KR20090098057A - Apparatus for picking up semiconductor chips - Google Patents

Abstract

An apparatus for picking up semiconductor chips stored in a tray using a plurality of short screw rods are provided to simplify the assembly process by easily controlling the pitch of the absorbers absorbing the above semiconductor chip. A semiconductor chip pickup device(1) is located in the upper of the tray(2) including pocket(2a) formed with a constant pitch. A semiconductor chip(3) having the pitch like the pitch of pockets is accepted to the single in pockets. The above semiconductor chip pick up device comprises the base(10) which was to the front. The above semiconductor chip pick up device comprises the first and second screws(20,30) pivotally installed by the bearing(12) of the upper part of the base in the top of the base. The above semiconductor pickup device comprises absorbers(51,52,53,54,55) of the single having the pitch controlled according to the rotation ratio of the first and the second screw. The above semiconductor chip located in each pocket is absorbed with absorbers with the vacuum pressure. The driving unit rotates the first and the second screw.

Description

Semiconductor Chip Pickup Device {APPARATUS FOR PICKING UP SEMICONDUCTOR CHIPS}

The present invention relates to a semiconductor chip pick-up apparatus, and more particularly, to an apparatus for picking up and transferring a row of semiconductor chips arranged in a tray.

In the semiconductor process, a tray (ie, a seed tray) for receiving a plurality of semiconductor chips is used for transporting a semiconductor chip (particularly a packaged semiconductor chip). Such a tray has a plurality of pockets in which semiconductor chips are stored, the plurality of pockets being in a plurality of rows.

During semiconductor chip transport, the pocket size of the tray is determined to be substantially the same as that of the semiconductor in order to prevent the semiconductor chip from shaking and being damaged. The size of the semiconductor chip is different for each product, and therefore, trays for storing semiconductor chips are also used in various standards. Depending on the size of the tray, the pitch of the pockets in which the semiconductor chips are accommodated varies.

During the semiconductor process, in particular for the inspection of semiconductor chips, an apparatus for picking up and transferring several semiconductor chips in a row of trays at a time is needed. Typically, such an apparatus includes a plurality of vacuum adsorbers arranged in a row, and the plurality of vacuum adsorbers simultaneously pick up and transport a series of semiconductor chips. However, as the type of semiconductor chip to be transported changes, the size of the tray and the pitch of the pocket accordingly change, so that the pitch change between the vacuum absorbers is also required.

In accordance with the above requirements, in accordance with the change in the pocket pitch of the tray, devices that enable the pitch adjustment between the vacuum adsorber has been developed in the past. Such an apparatus is disclosed in Korean Patent Publication No. 10-2004-0009803 published under the name of "Semiconductor Chip Package Transfer Device with Free Pitch Adjustment of Vacuum Absorption Pad" as an example. have.

The prior art document discloses a structure in which a plurality of vacuum adsorption pads are threadedly inserted into a single screw rod, and a plurality of threads in opposite directions are formed on the single screw rod, respectively, based on a center dividing the vacuum adsorption pads. do. In addition, the conventional technology, the plurality of threads formed on the one hand relative to the center has a pitch ratio of the thread from the first thread to the nth thread is 2n-1, so that the pitch of the vacuum adsorption pads is always variable at a constant ratio. do.

However, the conventional technique causes all the vacuum suction pads used for the pickup of the semiconductor chip to be pitch-adjustable to one single screw rod, thereby causing an increase in the length of the single screw rod and thus the width of the pickup device. Increasing the width of the pickup device causes the semiconductor pickup device to occupy an unnecessarily large occupied area in the semiconductor manufacturing plant, thereby greatly reducing practicality and economy. In addition, the assembly process of inserting a large number of vacuum adsorption pads into a threaded rod with a large number of threads of different pitches is very difficult in reality, and many problems are caused by the inaccurate assembly of the vacuum adsorption pads even though it is possible by a special design such as a screw rod. Implies In addition, since several heavy vacuum adsorption pads are installed on an unnecessarily long screw rod, deformation of the screw rod is caused by a large load.

Accordingly, the technical problem of the present invention is to place a plurality of relatively short screw rods up and down instead of one long screw rod used in the conventional semiconductor chip pick-up apparatus for pitch adjustment of a vacuum absorber (or vacuum suction pad). It is to provide a semiconductor chip pick-up apparatus including a structure to be used.

In accordance with an aspect of the present invention, a semiconductor chip pickup device includes a base, first and second screw rods rotatably installed side by side in a longitudinal direction on the base, and adjacent to each other in a horizontal direction. The first and second variable adsorbers which are installed in a threaded manner in each of the forward threads of each of the two threaded rods, and driving means for rotating the first and second threaded rods, the rotational ratio of the first and second threaded rods or According to the screw pitch ratio, the distance between the first variable adsorber and the second variable adsorber is configured to be adjusted.

