KR20090112785A - Led light emitting element squipped device - Google Patents

Abstract

PURPOSE: A lighting apparatus with an LED is provided to maintain high optical power by emitting heat through over a heat sink cover and keeping a certain temperature. CONSTITUTION: A lighting apparatus with an LED is composed of a base(9), a metal core substrate(8), a heat sink cover(6), a reflector(5), a glass(15), and a cap(2). A screw is formed on the circumference of the base and a base packing is formed at the lower part of the base so that an upper part of the base is inserted into the bottom of the heat sink. A plurality of light emitting diode chips are arranged on top of the base. The heat sink cover pressures the edge of a metal core substrate and fixes it by a protrusion formed on an internal side.

Description

Light emitting diode squipped device

The present invention relates to a light emitting diode light emitting device, which will be described in more detail by mounting a light emitting diode on a printed circuit board, thereby improving the light output efficiency of the light emitting diode and packaging the number of light emitting devices according to a luminaire. It relates to a light emitting diode light emitting device that can be used in combination.

Generally, various kinds of light fixtures are used as light sources such as incandescent lamps, high pressure mercury lamps, fluorescent lamps, sodium lamps, etc., but there is a problem of high energy consumption and short lifespan.

Therefore, in recent years, in order to solve the above problems, light emitting diodes are being used as a light source of a luminaire.

The light emitting diode is called an LED (Light Emitting Diode), which is a light emitting device used to send and receive signals by converting an electric signal into a form of infrared rays, visible rays, or light using characteristics of a compound semiconductor.

In recent years, the present invention has been widely used for display devices of various mechanical devices, lightings used in exteriors of automobiles, internal devices, electronic displays, and the like.

The light emitting device typically includes a light emitting diode chip mounting portion formed on a PCB substrate from an upper surface thereof, a reflective film formed obliquely around the light emitting diode chip mounting portion, a light emitting diode chip mounted on the light emitting diode chip mounting portion, and a light emitting diode chip; The upper portion of the reflective film is provided with a lens to irradiate the light source emitted.

However, the light emitting device having the structure as described above generates high heat in the light emitting diode when the current is increased in order to obtain high output light, and the light emitting device has a very low resistance when the temperature is increased by heat. This has a problem of deterioration.

In addition, the conventional light emitting device has a disadvantage that the heat generated from the light emitting diode is not easily transferred to the outside.

In order to solve the above problems, the metal core substrate is used to form excellent thermal and electrical conductivity, and then the direct light emitting diode is mounted to maximize the conduction of heat generation due to high power to the entire heat sink to improve luminous efficiency. Provided is a light emitting diode light emitting device.

To this end, only a portion of the metal core substrate on which the light emitting diode is mounted forms an insulating layer, and other than that, the metal portion is exposed as it is, so that heat conduction is quickly performed.

In addition, the entire heat sink is coupled without bolting, and the entire heat sink is used as a heat sink.

As described above, in the present invention, even when the light emitting device increases the light output of the light emitting diode, the light emitting device receives heat generated by the heat sink cover and evenly distributes the heat sink cover to the entire heat sink cover to maintain a constant temperature by dissipating the air easily. It is effective to maintain a high light output.

Therefore, the present invention has the effect of maximizing the light output by installing the light emitting device in the form of a package according to the luminaire.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a light emitting device of the present invention, Figure 2 is a combined perspective view showing a light emitting device of the present invention, Figure 4 is a cross-sectional view showing a light emitting device of the present invention.

According to the present invention, the light emitting device 1 having the light emitting diode chip 7 as a light source includes a metal core substrate 8, a reflector 5, a glass 15, and a cap 2 on the upper portion of the base 9 to increase heat dissipation. ) Is a structure that is tightened and tightened sequentially.

