KR20090102511A - Method manufacturing orthodontics wire and wire thereof - Google Patents

Abstract

PURPOSE: A method for manufacturing wire for orthodontics and the wire manufactured by the same are provided, which can achieve wire production of the high quality by removing hydrogen embrittlement. CONSTITUTION: A method for manufacturing wire for orthodontics is constituted as follows. The wire for orthodontics is made of alloy of nickel, titanium, and so on. The irregular surface is formed by processing the surface of the wire(S100). The oxide formed in the surface of the wire which is surface-treated is removed(S200). The oxide removed surface of the wire is coated with silver(S300). The hydrogen embrittlement of the wire is removed by the silver(S400). The hydrogen embrittlement removed wire is coated with polymers(S500).

Description

Orthodontic wire manufacturing method and wire

The present invention relates to a wire manufacturing method and a wire for coating the surface of the metal wire used in orthodontics, and more particularly, to form a surface of the metal wire to an irregular surface to facilitate the plating of the silver and coating the polymer compound on the irregular surface It relates to a wire manufacturing method and a wire to achieve.

Orthodontic metal wire is used to correct orthodontic teeth,

For example, as the periodontitis is destroyed by the progression of periodontal tissue, the periodontal tissue is sequentially destroyed from the edge of the gum, and the alveolar bone gradually disappears, so-called, periodontal abscess Symptoms appear.

As for the treatment method of the tooth of the alveolar pus, the fluctuation is severe and extraction is performed for the tooth which does not have a preservation hope, but there is little fluctuation which is adjacent to this for the tooth which is agitation but there is hope of preservation There is a method of fixing with the teeth.

When fixing a plurality of adjacent teeth, the use of metal wires is common. This is a method of winding a metal wire around a plurality of teeth to be fixed using the elasticity of the metal wire, applying a load load generated by bending or stretching the metal wire to these teeth, and fixing the tooth by this load.

In the above-described method, the metal wire is seen from the front when the patient always feels pain, suffers from discomfort, and opens his mouth because of the load that is used and added to the work of sequentially fixing the metal wire to the tooth. There is a problem that it is not good to see.

Therefore, a method of fixing teeth by using a shape memory alloy has recently been proposed.

These methods heat-treat the wire-shaped straightening member which is a shape memory alloy material so that the shape of a hair-shaped state may become a desired shape, ie, an anatomically correct tooth shape previously, and this straightening member It is installed in accordance with the patient's dentition in a low temperature environment, heated to return to its original shape, and to correct the dentition by the elastic force.

In the conventional metal wire as described above, it is common to obtain the same color as the tooth by using a coating method such as Teflon coating to obtain the same color as the tooth.

However, the coating method such as Teflon coating caused a controversy on the harmfulness to the human body and required a method for producing a metal wire harmless to the human body.

Various metal wire coating methods have been proposed to solve the above problems, and an example thereof will be described below with reference to the accompanying drawings.

[Document 1] Korean Patent Registration Publication (10-0795106); Registered date: 2008.01.09 Orthodontic wire and its manufacturing method

1 is a schematic and cross-sectional view of a conventional wire.

As shown in FIG. 1A, the orthodontic wire 20 is similar in appearance to a general wire.

However, since it is internally different from a general wire, the shape and manufacturing process thereof will be described with reference to FIG.

As shown in FIG. 1B, a conventional orthodontic wire 20 includes a metal wire 21 that is formed long and a silver film 23 coated on a surface of the metal wire 21. And a polymer compound film 25 coated on the surface of the silver (Ag) film 23.

In the conventional orthodontic wire, a silane-based adhesion is performed between the silver film 23 and the polymer compound film 25 to improve adhesion between the silver film 23 and the polymer compound film 25. A promotion film (not shown) is further provided.

The conventional metal wire 21 includes a general metal material and shape memory alloy material

It is formed using a metal alloy.

The metal alloy material for forming the metal wire 21 is generally composed of titanium-nickel (Ti-Ni) alloy, stainless steel, nickel cobalt alloy, nickel chromium alloy, titanium alloy, and the like used in medical equipment.

The silver (Ag) film 23 coated on the surface of the metal wire 21 is coated on the surface of the metal wire 21 to give a color similar to the tooth color.

The polymer compound film 25 formed on the surface of the silver film 23 is coated to prevent the color of the silver (Ag) film 23 from being discolored.

The polymer compound film 25 is formed by coating parylene on the surface of the silver (Ag) film 23.

