KR20090128267A - A system for testing electronic parts - Google Patents

Abstract

PURPOSE: An electronic component test system is provided to exchange only a sub-system having necessity for replacement by individually operating a loading task, a testing task and an unloading task of electronic components. CONSTITUTION: A loading system(C1) includes a loading device for receiving electronic components to be tested at a test tray. A test system(C2) tests the electronic components trasferred from the loading system. An unloading system(C3) includes an unloading device for unloading a tested electronic components in accordance with a test result. The loading system, the test system and the unloading system are arranged to be separated from one another. A reloading system(C4) is provided with a fault test tray from the loading system.

Description

Electronic component test system {A system for testing electronic parts}

The present invention relates to an electronic component test system, and more particularly, to an electronic component test system for testing electronic components such as a bare die and a semiconductor package.

In general, an electronic component refers to a bare die and a semiconductor package module in which the bare die is subjected to a packaging step. These electronic components are shipped after various tests after production.

The test is usually done through a test handler. The test handler may include a loading unit configured to move the electronic component to be tested from the customer tray to the test tray, and a testing unit coupled to external test equipment such as a high fix board to test the electronic components stored in the test tray socket. And an unloading part configured to move and receive the tested electronic component from the test tray to the unloading tray.

The loading unit includes a loading stacker accommodating customer trays containing electronic components, and an electronic component picker for transferring the electronic components from the customer tray accommodated in the loading stacker to the test tray. In addition, the unloading unit includes an electronic component picker for transferring the electronic component from the test tray to the unloading tray.

The loading unit, the testing unit, and the unloading unit are combined with each other to form a test handler integrally. In the electronic component test process in the test handler, a loading tray is first stacked on a loading stacker, and the loading stacker is mounted on the loading unit. Then, the first electronic component picker picks up the electronic component from the loading tray and stores it in the test tray. After that, the test tray is transferred to the testing unit and the electronic component is tested by the external test equipment. After the electronic component is tested, the test tray is transferred to the unloading unit, and the tested electronic component is picked up by the second electronic component picker and stored in the unloading tray or the sorting tray.

In this case, the loading tray, the unloading tray and the sorting tray are usually used as customer trays.

 However, since the loading operation, the testing operation, and the unloading operation are performed in one system in one test handler, when an error occurs in any one of the loading unit, the unloading unit, and the testing unit, Work must be interrupted. Accordingly, there is a problem that the test time of the electronic component is increased.

In addition, if it is necessary to replace the part where the error occurs, the entire handler should be replaced.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and to provide an electronic component test system in which an electronic component loading operation, a testing operation, and an unloading operation are performed by separate systems.

An electronic component test system according to an embodiment of the present invention for achieving the above object is a loading system having a loading device for accommodating the electronic components to be tested in a test tray, and stored in a test tray conveyed from the loading system And an unloading system having a test system for allowing an electronic component to be tested by a test equipment, and an unloading device for unloading the tested electronic component according to a test result, wherein the loading system and the test system , And the unloading system are arranged separately from each other.

In this case, between the loading device and the testing device, a first tray silo that sequentially receives test trays containing the test electronic part, and between the testing device and the unloading device, the tested electronic part It is preferable to further include a second tray silo for accommodating the test trays accommodated therein.

In this case, when the test tray storing the electronic component by the loading device is defective, the test tray may further include a reloading system to which the test tray is transferred. The reloading system may pick up the electronic component and store it in a separate test tray. A reloading device can be provided.

The test system may further include a testing device, wherein the testing device receives a test tray sequentially from the loading system, and supplies a preheating chamber in which the internal temperature can be controlled to a set temperature, and a test tray from the preheating chamber. And a test chamber in which the electronic components contained in the test tray are tested in combination with an external test equipment or by itself, and the test chamber is supplied from the test chamber, and the defrost chamber can be controlled at a set temperature. It can be provided.

On the other hand, the electronic component is a bare die, the loading device loads the bare die to be tested from the wafer frame to the test tray, and the unloading device picks up the tested bare die to the top surface of the empty wafer frame. It is preferable to receive.

