KR20090084707A - 연마 장치, 연마재를 구비한 회로 기판 시험 장치, 및 연마공정을 구비한 회로 기판 제조 방법 - Google Patents

연마 장치, 연마재를 구비한 회로 기판 시험 장치, 및 연마공정을 구비한 회로 기판 제조 방법 Download PDF

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Publication number
KR20090084707A
KR20090084707A KR1020090006940A KR20090006940A KR20090084707A KR 20090084707 A KR20090084707 A KR 20090084707A KR 1020090006940 A KR1020090006940 A KR 1020090006940A KR 20090006940 A KR20090006940 A KR 20090006940A KR 20090084707 A KR20090084707 A KR 20090084707A
Authority
KR
South Korea
Prior art keywords
polishing
circuit board
abrasive
pin
tip
Prior art date
Application number
KR1020090006940A
Other languages
English (en)
Korean (ko)
Inventor
도시히로 이시즈카
유타카 노다
마사하루 스즈키
Original Assignee
후지쯔 가부시끼가이샤
가부시키가이샤 토란스토론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쯔 가부시끼가이샤, 가부시키가이샤 토란스토론 filed Critical 후지쯔 가부시끼가이샤
Publication of KR20090084707A publication Critical patent/KR20090084707A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Measuring Leads Or Probes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020090006940A 2008-01-31 2009-01-29 연마 장치, 연마재를 구비한 회로 기판 시험 장치, 및 연마공정을 구비한 회로 기판 제조 방법 KR20090084707A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-021625 2008-01-31
JP2008021625A JP2009178821A (ja) 2008-01-31 2008-01-31 研磨装置、研磨材を備えた回路基板試験装置、及び研磨工程を備えた回路基板製造方法

Publications (1)

Publication Number Publication Date
KR20090084707A true KR20090084707A (ko) 2009-08-05

Family

ID=40944562

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090006940A KR20090084707A (ko) 2008-01-31 2009-01-29 연마 장치, 연마재를 구비한 회로 기판 시험 장치, 및 연마공정을 구비한 회로 기판 제조 방법

Country Status (3)

Country Link
JP (1) JP2009178821A (zh)
KR (1) KR20090084707A (zh)
CN (1) CN101497173A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015102435A (ja) * 2013-11-26 2015-06-04 株式会社村田製作所 検査装置
CN107263256B (zh) * 2017-08-11 2019-05-10 烟台三维汽车配件有限公司 一种注塑模具拉料针端部旋磨装置
US11245238B2 (en) 2018-10-11 2022-02-08 International Business Machines Corporation Tool for shaping contact tab interconnects at a circuit card edge

Also Published As

Publication number Publication date
JP2009178821A (ja) 2009-08-13
CN101497173A (zh) 2009-08-05

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