In the conventional metal wire as described above, a silver (Ag) film similar to the color of the tooth is formed and paraline is coated to prevent discoloration of the silver (Ag) film.

The parylene coating is generally used for medical devices, etc. In general, the parylene coating is usually formed through a powder-type parylene after a predetermined step after forming a undercoat on the material to be coated. It is common to vaporize and apply the vaporized paraline to the material to be coated to form a paraline coating.

However, the conventional metal wire has a problem that the surface of the material is generally smooth and stable, so that the silver (Ag) film and the surface of the metal wire are separated from each other, and the silane is separated from the silane so that the mutual adhesion between the silver film and the parylene coating film is good. There is an inconvenience in forming a silane-based film, and the silane-based film is an incomplete compound, in which a silver film and a parylene coating film are incompletely bonded to each other.

In addition, since the hydrogen embrittlement occurs in the wire during silver plating for forming the silver film to shorten the life of the wire, the wire in which the silver film is formed at a high temperature of 250 ° C. is usually used to remove the hydrogen embrittlement. To dry for a long time, there is a problem that the silver (Ag) film is weak to heat discoloration.

The present invention is to solve the problem of the conventional wire manufacturing method, the object of the present invention is to process the metal wire into an irregular surface, the silver plating and the polymer compound is firmly adhered to each other, and easily remove the hydrogen embrittlement generated in the wire And to prevent discoloration of silver plating, and to provide a high quality orthodontic wire manufacturing method and wire harmless to the human body.

In order to achieve the object of the present invention, a metal orthogonal element such as nickel (Ni) and titanium (Ti) is alloyed at a predetermined ratio, and the method for producing orthodontic wire coated with the surface of the metal wire used in medical procedures such as orthodontics. A wire surface processing step for forming an irregular surface by processing the surface of the wire; An oxide removal step of removing oxides formed on the surface of the wires having the surface processing of the wires; A silver plating step of plating silver on the surface of the wire from which the oxide is removed; A hydrogen embrittlement removing step for removing hydrogen embrittlement of the silver plated wire; And a coating step of coating a polymer compound on the wire from which the hydrogen embrittlement is removed.

In the present invention, the wire surface processing step, it is preferable to melt the titanium (Ti) on the surface of the wire by an electrolytic etching method (Ni) to protrude to form an irregular surface.

In the present invention, the wire surface processing step, the surface of the wire is preferably processed by a mixture of sulfuric acid (H₂SOH), nitric acid (HNO₃), fluoride (fluoride).

In the present invention, the oxide removal step, it is preferable to clean the wire with a chemical mixture for removing the oxide generated in the wire surface processing step.

In the present invention, the oxide removal step, it is preferable to clean the wire surface of the mixture of hydrochloric acid (HCℓ), nitric acid (HNO₃), fluoride (fluoride) for 20 to 50 seconds at room temperature.

In the present invention, the silver plating step is preferably composed of a first plating step and a second plating step.

In the present invention, the silver plating step, a mixture of silver cyanide (AgCN), cyanide (KCN) is applied to the surface of the wire, the wire for 10 seconds to 15 seconds at an anode current density of 15Am / dm² to 52Am / dm² at room temperature A first plating step of processing the surface; And applying a mixture of silver cyanide (AgCN), PE (polyethylene) and cyanide (KCN) to the wire surface, and processing the wire surface for 2 minutes to 3 minutes at a current density of 15Am / dm² to 50Am / dm² of the anode at room temperature. The second plating step; preferably consists of.

In the present invention, the hydrogen embrittlement removing step, it is preferable to heat the silver plated wire in a vacuum state at a temperature of 100 ℃ to 150 ℃ for 2 to 4 hours.

In the present invention, the high molecular compound of the coating step is preferably parylene (parylene).

In the present invention, it is preferable to further include a heat treatment step of heat-treated by heating the polymer compound coated wire at a temperature of 100 ℃ to 150 ℃ for 2 to 4 hours in a vacuum state.

The present invention relates to an orthodontic wire in which a metal element such as nickel (Ni) or titanium (Ti) is alloyed at a predetermined ratio and coated with the surface of a metal wire used in a medical procedure such as orthodontic treatment. The irregular surface is formed, and a silver plating layer is formed on the surface of the wire, and the surface of the silver plating layer is formed with a coating of a polymer compound.

In the present invention, the silver plating layer is preferably formed of a first plating layer and a second plating layer.