According to the invention, the loading system, unloading system and test system are arranged separately and operated individually. As a result, work is suspended only in the subsystem where the error occurred, and the remaining subsystems can continue to work.

In addition, since only the subsystem requiring replacement needs to be replaced, the replacement does not need to be interrupted in other subsystems. As a result, the overall work time can be reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating an electronic component test system according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the electronic component test system includes a system for loading C1, a system for testing C2, and a system for unloading C3. do.

The loading system C1 has a loading device 10 to receive the electronic component E to be tested in the test tray 52. The test tray 52a in which the electronic components are stored is transferred to the test system C2 immediately or at a test required time. In addition, the test tray 52a containing the electronic components to be tested by the loading device may be individually transferred to the test system C2, and a plurality of the test trays 52a may be simultaneously transferred to the test system C2.

The test system C2 has a testing device 20. The testing device 20 is connected to the external test equipment 100 or the built-in test equipment, and allows the electronic component stored in the test tray to be tested by the test equipment.

The unloading system C3 has an unloading device 30. The unloading device 30 picks up the tested electronic component from the test tray 52d and stores it in the unloading tray 92. In this case, the unloading device 30 may further have a function of accommodating each sorting tray 94 according to a test result of the electronic component.

Meanwhile, the present invention may further include a reloading system C4. The reloading system C4 is a place where the test tray 52b which is defective in the loading system C1 is transferred, and has a reloading device 40. The failure of the test tray 52b means that the electronic components stored in the test tray are not normally stored in the correct storage position of the test tray, or the number of the electronic components stored therein differs from the set number. It means you can't take the test.

The reloading device 40 houses the electronic components back in the test tray 52c so that the good test tray 52c is transferred to the test system.

In this case, a first tray silo 62 may be interposed between the loading system C1 and the test system C2. The first tray silo 62 may in turn receive the transferred test trays 52a, 52c from the loading system C1 or the reloading system C4. Test trays accommodated in the first tray silo may be transferred to the testing apparatus 20.

In this case, the silos that carry the test trays from the reloading system C4 may be configured separately from the silos that carry the test trays from the loading system C1.

In addition, a second tray silo 82 may be interposed between the test system C2 and the unloading system C3. The second tray silo 82 may in turn receive the transferred test trays 52d from the test system C2. Test trays stored in the second tray silo may be transferred to the unloading device 30.

According to the invention, the loading system, unloading system and test system are arranged separately and operated individually. As a result, work is suspended only in the subsystem where the error occurred, and the remaining subsystems can continue to work.

In addition, since only the subsystem requiring replacement needs to be replaced, the replacement does not need to be interrupted in other subsystems. As a result, the overall work time can be reduced.

Hereinafter, a loading system, a test system, an unloading system and a reloading system will be described in detail.

FIG. 2 is a conceptual diagram of the electronic component test system of FIG. 1, and FIG. 3 schematically illustrates an example of the loading device 10 in the electronic component test system.

As shown in FIGS. 2 and 3, the loading system C1 has a loading device 10. The loading device 10 accommodates the electronic components E to be tested in the test tray 52, an electronic component supply unit 16 for supplying the electronic components, and a tray supply unit 18 for supplying an empty test tray. And an electronic component picker 14 which picks up the electronic component E from the electronic component supply unit 16 and stores it in the test tray.

The tray supply unit 18 supplies an empty test tray 52 '. The tray supply unit 18 may accommodate a plurality of empty test trays 52 '. The empty test tray 52 ′ may in turn be transferred from the tray supply unit 18 to the first tray outlet 19. The electronic component picker 14 picks up at least one electronic component E from the electronic component supply unit 16 and stores it in the test tray 52 ′. When the electronic component is accommodated in the test tray 52 ′, the test tray 52 ′ may be located at the tray supply unit 19 or the first tray outlet 19.

When all the electronic components are stored in the test tray 52, the test tray 52 is immediately moved to the test system C2, or, if necessary, a plurality of test trays are stored at a time after a certain number of test trays are stored. May be moved to (C2).