Preferably, further comprising a fixed adsorber fixed to the base close to the first vacuum adsorber and away from the second vacuum adsorber, wherein the fixed adsorber has a gap with respect to the first variable adsorber, the first And is arranged to be equal to the distance between the variable adsorber and the second variable adsorber.

Preferably, each of the first and second threaded rods has reverse threads of the same thread pitch as the forward threads on opposite sides of the fixed adsorber, and each of the first and second threaded rods has reverse threads. The third and fourth variable adsorbers are installed in a screw feed manner symmetrically with the first variable adsorber and the second adsorber.

According to one embodiment of the invention, the screw pitch ratio of the first screw rod and the second screw rod is the same, the rotation ratio of the first screw rod and the second screw rod is 2: 1. In this case, a first gear is installed on the first screw rod, and a second gear is tooth-engaged with the first gear on the second screw rod, and the first or second gear is rotated for the rotation of the first and second gears. A third gear that is tooth-engaged with the second gear is provided on the drive shaft, wherein a gear ratio of the second gear to the first gear is 1/2.

Alternatively, the gaps between the fixed adsorber and the variable adsorbers may be made equal by a rotation ratio of the first screw rod and the second screw rod, and the screw pitch ratio of the first screw rod and the second screw rod is 1: 2, That is, the pitch can be adjusted.

Preferably, the semiconductor chip pickup device further includes LM guide means for slidably supporting the first, second, third, and fourth variable adsorbers in a horizontal direction.

 Preferably, the fixed adsorption unit and the first, second, third, and fourth variable adsorbers each include a base block, a pneumatic cylinder provided in the base block, and a vacuum lifted up and down by the pneumatic cylinder. Including a suction head, the base block of the fixed adsorber is fixedly fastened to the base, each of the base block of the first and third variable adsorber is threadedly connected to the forward and reverse threads of the first screw rod, The base blocks of the second and fourth variable adsorbers are threadedly connected to the forward and reverse threads of the second screw rod.

According to the present invention, according to the change in the pitch of the semiconductor chips in a row, the pitch of the adsorber adsorbing the semiconductor chip can be easily made. In addition, unlike the conventional semiconductor chip pick-up device that adjusts the pitch of the vacuum adsorber by using a long single screw rod, the pitch of the vacuum adsorber is adjusted by using a plurality of relatively short screw rods, so the pick-up is caused by the long length of the screw rod. The problem that the width of the device becomes unnecessarily large can be solved. In addition, the conventional pickup device has a structure in which a plurality of threads having different pitches are formed on one screw rod, so that an assembly process of connecting the adsorber to the threads of different pitches is very difficult, but according to the present invention. Since the threads of the same pitch in opposite directions are used, it is possible to solve conventional problems such as difficulty in assembling.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 shows another semiconductor chip pick-up apparatus and a tray containing semiconductor chips picked up by the pick-up apparatus in one embodiment of the present invention, and FIG. 2 shows a portion of the absorbers of the semiconductor pick-up apparatus removed. It is.

 1 and 2, the semiconductor chip pick-up apparatus 1 is positioned above the tray 2 including the row of pockets 2a formed at a predetermined pitch. In the pockets 2a, a plurality of semiconductor chips 3 are arranged in a row at the same pitch as the pitches of the pockets 2a.

The semiconductor chip pick-up apparatus 1 includes first and second screws rotatably installed on the base 10 by the base 10 facing forward and the bearings 12 on the base 10. And four fours (20, 30). In the semiconductor pickup device 1, when the pitch of the pocket 2a changes due to the replacement of the tray 2, the pitch is changed by the rotation ratio of the first and second screw rods 20 and 30. A row of adsorbers 51, 52, 53, 54, 55 that can be adjusted are included, and the adsorbers 51, 52, 53, 54, 55 are semiconductor chips located in each pocket 2a by vacuum pressure. 3) It is used for adsorption and transport. The adsorbers 51, 52, 53, 54, 55 and their pitch control structures will be described in more detail below.

The first screw rod 20 and the second screw rod 30 are installed side by side in the longitudinal direction. The first and second screw rods 20 and 30 are symmetrically formed with forward threads 22 and 32 and reverse threads 24 and 34 on both left and right sides with respect to the center. At this time, the first screw rod 20 and the second screw rod 30, the thread pitch is the same regardless of the screw direction (shown well in Figure 2).

The first screw rod 20 and the second screw rod 30 are configured to rotate by a driving means 40 including a motor (not shown). The driving means includes a first gear 42 provided on the first screw rod 20, a second gear 44 provided on the second screw rod 30, and a main shaft 47 of the motor. And a third gear 46. The first gear 42 is tooth engaged with the second gear 44, and the third gear 46 is tooth engaged with the first gear 42. Therefore, when the main shaft 47 is rotated by the motor drive, both the first screw rod 20 and the second screw rod 30 rotates.

