KR20090081731A - LTCC module - Google Patents

Abstract

An LTCC module is provided to easily perform a module having integration is high by reducing the signal loss and miniaturize the size of module. An LTCC module comporises power plan, upside/downside ground, signal via, upside/downside microstrip line, and upside/downside ground via connection line. The power plan has anode slit. The upside/downside ground is formed on the parallel surface having interval with upside/downside of the power plan and forms upside/downside slit. The signal via is extended through the upside slit on the upper end and through downside slit on lower end.

Description

LTCC module {LTCC module}

The present invention relates to an LTC module, and more particularly, to reduce the signal and radiation loss of the LTC module, and more easily to implement a module with high integration, and relates to an LTC module capable of miniaturizing the size of the module.

Low Temperature Cofired Ceramics (LTCC) technology has been partially applied for military use in the first place, but it is mainly applied to passive devices for high frequency communication and applied to medical, home appliances, wireless communication parts and satellite digital multimedia broadcasting tuners. It is expanding rapidly.

LTC is mainly made of a glass and ceramic material that is thinner than a paper called green sheet, cut into several pieces and coated with metal such as gold, silver and copper on each sheet to match the role of a simple electrode or device. And the technology to make a module by stacking them in several layers and firing at the same time (because the ceramic and metal must be baked at the same time, sintering at 1,000 ℃ or lower, which is lower than the temperature of firing only ceramics for metals with low melting point) Say.

LTC's manufacturing processes include Slitting, Preconditioning, Blank, Punch, Fill, Print, Inspect, Laminate, Copa It consists of earing (Cofiring), post fire processing, electrical testing, signing, and final inspection.

1 to 3 is a view showing the configuration of the conventional MT module, the conventional LT module, the power plan 10, the upper surface of the power plan 10, the predetermined power plan 10, the anode slit 10h is formed The upper ground 20 is formed on the parallel surface having an interval and the upper slit 20h is formed, the lower surface of the power plan 10 is formed on a parallel surface having a predetermined interval and the lower slit 30h is formed. Lower ground 30, the upper end extends through the upper slit 20h, the lower end extends through the lower slit 30h, the signal via 40, horizontally in one direction from the upper end of the signal via 40 The upper microstrip line 50 extends, and the lower microstrip line 60 extending horizontally in the other direction from the lower end of the signal via.

As described above, the conventional LTC module disclosed in FIGS. 1 to 3 has a disadvantage in that radiation loss may increase because there is no part for grounding around the signal via 40.

4 to 6 is a view showing the configuration of another conventional LTC module for solving the above-described problems, the other conventional LTC module, the upper side when compared with the conventional LTC module disclosed in FIGS. The ground via V connecting the ground 20 and the lower ground 30 is added.

As described above, another conventional LTCC module disclosed in FIGS. 4 to 6 has sufficient grounding around the signal via 40 only by the ground via V connecting the upper ground 20 and the lower ground 30. There is a problem that the signal loss occurs because it does not provide.

In addition, when the thickness between the upper microstrip line 50 and the upper ground 20 and the lower microstrip line 60 and the lower ground 30 is different or too thick, there is a limit in reducing signal loss. Radiation to the outside or surface waves may occur, causing signal interference.

The present invention has been made in view of the above problems, it is possible to more easily implement a module with a high degree of integration as the signal and radiation loss of the LTC module can be more easily implemented, and to reduce the size of the module module Its purpose is to provide.

In order to achieve this technical problem, the MT module of the present invention, the power plan is formed a positive electrode slit; An upper ground formed on a parallel surface having a predetermined distance from an upper surface of the power plan and having an upper slit formed thereon; A lower ground formed on a parallel surface having a predetermined distance from a lower surface of the power plan and having a lower slit formed thereon; A signal via an upper end extending through the upper slit and a lower end extending through the lower slit; An upper microstrip line extending horizontally in one direction from an upper end of the signal via; A lower microstrip line extending horizontally from the lower end of the signal via in the other direction; An upper ground via connection line spaced apart from the upper microstrip line on a plane on which the upper microstrip line is formed; A lower ground via connection line spaced apart from the lower microstrip line on a plane on which the lower microstrip line is formed; And a plurality of ground vias connected to at least the upper ground and the lower ground and selectively connected to the upper ground via connection line or the lower ground via connection line.

