KR20090103820A - Resin composition for printed wiring board, dry film and printed wiring board - Google Patents

Abstract

PURPOSE: A resin composition for a printed wiring board is provided to ensure excellent insulating property, heat resistance, and light transmittance while considering environment, and to suppress pattern defects. CONSTITUTION: A resin composition for a printed wiring board includes recycled polyethylene terephthalate, thermosetting resins, and photosensitive resin. The resin composition for a printed wiring board is prepared by mixing recycled polyethylene terephthalate micropowder of the average particle diameter 0.1 ~ 15 μm. The recycled polyethylene terephthalate is 0.1 ~ 75% of the total amount. A dry film has a coating dry film of a resin composition for a printed circuit board.

Description

RESIN COMPOSITION FOR PRINTED WIRING BOARD, DRY FILM AND PRINTED WIRING BOARD

This invention relates to the resin composition for printed wiring boards which considers an environment, and is excellent in insulation and heat resistance, and the dry film and printed wiring board using the same.

In recent years, from the viewpoint of environmental issues, the use of environmentally friendly materials has also been required for printed wiring boards used in electronic devices. For example, due to the social problem of the generation of harmful gases such as dioxins during incineration, the transition from non-halogen-based systems containing halogen such as bromine is required for flame retardant materials and coloring materials used in prepregs, solder resist films and the like. have.

For example, various studies have been conducted on the non-halogenation of the flame retardant material of the composition for printed wiring boards (for example, see Patent Document 1). However, the growing interest in environmental issues has sought further environmental considerations.

 On the other hand, since printed wiring boards are used for electronic devices, insulation is required. In addition, since electronic components are attached to the interlayer resin insulating layer of the printed wiring board at a high temperature, heat resistance is required.

Moreover, in recent years, the photolithographic method is used for pattern formation with the refinement | miniaturization of the pattern of the soldering resist film formed in the outermost layer of a printed wiring board. At this time, since a pattern is formed by irradiating an active energy ray through a mask pattern, photocurability is calculated | required further by the resin composition for forming a soldering resist film. Therefore, in such a photosensitive resin composition, the thing of the non-halogen type which considered the environment is proposed (for example, refer patent document 2 etc.).

Thus, in the resin composition for printed wiring boards, both the consideration of environment and the improvement of the maintenance improvement of a characteristic are calculated | required.

On the other hand, PET bottles have recently increased in use due to their light weight, excellent transparency, gas barrier properties, and high strength, and their disposal methods have become a social problem. Therefore, the recycling of PET bottles has been studied in various ways (see Patent Documents 3 to 5 and the like). However, there is a problem that the molecular weight of PET decreases due to hydrolysis of ester bonds during the recycling process, and the melt viscosity and mechanical strength of PET decrease. In addition, such deterioration of quality has become a factor in the inhibition of recycling of PET bottles. Therefore, the recycled PET resin is actually used mainly in the field of textiles or industrial materials. However, as the amount of PET bottle waste is increased, a new effective utilization method of recycled PET resin is being sought.

Patent Document 1: WO02 / 006399 (claim 1, etc.)

<Patent Document 2> Japanese Patent Laid-Open No. 2000-7974 (claim 1, etc.)

<Patent Document 3> Japanese Patent Application Laid-Open No. 10-287844 (claim 1, etc.)

<Patent Document 4> Japanese Patent Application Laid-Open No. 11-114961 (claim 1, etc.)

<Patent Document 5> Japanese Patent Laid-Open No. 2000-53892 (claim 1, etc.)

As mentioned above, in the resin composition for printed wiring boards, both the consideration of environment and the improvement of the maintenance improvement of a characteristic are calculated | required.

Therefore, an object of this invention is to provide the resin composition for printed wiring boards which can improve the maintenance of a characteristic, considering environment, and the dry film and printed wiring board using the same.

In order to solve the said subject, the resin composition for printed wiring boards of one aspect of this invention contains recycled polyethylene terephthalate (A), It is characterized by the above-mentioned.

By this structure, it becomes possible to obtain the resin composition for printed wiring boards which is excellent in insulation, heat resistance, and light transmittance, and which considered environment.

Moreover, in such a resin composition for printed wiring boards, it is preferable that it is manufactured by mixing the recycled polyethylene terephthalate fine powder with an average particle diameter of 0.1-15 micrometers.

Such a structure makes it possible to obtain good smoothness and insulation of the printed wiring board and to suppress defects in the pattern when forming the pattern.

Moreover, in such a resin composition for printed wiring boards, it is preferable that the said regeneration polyethylene terephthalate (A) is 0.1 to 75% of the total amount.

By this structure, while the resin composition for printed wiring boards acquires favorable fluidity | liquidity, applicability | paintability, and moldability, it becomes possible to suppress the fragility of the hardened | cured material.

Moreover, in such a resin composition for printed wiring boards, it is preferable to contain thermosetting resin (B).

By containing a thermosetting resin (B), it can harden | cure by heating and it becomes possible to form a favorable permanent film.

And in such a resin composition for printed wiring boards, it is preferable to contain photosensitive resin (C).

Moreover, by using photosensitive resin (C), it can harden | cure by light irradiation and formation of the fine pattern by the photolithographic method becomes possible.

And the dry film of one aspect of this invention is provided with the coating dry film of the resin composition for printed wiring boards mentioned above on the base material.