In addition, the gear ratio of the second gear 44 to the first gear 42 is 1/2, so, the rotation ratio of the first screw rod 20 and the second screw rod 30 is 1 2 is. Accordingly, when the first screw rod 20 rotates one time, the second screw rod 30 rotates two times.

The aforementioned series of adsorbers includes a stationary adsorber 51 and first, second, third and fourth variable adsorbers 52, 53, 54, 55. The fixed adsorber 51 is fixed to the base 10 and has no movement in the lateral direction. On the other hand, the first, second, third, and fourth variable adsorbers 52, 53, 54, 55 are screw-mounted to the first screw rod 20 or the second screw rod 30 described above. , It is conveyed in the transverse direction, and contributes to the pitch adjustment of the adsorbers 51, 52, 53, 54, 55 by the transverse conveyance as described below. The variable adsorbers 52, 53, 54 or 55 are represented by threads of partial dashed lines engaged with the screw rods 20 or 30.

 The first and second variable adsorbers 52 and 53 are disposed in order on the left side of the fixed adsorber 51, and the third and fourth variable adsorbers in order on the right side of the fixed adsorber 51. 54 and 55 are arranged. In addition, the first variable adsorber 52 and the third variable adsorber 54 are laterally symmetrical with respect to the fixed adsorber 51 and the forward thread 22 and the reverse thread of the first screw rod 20. Each screw 24 is screwed. In addition, the second variable adsorber 53 and the fourth variable adsorber 55 may be laterally symmetrical with respect to the fixed adsorber 51 and the forward thread 32 and the reverse thread of the second screw rod 30. 34 are screw-mounted respectively.

In this case, the fixed adsorption unit 51 is disposed such that the interval with respect to the first variable adsorption unit 52 is equal to the interval between the first variable adsorption unit 52 and the second variable adsorption unit 53. In addition, the fixed adsorber 51 is arranged such that the interval with respect to the three variable adsorber 54 is equal to the interval between the third variable adsorber and the fourth variable adsorber 55. Thus, the pitch of the adsorbers is constant before their transverse conveyance.

Looking at the relationship between the fixed adsorber 51, the first variable adsorber 52, the second variable adsorber 53, the rotation ratio of the first screw rod 20 and the second screw rod 30 is 1: 2 and the forward thread pitches of the first and second threaded rods 20 and 30 are the same, so that the distance between neighboring adsorbers is changed by the rotation of the first and second threaded rods 20 and 30. The ratio of the distance between the first variable type adsorber 52 and the second variable type adsorber 53 to the fixed adsorber 51 is always maintained at 1: 2. This means that the pitch of the adsorbers 52 and 53 on the left side can be adjusted based on the fixed adsorber 51.

On the contrary, looking at the relationship between the fixed adsorber 51, the third variable adsorber 54, and the fourth variable adsorber 55, the rotation ratio of the first screw rod 20 and the second screw rod 30 is 1: 2 and the reverse thread pitches of the first and second threaded rods 20, 30 are the same, so that the spacing between neighboring adsorbers is reduced by the rotation of the first and second threaded rods 20, 30. Even if it varies, the ratio of the distance between the fixed variable absorber 51 and the third variable absorber 54 and the fourth variable absorber 55 is always maintained at 1: 2. This means that the pitch of the adsorbers 54 and 55 on the right side of the fixed adsorber 51 can be adjusted.

  As a whole, based on the fixed adsorber 51, the first and second variable adsorbers 52 and 53 on the left side and the third and fourth variable adsorbers 54 and 55 on the right side are symmetrically adjusted, This means that the overall pitch adjustment of the adsorbers 51, 52, 53, 54, 55 arranged in a row is possible.

Although only a semiconductor chip pick-up device including two screw rods 20 and 30 is shown in the drawing, a semiconductor chip pick-up apparatus including three or more screw rods is also within the scope of the present invention. 1: 2n, where n is the fastest rotating screw rod order.

As shown in FIG. 1, the fixed adsorber 51 and the first, second, third, and fourth variable adsorbers 52, 53, 54, and 55 each have a base block 512, 522, 532. , 542, 552, pneumatic cylinders 514, 524, 534, 544, 554 installed in the base block, and vacuum suction heads 516, 526, 536, 546, 556 that are lifted up and down by the pneumatic cylinders. ).