Preferably, the plurality of ground vias are circularly arranged at the same angle with respect to the signal via.

Preferably, a ground via at a position corresponding to an upper microstrip line among the plurality of ground vias is connected to the upper ground, lower ground, and lower ground via connection lines, and corresponds to a lower microstrip line among the plurality of ground vias. The ground via of the position is characterized in that connected to the upper ground, lower ground, upper ground via connection line.

More preferably, the remaining ground vias except for the ground vias of positions corresponding to upper microstrip lines or lower microstrip lines among the plurality of ground vias may include the upper ground, lower ground, upper ground via connection lines, and lower ground via connection lines. It is characterized in that connected with.

Preferably, when the width of the upper microstrip line is formed wider than the width of the lower microstrip line, the diameter of the upper slit is characterized in that formed larger than the diameter of the lower slit.

Preferably, when the width of the lower microstrip line is formed wider than the width of the upper microstrip line, the diameter of the lower slit is characterized in that formed larger than the diameter of the upper slit.

Preferably, the upper ground via connection line and the lower ground via connection line may be formed in a semicircular ring shape facing each other with respect to the signal via.

In order to achieve another technical problem, the MT module of the present invention, the power plan is formed a positive electrode slit; An upper ground formed on a parallel surface having a predetermined distance from an upper surface of the power plan and having an upper slit formed thereon; A lower ground formed on a parallel surface having a predetermined distance from a lower surface of the power plan and having a lower slit formed thereon; A signal via an upper end extending through the upper slit and a lower end extending through the lower slit; An upper microstrip line extending horizontally in one direction from an upper end of the signal via; A lower microstrip line extending horizontally from the lower end of the signal via in the other direction; And a plurality of ground vias connected to the upper ground and the lower ground.

Preferably, the plurality of ground vias are circularly arranged at the same angle with respect to the signal via.

Preferably, when the width of the upper microstrip line is formed wider than the width of the lower microstrip line, the diameter of the upper slit is characterized in that formed larger than the diameter of the lower slit.

Preferably, when the width of the lower microstrip line is formed wider than the width of the upper microstrip line, the diameter of the lower slit is characterized in that formed larger than the diameter of the upper slit.

Preferably, the upper ground via connection line and the lower ground via connection line may be formed in a semicircular ring shape facing each other with respect to the signal via.

According to the present invention as described above, it is possible to reduce the signal and radiation loss of the MT module.

In addition, as the signal loss is reduced, a module having a high degree of integration can be more easily implemented, and the size of the module can be reduced.

[First Embodiment]

As shown in FIGS. 7 to 9, the LTC module of the first embodiment includes a power plan 10, an upper ground 20, a lower ground 30, a signal via 40, and an upper microstrip line 50. ), A lower microstrip line 60, an upper ground via connection line 70, a lower ground via connection line 80, and a ground via 90.

The anode slit 10h is formed at the center of the power plan 10, and in detail, the power plan 10 is formed on one green sheet s1 and then the other green sheet s2 is powered. Covering the top of the plan 10 to form a positive electrode slit (10h) in the center portion of the power plan (10).

The upper ground 20 is formed on a parallel surface having a predetermined distance from the upper surface of the power plan 10, in this case, the upper slit corresponding to the anode slit 10h in the center portion of the upper ground 20 20h is formed. In detail, the upper ground 20 is formed on the upper surface of the green sheet s2 covered by the upper surface of the power plan 10, and then the other green sheet s3 is covered on the upper surface of the upper ground 20 so that the upper side is The upper slit 20h of the ground 20 is formed.

The lower ground 30 is formed on a parallel surface having a predetermined distance from the lower surface of the power plan 10, and in this case, the lower slit corresponding to the anode slit 10h is formed at the center of the lower ground 30. 30h is formed. Specifically, the lower ground 30 is formed on the lower surface of the green sheet s1 located on the lower surface of the power plan 10, and then the other green sheet s4 is covered on the lower surface of the lower ground 30 to lower the lower side. The lower slit 30h of the ground 30 is formed.

The signal via 40 has an upper end extending through the upper slit 20h and a lower end extending through the lower slit 30h.

In detail, the signal via 40 penetrates the green sheets s1 to s4 as a whole, and an upper end of the signal vias 40 is formed to penetrate to an upper surface of the green sheet s3 covering the upper surface of the upper ground 20. The lower end of the signal via 40 is formed to penetrate to the lower surface of the green sheet s4 covering the lower surface of the lower ground 30.