Accordingly, the base 9 of the light emitting element 1 has a cylindrical shape in the shape of a plate, and a center thereof protrudes, and a screw 4 is formed at the periphery of the heat sink cover 6 to be tightly coupled to the heat sink cover. Insertion grooves 18 are formed at the lower edges of the base packing 10 so as to close the gap during the fastening coupling with (6).

In addition, the base 9 is formed with a groove through which upper and lower holes are inserted to supply power to the metal core substrate 8 positioned at an upper portion thereof to insert an electric wire.

A plurality of light emitting diode chips 7 are bonded to each other in the metal core substrate 8 positioned on the upper surface of the base 9 to be connected to the wires through the base 9.

In addition, the heat sink cover 6 located on the upper surface of the base 9 is tubular in shape and has a screw 4 formed at a predetermined height so that the upper part of the base 9 is inserted and fastened to the lower inner circumferential surface, and the screw ( The upper end of 4) is formed with a vertical step 17 for fixing the metal core substrate (8).

In addition, a screw 4 is formed around the upper outer circumferential surface of the heat sink cover 6 so as to be tightened with the cap 2.

Therefore, the heat sink cover 6 is a process of tightening the vertical step 17 formed on the inner circumferential surface of the heat sink cover 6 by tightening and coupling the base 9 on which the metal core board 8 is located on the upper surface with the screw 4. When the metal core substrate 8 is pressed and fixed at a high temperature, the high temperature generated by the output of the light emitting diode chip 7 is conducted through the metal core substrate 8 to radiate heat inside to lower the temperature.

The reflector 5 inserted into the heat sink cover 6 has a narrow lower portion and a wider upper portion is inserted into a funnel shape. The lower portion surrounds the circumference of the light emitting diode chip 7 to reflect light emitted from the glass 15. do.

It is preferable to use the glass 15, and can be used in place of the convex lens 14 or the PC plate.

Therefore, the reflector 5 has a funnel shape, and a narrow lower part is in close contact with the light emitting diode chip 7 to reflect light through the wide upper part to the glass 15.

In addition, the glass 15 is weak in durability due to the material has a high risk of breakage during the tightening process, the cap packing (3) is wrapped around the edge to protect and seal it.

In addition, the cap 2 with the screw 4 formed therein is tightened and fastened to the screw 4 formed in the upper portion of the heat sink cover 6 to press-fix the cap packing 3.

Accordingly, the glass with the reflector 5 and the cap packing 3 inserted therein is fastened and fastened with the lower portion of the heat sink cover 6 while the metal core substrate 8 is positioned on the upper surface of the base 9. 15 is positioned so that the cap 2 and the upper portion of the heat sink cover 6 are tightened.

Figure 3 is an exploded perspective view showing a metal core substrate in the light emitting device of the present invention.

The metal core substrate 8 is located on the upper surface of the base 9 is located an aluminum plate 11 that conducts heat to the heat sink cover 6.

A pair of insulating layers are stacked on the upper surface of the aluminum plate 11 so that only the light emitting diode chip 7 bonded to the PCB pattern 16 is exposed to the upper side except the edge of the edge. 13, 13 ′, and a base ring 12 positioned on upper surfaces of the insulating layers 13 and 13 ′ to conduct heat by a vertical step 17 which is pressed against and fixed to an edge of the insulating layer 13 ′. It is composed of

Therefore, the heat sink cover 6 can maintain the proper temperature by conducting heat generated from the light emitting diode chip 7 by the aluminum plate 11 and the base ring 12 and evenly dispersing the heat sink.

The aluminum plate 11 has a PCB pattern to bond the light emitting diode chip 7 therein to an upper surface of the aluminum plate 11 made of aluminum having excellent thermal conductivity so as to conduct heat to the heat sink cover 6. A pair of insulating layers 13 and 13 'stacked up and down with 16) in between is placed to protect the light emitting diode chip 7 from being damaged by preventing current or heat from passing through.