By this structure, it becomes possible to obtain the dry film excellent in insulation, heat resistance, and light transmittance, and it is possible to form the resin composition layer containing regenerated polyethylene terephthalate (A) easily on a printed wiring board by transferring to a printed wiring board. Become.

And the printed wiring board of one aspect of this invention is equipped with the board | substrate with which the circuit was formed, and the permanent film formed in at least one part on this board | substrate, and hardening the resin composition for printed wiring boards mentioned above. It is characterized by the above-mentioned.

By this structure, it becomes possible to obtain the printed wiring board excellent in insulation and heat resistance.

Moreover, the printed wiring board of one aspect of this invention is equipped with the board | substrate with which the circuit was formed, and the permanent film which hardened the coating dry film of the resin composition for printed wiring boards transferred by the above-mentioned dry film to at least one part on this board | substrate. It is characterized by the above-mentioned. .

By such a structure, it becomes possible to obtain the printed wiring board which was excellent in insulation and heat resistance easily, and considered environment.

By the resin composition for printed wiring boards of this invention, the dry film using this, and a printed wiring board, maintenance of a characteristic can be improved, considering environment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

The resin composition for printed wiring boards of this embodiment contains recycled polyethylene terephthalate (A). It is characterized by the above-mentioned.

The regenerated polyethylene terephthalate (A) of the present embodiment is not particularly limited as long as it is a regenerated polyethylene terephthalate. For example, a recycled polyethylene terephthalate raw material obtained from a recycled raw material obtained by collecting, pulverizing, crushing and washing a used PET bottle, or a defective product generated in the manufacturing process of a PET bottle or PET film can be used.

In such a regenerated polyethylene terephthalate raw material, it is preferable that it is a high crystallinity resin containing an ethylene terephthalate homopolymer or a small amount of copolymers in some cases. Under the present circumstances, crystallinity can be made into 35% or more by heat processing, for example. Moreover, you may melt-mix polyester resin, a modified polyester resin, etc. Then, after grinding or slurrying of the finely divided recycled PET which has been pulverized such a recycled polyethylene terephthalate raw material by mechanical or chemical grinding, various grinding and dispersing processes using a jet mill or the like or a treatment by various classification apparatuses are performed. It is preferable to use an average particle diameter as 0.1-15 micrometers by doing so. If the average particle diameter is less than 0.1 µm, the surface energy is increased, so that aggregation is easy, and there is a fear that the smoothness and insulation of the printed wiring board cannot be sufficiently obtained by the influence of the aggregate. On the contrary, when the average particle diameter exceeds 15 µm, there is a concern that the smoothness of the printed wiring board is impaired, or a defect due to a defect in the pattern may be generated when the solder resist film is formed. More preferably, the average particle diameter is 1 to 12 µm. Here, in order to prevent it from becoming easy to aggregate by increasing said surface energy, it is also possible to handle in the slurry state previously disperse | distributed to the organic solvent. At this time, the average particle diameter can be used not only in the above-mentioned but also in a finer state.

The resin composition for printed wiring boards is formed by mixing such pulverized recycled PET with a thermosetting component, a photosensitive component, etc. At this time, it is preferable that the compounding ratio of regenerated polyethylene terephthalate (A) is 0.1 to 75 weight% of the total amount of a composition. In consideration of environmental considerations, the blending ratio is preferably as high as 1% by weight or more. On the other hand, when it exceeds 60 weight%, the hardened | cured material of an insulation composition may weaken, the fluidity | liquidity of an insulation composition may fall, and there exists a possibility that it may interfere with application | coating and shaping | molding. More preferably, it is 1-60 weight%.

The resin composition for printed wiring boards of this embodiment can contain various structural components, such as a thermosetting component and the photosensitive component, other than a regeneration polyethylene terephthalate (A). If it can use suitably for a printed wiring board, such as insulation and heat resistance, it is not limited to a specific structural component, It can select suitably.

Basically, various embodiments are contemplated which include a heat curable component or photosensitive component or both components. Generally, in the case of a thermosetting resin composition, a regeneration polyethylene terephthalate (A) and a thermosetting resin (B) are used, and in the case of a photocurable resin composition, a regeneration polyethylene terephthalate (A), a photosensitive resin (C), a photoinitiator. In the case of alkali-developable photocurable thermosetting resin composition, (D) is a regenerated polyethylene terephthalate (A), thermosetting resin (B) and photosensitive resin (C), a photoinitiator (D), and carboxyl group-containing resin (E) ). And the hardened | cured material of a desired characteristic can be obtained by selecting the kind of each of these components suitably, and using as a resin composition for printed wiring boards which optimized the compounding ratio.

Such a resin composition for printed wiring boards may further contain a thermosetting catalyst (F), a filler (G), an organic solvent (H), etc. as needed.

In this embodiment, if thermosetting resin (B) is excellent in all the characteristics at the time of using hardened | cured material, such as insulation, in a printed wiring board, it will not become a restriction | limiting in particular, Specifically, an epoxy resin, a phenol resin, a urethane resin, polyester Resin, hydroxyl group, amino group or carboxyl group-containing polyurethane, polyester, polycarbonate, polyol, phenoxy resin, acrylic copolymer resin, vinyl resin, polyimide, polyamideimide, oxazine resin, cyanate resin, oxetane compound, Polyisocyanate, block isocyanate, carbodiimide (compound) resin, oxazoline (compound) resin and the like. These can be used individually or in mixture of 2 or more types.