The upper microstrip line 50 extends horizontally in one direction from the upper end of the signal via 40, and extends horizontally on the upper surface of the green sheet s3 covering the upper surface of the upper ground 20, and the lower side. The microstrip line 60 extends horizontally from the lower end of the signal via 40 to the other direction and extends horizontally on the lower surface of the green sheet s4 covering the lower surface of the lower ground 30.

The upper ground via connection line 70 is connected to the upper microstrip line 50 on a plane on which the upper microstrip line 50 is formed, that is, on the upper surface of the green sheet s3 covering the upper surface of the upper ground 20. The lower ground via connection line 80 is spaced apart from each other, and the lower microstrip line 80 is formed on the plane on which the lower microstrip line 60 is formed, that is, on the lower surface of the green sheet s4 covering the lower surface of the lower ground 30. It is formed spaced apart from the line (60).

In this case, the above-described upper ground via connection line 70 and the lower ground via connection line 80 are formed in a semicircular ring shape facing each other with respect to the signal via 40 as shown in FIG. 10. do.

A plurality of ground vias 90 are connected to at least the upper ground 20 and the lower ground 30, and selectively connected to the upper ground via connection line 70 or the lower ground via connection line 80. That is, the ground via 90 simultaneously connects the upper ground 20, the lower ground 30, and the lower ground via connection line 80, or connects the upper ground 20, the lower ground 30, and the upper ground via. The lines 70 may be simultaneously connected or the upper ground 20, the lower ground 30, the upper ground via connecting line 70, and the lower ground via connecting line 80 may be simultaneously connected.

In this case, the plurality of ground vias 90 are circularly arranged at the same angle with respect to the signal via 40.

Meanwhile, as shown in FIG. 10, the ground via 90 at a position corresponding to the upper microstrip line 50 among the ground vias 90 may include the upper ground 20, the lower ground 30, The ground via 90 connected to the lower ground via connection line 80 and corresponding to the lower microstrip line 60 among the plurality of ground vias 90 is the upper ground 20 and the lower ground ( 30, it is preferable to be connected to the upper ground via connection line 70.

The ground vias 90 except for the ground vias 90 at positions corresponding to the upper microstrip line 50 or the lower microstrip line 60 among the plurality of ground vias 90 are the upper grounds 20. The lower ground 30, the upper ground via connecting line 70, and the lower ground via connecting line 80 are preferably connected to the lower ground 30.

The LC module of the first embodiment configured as described above has a plurality of ground vias 90 connecting the upper ground 20 and the lower ground 30, and the upper microstrip line 50 is formed on a plane. By selectively connecting to the upper ground via connecting line 70 or the lower ground via connecting line 80 formed on the plane on which the lower microstrip line 60 is formed, the groundable portion is increased. Accordingly, there is an advantage that the loss of the signal can be reduced.

Second Embodiment

As shown in FIGS. 11 to 13, the LTC module of the second embodiment includes a power plan 10, an upper ground 20, a lower ground 30, a signal via 40, and an upper microstrip line 50. ), A lower microstrip line 60, and a ground via 90.

On the other hand, in the LT module of the second embodiment, detailed description of the same parts as in the first embodiment is omitted, and the same reference numerals are applied to the same name.

The upper microstrip line 50 extends horizontally in one direction from the upper end of the signal via 40 and extends horizontally on the upper surface of the green sheet s3 covering the upper surface of the upper ground 20, and the lower micro The strip line 60 extends horizontally from the lower end of the signal via 40 in the other direction and extends horizontally on the lower surface of the green sheet s4 covering the lower surface of the lower ground 30.

14, when the width a1 of the upper microstrip line 50 is wider than the width a2 of the lower microstrip line 60, the upper slit of the upper ground 20 is formed. When the diameter of 20h is formed to be larger than the diameter of the lower slit 30h of the lower ground 30, and the width of the lower microstrip line 60 is wider than the width of the upper microstrip line 50, The diameter of the lower slit 30h of the lower ground 30 is larger than the diameter of the upper slit 20h of the upper ground 20.

A plurality of ground vias 90 are connected to the upper ground 20 and the lower ground 30. In this case, the plurality of ground vias 90 are circularly arranged at the same angle with respect to the signal via 40.