The electronic component E may be a bare die. In this case, the bare die E may be supplied to the electronic component supply unit while being disposed on the upper surface of the wafer frame. The electronic component E may be a semiconductor package module. In the case of the semiconductor package module, the electronic component may be supplied as received in a customer tray.

Referring to FIG. 3, the loading device 10 includes a stage 11, an electronic component supply unit 16, X, Y gantry 12, 13, at least one electronic component picker 14, The first tray outlet 19 may be provided.

The stage 11 is equipped with a Y gantry 12 and an X gantry 13 mounted to the Y gantry so as to be movable in the Y axis. At least one electronic component picker 14 is mounted on the X gantry 13 so as to be movable at least in the X axis direction.

The electronic component supply part 16 supplies the customer tray which accommodated the electronic component E, or a wafer frame.

 The test tray containing the electronic components is transferred from the first tray outlet 19 to the test system C2.

The first tray outlet 19 may be configured to hold a plurality of test trays 52. As described above, the electronic tray may be accommodated in the test tray at the first tray outlet 19, and in this case, the test tray in which the electronic component is completed is sequentially placed in the first tray outlet 19. A lifting means for raising and / or lowering and a storage unit (not shown) for sequentially loading and storing the test trays may be further provided. Accordingly, in the first tray outlet 19, the test tray containing the electronic component can be immediately lowered in turn, and thus, before the test tray containing the electronic component is transferred to the test system C2. Even if it is possible, the operation which accommodates an electronic component in another test tray can be performed. Therefore, the operation of the loading apparatus 10 may not be stopped until the test tray containing the electronic components is transferred to the test system C2.

A buffer tray 15 may be disposed between the electronic component supply unit 16 and the first tray outlet unit 19. In this case, the electronic component picker 14 includes a first electronic component picker 14a that reciprocates between the electronic component supply unit 16 and the buffer tray 15, the buffer tray 15, and the first tray outlet unit ( 19) and a second electronic component picker 14b for reciprocating therebetween.

Accordingly, when the wafer frame or the customer tray is placed in the electronic component supply unit 16, the first electronic component picker 14a picks up the electronic components from the wafer frame or the customer tray and stores the electronic components in the buffer tray 15. After that, the first electronic component picker 14a returns to the electronic component supply unit 16 to pick up the next electronic component. Meanwhile, the electronic components stored in the buffer tray 15 are picked up by the second electronic component picker 14b and stored in the test tray 52 of the first tray outlet 19.

4 is a conceptual diagram particularly conceptually showing the configuration of the test system C2. As shown in FIG. 4, the test system C2 includes a testing apparatus 20. The testing device 20 is coupled to the test tray 52 transferred from the loading system C1 (see FIG. 1) on its own or with external test equipment 100, to store the electronics stored in the test tray 52. Allow the part to be tested.

Meanwhile, the present invention further includes a first tray silo 62, and the testing apparatus 20 receives the tray inlet 21 from which the test tray 52 is supplied from the first tray silo 62. ) May be provided. The first tray silo 62 sequentially receives the test trays 52 containing electronic components from the loading system C1 or the reloading system C4, and then the test tray through the tray inlet 21. 52 is supplied to the testing apparatus.

The first tray silo 62 may be detachably coupled to the loading device 10 and the testing device 20, respectively.

The first tray silo 62 may be detachably coupled to the loading device 10 or the testing device 20 by a worker.

The first tray silo 62 may be connected in-line to the loading device 10 and the testing device 20. Accordingly, when the predetermined number of test trays 52 are transferred from the loading device 10, the first tray silo 62 is automatically separated from the loading device 10 to be coupled to the testing device 20. Can be. When the test trays 52 stored in the first tray silo 62 are all transferred to the testing apparatus 20 and are empty, the first tray silo 62 is automatically separated from the testing apparatus 20 and then loaded into the loading apparatus 10. Can be combined.