The compounding ratio of such a thermosetting resin (B) is 10-100000 mass parts with respect to 100 mass parts of recycled PET powder (A), More preferably, it is 30-1000 mass parts. If it is less than 10 mass parts, fluidity | liquidity falls, application | coating and formation become difficult, or mechanical strength falls. On the other hand, when it exceeds 100000 mass parts, it is meaningless from a viewpoint of environment consideration, and it is not preferable.

The photosensitive resin (C) is not particularly limited as long as it is a compound in which the ethylenically unsaturated double bond is radically polymerized by irradiation of an active energy ray, and is not limited to (meth) acrylate compound, unsaturated polyester compound, unsaturated urethane compound, styrene compound, Butadiene type compound etc. are mentioned. Among these ethylenically unsaturated compounds, a (meth) acrylate-based compound is particularly preferred, and the (meth) acrylate-based compound may be any of a monofunctional, polyfunctional, monomer, and oligomer (prepolymer), and also acrylic You may have functional groups other than a diary (methacryloyl group). Specifically, monomers such as substituted or unsubstituted aliphatic acrylates, alicyclic acrylates, aromatic acrylates, and ethylene oxide modified acrylates thereof, epoxy acrylates, urethane acrylates, polyester acrylates, and polyether acrylates And oligomers such as polyol acrylate, alkyd acrylate, melamine acrylate, silicone acrylate and polybutadiene acrylate, and methacrylates corresponding thereto. These can be used individually or in mixture of 2 or more types.

In order to improve the reactivity of such photosensitive resin (C), you may also add a photoreactive monomer. Specifically, butoxymethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycerol ( Meth) acrylate, 4- (meth) acryloxytricyclo [5.2.1.02.6] decane, isobornyl (meth) acrylate, isodecyl (meth) acrylate, phenoxyethyl (meth) acrylate, cyclo Hexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylic Monofunctional (meth) acrylates such as acrylate, 4- (meth) acryloxyalkyl acid phosphate and γ- (meth) acryloxyalkyltrialkoxysilane; Monofunctional monomers such as acryloyl morpholine, N-vinylpyrrolidone, N, N-dimethylacrylamide, N-vinylcarbazole, styrene, vinyl acetate, acrylonitrile and trialkoxy vinylsilane; Bisphenol-A-di (meth) acrylate, alkylene oxide modified bisphenol-A-di (meth) acrylate, 1,4-butanedioldi (meth) acrylate, 1,6-hexanedioldi (meth) acrylate , 1,9-nonanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acryl Rate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, bis [4- (meth) acryloxymethyl] tricyclo [5.2.1.02 .6] decane, bis [4- (meth) acryloxy-2-hydroxypropyloxyphenyl] propane, isophorone diisocyanate modified urethane di (meth) acrylate, hexamethylene diisocyanate modified urethane di (meth) acrylate Trimethylhexamethyl Polyfunctional (meth) acrylates, such as diisocyanate modified urethane (meth) acrylate, trimethylhexamethylene diisocyanate modified urethane (meth) acrylate, aliphatic epoxy modified (meth) acrylate, and oligosiloxanyl di (meth) acrylate Ryu; And polyfunctional monomers such as triallyl isocyanurate, vinyl (meth) acrylate and allyl (meth) acrylate. These ethylenically unsaturated compounds can be used individually or in mixture of 2 or more types.

The compounding ratio of such photosensitive resin (C) is 10-100000 mass parts with respect to 100 mass parts of recycled PET powder (A), More preferably, it is 30-1000 mass parts. If it is less than 10 mass parts, fluidity | liquidity falls, application | coating and formation become difficult, or mechanical strength falls. On the other hand, when it exceeds 100000 mass parts, it is meaningless from a viewpoint of environment consideration, and it is not preferable.

As a photoinitiator (D), 1 type, or 2 or more types chosen from the group which consists of an oxime ester type photoinitiator, the (alpha)-amino acetophenone type photoinitiator, and an acylphosphine oxide type photoinitiator can be used.

Specific examples of the oxime ester photopolymerization initiator include CGI-325 manufactured by Ciba Specialty Chemicals, Irgacure OXE01, Irgacure OXE02 and the like.

Specific examples of the α-aminoacetophenone-based photoinitiator are 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropaneone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1- Butanone, N, N-dimethylaminoacetophenone, and the like. Examples of commercially available products include Irgacure 907, Irgacure 369, Irgacure 379, and the like manufactured by Ciba Specialty Chemicals.

As an acyl phosphine oxide type photoinitiator, 2,4,6- trimethyl benzoyl diphenyl phosphine oxide, bis (2, 4, 6- trimethyl benzoyl)-phenyl phosphine oxide, bis (2, 6- dimeth) specifically, Oxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and the like. As a commercial item, Lucirin TPO by BASF Corporation, Irgacure 819 by Ciba Specialty Chemicals, etc. are mentioned.

The compounding ratio of such a photoinitiator (D) may be 0.01-50 mass parts with respect to 100 mass parts of photosensitive resin (C). If it is less than 0.01 mass part, since the photocurability on copper used for a printed wiring board is inadequate, peeling off a coating film or coating film characteristics, such as chemical-resistance, may be unpreferable. On the other hand, when it exceeds 50 mass parts, there exists a tendency for the light absorption in the soldering resist coating film surface of a photoinitiator (D) to become severe, and deep-part sclerosis | hardenability falls. More preferably, it is 0.5-30 mass parts.

