched to form a dummy ohmic contact under the data line 103 and made of the same material as the ohmic contact pattern 121b. The pattern 121c is further disposed.

In addition, the storage electrode 108 may be further formed to overlap the common wiring 103 with the gate insulating layer 110 therebetween to form a storage capacitor.

Referring to FIG. 12, color filter layers 120a, 120b, and 120c are disposed on a substrate 100 including the source electrode 131, the drain electrode 141, the data wire 102, and the first data pad electrode 106. ).

On the substrate 100 including the source electrode 131, the drain electrode 141, the data line 102, and the first data pad electrode 106 to form the color filter layers 120a, 120b, and 120c. After applying the red color filter to the red color filter layer 120a by performing exposure and development processes. Similarly, the green color filter layer 120b and the blue color filter layer 120c are formed. In an embodiment of the present invention, the order of forming the red, green, and blue color filter layers 120a, 120b, and 120c is not limited.

In the process of forming the color filter layers 120a, 120b, and 120c, the color filter layers 120a, 120b, and 120c are formed to expose the outer portion of the substrate 100. As a result, the first gate pad electrode 103 and the first data pad electrode 106 are exposed. In addition, a second contact hole C2 exposing a part of the drain electrode 141 and a third contact hole C3 exposing a part of the common wiring 103 are formed.

Referring to FIG. 13, a color filter protective layer 130 is formed on a substrate 100 including the color filter layers 120a, 120b, and 120c.

The color filter protective layer 130 may be formed through chemical vapor deposition. The color filter protective layer 130 may be formed of silicon oxide or silicon nitride.

In this case, the color filter protective layer 130 may expose the first, second and third contact holes C1, C2, and C3 and the fourth contact hole C4 exposing a part of the first data pad electrode 106. Can be formed. The first, second, third and fourth contact holes C1, C2, C3, and C4 may be formed using a photolithography process.

Referring to FIG. 14, third and fourth conductive layers 191 and 192 and a fourth photoresist pattern 180d are sequentially formed on the color filter protective layer 130.

The third and fourth conductive layers 191 and 192 may be formed by vacuum deposition or sputtering. The third conductive layer 191 may be formed of a transparent conductive material such as ITO or IZO. In addition, the fourth conductive layer 192 may be a conductive material that shields light, for example, Mo, Cr, and Al.

The fourth photoresist pattern 180d is formed to have a step using a halftone mask or a diffraction mask as in the process of forming the first photoresist pattern 180a described above.

The third and fourth conductive layers 191 and 192 are etched using the fourth photoresist pattern 180d as an etching mask, and as shown in FIG. 15, the preliminary pixel electrode 193 and the preliminary common electrode 194. ), The preliminary second gate pad electrode 195, the preliminary second data pad electrode 196, and the light blocking layer 140 are formed.

The light blocking layer 140 may include first and second conductive patterns 140a and 140b in which the third and fourth conductive layers 191 and 192 are etched and stacked.

A portion of the light blocking layer 140 may be integrally formed with the preliminary pixel electrode 193.

An ashing process is performed until the step of the fourth photoresist pattern 180d is removed to form the fifth photoresist pattern 180e as shown in FIG. 16.

By using the fifth photoresist pattern 180e as an etching mask, the preliminary pixel electrode 193, the preliminary common electrode 194, the preliminary second gate pad electrode 195, and the preliminary second data pad electrode 196 are formed. After removing the second conductive pattern, the pixel electrode 134, the common electrode 135, the second gate pad electrode 105, and the second data pad electrode 107 are formed. Thereafter, as shown in FIG. 17, the fifth photoresist pattern 180e is removed.

Referring to FIG. 18, a spacer 155 is formed on the light blocking layer 140. In order to form the spacer 155, an organic layer is formed on the substrate 100 including the light blocking layer 140. Thereafter, the spacer 155 is formed by performing the exposure and development processes of the organic layer. Examples of the organic film material for forming the spacer 155 may be acrylic resin, polyimide resin, or the like.

Referring to FIG. 19, after the sealant 300 is formed along the edge of the substrate 100 on which the spacer 155 is formed, the polarizing film 200 is bonded using the sealant 300. In this case, a liquid crystal layer interposed between the substrate 100 and the polarizing film 200 may be formed before or after bonding the polarizing film 200.

The polarizing film 200 has a polarizing function and serves to support the liquid crystal display together with the substrate 100.

