KR20090102219A - Method for manufacturing light emitting diode package - Google Patents

Abstract

PURPOSE: A method for manufacturing a light emitting diode package is provided to improve heat radiation characteristic and light emitting efficiency. CONSTITUTION: A heat conductive filler and a high polymer are filled in a mold and are formed. A plurality of cavities are formed in one side of a package body(110). An electrode(120) passes through the package body. A light emitting diode chip(140) is mounted on the lower part of the cavity formed in the package body. A light emitting diode chip and an electrode are electrically connected with a bonding unit(150). The light emitting diode and the bonding unit are sealed using the molding resin.

Description

Method for manufacturing light emitting diode package

The present invention relates to a light emitting device, and more particularly, to a method of manufacturing a light emitting diode package manufactured using a thermoplastic polymer material and a thermally conductive filler.

Light emitting diodes (LEDs) are widely used in signs, displays, automobiles, traffic lights, backlights, and general lighting, and continue to grow in their respective fields. Recently, a small and small liquid crystal display (LCD), which is used for a monitor, a notebook, a mobile communication terminal, etc., has been in the spotlight, and the light emitting diode field has also developed together. Since the LCD does not generate light by itself, it is common to have a backlight used as a light source for generating light from the back or side of the LCD panel because a light emitting diode is mainly used as the backlight.

The light emitting diode is environmentally friendly, has a response speed of about several nanoseconds, enables high speed response, and has a long life and high impact resistance. In addition, the light emitting diode can freely change the brightness, color temperature, etc. by adjusting the amount of light of the red, green, and blue light emitting diodes, and is excellent in color reproducibility, and is also suitable for light and thin shortening. Therefore, in recent years, it is attracting attention as a light source for illumination that can replace fluorescent and incandescent bulbs.

The light emitting diode for lighting requires characteristics of high light quantity, high efficiency, and large area, and accordingly, the light emitting diode package also requires characteristics such as high heat dissipation, light weight, small size, and reliability. In addition, in order to spread the light emitting diode for lighting, it is necessary to develop a low-cost LED package platform that can reduce the material cost and process cost.

1 is a side view showing the structure of a light emitting diode package employing a lead frame structure according to the prior art.

Referring to FIG. 1, in the LED package employing the lead frame structure according to the related art, the LED chip 40 is mounted on the lead frame 20, and then wire bonded 50. The molding resin 60 is injected into the injection molding 30 surrounding the lead frame 20. However, as shown in FIG. 1, a light emitting diode package employing a lead frame has difficulty in lightening and thinning a package due to the weight of the lead frame, and increases in overall material costs because the lead frame itself is expensive. In addition, the chip design due to the placement of the lead frame is a big constraint, and additional heat dissipation system such as heat sink 10 for heat dissipation was required.

In order to solve this problem, there is a light emitting diode package using a low temperature co-fired ceramic (LTCC) as another type of light emitting diode package replacing the above-described lead frame structure. Figure 2 is a side view showing the structure of a light emitting diode package using a low temperature co-fired ceramic (LTCC) according to the prior art.

Referring to FIG. 2, the light emitting diode package using the LTCC may include a lower ceramic sheet 11, an electrode 21, an upper ceramic sheet 31, a reflector 32, a light emitting diode chip 41, a wire bonding 51, The molding resin 61 is included. As described above, the light emitting diode package using the LTCC is capable of cavity processing through punching, and a conventional leadframe structure in that a light emitting diode package can be manufactured by stacking a plurality of ceramic sheets. There is an advantage to replace, but there are the following problems.

First, since the light emitting diode package using LTCC uses a ceramic substrate, the material cost is not only expensive, and there is a high risk of cracking as the size of the substrate increases, so that a plurality of LED chips are mounted on one substrate. I'm having a hard time. In addition, since the coefficient of thermal expansion is different between the ceramic substrate and the molding resin, a defect such as a drop in wire bonding may occur.

In addition, the light emitting diode package using the LTCC adopts a conventional ceramic substrate process as it is when manufacturing the package, so the manufacturing process of the light emitting diode package is complicated. That is, in the method of manufacturing a light emitting diode package using the LTCC, in order to form a cavity, which is a space in which the light emitting diode chip is to be mounted, a plurality of processes, such as a punching / cutting process, a stacking process, and a firing process, must be performed. In addition, the cavity fabricated by the punching / cutting and lamination processes always has a vertical plane, and thus it is difficult to secure a wide angle of light (light emitting angle) in the LED package.