Moreover, photoinitiator, photoinitiation adjuvant, and a sensitizer other than the compound mentioned above can be used for the resin composition for printed wiring boards of this embodiment. For example, a benzoin compound, an acetophenone compound, an anthraquinone compound, a thioxanthone compound, a ketal compound, a benzophenone compound, a xanthone compound, a tertiary amine compound, etc. are mentioned.

Specific examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether and the like.

Specific examples of the acetophenone compound include acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone.

Specifically as an anthraquinone compound, 2-methyl anthraquinone, 2-ethyl anthraquinone, 2-t- butyl anthraquinone, 1-chloro anthraquinone, etc. are mentioned.

Specifically as a thioxanthone compound, 2, 4- dimethyl thioxanthone, 2, 4- diethyl thioxanthone, 2-chloro thioxanthone, 2, 4- diisopropyl thioxanthone, etc. are mentioned.

Specifically as a ketal compound, acetophenone dimethyl ketal, benzyl dimethyl ketal, etc. are mentioned.

Specific examples of the benzophenone compound include benzophenone, 4-benzoyldiphenyl sulfide, 4-benzoyl-4'-methyldiphenyl sulfide, 4-benzoyl-4'-ethyldiphenyl sulfide and 4-benzoyl-4 '. -Propyl diphenyl sulfide, etc. are mentioned.

Specific examples of the tertiary amine compound include an ethanolamine compound and a compound having a dialkylaminobenzene structure, for example, 4,4'-dimethylaminobenzophenone (Nisocure MABP manufactured by Nippon Soda Co., Ltd.), 4,4'-di Dialkylaminobenzophenones such as ethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co., Ltd.), 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one (7- (diethylamino Dialkylamino group-containing coumarin compounds such as 4-methylcoumarin), ethyl 4-dimethylaminobenzoate (Gayacure EPA manufactured by Nippon Kayaku Co., Ltd.), ethyl 2-dimethylaminobenzoate (Quantacure DMB manufactured by International Biosynthetic Co., Ltd.) ), 4-dimethylaminobenzoic acid (n-butoxy) ethyl (Quantacure BEA manufactured by International Bio Synthetics Co., Ltd.), isoamylethyl ester of p-dimethylaminobenzoic acid (Gayacure DMBI manufactured by Nippon Kayaku Co., Ltd.), 4-dimethylamino 2-Ethyl hexyl benzoate (Esolo by Van Dyk) l) 507) and 4,4'- diethylamino benzophenone (The EAB by Hodogaya Chemical Co., Ltd.) etc. are mentioned.

Among these compounds, particularly preferred are thioxanthone compounds and tertiary amine compounds. It is preferable that a thioxanthone compound is contained in terms of core hardenability, and especially 2, 4- dimethyl thioxanthone, 2, 4- diethyl thioxanthone, 2-chloro thioxanthone, and 2, 4- diiso Thioxanthone compounds, such as propyl thioxanthone, are preferable.

As the tertiary amine compound, a compound having a dialkylaminobenzene structure is preferable, and a dialkylaminobenzophenone compound and a dialkylamino group-containing coumarin compound having a maximum absorption wavelength of 350 to 410 nm are particularly preferable. As a dialkylamino benzophenone compound, 4,4'- diethylamino benzophenone is low and preferable. Since the maximum absorption wavelength is in the ultraviolet region, the dialkylamino group-containing coumarin compound having a maximum absorption wavelength of 350 to 410 nm has little coloration, and of course, a colorless transparent photosensitive resin composition, as well as the color of the color pigment itself using a color pigment. It becomes possible to provide the coloring soldering resist film which reflected this. In particular, 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one is preferable because it exhibits an excellent sensitizing effect on laser light having a wavelength of 400 to 410 nm.

These photoinitiators, photoinitiator, and sensitizer can be used individually or in mixture of 2 or more types.

Moreover, as carboxyl group-containing resin (E), various resin compounds which have a carboxyl group can be used in a molecule | numerator, and alkali developability can be provided. Especially as such carboxyl group-containing resin (E), carboxyl group-containing photosensitive resin (E-1) which has an ethylenically unsaturated double bond in a molecule | numerator is more preferable at the point of photocurability and developability. And it is preferable that the unsaturated double bond is derived from acrylic acid or methacrylic acid, or derivatives thereof.

As a specific example of carboxyl group-containing resin (E), the compound listed below is preferable. In addition, (meth) acrylate is a term which generically refers to acrylate, methacrylate, and mixtures thereof, and is the same also about the expression of another similarity.

(1) Carboxyl group-containing resin obtained by copolymerization of (meth) acrylic acid and an unsaturated group content.

(2) Carboxylic acid containing urethane resin by polyaddition reaction of diisocyanate, a carboxyl group-containing dialcohol compound, and a diol compound.

(3) Photosensitive carboxylic acid containing urethane resin by the polyaddition reaction of diisocyanate, bifunctional epoxy (meth) acrylate, or partial acid anhydride modified substance of it, and a carboxyl group-containing dialcohol compound and a diol compound.