The insulating layer 13 disposed below the pair of insulating layers 13 and 13 ′ has a light emitting diode chip 7 in a pattern 16 having a predetermined shape so that the light emitting diode chip 7 may be arranged on an upper surface thereof. ) Is bonded and the insulating layer 13 ′ positioned at the top thereof exposes only the light emitting diode chip 7 perforated in the same manner as the pattern 16.

In addition, a heat sink in a state in which a ring-shaped base ring 12 having the same size as the insulating layers 13 and 13 ′ is positioned on the insulating layers 13 and 13 ′ so as to be fixed to the aluminum plate 11. The vertical step 17 of the cover 6 is fixed by pressing in the tightening process.

Then, the aluminum plate 11 conducts heat to the heat sink cover 6 through the base ring 12 at the same time as the remaining edge portions except for the insulating layers 13 and 13 'closely adhered to the upper surface to maximize the heat dissipation effect. Can be.

Therefore, the light emitting device 1 of the present invention distributes heat generated when the light emitting diode chip 7 outputs light to the entire heat sink cover 6 so that heat radiation to the air can be easily performed.

FIG. 5 is a cross-sectional view showing a cross-sectional view showing another embodiment of the light emitting device of the present invention. By using the convex lens 14 instead of glass, the light reflected by the reflector 5 is focused to provide brighter light to the outside. It is a structure that can be investigated.

1 is an exploded perspective view showing a light emitting device of the present invention.

Figure 2 is a perspective view showing a combination of the light emitting device of the present invention.

Figure 3 is an exploded perspective view showing a metal core substrate in the light emitting device of the present invention.

Figure 4 is a cross-sectional view showing a light emitting device of the present invention.

Figure 5 is a cross-sectional view showing another embodiment of the light emitting device of the present invention.

Explanation of symbols on the main parts of the drawings

1: light emitting element 2: cap

3: cap packing 4: screw

5: reflector 6: heatsink cover

7: light emitting diode chip 8: metal core substrate (MCPCB)

9: base 10: base packing

11: aluminum plate 12: base ring

13 and 13 ': upper and lower insulating layers 14: convex lens

15: glass 16: pattern

17: Vertical step 18: Insertion groove

Claims (3)

In the light emitting element 1 whose light emitting diode is a light source, A base (9) having a screw (4) formed therein and a base packing (10) fitted therein so that an upper portion is inserted into the lower portion of the heat sink cover (6) and tightened thereon; A metal core substrate 8 having a plurality of light emitting diode chips 7 arranged on an upper surface of the base 9; A screw 4 is formed on the inner circumferential surface in the lower direction so as to be tightly coupled to the upper portion of the base 9, and a screw 4 is formed on the outer circumferential surface to fix the cap 2 on the upper portion, and the base is inserted into the lower portion ( 9) the heat sink cover 8 which presses and fixes the upper edge of the upper surface of the metal core substrate 8 by the vertical step 17 formed on the inner circumferential surface when tightened with the 9); A lower portion inserted into the heat sink cover 8 includes a funnel-shaped reflector 5 which surrounds the circumference of the light emitting diode chip 7 and reflects light emitted to the glass 15; On the upper surface of the reflector 5 and the glass 15 with the cap packing 3 fitted to the edge to prevent breakage: A light emitting diode light emitting device, characterized in that the cap (2) is wrapped around the upper surface to fix the glass (15) and the cap is tightly coupled to the upper outer peripheral surface of the heat sink cover (6). In the light emitting element 1 whose light emitting diode is a light source, The metal core substrate 8 includes an aluminum plate 11 positioned on an upper surface of the base 9 to conduct heat to the heat sink cover 6; The aluminum plate 11 has a pair of insulating layers stacked on top and bottom so that only the light emitting diode chip 7 bonded to the PCB pattern 16 located inside the aluminum plate 11 is exposed to the top except for an edge. 13, 13 ') light emitting diode light emitting device comprising: a. The light emitting diode light emitting device according to claim 1, wherein a convex lens (14) or a PC (Polyvinylchlorid) plate is used in place of the glass (15).

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