Accordingly, the present invention provides a method of manufacturing a light emitting diode package that can improve heat dissipation characteristics through a simple process.

In addition, the present invention is not limited in design, and provides a method of manufacturing a light emitting diode package capable of lightening, thinning, and miniaturization.

In addition, the present invention provides a light emitting diode package manufacturing method that can greatly increase the light emission intensity, the light emission efficiency.

Other objects of the present invention will be readily understood through the following description.

According to an aspect of the present invention, by inserting and molding a thermoplastic polymer material and a thermally conductive filler (filler) in a pre-made mold, manufacturing a package body in which a plurality of cavities (cavity) is formed on one surface; Forming an electrode penetrating the package body; Mounting a light emitting diode chip on a bottom surface of the cavity formed in the package body; Electrically connecting the light emitting diode chip and the electrode using a bonding means; And sealing the light emitting diode chip and the bonding means by using a molding resin.

Here, the package body is produced by a method of compression molding the thermoplastic polymer material in powder form and the thermally conductive filler in powder form, or the package body is melted in the thermoplastic polymer material and molten state The thermally conductive filler may be manufactured by injection molding by injecting the mold into the mold.

In addition, the package body may be molded to form an inclined surface formed on a side wall located between two adjacent cavities, the electrode is formed by inserting a conductive material into the through-hole penetrating the package body, the electrode Prior to forming a, it may further comprise the step of forming the through hole through a drilling process to the position to form the electrode.

The electrode is formed by inserting a conductive material into a through hole penetrating through the package body, and the through hole is formed corresponding to a position where the electrode is to be formed. At the same time as the manufacturing step, the thermoplastic polymer material is a liquid crystal polymer (LCP, liquid crystal polymer), polyetherimide (PEI, polyetherimide), polyether sulfone (PES, Polyethersulfone), polyether ether ketone (PEEK, Polyetheretherketone) and polytetrafluoroethylene (PTFE).

In addition, the thermally conductive filler may be a ceramic filler, in which case the ceramic filler may be any one of spherical, flake, whisker, and combinations thereof.

The method may further include applying a phosphor to an upper surface of the molding resin, wherein the package body may be manufactured in a bar type, and the plurality of cavities may be formed in one line on the surface of the package body.

According to another aspect of the present invention, by inserting a thermoplastic polymer material and a thermally conductive filler (filler) in a pre-fabricated mold, forming a package body in which a plurality of through parts are formed; Forming an electrode penetrating the package body at a position different from the position at which the through portion is formed; Attaching an adhesive tape to one surface of the package body such that a closed surface is formed in one direction of the through part; Mounting a light emitting diode chip on the closed surface formed on the penetrating portion; Electrically connecting the light emitting diode chip and the electrode using a bonding means; And sealing the light emitting diode chip and the bonding means by using a molding resin.

At this time, the package body is manufactured by a method of compression molding the thermoplastic polymer material in the powder state and the thermally conductive filler in the powder state into the mold, or the thermoplastic polymer material in the molten state and the thermal conductivity in the molten state. It can be produced by a method of injection molding the filler into the mold.

The electrode may be formed by inserting a conductive material into a through hole penetrating through the package body, and before forming the electrode, forming the through hole through a drilling process at a position where the electrode is to be formed. The electrode may be further formed by inserting a conductive material into a through hole penetrating the package body, wherein the through hole is formed corresponding to a position where the electrode is to be formed. The process may be performed at the same time as manufacturing the package body.

In addition, the thermoplastic polymer material is a liquid crystal polymer (LCP), polyetherimide (PEI, polyetherimide), polyethersulfone (PES, Polyethersulfone), polyether ether ketone (PEEK, Polyetheretherketone) and polytetrafluoroethylene ( PTFE or polytetrafluoroethylene, or the thermally conductive filler may be a ceramic filler, and the ceramic filler may be any one of spherical, flake, whisker, and combinations thereof. .

And after the sealing of the light emitting diode and the bonding means, removing the adhesive tape; And applying a phosphor to a surface from which the adhesive tape has been removed. The package body may be manufactured in a bar type, and the plurality of through parts may be formed in a line on the package body.

According to the LED package manufacturing method according to the present invention, it is possible to improve the heat radiation characteristics of the LED package through a simple process.

In addition, according to the present invention, without limiting the design, it is possible to implement a light weight, thinner, smaller size of the LED package.