(4) The terminal (meth) acrylated carboxylic acid-containing urethane resin which added the compound which has one hydroxyl group and one or more (meth) acryl groups in a molecule | numerator during synthesis | combination of resin of said (2) or (3) mentioned above.

(5) The terminal (meth) acrylated carboxylic acid-containing urethane resin which added the compound which has one isocyanate group and one or more (meth) acryl groups in a molecule | numerator during the synthesis | combination of resin of said (2) or (3) mentioned above.

(6) Photosensitive carboxyl group-containing resin which made (meth) acrylic acid react with bifunctional and polyfunctional (solid) epoxy resin, and added dibasic acid anhydride to the hydroxyl group which exists in a side chain.

(7) Photosensitive carboxyl group-containing resin which added dibasic acid anhydride to the hydroxyl group produced by making (meth) acrylic acid react with the polyfunctional epoxy resin which further epoxidized the hydroxyl group of bifunctional (solid) epoxy resin with epichlorohydrin.

(8) Carboxylic acid containing polyester resin which added dibasic acid anhydride to the primary hydroxyl group which produced | generated the dicarboxylic acid by making bifunctional oxetane resin react.

(9) Photosensitive carboxyl group-containing resin formed by adding the compound which has one epoxy group and one or more (meth) acryl groups in 1 molecule further to resin mentioned above.

By containing these carboxyl group-containing resin (E), since it has many free carboxyl groups in the side chain of a backbone polymer, image development by a diluted alkali aqueous solution is attained.

Moreover, it is preferable that the acid value of carboxyl group-containing resin (E) is 40-200 mgKOH / g. When the acid value of the carboxyl group-containing resin is less than 40 mgKOH / g, alkali development becomes difficult. On the other hand, when the acid value exceeds 200 mgKOH / g, the line becomes thinner than necessary to proceed the dissolution of the exposed portion by the developer, or in some cases It dissolves and peels off with a developing solution without distinguishing a light part and an unexposed part, and drawing of a normal resist pattern becomes difficult. More preferably, it is 45-120 mgKOH / g.

In addition, although the weight average molecular weight of carboxyl group-containing resin (E) changes with resin skeleton, it is preferable to exist in the range of 2,000-150,000 generally and 5,000-100,000. If the weight average molecular weight is less than 2,000, the tack-free performance may be inferior, the moisture resistance of the coating film after exposure is poor, the film decreases at the time of image development, and the resolution may fall large. On the other hand, when a weight average molecular weight exceeds 150,000, developability may become remarkably bad and storage stability may be inferior.

It is preferable that the compounding ratio of such carboxyl group-containing resin (E) is 20-60 mass% in all compositions. When it is less than the said range, since coating film strength may fall, it is not preferable. On the other hand, when more than the said range, viscosity will become high, applicability | paintability, etc. will fall. More preferably, it is 30-50 mass%.

Such carboxyl containing resin can be used individually or in mixture of 2 or more types.

As the thermosetting catalyst (F), a resin capable of promoting the curing of the thermosetting resin can be used. Specific examples of such a thermosetting catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-ethyl. 4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- (2-cyanoethyl) -2-ethyl-4 Imidazole derivatives such as methylimidazole; Amines such as dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine, 4-methyl-N, N-dimethylbenzylamine Hydrazine compounds such as compounds, adipic dihydrazide and sebacic acid dihydrazide; As commercially available things, such as phosphorus compounds, such as a triphenylphosphine, 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (all are brand names of an imidazole compound) by Sanko Kasei Kogyo Co., Ltd., and San Apro U-CAT3503N, U-CAT3502T (all are brand names of the block isocyanate compound of dimethylamine), DBU, DBN, U-CATSA102, U-CAT5002 (both bicyclic amidine compound and its salt) etc. are mentioned. It is not limited to these in particular, It may be what promotes the reaction of the thermosetting catalyst of an epoxy resin or an oxetane compound, or an epoxy group and / or an oxetanyl group, and a carboxyl group, These can be used individually or in mixture of 2 or more types. have.

Also, guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-4,6-diamino-S-tri Azine, 2-vinyl-4,6-diamino-S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanuric acid S-triazine derivatives, such as an adduct, can also be used and it is preferable to use together the compound which also functions as these adhesive imparting agents with a thermosetting catalyst.

The compounding ratio of these thermosetting catalysts is sufficient in normal quantity ratio, for example, it is preferable to set it as 0.1-20 mass parts with respect to 100 mass parts of thermosetting components (B) or carboxyl group-containing resin (E). More preferably, it is 0.5-15.0 mass parts.

Filler G is used as needed in order to raise the physical strength of the coating film, etc. As such a filler (G), although an inorganic or organic filler can be used, especially barium sulfate, spherical silica, and talc are used preferably. Moreover, when using for interlayer insulation layers, such as a prepreg, an insulating sheet, and copper foil with resin, a glass cross, an inorganic, and an organic fiber nonwoven fabric can be used. In addition, in order to obtain a white appearance and flame retardancy, metal hydroxides such as titanium oxide, metal oxides and aluminum hydroxide can be used as the extender pigment filler.

It is preferable that the compounding ratio of filler (G) is 75 weight% or less of the composition whole quantity. When the blending ratio of the filler exceeds 75% by weight of the total amount of the composition, the viscosity of the insulating composition is increased, so that coating and moldability are reduced, or the cured product is weak. More preferably, it is 0.1 to 60 weight%.