In the present invention, the polymer compound coated on the surface of the silver plated wire is preferably parylene.

According to the present invention, the surface of the metal wire is irregularly formed so that the silver plating layer is firmly adhered to the metal wire and is plated, and the silver plating layer is protruded by the irregular surface of the wire, so that the silver plating layer and the polymer compound coating are firmly adhered to each other. There is.

In addition, it is possible to prevent discoloration of the silver plating layer in advance and to remove hydrogen embrittlement generated during processing of the metal wire, thereby making it easy to manufacture high quality wire.

1 is a schematic and cross-sectional view of a conventional wire.

Figure 2 is a flow chart illustrating a manufacturing method of the wai according to the present invention.

Figure 3 is a cross-sectional view showing a state in which the surface of the wire is irregularly processed according to the present invention, (a) is a cross-sectional view showing the surface of the wire, (b) shows a state where the wire surface is irregularly formed. One cross section.

4 is a cross-sectional view illustrating a state in which silver plating is performed on the wire of FIG. 3, (a) is a cross-sectional view showing a rough silver plating on the surface of the wire, and (b) is a rough silver plating. It is sectional drawing which shows the state which silver plating of the surface which selected the state was made.

5 is a cross-sectional view showing a state in which a polymer compound is coated on the silver plated wire of FIG. 4.

6 is a cross-sectional view showing a wire coated by the wire manufacturing method of the present invention.

* Explanation of Signs of Major Parts of Drawings *

100: wire 110: surface

112: irregular surface 120: silver plating layer

122: first plating film 124: second plating film

130: high molecular compound

Hereinafter, an embodiment of the orthodontic wire manufacturing method and the wire according to the present invention with reference to the accompanying drawings in detail as follows.

<Example of a method for manufacturing orthodontic wire>

Figure 2 is a flow chart illustrating a manufacturing method of the wire according to the present invention, Figure 3 is a cross-sectional view showing a state in which the surface of the wire is irregularly processed according to the present invention, (a) shows the surface of the wire (B) is a cross-sectional view showing a state in which the wire surface is irregularly formed, and FIG. 4 is a cross-sectional view showing a state in which silver plating is performed on the wire of FIG. (B) is a cross-sectional view showing a state in which the silver plating of the surface evenly formed a rough silver plating state, Figure 5 is a polymer compound on the silver-plated wire of FIG. It is sectional drawing which shows the coated state.

Wire surface processing step (S100) of Figure 2, to process the surface 110 of the wire 100 to form an irregular surface 112, titanium (Ti) or wire of the wire surface by the electrolytic etching (etching) method Since some of the alloy elements constituting the (100) are melted, metal elements such as nickel (Ni) protrude to form an irregular surface 112.

The mixture for the electrolytic etching is a mixture of sulfuric acid (H 2 SO ₄), nitric acid (HNO 3), fluoride (vinyl fluoride), the titanium constituting the wire by the mixture (Ti) due to the melting of the mixture due to nickel It is preferable that metal elements such as (Ni) protrude to form the irregular surface 112.

As shown in (a) of FIG. 3, the wire 100 has a smooth and stable structure, so that the plating solution or the coating compound may form the surface 110 of the wire 100 when plating or coating the wire 100. ), The plating solution or coating compound is shorted and plating or coating is easily peeled off.

However, if nickel alloys (Ni + Ti) alloy constituting the wire 100 or alloy elements except for a few metal elements such as nickel (Ni) among the alloys of various metals constituting the stainless steel or the wire 100 is selectively melted Since nickel (Ni) and the like protrude, the irregular surface 112 of the wire 100 is irregular and roughly formed as shown in FIG.

In addition, when processing the irregular surface 112 of the wire 100, a mixture of sulfuric acid (H₂SO₄) 5 ~ 90%, nitric acid (HNO₃) 5 ~ 90%, fluoride 5 ~ 90% is mixed at 25 ℃ of room temperature It is desirable to instantaneously electrolytic etch at a cathode current of 80 Am / dm 2 to 100 Am / dm 2 at -35 ° C.

In addition, the mixture is mixed with water (H₂O), the mixing ratio of the mixture according to the user's convenience and the composition of the metal elements constituting the wire sulfuric acid (H₂SO₂), nitric acid (HNO₃), fluoride (fluoride), The mixing ratio of water (H 2 O) is changeable and falls within the scope of the technical idea of the present invention.