In addition, according to the present invention, the light emission intensity and light emission efficiency of the LED package can be greatly improved.

1 is a side view showing the structure of a light emitting diode package employing a lead frame structure according to the prior art.

Figure 2 is a side view showing the structure of a light emitting diode package using a low temperature co-fired ceramic (LTCC) according to the prior art.

Figure 3 is a side view showing the structure of a light emitting diode package according to a first embodiment of the present invention.

FIG. 4A is a plan view of the light emitting diode package shown in FIG. 3 as viewed from above. FIG.

Figure 4b is a side view showing only the package body in the light emitting diode package shown in FIG.

Figure 5 is a side view showing the structure of a light emitting diode package according to a second embodiment of the present invention.

6 is a side view showing the structure of a light emitting diode package according to a third embodiment of the present invention;

Figure 7 is a side view showing the structure of a light emitting diode package according to a fourth embodiment of the present invention.

8A to 8D are flowcharts schematically illustrating a manufacturing method of the light emitting diode package illustrated in FIG. 6.

9A to 9D are plan views showing the top view of the LED package in the manufacturing process corresponding to the order shown in FIGS. 8A to 8D, respectively.

10A and 10B are structural diagrams showing the structure of a light emitting diode lighting module according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

110: package body 120: electrode

130: cavity 140: light emitting diode chip

150: bonding means 160: molding part

170: fluorescent layer

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term and / or includes a combination of a plurality of related items or any item of a plurality of related items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a side view showing the structure of a light emitting diode package according to a first embodiment of the present invention, FIG. 4a is a plan view showing a top view of the light emitting diode package shown in FIG. 3, and FIG. 5b is shown in FIG. 3. In the illustrated light emitting diode package, only the package body is shown, and FIG. 6 is a side view showing the structure of the light emitting diode package according to the second embodiment of the present invention.

3 and 4B, the light emitting diode package according to the first embodiment of the present invention includes a package body 110, an electrode 120, a light emitting diode chip 140, a bonding means 150, and a molding part 160. ) And the fluorescent layer 170.

In this case, the electrode 120 is formed through the package body 110 to be connected to an external power source. In addition, the LED chip 140 is mounted on the bottom surface of the cavity 130 formed in the package body 110 and electrically connected to the electrode 120 through the bonding means 150. Therefore, the LED chip 140 performs a light emission operation corresponding to an electrical signal transmitted from an external power source through the bonding means 150 and the electrode 120. The molding part 160 fixes and seals the LED chip 140 and the bonding means 150. The fluorescent layer 170 is applied to the light emitting surface of the LED package, and serves to increase light emission characteristics or light emission efficiency when light generated from the LED chip 140 is output to the outside of the package.

The light emitting diode package according to the embodiment of the present invention has a main feature on the package main body 110, and will be described below with reference to a material, a shape, and a molding method of the package main body 110. Do it. In addition, a more detailed description of the aforementioned components will be described later with reference to FIGS. 8A to 9D.

In the first embodiment of the present invention, the package body 110 may be manufactured in a bar type, in which a plurality of cavities 130 are formed on one surface in a row, as shown in FIG. 4B. In the drawings presented throughout this specification, only three cavities are formed in the package body for convenience of drawing, but a larger number of cavities may be formed in one side of the package body. In addition, it will be readily understood from the following description that the package body may be manufactured in various forms other than the bar shape.

In this case, since the light emitting diode chip 140 is mounted on the bottom surface of the cavity 130 formed in the package body 110, the package body 110 may be manufactured in a bar shape. Since the light emitting diode chips are mounted in a plurality of cavities at one time, productivity improvement such as reduction in manufacturing time and manufacturing cost can be expected, as compared with the conventional packaging and used separately for each light emitting diode chip. In addition, since more LED chips can be mounted in one package, there is an advantage in that the light emission intensity and light emission efficiency of the LED package are further improved. However, in the prior art, it is difficult to manufacture a light emitting diode package in a long bar type. As described above, when the substrate made of a ceramic material is thin and long, there is a high risk of cracking or cracking.

In the first embodiment of the present invention, the material of the package body 110 includes a thermoplastic polymer material together with a thermally conductive filler. First, referring to the thermoplastic polymer material, when the package body 110 is manufactured using the thermoplastic polymer material, it is possible to manufacture the package body 110 thin and long. At this time, the package body 110 serves as a support for forming a base surface of the LED package so that the LED chip mounted thereon can be stably positioned, and withstands heat generated by driving the LED chip. It should be possible. Therefore, the thermoplastic polymer material to be used to fabricate the package body 110 needs to have heat resistance at high temperatures and excellent mechanical strength.