In addition, the organic solvent (H) is used for synthesis | combination of thermosetting resin (B), photosensitive resin (C), carboxyl group-containing resin (E), adjustment of a composition, adjustment of the viscosity at the time of shaping | molding, and application | coating of an insulation composition.

Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons and petroleum solvents. More specifically, ketones, such as methyl ethyl ketone and cyclohexanone; Aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; Cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether Glycol ethers such as these; Esters such as ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol butyl ether acetate, methyl lactate, ethyl lactate, and butyl lactate; Alcohols such as ethanol, propanol, ethylene glycol and propylene glycol; Aliphatic hydrocarbons such as octane and decane; Petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, solvent naphtha and the like. These organic solvents can be used individually or in mixture of 2 or more types.

In addition, if necessary, known conventional coloring agents (pigments, dyes, pigments, such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, and naphthalene black may be used. ) Can be used.

These coloring agents are given to the following.

[Blue colorant]

As the blue colorant, there are phthalocyanine-based and anthraquinone-based compounds, and the pigment-based compound is classified as Pigment, specifically, the following color index (CI; The Society of Diamonds & Colors (The Society of Issued by Dyers and Colourists).

Pigment Blue 15, Pigment Blue 15: 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4, Pigment Blue 15: 6, Pigment Blue 16, Pigment Blue 60,

As dye system

Solvent Blue 35, Solvent Blue 45, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 101, Solvent Blue 104, Solvent Blue 122, Solvent Blue 136, solvent blue 67, solvent blue 70, and the like can be used. In addition to the above, a metal substituted or unsubstituted phthalocyanine compound can also be used.

[Green Coloring Agent]

As a green coloring agent, there exist phthalocyanine series, anthraquinone series, and a perylene system similarly, Specifically,

Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28

Etc. can be used. In addition to the above, a metal substituted or unsubstituted phthalocyanine compound can also be used.

[Yellow colorant]

Examples of the yellow colorant include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, anthraquinone and the like. Specific examples include the following.

(Anthraquinone)

Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, Pigment Yellow 202

Isoindolinone series

Pigment Yellow 110, Pigment Yellow 109, Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185

(Condensation azo system)

Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Yellow 166, Pigment Yellow 180

(Benzimidazolone series)

Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181

(Monoazo system)

Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167 , 168, 169, 182, 183,

(Disazo system)

Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198

[Red colorant]

Examples of the red colorant include monoazo, disazo, azolake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone and quinacridone. It can be mentioned.

(Monoazo system)

Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170 , 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269,

(Disazo system)

Pigment Red 37, 38, 41

(Mono Azo Lake system)

Pigment Red 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57: 1 , 58: 4, 63: 1, 63: 2, 64: 1, 68

(Benzimidazolone series)

Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208

(Perylene system)

Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red 194, Pigment Red 224

(Diketopyrrolopyrrole)

Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272

(Condensation azo system)

Pigment Red 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221, Pigment Red 242

(Anthraquinone)

Pigment Red 168, Pigment Red 177, Pigment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, Solvent Red 207

(Quinacridone system)

Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red 209

In addition, for the purpose of adjusting the color tone, a coloring agent such as purple, orange, shade, or black may be added. Specifically, pigment violet 19, 23, 29, 32, 36, 38, 42, solvent violet 13, 36, C.I. Pigment Orange 1, C.I. Pigment Orange 5, C.I. Pigment Orange 13, C.I. Pigment Orange 14, C.I. Pigment Orange 16, C.I. Pigment Orange 17, C.I. Pigment Orange 24, C.I. Pigment Orange 34, C.I. Pigment Orange 36, C.I. Pigment Orange 38, C.I. Pigment Orange 40, C.I. Pigment Orange 43, C.I. Pigment Orange 46, C.I. Pigment Orange 49, C.I. Pigment Orange 51, C.I. Pigment Orange 61, C.I. Pigment Orange 63, C.I. Pigment Orange 64, C.I. Pigment Orange 71, C.I. Pigment Orange 73, C.I. Pigment Brown 23, C.I. Pigment Brown 25, C.I. Pigment Black 1, C.I. Pigment black 7 and the like.

In addition, thermal polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol and phenothiazine, thickeners such as fine silica, organic bentonite and montmorillonite, and antifoaming agents such as silicone, fluorine and polymer And / or additives such as adhesion imparting agents such as leveling agents, imidazole series, thiazole series, and triazole series, and silane coupling agents.

The resin composition for printed wiring boards of this embodiment can also be used as a uncured state in which a monomer or a low molecular weight polymer having a constant molecular weight is dispersed in an organic solvent or molded into a resin sheet (film).

In the uncured state, for example, the organic solvent is adjusted to a viscosity suitable for the coating method, and used in methods such as dip coating, flow coating, roll coating, bar coater, screen printing, and curtain coating. The coating film of a tack free can be formed by apply | coating on a base material and volatilizing (temporarily drying) the organic solvent contained in a composition at the temperature of about 60-100 degreeC.

At this time, as the volatilization drying method, a hot air circulating drying furnace, an IR furnace, a hot plate, a convection oven, or the like provided with a heat source of an air heating system by steam, such as a method of countercurrently contacting the hot air in the dryer, and a support by a nozzle It can carry out using the system sprayed on.