In addition, a process of attaching the polarizing member to the outer surface of the substrate 100 may be further performed.

Therefore, in the embodiment of the present invention by replacing the conventional upper substrate with a polarizing film in the glass, it is possible to manufacture a light and thin liquid crystal display device.

In addition, by forming a device and a color filter layer formed in a high temperature environment on one substrate, it is possible to prevent the polarizing film from being damaged.

In addition, as the polarizing film has a polarizing function, the process of attaching the polarizing member separately may be reduced, thereby simplifying the manufacturing process and reducing the manufacturing cost of the process.

1 is a cross-sectional view of a liquid crystal display device according to a first embodiment of the present invention.

2 is a cross-sectional view of a polarizing film of a first embodiment applied to a liquid crystal display according to an embodiment of the present invention.

3 is a cross-sectional view of a polarizing film according to a second embodiment that may be applied to a liquid crystal display according to an embodiment of the present invention.

4 is a cross-sectional view of a polarizing film according to a third embodiment that may be applied to a liquid crystal display according to an embodiment of the present invention.

5 to 19 are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a second exemplary embodiment of the present invention.

 (Explanation of reference numerals for the main parts of the drawings)

100 substrate 110 gate insulating film

101: gate wiring 102: data wiring

103: common wiring 111: gate electrode

120a, 120b, and 120c: color filter layer 121: semiconductor pattern

130: color filter protective layer 131: source electrode

134: pixel electrode 135: common electrode

140: light blocking layer 141: drain electrode

200: polarizing film 300: sealant

400: liquid crystal layer

Claims (10)

A thin film transistor disposed on an inner surface of the substrate; A color filter layer disposed on the thin film transistor; A pixel electrode disposed on the color filter layer; A common electrode disposed on the color filter layer to form a transverse electric field with the pixel electrode; A polarizing film spaced apart from the substrate and bonded by a sealant; And And a liquid crystal layer interposed between the substrate and the polarizing film. The method of claim 1, The polarizing film is A base film having a supporting force for maintaining a constant distance from the substrate; An antiglare layer disposed on an outer surface of the base film; An adhesive layer disposed on an inner surface of the base film; A polarizing layer disposed on the adhesive layer and supported by the base film and having the polarization axis; A support layer disposed on the polarization layer to support the polarization layer; And And an alignment layer disposed on the support layer for initial alignment of the liquid crystal. The method of claim 2, The polarizing film further comprises an additional support layer between the base film and the polarizing layer. The method of claim 1, The polarizing film, A base film having a supporting force for maintaining a constant distance from the substrate; A polarizing layer disposed on the base film and supported by the base film and having the polarization axis; An adhesive layer disposed on the polarizing layer; A compensation layer disposed on the adhesive layer and compensating for light through retardation of the light; And And an alignment layer disposed on the compensation layer. The method of claim 4, wherein The liquid crystal display device further comprises a protective layer between the polarizing layer and the adhesive layer. The method of claim 1, A color filter protective layer interposed between the color filter layer and the common electrode; And And a light blocking layer disposed on the color filter protective layer and disposed along the periphery of the pixel. The method of claim 6, And a spacer disposed on the light blocking layer and supporting the polarizing film to maintain a gap between the substrate and the polarizing film. The method of claim 6, The light blocking layer includes a first conductive pattern made of the same material as the common electrode and a second conductive pattern disposed on the color filter protective layer and laminated with the first conductive pattern to block light. Device. Forming a thin film transistor on the substrate; Forming a color filter layer on the thin film transistor; Forming a pixel electrode on the color filter layer, the pixel electrode electrically connected to the thin film transistor, and a common electrode for forming a transverse electric field with the pixel electrode; Forming a liquid crystal layer on the substrate including the pixel electrode and the common electrode; And And bonding the polarizing film to the substrate by a sealant with the liquid crystal layer interposed therebetween. The method of claim 9, Forming the pixel electrode and the common electrode Sequentially forming first and second conductive layers on the color filter layer; The first and second conductive layers are etched, and are disposed in the periphery of the pixel, and a preliminary common layer is disposed in the pixel and the light blocking layer is formed of the first and second conductive patterns. Forming an electrode and a preliminary pixel electrode; And And removing the second conductive patterns of the preliminary common electrode and the preliminary pixel electrode to form a common electrode and a pixel electrode.

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