The base block of the fixed adsorption unit 51 is fixed to the base 10, and each of the base blocks 522 and 542 of the first and third variable adsorption units 52 54 is formed of the first screw rod 20. It is threadedly connected to the forward thread 22 and the reverse thread 24, each of the base blocks 532, 552 of the second and fourth variable adsorbers 53, 55 each of the second threaded rod 30 It is threadedly connected to the forward thread 32 and the reverse thread 34.

The vacuum suction heads 516, 526, 536, 546, 556 are lowered by the pneumatic cylinders 514, 524, 534, 544, 554, and then each pocket 2a of the tray 2 under vacuum pressure. After adsorbing the semiconductor chips 3 stored therein, the semiconductor chips 3 are lifted by the upward driving of the pneumatic cylinders 514, 524, 534, 544, and 554. Then, the base 10, on which the adsorbers 51, 52, 53, 54, 55 are installed, moves to carry the semiconductor chips 3 to a desired position.

In addition, the first, second, third, and fourth variable adsorbers 52, 53, 54, 55 are slidably supported in the horizontal direction by linear motion (LM) guide means on the base 10. In this embodiment, the LM guide means are arranged side by side up and down, the first LM guide 72 and the second and third variable adsorber 53 supporting the first and fourth variable adsorbers 52, 55. And a second LM guide 74 supporting 54.

3 is a view for explaining a semiconductor chip pick-up apparatus according to another embodiment of the present invention. Referring to FIG. 3, the first gear 42 provided in the first screw rod 20 and the second gear 44 provided in the second screw rod 30 have the same diameter and the same tooth shape, and thus the first gear The screw rod 20 and the second screw rod 30 rotate at a rotation ratio of 1: 1. Instead, the screw pitch ratio of the first threaded rod 20 and the second threaded rod 30 is 1: 2. Therefore, when the first screw rod 20 and the second screw rod 30 rotates 1: 1, the pitch of the adsorbers 51, 52, 53, and 54 are increased and decreased while the intervals remain the same. Can be. At this time, the number of screw rods may be three or more, in this case, the screw pitch ratio is 1: 2N, and N is the order of the screw rods having the largest pitch.

1 is a view for explaining a semiconductor chip pickup device according to an embodiment of the present invention.

FIG. 2 is a view illustrating the removal of some components of each of the adsorbers of the semiconductor chip pickup apparatus shown in FIG.

3 is a view for explaining a semiconductor chip pickup device according to another embodiment of the present invention.

Claims (8)

A base; First and second screw rods rotatably installed side by side on the base; First and second variable adsorbers positioned side by side in the lateral direction and installed in a threaded manner on the forward threads of each of the first and second threaded rods; It includes a drive means for rotating the first and second screw rods, The semiconductor chip pick-up apparatus, wherein the distance between the first variable adsorber and the second variable adsorber is adjusted according to the rotation ratio or the screw pitch ratio of the first and second screw rods. The method of claim 1, further comprising a fixed adsorber fixed to the base close to the first vacuum adsorber and away from the second vacuum adsorber, wherein the fixed adsorber is, the spacing with respect to the first variable adsorber, the first The semiconductor chip pick-up apparatus, characterized in that arranged so as to be equal to the interval between the first variable adsorber and the second variable adsorber. The method of claim 2, wherein each of the first and second threaded rod has a reverse thread of the same thread pitch as the forward thread on the opposite side relative to the fixed adsorber, the reverse thread of each of the first and second threaded rod And a third and fourth variable adsorber are installed in a screw transfer manner symmetrically with the first variable adsorber and the second adsorber. The semiconductor chip pickup device according to claim 3, wherein a rotation ratio of the first screw rod and the second screw rod is the same, and a screw pitch ratio of the first screw rod and the second screw rod is 1: 2. The semiconductor chip pickup device according to claim 3, wherein a screw pitch ratio of the first screw rod and the second screw rod is the same, and a rotation ratio of the first screw rod and the second screw rod is 2: 1. 6. The method of claim 5, wherein the first gear provided to the first screw rod and the second gear tooth-engaged with the first gear while installed on the second screw rod, and the first gear for rotation of the first and second gear And a third gear on the drive shaft that is tooth-engaged with the second gear, wherein a gear ratio of the second gear to the first gear is 1/2.  4. The semiconductor chip pickup device according to claim 3, further comprising LM guide means for slidably supporting the first, second, third, and fourth variable adsorbers in a horizontal direction. The method according to claim 3, The fixed adsorption unit and the first, second, third and fourth variable adsorption units each include a base block, a pneumatic cylinder installed on the base block, and a vacuum adsorption head which is lifted up and down by the pneumatic cylinder. , The base block of the fixed adsorber is fixed to the base, Each of the base blocks of the first and third variable adsorbers is threadedly connected to the forward and reverse threads of the first screw rod, And the base blocks of the second and fourth variable adsorbers are threadedly connected to the forward and reverse threads of the second screw rod.

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