Moreover, in the case of a resin sheet, a resin layer can be formed by apply | coating on a carrier film, and drying and bonding the dry film wound up as a film on a base material. Moreover, the prepreg of the semi-hardened state impregnated into the copper foil with resin which formed the dry coating film on copper foil, and glass cross may be sufficient. Specifically, a soldering resist, a prepreg, copper foil with resin, a built-up material, the adhesive agent for printed wiring boards, the cover coating for printed wiring boards, the undercoat for printed wiring boards, marking ink, etc. are mentioned.

In addition, the resin composition for photocurable printed wiring boards containing photosensitive resin (C) etc. becomes hardened | cured material by photocuring. Photocuring can be hardened | cured using various ultraviolet curing apparatuses, an ultraviolet exposure apparatus, or a laser transmission light source, especially the photocuring apparatus by the laser beam of wavelength 350-410 nm. Moreover, the resin composition for photocurable thermosetting printed wiring boards containing a thermosetting resin (B) can be hardened by thermosetting after such photocuring.

And the alkali developable insulating composition containing carboxyl group-containing resin (E) can be pattern-exposed with the photocuring apparatus mentioned above, and can develop a pattern by developing an unexposed part with dilute alkali aqueous solution.

At this time, the developing method may be a dipping method, a showering method, a spraying method, a brush method, or the like. As the developing solution, an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, amines or the like may be used. Can be.

Hereinafter, an Example demonstrates this invention concretely.

<Example>

Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example. In the examples, parts and% are based on mass unless otherwise indicated.

[Preparation of Pulverized Recycled PET Slurry]

(Manufacture of A-1)

The crushed recycled PET (average particle diameter 25 µm) manufactured by Seishin Fine Engineering was put into a jet mill grinder and passed in two passes under a condition of a grinding pressure of 0.6 MPa to obtain a finely divided recycled PET (average particle diameter 12 µm) (A-0). 200 g of the obtained finely ground regenerated PET (A-0) was dispersed in 200 g of propylene glycol monomethyl ether acetate, and then filtered through a mesh of 120 × 1000 twill weave (nominal filtration accuracy: about 30 μm) made of SUS, and finely ground. A recycled PET slurry (A-1) was obtained. At this time, there was no change in the average particle diameter.

(Manufacture of A-2)

A finely divided recycled PET slurry (A-2) was obtained in the same manner as in Production Example 1 except that 200 g (A-0) of finely divided recycled PET was dispersed in 200 g of 2-hydroxyethyl methacrylate. At this time, there was no change in the average particle diameter.

[Synthesis of Resin]

660 g of a cresol novolak-type epoxy resin (manufactured by Nippon Kayaku Co., EOCN-104S, softening point 92 ° C., epoxy equivalent 220) in a two-liter separation flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen inlet tube. 421.3 g of carbitol acetate and 180.6 g of solvent naphtha were introduced and dissolved by heating and stirring at 90 ° C. Next, it cooled to 60 degreeC once, 216 g of acrylic acid, 4.0 g of triphenylphosphines, and 1.3 g of methylhydroquinone were added, and it reacted at 100 degreeC for 12 hours, and obtained the reaction product of acid value 0.2 mgKOH / g. 241.7 g of tetrahydrophthalic anhydride was put into this, it heated at 90 degreeC, and made it react for 6 hours. Thereby, a solution of carboxyl group-containing photosensitive resin (E-1) having an acid value of 50 mgKOH / g, a double bond equivalent weight (g weight of resin per mole of unsaturated group) 400, and a weight average molecular weight of 7,000 was obtained.

[Production of Resin Composition]

Each component shown in Table 1 was mix | blended, and it premixed with the stirrer, and knead | mixed using the triaxial roll mill, and produced the resin composition of Examples 1-5. It was 30 micrometers or less when the dispersion degree of the resin composition obtained here was evaluated by the particle size measurement by the erycksen company grinder.

[Evaluation 1 of Resin Composition]

(Production of test piece)

In each of the resin compositions of Examples 1 to 4 thus obtained, a copper-clad laminate plate formed of a copper-clad laminate plate FR-4 substrate (for solder heat resistance evaluation) and an IPC B-25 comb-shaped electrode B coupon was formed as a substrate. Using (for electrical insulation evaluation), the test piece was produced as follows.

Resin composition of Example 1: The test piece was prepared by apply | coating to each board | substrate with the thickness of 20 micrometers on the screen of PET 150 mesh, and heat-hardening by heating at 150 degreeC for 30 minutes by the hot-air circulation type drying furnace.

Resin composition of Example 2: A screen of PET 225 mesh was applied to each substrate at a thickness of 15 μm and transferred to an air-cooled 80 W / cm, 3-lamp high pressure mercury lamp while conveying at a conveyor speed of 4 m / min. UV light was irradiated to prepare a test piece.

Resin composition of Example 3, 4: It apply | coated to each board | substrate with the thickness of 20 micrometers on the screen of PET100 mesh, and dried at 80 degreeC for 30 minutes by the hot-air circulation type drying furnace, and formed the tack-free coating film. Place the negative film to the substrate, a resist pattern was formed by exposure in a predetermined pattern, and developed with a spray pressure 1% Na ₂ CO ₃ aqueous solution by weight of 2 kg / ㎠. This board | substrate was heated at 150 degreeC for 60 minutes, and thermosetted, and the test piece was produced.

(Performance evaluation)

Thus, the following items were evaluated about the test piece manufactured.