The oxide removal step (S200) of FIG. 2 is to remove oxides (not shown) formed on the irregular surface 112 of the wire 100, and the titanium (Ti) or molten in the wire surface processing step (S100). The wire 100 is cleaned with a mixture of hydrochloric acid (HC 1), nitric acid (HNO 3), and fluoride to remove oxides such as residues or rust of other metal elements.

The mixture for removing the oxide is composed of 10 to 80% hydrochloric acid (HCℓ), 10 to 80% nitric acid (HNO₃), 10 to 80% fluoride (fluoride) 10 to 50 seconds at room temperature to clean the wire 100 irregular It is desirable to remove the metal oxide (not shown) accumulated on the surface 112.

In addition, the mixing ratio of the mixture is a mixture ratio of hydrochloric acid (HCℓ), nitric acid (HNO₃), fluoride (fluorine) depending on the user's convenience and the amount of oxide (not shown) accumulated on the irregular surface 112 or fixed state, etc. It is possible to change and belong to the scope of the technical idea of the present invention.

In the silver plating step (S300) of FIG. 2, the silver plating layer 120 is formed by plating silver (Ag) on the wire 100 of the irregular surface 112 on which the oxide is removed. A first plating step S302 for forming 122 and a second plating step S304 for forming a second plating film 124 are performed.

The first plating step (S302) is a rough coating of silver (Ag) instantaneously to the irregular surface 112 of the wire 100 by close contact structure of the silver (Ag) and the irregular surface 100 of the wire 100 completely It is to be made, which is as shown in Figure 4 (a).

In the first plating step S302, a mixture of silver cyanide (AgCN) 5 to 90% and cyanide (KCN) 10 to 95% is applied to the irregular surface 112 of the wire 100, and the current density at room temperature. It is preferable to electrolytically etch the wire for 10 to 15 seconds at 15 Am / dm² to 52 Am / dm².

In addition, the mixture is to be mixed with water (H₂O), the mixing ratio of the mixture is a mixture ratio of silver cyanide (AgCN), cyanide (KCN), water (H₂O) according to the user's convenience and the roughness of the mixture to be applied This change is possible and belongs to the scope of the technical idea of the present invention.

In addition, it is preferable that the insoluble iridium is further added and mixed with the mixture.

As described above, the second plating step S304 is formed on the irregular surface 112 of the wire 100 having completed the first plating step S302, and the second plating step S304 is performed by the first plating step S302. In order to stably plate the roughly plated surface in to smooth the lines of the fine protrusions, as shown in Figure 4 (b).

In the second plating step (S304), a mixture of silver cyanide (AgCN) 20 to 90%, PE (polyethylene) 0.01 to 1%, and cyanide (KCN) 10 to 90% is applied to the wire surface, and the current of the anode at room temperature. Electrolytic etching plating of the wire for 2 to 3 minutes with a density of 15 Am / dm 2 to 50 Am / dm 2 is preferred.

In addition, the mixture is mixed with water (H₂O), the mixing ratio of the mixture according to the user's convenience and the stability of the plated surface silver cyanide (AgCN), PE (polyethylene), cyanide (KCN), water ( The mixing ratio of H2O) is changeable and falls within the scope of the technical idea of the present invention.

The mixture for forming the wire surface processing step (S100), oxide removal step (S200), silver plating step (S300 ) is to form a mixture with water (H₂O).

In the hydrogen embrittlement removal step S400 of FIG. 2, brittleness is generated in the wire 100 by hydrogen (H) generated during silver (Ag) plating, which causes a problem of shortening the life of the wire 100. In order to remove this, the silver (Ag) is to dry the wire 100 is completed.

Hydrogen (H) generated in the wire 100 by heating and drying the silver-plated wire 100 to a temperature of 100 ℃ to 150 ℃ for 2 to 4 hours in a vacuum state in order to remove the hydrogen embrittlement It is to remove the, and to prevent the discoloration of the silver due to the low melting point of the silver is dried in a vacuum.

The coating step (S400) of FIG. 2 is to coat the polymer compound 130 on the wire 100 from which hydrogen embrittlement is removed, and the polymer compound 130 is made of parylene, which is harmless to the human body. It is preferred to be coated, as shown in FIG. 5.

The coating of the polymer compound 130 forms a coating of parylene directly on the wire 100 having silver plating, without forming a separate undercoat, which forms an irregular surface 112 on the wire 100. As a result, a structure in which protruding protrusions and parylene are formed to be in close contact with each other is formed to form a coating such that parylene is firmly in close contact with each other on the silver plating layer 120 of the wire 100.