Thermoplastic materials having such heat resistance and mechanical strength include polyetherimide (PEI), polyethersulfone (PES, polyethersulfone), polyetheretherketone (PEEK, polyetheretherketone), and polytetrafluoride, which are known as high-performance engineering plastics. Ethylene (PTFE, polytetrafluoroethylene), and liquid crystal polymer (LCP). In particular, the liquid crystal polymer (LCP) has excellent features such as heat resistance, rigidity, dimensional stability, molding processability, etc., and is inexpensive in terms of price and is attracting attention among high-functional engineering plastics.

In addition, the package body 110 needs to easily dissipate heat generated as the LED chip is driven. This is because if the heat dissipation is not performed smoothly, the temperature inside the package becomes very high and the light emitting diode chip may malfunction such as the wavelength of the emitted light is changed or its output is shaken. Therefore, as described above, the package body 110 according to the first embodiment of the present invention may be manufactured using a composite of a thermoplastic polymer-thermally conductive filler in which a thermally conductive filler is added to the thermoplastic polymer material. . The thermally conductive filler is a filler having excellent thermal conductivity, and according to the first embodiment of the present invention, may be a ceramic filler. However, it will be apparent to those skilled in the art that in addition to the ceramic filler, the present invention may be used without limitation in the scope without departing from the object of the present invention. Package body 110 using a composite material in which a ceramic filler having excellent thermal conductivity and low thermal expansion such as fused SiO 2, alumina (Al 2 O 3), boron nitride (BN), and the like is dispersed in a thermoplastic polymer material If manufactured, it is greatly helpful in improving the heat radiation function of the manufactured LED package.

At this time, the shape of the thermally conductive filler may be any one of a form consisting of a spherical shape, a flake (flake), a whisker type and a combination thereof. When various types of thermally conductive fillers are used in the fabrication of the package body 110, through the combination of various filler structures, an increase in the average free movement path of the electrons due to a difference in aspect ratio, which is one of the thermally conductive components, is achieved. This results in improved thermal conductivity.

According to the present embodiment, the content of the thermally conductive filler in the package body 110 of the LED package may be variously added within 40 to 95wt%. However, when the thermally conductive filler content is 70 wt.% Or more, it may cause an increase in price due to the addition of expensive thermally conductive fillers, and due to the high addition amount, it is difficult to disperse the process, thereby limiting the production of a uniform molded body. .

As described above, in order to manufacture the package body 110 into a long bar type by using the thermoplastic polymer material, the thermoplastic polymer material and the thermally conductive filler are put into a pre-made mold and compression molding or injection molding. You can.

For example, when fabricating the package body 110 using an injection molding method, first, the thermoplastic polymer and the thermally conductive filler are heated to a molten state, and then the same shape as that of the package body 110 to be manufactured. By injecting a thermoplastic polymer material and a thermally conductive filler in a molten state into a mold prepared in advance, a package body 110 having a desired shape may be manufactured. Next, in the case of manufacturing the package main body 110 using the compression molding method, the thermoplastic polymer material in the powder state and the thermally conductive filler in the powder state are put in a preheated mold and pressed with a press to simultaneously heat. In this way, the package body 110 having a desired shape can be manufactured.

In particular, the compression molding method has a lower process cost than the injection molding method, and thus, the molding process is performed under high temperature and high pressure using a compressor, so that each of the molecules of the thermoplastic polymer powder and the thermally conductive filler powder is tightly bound. ), A package body 110 having better heat resistance and mechanical strength can be manufactured.

As described above, in the first embodiment of the present invention, since the package body 110 is manufactured by compression molding or injection molding using a composite of a thermoplastic polymer and a thermally conductive filler, the package body 110 may be manufactured in various shapes according to the shape of a previously manufactured mold. The package body 110 having a shape and a shape can be produced. That is, in the present invention, since the design of the package body 110 to be manufactured may be easily changed and changed by a method of changing the mold design, the package body 110 manufactured according to the first embodiment of the present invention may have any design. There is no restriction.