The loading system C1 and the test system C2 are disposed separately, and the test tray 52 is transferred from the loading system C1 to the test system C2 through the first tray silo 62. The electronic component test system may include the loading system C1 and the test system C2 in different numbers. For example, if the time for testing the electronic component in the test system C2 takes longer than the time for storing the electronic component in the test tray in the loading system C1, the electronic component test system is more than the loading system C1. By including a number of test systems (C2), a plurality of test systems (C2) can be arranged to correspond to the one loading system (C1). Alternatively, if the time for testing the electronic component in the test system C2 takes less than the time for storing the electronic component in the test tray in the loading system C1, the electronic component test system is more than the test system C2. The number of loading systems C1 may be included so that a plurality of loading systems C1 may correspond to one test system C2.

That is, the time required for the loading operation and the time required for the test operation may be changed by various factors such as the characteristics of the electronic component, and the electronic component test system according to the present invention can cope with this flexibly.

On the other hand, the first tray silo 62 may be stored by loading the test trays, it may be further provided with a lifting means (not shown).

Accordingly, when a test tray is supplied from the first tray outlet 19 to the first tray silo 62, the lifting means sequentially raises the test tray in the first tray silo 62 to test a plurality of tests. The tray may be stored, and the test tray may be lowered in order to transfer the tray to the tray supply part 21 of the testing apparatus 20.

In addition, the lifting means may lower the test tray in the first tray silo 62 in order to store a plurality of test trays, and transfer the stored test trays to the testing apparatus 20 while raising the stored test trays in sequence.

In addition, when the test tray 52 is supplied from the first tray outlet 19 to the first tray silo 62, the lifting means lowers the test tray in the first tray silo 62 in turn. A plurality of test trays may be stored and transferred to the testing apparatus 20 sequentially from the lowermost or uppermost test tray.

The first tray silo 62 may also function as a preheating chamber 22 of the testing apparatus 20 to be described later. In this case, the first tray silo 62 may heat or cool the electronic component accommodated in the test tray 52 to a first temperature therein. The first temperature may be a temperature range that the electronic component should have when the electronic component is tested by the test equipment. The first temperature may vary depending on the type of electronic component, a quality standard desired by a user, and the like.

In addition, the present invention may further include a second tray silo 82, and the testing apparatus 20 may include a second tray outlet 29 to which the second tray silo is mounted or adjacent to the second tray silo 82. have. The second tray silo 82 accommodates the test trays 52 in which the tested electronic components are accommodated. Therefore, the test tray 52 containing the tested electronic component is transferred from the testing apparatus to the second tray silo 82 through the second tray outlet 29.

 The second tray silo 82 may be detachably coupled to the testing device 20 and the unloading device 30, respectively.

In this case, the second tray silo 82 may be detachably coupled to the testing device 20 or the unloading device 30 by a worker.

The second tray silo 82 may be connected in-line to the testing device 20 and the unloading device 30. Accordingly, when the predetermined number of test trays 52 are transferred from the testing apparatus 20, the second tray silo 82 is automatically separated from the testing apparatus 20 and coupled to the unloading apparatus 30. Can be. The second tray silo 82 is automatically separated from the unloading device 30 when all the test trays 52 stored therein are transferred to the unloading device 30 and are emptied. ) May be combined.

The unloading system C3 and the test system C2 are disposed separately, and the test tray 52 is transferred from the test system C2 to the unloading system C3 through the second tray silo 82. Since the electronic component test system is transferred, the test system C2 and the unloading system C3 may include different numbers. For example, if the time for testing the electronic component in the test system C2 takes longer than the time for unloading the electronic component in the unloading system C1, the electronic component test system is more than the unloading system C3. By including a number of test systems (C2), a plurality of test systems (C2) can be arranged to correspond to the one unloading system (C3). Alternatively, if the time for testing the electronic component in the test system C2 is less than the time for unloading in the unloading system C3, the electronic component test system has a larger number of unloading than the test system C2. By including the systems C3, the plurality of unloading systems C3 may correspond to one test system C2.

That is, the time taken for the unloading operation and the time taken for the test operation may be changed by various factors such as the characteristics of the electronic component, and the electronic component test system according to the present invention can cope with this flexibly.

On the other hand, the second tray silo 82 may store and store test trays as the first tray silo 62, and may further include lifting means (not shown).

Therefore, when a test tray is supplied from the second tray outlet 29 to the second tray silo 82, the lifting means sequentially raises the test tray in the second tray silo 82, thereby providing a plurality of test trays. The test tray may be stored, and the test tray may be lowered in order to be transferred to the unloading device 30.