In the heat treatment step S500 of FIG. 2, the wire 100 coated with the polymer compound 130 is heat-treated by heating at a temperature of 100 ° C. to 150 ° C. for 2 to 4 hours in a vacuum state, which is a silver plating layer ( 120) and the polymer compound 130 to achieve a tight contact with each other, to increase the coating strength of the paraline, and to prevent discoloration of the silver plated layer 120 by heat treatment in a vacuum state.

<Example of Orthodontic Wire>

Figure 6 is a front cross-sectional view showing a wire coated by the wire manufacturing method of the present invention.

As shown in FIG. 6, the orthodontic wire 100 includes a compound in which metal elements such as titanium (Ti) are instantaneously mixed except for some elements such as nickel (Ni) among the metal elements constituting the wire 100, and Since it is etched and melted by the cathode current, metal elements such as nickel (Ni) protrude to form an irregular surface 112.

In order to form the irregular surface 112 on the wire 100 as described above, a mixture of sulfuric acid (H₂SO₄), nitric acid (HNO₃), and fluoride is mixed at room temperature of 25 ° C to 35 ° C with a cathode current of 80Am / dm² to 100Am. It is desirable to electrolytically etch instantaneously at / dm².

In addition, the mixture is mixed with water (H 2 O) it is possible to change the concentration and mixing ratio of the mixture.

As described above, the silver plating layer 120 is formed on the wire 100 on which the irregular surface 112 is formed, and the silver plating layer 120 is formed of the first plating film 122 and the second plating film 124.

The first plating film 122 is a silver mixture is instantaneously electrolytically etched plating by an anodic current, the first plating film 122 is instantaneously roughened plating and irregular surface 112 of the wire 100 and It is to form a tight contact structure with each other.

To this end, the first plating film 122 is coated with a mixture of silver cyanide (AgCN) and cyanide (KCN) on the irregular surface 112 of the wire 100, and has a current density of 15 Am / dm² to 52 Am / dm² at room temperature. It is desirable to process the wire 100 for 10 to 15 seconds.

It is preferable that an insoluble iridium is further added and mixed in the mixture for forming the first plating film 122.

In addition, the mixture is mixed with water (H 2 O) it is possible to change the concentration and mixing ratio of the mixture.

The second plating film 124 is an electrolytically etched silver mixture on the wire 100 on which the first plating film 122 is formed with an anodic current. The second plating film 124 is finely plated by roughly plating the roughly formed plating film of the first plating film 122. The surface of the wire 100 is formed as a stable surface by plating an irregular surface, so that the wire 100 forms a silver plated layer 120 similar to tooth color, and the wire 100 is plated with silver that protrudes irregularly. Is to form a silver plated layer 120 similar to the tooth color.

To this end, the second plating film 124 is a current density of the anode on the surface of the first plating film 122 plated with a mixture of silver cyanide (AgCN), PE (polyethylene) and cyanide (KCN) on the wire 100. Electrolytic etching plating is preferably performed for 2 to 3 minutes at room temperature from 15 Am / dm² to 50 Am / dm².

In addition, the mixture is mixed with water (H 2 O) it is possible to change the concentration and mixing ratio of the mixture.

The coating of the polymer compound 130 is formed on the wire 100 on which the silver plating layer 120 is formed, and the polymer compound 130 is preferably parylene, and is plated by the silver plating layer 120. Irregularly protruding protrusions and the polymer compound 130 on the wire 100 forms a tight contact structure with each other to form a coating of the polymer compound (130).

As described above, the wire 100 is formed as an irregular surface 112, the silver plating layer 120 is formed, the wire 100 coated with the polymer compound 130 is completed by heat treatment to 100 ℃ in a vacuum state to It is preferable that the heat treatment by heating to a temperature of 150 ℃ for 2 to 4 hours.

In addition, the oxide (not shown) generated when forming the irregular surface 112 of the wire 100 is preferably removed by a separate mixture. For this purpose, hydrochloric acid (HCℓ)%, nitric acid (HNO₃), and fluoride More preferably, the mixed mixture is washed with wire at room temperature for 20 to 50 seconds.

In addition, the temperature at which the silver plating layer 120 does not discolor for a predetermined time in a vacuum state of the wire 100 on which the silver plating layer 120 is formed in order to remove hydrogen embrittlement generated when the silver plating layer 120 is formed. It is preferable to dry by heating, for this purpose it is more preferable to heat and dry the wire 100 for 2 to 4 hours at a temperature of 100 ℃ to 150 ℃.