In addition, unlike the case of the conventional LED package using the LTCC which is difficult to expand the orientation angle as the cavity is formed by the punching / cutting method, the LED package according to the manufacturing method according to the first embodiment of the present invention is directed Each magnification can also be easily implemented. This is because the shape of the package body 110 is determined according to the mold, and therefore, it is not difficult to form an inclined surface on the sidewalls located at the boundary between the cavities or to change the height of the sidewalls.

In the case of the LED package according to the second embodiment of the present invention shown in FIG. 5, the sidewalls formed between two adjacent cavities in the package body 110 are formed lower than in the case of FIG. It can be easily confirmed.

In addition, in the prior art, when the cavity was formed, it had to go through a complicated process of punching (or cutting)-> lamination-> firing, but in the first embodiment of the present invention, the package body in a state in which the cavity is already formed by compression molding or the like Since it is possible to manufacture the at once, it can be expected to simplify the process, improve the productivity.

Descriptions relating to materials, shapes, molding methods, etc. of the package body 110 may be applied to the LED package according to another embodiment of the present invention, which will be described later. Duplicate description of) will be omitted.

6 is a side view showing the structure of a light emitting diode package according to a third embodiment of the present invention, Figure 7 is a side view showing the structure of a light emitting diode package according to a fourth embodiment of the present invention.

6 and 7, the light emitting diode package according to the third and fourth embodiments of the present invention also includes a package body 110, an electrode 120, a light emitting diode chip 140, a bonding means 150, The molding unit 160 and the fluorescent layer 170 is included.

However, the light emitting diode package illustrated in FIGS. 6 and 7 has a structure different from that of the light emitting diode package illustrated in FIGS. 3 and 5. This is due to the difference in the light emitting surface of the LED package. That is, in the case of FIGS. 3 and 5, the light emitting surface of the LED chip 140 is different from that of the light emitting surface of the LED chip 140. It is formed in the direction which a bottom face faces. Therefore, the fluorescent layer 170 applied to the light emitting surface is formed on the molding unit 160 in FIGS. 3 and 5, but in the case of FIGS. 7 and 8, the cavity in which the light emitting diode chip 140 is mounted. It is formed on the base surface of the substrate.

In the case of FIGS. 6 and 7, the bottom surface of the LED chip 140 has a structure in which a light emitting surface is formed in a direction that the bottom surface of the light emitting diode chip 140 is directed to emit light upward from the bottom surface thereof. It is called a light emitting diode package. As described above, the LED package having the bottom up structure has an advantage in that a direction in which the light emitting angle is not limited by sidewalls positioned at the boundary between the cavities 130 does not occur. Hereinafter, a manufacturing method will be described, for example, when the light emitting diode package has a bottom up structure of the form shown in FIG. 6.

8A to 8D are flowcharts schematically illustrating a manufacturing method of the light emitting diode package illustrated in FIG. 6, and FIGS. 9A to 9D are plan views of the flowcharts illustrated in FIGS. 8A to 8D. Here, FIGS. 8A to 8D illustrate cutting planes cut on the basis of X-X 'lines in FIGS. 9A to 9D, respectively.

Referring to FIGS. 8A and 9A, a package body 110 having a plurality of through parts 130 formed in a row is manufactured. As described above, the thermoplastic polymer material and the thermally conductive filler may be put into a mold manufactured according to the shape, and may be manufactured by compression molding or injection molding.

At this time, the package body 110 shown in Figures 8a and 9a, unlike the case where a plurality of cavities are formed in the package body in the case of Figures 3 to 5, both the upper surface and the lower surface (through) in the open state A plurality of portions 130 are formed. As such, the reason why the through-hole is formed in the package body is not the cavity because the LED package illustrated in FIG. 6 has a bottom-up structure unlike the LED package illustrated in FIG. 3 or 5. However, the through part formed in this step is also closed in one direction while going through a later step (see FIGS. 8D and 9D), so that the final manufactured package will have a cavity shape. The cavities are indicated by the same reference numerals.

At this time, the through hole 121 is further formed in the package body 110 illustrated in FIGS. 8A and 9A in addition to the plurality of through parts 130. The through hole 121 is manufactured to form the electrode 120, and may be simultaneously formed with the electrode 120 corresponding to the position where the electrode 120 is formed in the manufacturing process of the package body 110. Of course, it is apparent to those skilled in the art that the through hole 121 may be formed through a drilling process such as mechanical processing or laser processing, separately from the manufacture of the package body 110.