In addition, the elevating means may lower the test tray in the second tray silo 82 in order to store a plurality of test trays, and transfer the stored test trays to the unloading device 30 while raising the stored test trays in sequence. .

In addition, when a test tray is supplied from the second tray outlet 29 to the second tray silo 82, the lifting means lowers the test tray in the second tray silo 82 in turn to test a plurality of tests. The tray may be stored and transferred to the unloading device 30 in order from the lowermost or uppermost test tray.

The second tray silo 82 may also function as a defrost chamber 28 of the testing apparatus 20 to be described later. In this case, the second tray silo 82 may heat or cool the electronic component accommodated in the test tray 52 at a second temperature therein. The second temperature may be a temperature range including a temperature at or near room temperature.

The testing apparatus 20 has a test chamber 25. In addition, as illustrated in FIG. 4, the testing apparatus 20 may include a testing apparatus, a preheating chamber 22, and a defrost chamber 28 together with the test chamber 25.

Hereinafter, for convenience of description, a case in which the testing apparatus 20 includes the preheating chamber 22 and the defrost chamber 28 will be described as an example. However, as described above, the first tray silo functions as a preheating chamber. The testing apparatus 20 may not have the preheating chamber 22, and if the second tray silo also functions as the defrost chamber, the testing apparatus 20 does not have the defrost chamber 28. You may not.

The preheating chamber 22 may heat or cool the electronic component accommodated in the test tray 52 to a first temperature therein. The first temperature may be a temperature range that the electronic component should have when the electronic component is tested by the test equipment. The first temperature may vary depending on the type of electronic component, a quality standard desired by a user, and the like.

The preheating chamber 22 may include a first transfer device (not shown) that sequentially receives the test tray 52 from the first tray silo 62 and transfers the test tray 52 to the test chamber 25.

When the test tray is transferred to the preheating chamber 22, the first transfer device may transfer the test tray to the test chamber 25 by raising or lowering the test tray in sequence.

The test chamber 25 is sequentially supplied with a test tray 52 from the preheating chamber 22. Test equipment for testing electronic components may be installed inside or outside the test chamber 25. The electronic component stored in the test tray 52 in the test chamber 25 is connected to test equipment (for example, high fix board) 100. In this case, the test tray 52 is preferably arranged such that the electronic component housed therein is smoothly connected to the test equipment 100. To this end, the testing apparatus 20 includes the support plate 26 supporting the test tray in the test chamber 25 and the support plate 26 by moving the support plate 26 back and forth or up and down so that the electronic component is connected to the test equipment. A driving unit 27 for transferring the test tray to a position connected to the 100 may be further provided. The drive unit 27 may include a motor, and may include a rack pinion gear or a pulley and a belt to transfer the driving force of the motor to the support plate 26.

The defrost chamber 28 receives a test tray 52 containing the tested electronic components from the test chamber 25. The defrost chamber 28 may heat or cool the electronic component accommodated in the test tray 52 to a second temperature therein. The second temperature may be a temperature range including a temperature at or near room temperature.

The defrost chamber 28 is a second transfer device (not shown) which sequentially transfers the test tray containing the tested electronic component to the second tray silo 82 through the second tray outlet 29. ) May be provided.

When the test tray is transferred to the defrost chamber 28, the second transfer apparatus may transfer the test tray to the unloading apparatus by sequentially raising or lowering the test tray.

Meanwhile, as shown in FIG. 5, the unloading system may include an unloading device 30. The unloading device 30 accommodates the electronic component in the unloading tray 92 or the wafer frame 93 (see FIG. 2) according to the test result.

As shown in FIG. 5, as an example of the unloading apparatus 30, the stage 31, the tray loading unit 36, the unloading electronic component picker 34, and the unloading unit 37 are provided. It may be provided.

The stage 31 is equipped with a Y gantry 32 and an X gantry 33 mounted to the Y gantry 32 so as to be movable in the Y axis direction. The tray loading unit 36 is supplied with a test tray 52 containing the tested electronic components. In this case, the test tray 52 may be sequentially supplied to the tray loading unit 36 from the second tray silo 82.