What has been described above is just one embodiment for performing the orthodontic wire manufacturing method and the wire of the present invention, the present invention is not limited to the above embodiment, the subject matter of the present invention claimed in the claims below Without departing from the technical spirit of the present invention to the extent that any person skilled in the art to which the present invention pertains various modifications can be said.

Claims (13)

In the method for manufacturing orthodontic wire, in which metal elements such as nickel (Ni) and titanium (Ti) are alloyed at a predetermined ratio, and the surface of the metal wire used for medical procedures such as orthodontics is coated. Wire surface processing step (S100) for processing the surface of the wire to form an irregular surface; An oxide removal step (S200) for removing oxides formed on the surface of the wires formed with the surface processing of the wires; A silver plating step (S300) of plating silver (Ag) on the surface of the wire on which the oxide is removed; A hydrogen embrittlement removing step (S400) for removing hydrogen embrittlement of the silver-plated wire; And Orthodontic wire manufacturing method characterized in that consisting of; coating step (S500) for coating a polymer compound on the wire is removed hydrogen embrittlement (水 素 脆性). The method of claim 1, The wire surface processing step (S100), the orthodontic wire processing method, characterized in that by melting the titanium (Ti) of the surface of the wire by electrolytic etching (Ni) to protrude nickel (Ni) to form an irregular surface. The method of claim 1, The wire surface processing step (S100), the surface of the wire is processed by a mixture of 5 to 90% sulfuric acid (H₂SO₄), 5 to 90% nitric acid (HNO₃), 5 to 90% fluoride (vinyl fluoride) Orthodontic wire processing method characterized in that. The method of claim 1, The oxide removal step (S200), the orthodontic wire processing step, characterized in that for cleaning the wire with a mixture for removing the oxide generated in the wire surface processing step (S100). The method according to claim 1 or 4, The oxide removal step (S200), the mixture of 10 ~ 80% hydrochloric acid (HCℓ), 10 ~ 80% nitric acid (HNO₃), 10 ~ 80% fluoride (fluoride) 10 to 80 seconds at room temperature to the wire surface Orthodontic wire processing method characterized in that the cleaning. The method of claim 1, The silver plating step (S300), the orthodontic wire processing method, characterized in that consisting of the first plating step (S302) and the second plating step (S304). The method according to claim 1 or 6, In the silver plating step (S300), a mixture of silver cyanide (AgCN) 5 to 90% and cyanide (KCN) 10 to 95% is applied to the surface of the wire, and the current density is 15Am / dm² to 52Am / dm² at room temperature for 10 seconds. First plating step (S302) for processing the surface of the wire for 15 seconds to; And A mixture of 20 to 90% silver cyanide (AgCN), 0.01 to 1% PE (polyethylene) and 10 to 90% cyanide (KCN) is applied to the surface of the wire, and the anode has a current density of 15 Am / dm² to 50 Am / dm² at room temperature. Orthodontic wire processing method, characterized in that consisting of; second plating step (S304) of the wire electrolytic etching process for 2 to 3 minutes. The method of claim 1, The hydrogen embrittlement removing step (S400), the orthodontic wire processing method characterized in that for heating the silver (Ag) plated wire in a vacuum state at a temperature of 100 ℃ to 150 ℃ for 2 to 4 hours. The method of claim 1, The polymeric compound of the coating step (S500) is parylene (parylene) characterized in that the orthodontic wire processing method. The method according to claim 1 or 9, Orthodontic wire processing method characterized in that it further comprises a heat treatment step (S600) for heating the polymer compound coated wire in a vacuum at a temperature of 100 ℃ to 150 ℃ for 2 to 4 hours. In the orthodontic wire coated with the surface of the metal wire used in the medical procedure such as orthodontics by alloying metal elements such as nickel (Ni) and titanium (Ti) at a predetermined ratio, The surface 110 of the wire 100 forms an irregular surface 112, and forms a silver (Ag) plating layer 120 on the irregular surface 112, and a polymer compound (S) on the surface of the silver (Ag) plating layer 120. Orthodontic wire, characterized in that the coating of 130). The method of claim 11, The silver (Ag) plating layer 120, the orthodontic wire, characterized in that formed by the first plating film 122 and the second plating film (124). The method of claim 11 or 12, Orthodontic wire, characterized in that the polymer compound 130 is coated on the surface of the silver plating layer 120 is parylene (parylene).