8B and 9B, an electrode 120 is formed by inserting a conductive material into the through hole 121 formed in the package body 110. In this case, as a method of forming the electrode 120, a general method such as filling a conductive paste in the through hole 121 or thinly plating the inner wall of the through hole 121 may be used. At this time, of course, an electrode pad should be formed at one end of the electrode 120.

8C and 9C, first, an adhesive tape (for example, UV tape or the like as illustrated in the drawing) is attached to one surface of the package body 110. The reason for attaching the adhesive tape as described above is to provide a space and a mounting surface on which the LED chip 140 can be mounted by closing one open surface of the through part 130 and switching to a closed surface. Therefore, the LED chip 140 is mounted on the mounting surface produced by the adhesive tape.

Thereafter, the LED chip 140 and the electrode 120 are electrically connected through the bonding means 150. In the drawings, the wire is bonded using the wire as the bonding means 150, but various bonding methods including flip chip bonding and the like may be used.

8D and 9D, first, the LED chip 140 and the bonding means 150 are sealed using the molding resin 160. This is to protect the light emitting diode chip 140 and to preserve the shape of the bonding means 150 and to prevent separation / separation. In general, as the molding resin 160, a transparent silicone resin, an epoxy molding compound (EMC), or the like may be used, and a fluorescent material may be mixed and used to improve light emission characteristics or light emission efficiency.

After the light emitting diode chip 140 and the bonding means 150 are fixedly sealed through the above-described process, the adhesive tape which is attached is removed. At this time, since the light emitting diode chip 140 and the bonding means 150 are fixedly sealed by the molding resin 160, the original shape is maintained even when the adhesive tape is removed. The reason why the adhesive tape is removed in this manner is that the surface on which the adhesive tape is attached (that is, the bottom surface of the light emitting diode chip 140) constitutes the light emitting surface in the light emitting diode package having the bottom up structure. However, when the adhesive tape itself is made of a light transmissive material, it may not need to be removed. In this case, the phosphor 170 may be coated on the surface from which the adhesive tape is removed, and the phosphor 170 may help to increase light emission characteristics and light emission efficiency of the LED package as described above.

8A to 9D described the manufacturing method assuming the case of a light emitting diode package having a bottom-up structure of the form of FIG. 6, but this is also a large number in the manufacturing of the light emitting diode package shown in FIGS. Of course, the parts can be similarly applied. However, since the light emitting diode package illustrated in FIGS. 3 and 5 does not have a bottom-up structure unlike FIGS. 6 and 7, portions of the LED package illustrated in FIGS. 8A through 9D that do not correspond to FIGS. 3 and 5 ( The description relating to the formation of the penetrating portion, the attachment and removal of the adhesive tape, and the application position of the phosphor) should be reinterpreted in accordance with the structure of the LED package shown in FIGS. 3 and 5. However, this is a part that can be easily inferred by those skilled in the art through the package structure shown in FIGS. 3 and 5, and a further description thereof will be omitted.

Hereinafter, the structure of the LED lighting module according to an embodiment of the present invention will be described with reference to FIGS. 10A and 10B. 10A and 10B are structural diagrams showing the structure of a light emitting diode lighting module according to an embodiment of the present invention.

The LED lighting modules 200a and 200b may be manufactured by arranging a plurality of LED packages 110 (1), 110 (2), 110 (3), 110 (4), 110 (5) and hereinafter referred to as 110. have. The LED lighting modules 200a and 200b manufactured by arranging a plurality of LED packages 110 manufactured through the above-described process may be manufactured in a square or rectangular shape as shown in FIGS. 10A and 10B. . However, it will be apparent to those skilled in the art that the LED package 110 may be arranged in various ways to manufacture various types of LED lighting modules 200a and 200b in addition to squares or rectangles.

The light emitting diode lighting module 200a or 200b is composed of a plurality of light emitting diode packages 110. As described above, the design change is very free and solves reliability problems such as cracks. It is possible to manufacture the diode lighting module (200a, 200b). In addition, as the thermoplastic resin is used, it is possible to reduce the weight and size, and to reduce the material cost and the process cost according to mass production, and a thermally conductive filler is used to provide excellent heat dissipation effect.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be readily understood that modifications and variations are possible.