The unloading electronic component picker 34 is mounted on the X gantry 33 so as to be movable at least in the X-axis direction.

The unloading unit 37 may include an unloading tray 92 in which good electronic components are stored. Accordingly, when the tested test tray 52 is placed in the tray loading unit 36, the unloading electronic component picker 34 picks up good quality electronic components from the test tray and stores them in the unloading tray 92. Let's do it.

On the other hand, when the unloading device 30 needs to sort the electronic parts by grades according to the test results, the unloading device 30 stores the electronic parts in the unloading tray 92 or in a separate sorting tray 94. You can also

Meanwhile, the electronic component may be a bare die, and a wafer frame 93 (see FIG. 2) may be disposed on the unloading unit instead of the unloading tray.

Meanwhile, as shown in FIG. 1, the present invention may further include a reloading system C4. When the test tray 52b in which the electronic component is stored by the loading device 10 is defective, the test tray 52b is transferred to the reloading system C4.

The reloading system C4 has a reloading device 40. When the defective test tray is moved to the reloading system C4, the reloading device 40 may pick up an electronic component stored in the defective test tray 52b and store the electronic component in a separate test tray 52c. have. When all the electronic components are accommodated in the test tray 52c, the electronic device may be immediately moved to the test system C2 or may be moved to the test system C2 at a necessary time after storage.

According to the present invention, a loading system for loading an electronic component into a test tray, a test system for testing an electronic component, and an unloading system for unloading a tested electronic component may be separated from each other and operate independently.

Therefore, it is possible to simultaneously perform loading operations in a plurality of loading systems of electronic components, simultaneously perform test operations in a plurality of test systems, or simultaneously perform unloading operations in a plurality of unloading systems. You can do the work of. In addition, the loading operation in the loading system, the test operation in the test system, and the unloading operation in the unloading system are performed separately, thereby increasing the overall work speed.

1 is a block diagram illustrating an electronic component test system according to an exemplary embodiment of the present invention.

FIG. 2 is a conceptual diagram schematically illustrating an example of the electronic component test system of FIG. 1.

3 is a configuration diagram illustrating a loading apparatus in FIG. 1.

4 is a configuration diagram illustrating the testing apparatus in FIG. 1.

FIG. 5 is a diagram illustrating the unloading apparatus of FIG. 1.

 <Brief description of the major symbols in the drawings>

10: loading device 14, 34: electronic component picker

20: testing apparatus 22: preheating chamber

25: test chamber 28: defrost chamber

30: unloading device 40: reloading device

52: test tray 62: first tray silo

82: second tray silo 100: test equipment

C1: Loading System C2: Test System

C3: Unloading System C4: Reloading System

E: Electronic Component

Claims (5)

A loading system having a loading device for storing the electronic components to be tested in a test tray; A test system for causing electronic components stored in a test tray transferred from the loading system to be tested by test equipment; And An unloading system including an unloading device for unloading the tested electronic component according to a test result; And And the loading system, the test system, and the unloading system are arranged separately from each other. The method of claim 1, A first tray silo for receiving test trays containing electronic components to be tested transferred from the loading device and transferring the test trays to the test system; And a second tray silo for receiving test trays containing the tested electronic components transferred from the test system and transferring the test trays to the unloading device. The method of claim 1, And a reloading system for receiving a defective test tray from the loading system. The reloading system includes a reloading device for picking up an electronic component stored in a defective test tray and storing the electronic component in another test tray. The method of claim 1, The test system further includes a testing device: The testing device, A preheating chamber which receives a test tray from the loading system and whose interior is controlled at a set temperature; A test chamber supplied with the test tray from the preheating chamber and configured to test the electronic components stored in the test tray by a test equipment; A defrost chamber configured to receive the tested test tray from the test chamber and control an internal temperature at a set temperature; Electronic component test system comprising a. The method of claim 1, The electronic component is a bare die, The loading device loads the bare die to be tested from the wafer frame to the test tray, And said unloading device unloads the tested bare die from the test tray to the wafer frame.

Images