Solder Heat Resistance

The resin composition of Examples 1-4 was apply | coated rosin-type flux to each test piece manufactured using the copper clad laminated board FR-4 board | substrate circuit-formed, and immersed for 30 second in the solder bath previously heated at 260 degreeC, and propylene glycol mono After washing the flux with methyl ether, the expansion, peeling and discoloration of the resist layer were visually evaluated.

Table 2 shows the results of the evaluation. In addition, the evaluation criteria

○: no change at all

△: very slight change

X: thing with swelling and peeling in a coating film

It was made.

<Electric insulation>

The resin composition of Examples 1-4 was applied the bias voltage of 5.5 V of DC to the comb-shaped electrode of each test piece manufactured using the copper clad laminated board in which the IPC B-25 comb-shaped electrode B coupon was formed, humidity 85%, temperature 130 The insulation resistance value after leaving for 150 hours at ° C was measured.

Table 2 also shows the results of his evaluation.

As shown in Table 2, it was found that good solder heat resistance was obtained and high electrical insulation was obtained.

[Evaluation 2 of Resin Composition]

Preparation of Samples for Evaluation

About the compounding component of Example 5 shown in Table 1, the propylene glycol monomethyl ether acetate and the aerosil # 972 which are finely divided silica were added as an organic solvent, and it knead | mixed and disperse | distributed with a triaxial roll mill, and the viscosity was 40 dPa * s ± The thermosetting resin composition adjusted to 10 dPa * s (rotational viscometer 5 rpm, 25 degreeC) was obtained. Subsequently, the obtained thermosetting resin composition was further adjusted to viscosity 1-2 dPa * s using methyl ethyl ketone, and the varnish for application was manufactured.

Each obtained coating varnish was apply | coated on the rough surface (F3-WS: Furukawa Circuit Foil company make) of 18 micrometers thick copper foil so that the film thickness of a dry coating film may be 60 micrometers, respectively, using a die coater, and at 40-120 degreeC It dried and obtained copper foil with a resin. The gelation time in 170 degreeC of the copper foil with resin at this time was 60 second-90 second.

Next, the two copper foils with the resin thus obtained are bonded together as they are with the inner surface of the resin as it is, and heat-cured at 120 ° C. and 5 kgf / cm 2 for 30 minutes at 170 ° C. for 2 hours, and then integrally molded by a hot plate press. It was. And this, or copper foil was etched as it was, and the cured film sample for physical property measurement was manufactured.

In addition, 5 kgf / cm <2> was used for the copper foil with resin so that an inner layer circuit might be formed from the laminated board which coated the glass epoxy double-sided copper of 18 micrometers thick copper foil, and the resin surface adhered to both surfaces of the board | substrate processed by Mack's etch bonding. , 20 minutes at 120 ° C., followed by curing at 25 kgf / cm 2 and 170 ° C. for 2 hours to prepare a laminate.

Further, a hole was drilled at a predetermined position of the laminate to form a through hole. In addition, first, the copper foil was formed by selectively removing copper foil using an etching resist, and a guide was provided, and the laser via part was formed by performing a hole with a laser processing machine.

Next, after desmearing and removing the smear from the through hole and the laser via, the hole is conducted by electroless copper plating and electrolytic copper plating, and a pattern is formed by etching through a commercially available etching resist to form a multilayer printed wiring board. Samples were prepared.

(Performance evaluation)

Thus, the following items were evaluated about the sample for evaluation manufactured.

<Peel strength>

It measured according to JIS C 6481.

Solder Heat Resistance

The completed printed wiring board (10 cm x 10 cm) was immersed in the solder layer at 288 ° C ± 3 ° C for 10 seconds. And after repeating this operation 5 times, peeling of copper foil and resin was confirmed.

In addition, the evaluation criteria

○: no peeling

×: There is peeling

It was made.

<Pattern formability>

The peeling of the circuit of line and space 75 micrometers / 75 micrometers was visually examined. In addition, the evaluation criteria

○: no peeling

×: There is peeling

It was made.

As shown in Table 3, it was found that good solder heat resistance and pattern formability can be obtained with high peel strength.

In addition, this invention is not limited to embodiment mentioned above. Various modifications can be made without departing from the scope of the invention.

Claims (8)

Resin polyethylene terephthalate (A) is contained, The resin composition for printed wiring boards characterized by the above-mentioned. The resin composition for a printed wiring board according to claim 1, which is prepared by mixing a fine powder of regenerated polyethylene terephthalate having an average particle diameter of 0.1 to 15 mu m. The resin composition for a printed wiring board according to claim 1, wherein the regenerated polyethylene terephthalate (A) is 0.1 to 75% of the total amount. The resin composition for printed wiring boards of Claim 1 containing thermosetting resin (B). The resin composition for printed wiring boards of Claim 1 containing photosensitive resin (C). The coating film of the resin composition for printed wiring boards of any one of Claims 1-5 is provided on a base material, The dry film characterized by the above-mentioned. A circuit formed substrate, It is formed in at least one part on this board | substrate, and is provided with the permanent film which hardened the resin composition for printed wiring boards in any one of Claims 1-5, The printed wiring board characterized by the above-mentioned. A circuit formed substrate, At least one part of this board | substrate is provided with the permanent film which hardened the said coating dry film | membrane transferred by the dry film of Claim 6. The printed wiring board characterized by the above-mentioned.