Claims (21)

Manufacturing a package body in which a plurality of cavities are formed on one surface by inserting and molding a thermoplastic polymer material and a thermally conductive filler into a previously manufactured mold; Forming an electrode penetrating the package body; Mounting a light emitting diode chip on a bottom surface of the cavity formed in the package body; Electrically connecting the light emitting diode chip and the electrode using a bonding means; And Sealing the light emitting diode chip and the bonding means using a molding resin. The method of claim 1, The package body The thermoplastic polymer material in powder form and the thermally conductive filler in powder form are manufactured by a method of compression molding the mold. The method of claim 1, The package body is manufactured by a method of injection molding the thermoplastic polymer material in the molten state and the thermally conductive filler in the molten state by injection molding. The method of claim 1, The package body is a manufacturing method of a light emitting diode package, characterized in that the molding is formed so that the inclined surface is formed on the side wall located between two adjacent cavities. The method of claim 1, The electrode is formed by inserting a conductive material into the through hole penetrating the package body, Prior to forming the electrode, The method of manufacturing a light emitting diode package comprising the step of forming the through hole through a drilling process to the position to form the electrode. The method of claim 1, The electrode is formed by inserting a conductive material into the through hole penetrating the package body, The through hole is formed corresponding to a position where the electrode is to be formed, and the forming of the through hole is performed at the same time as manufacturing the package body. The method of claim 1, The thermoplastic polymer material is liquid crystal polymer (LCP), polyetherimide (PEI, polyetherimide), polyethersulfone (PES, Polyethersulfone), polyether ether ketone (PEEK, Polyetheretherketone) and polytetrafluoroethylene (PTFE, Polytetrafluoroethylene) any one of the manufacturing method of the light emitting diode package. The method of claim 1, The thermally conductive filler is a method of manufacturing a light emitting diode package, characterized in that the ceramic filler. The method of claim 8, The ceramic filler is a spherical, flake (flake), whisker (whisker) type, and any one of the form consisting of a combination thereof. The method of claim 1, The method of manufacturing a light emitting diode package comprising the step of applying a phosphor on the upper surface of the molding resin. The method of claim 1, The package body is manufactured in a bar type, wherein the plurality of cavities are formed in a line on the one surface of the package body, characterized in that the manufacturing method of the LED package. Manufacturing a package body in which a plurality of through parts are formed by inserting and molding a thermoplastic polymer material and a thermally conductive filler in a previously manufactured mold; Forming an electrode penetrating the package body at a position different from the position at which the through portion is formed; Attaching an adhesive tape to one surface of the package body such that a closed surface is formed in one direction of the through part; Mounting a light emitting diode chip on the closed surface formed on the penetrating portion; Electrically connecting the light emitting diode chip and the electrode using a bonding means; And Sealing the light emitting diode chip and the bonding means using a molding resin. The method of claim 12, The package body The thermoplastic polymer material in powder form and the thermally conductive filler in powder form are manufactured by a method of compression molding the mold. The method of claim 12, The package body is manufactured by a method of injection molding the thermoplastic polymer material in the molten state and the thermally conductive filler in the molten state by injection molding. The method of claim 12, The electrode is formed by inserting a conductive material into the through hole penetrating through the package body, and before forming the electrode, The method of manufacturing a light emitting diode package comprising the step of forming the through hole through a drilling process to the position to form the electrode. . The method of claim 12, The electrode is formed by inserting a conductive material into the through hole penetrating the package body, The through hole is formed corresponding to a position where the electrode is to be formed, and the forming of the through hole is performed at the same time as manufacturing the package body. . The method of claim 12, The thermoplastic polymer material is liquid crystal polymer (LCP), polyetherimide (PEI, polyetherimide), polyethersulfone (PES, Polyethersulfone), polyether ether ketone (PEEK, Polyetheretherketone) and polytetrafluoroethylene (PTFE, Polytetrafluoroethylene) any one of the manufacturing method of the light emitting diode package. The method of claim 12, The thermally conductive filler is a method of manufacturing a light emitting diode package, characterized in that the ceramic filler. The method of claim 18, The ceramic filler is a spherical, flake (flake), whisker (whisker) type, and any one of the form consisting of a combination thereof. The method of claim 12, After sealing the light emitting diode and the bonding means, Removing the adhesive tape; And The method of manufacturing a light emitting diode package, characterized in that it further comprises the step of applying a phosphor on the surface from which the adhesive tape has been removed. The method of claim 12, The package body is manufactured in a bar type, wherein the plurality of through parts are formed in a line in the package body, characterized in that the manufacturing method of the LED package.