In the MT module of the second embodiment configured as described above, a plurality of ground vias 90 connect the upper ground 20 and the lower ground 30, but the diameter of the upper slit 20h and the lower slit 30h. By controlling the ratio of the widths of the upper microstrip line 50 and the lower microstrip line 60 according to the size ratio of the diameters, the radiation and the loss of the signal can be reduced.

For example, the surface of the antenna should have a thick dielectric material, and for other RF circuits, the dielectric thickness should be thin to reduce signal loss. The upper microstrip line 50 is made thicker and wider to form an antenna, and the lower micro If the strip line 60 is thinner and narrower than the upper microstrip line 50 to form an RF circuit, the RF line circuit can be made compact and can be configured in an asymmetric structure.

Third Embodiment

As shown in FIGS. 15 to 17, the LTC module of the third embodiment includes a power plan 10, an upper ground 20, a lower ground 30, a signal via 40, and an upper microstrip line 50. ), A lower microstrip line 60, an upper ground via connection line 70, a lower ground via connection line 80, and a ground via 90.

On the other hand, in the LT module of the third embodiment, detailed descriptions of the same parts as in the first embodiment are omitted, and the same reference numerals are applied to the same names.

The upper microstrip line 50 extends horizontally in one direction from the upper end of the signal via 40 and extends horizontally on the upper surface of the green sheet s3 covering the upper surface of the upper ground 20, and the lower micro The strip line 60 extends horizontally from the lower end of the signal via 40 in the other direction and extends horizontally on the lower surface of the green sheet s4 covering the lower surface of the lower ground 30.

18, when the width a1 of the upper microstrip line 50 is wider than the width a2 of the lower microstrip line 60, the upper slit of the upper ground 20 is formed. When the diameter of 20h is formed to be larger than the diameter of the lower slit 30h of the lower ground 30, and the width of the lower microstrip line 60 is wider than the width of the upper microstrip line 50, The diameter of the lower slit 30h of the lower ground 30 is larger than the diameter of the upper slit 20h of the upper ground 20.

The upper ground via connection line 70 is connected to the upper microstrip line 50 on a plane on which the upper microstrip line 50 is formed, that is, on the upper surface of the green sheet s3 covering the upper surface of the upper ground 20. The lower ground via connection line 80 is spaced apart from each other, and the lower microstrip line 80 is formed on the plane on which the lower microstrip line 60 is formed, that is, on the lower surface of the green sheet s4 covering the lower surface of the lower ground 30. It is formed spaced apart from the line (60).

In this case, the upper ground via connection line 70 and the lower ground via connection line 80 described above are formed in a semi-circular ring shape facing each other with respect to the signal via 40.

A plurality of ground vias 90 are connected to at least the upper ground 20 and the lower ground 30, and selectively connected to the upper ground via connection line 70 or the lower ground via connection line 80. That is, the ground via 90 simultaneously connects the upper ground 20, the lower ground 30, and the lower ground via connection line 80, or the upper ground 20, the lower ground 30, and the upper ground via. The connection line 70 may be simultaneously connected or the upper ground 20, the lower ground 30, the upper ground via connection line 70, and the lower ground via connection line 80 may be simultaneously connected.

In this case, as shown in FIGS. 16 and 17, the ground via 90 may have a structure in which an upper portion and a lower portion are divided and electrically connected to each other via a lower ground 30, and each ground via 90 is formed. ) Are circularly arranged at the same angle about the signal via 40.

Meanwhile, the ground via 90 at a position corresponding to the upper microstrip line 50 among the ground vias 90 may include a ground via 90 connecting the upper ground 20 and the lower ground 30. And a ground via 90 connecting the lower ground 30 and the lower ground via connection line 80, and the ground via at a position corresponding to the lower microstrip line 60 among the plurality of ground vias 90. 90 is composed of a ground via 90 connecting the upper ground 20 and the lower ground 30, and a ground via 90 connecting the upper ground 20 and the upper ground via connection line 70. do.

The ground vias 90 except for the ground vias 90 at positions corresponding to the upper microstrip line 50 or the lower microstrip line 60 among the plurality of ground vias 90 are the upper grounds 20. , A ground via 90 connecting the lower ground 30 and the upper ground via connecting line 70, and a ground via 90 connecting the lower ground 30 and the lower ground via connecting line 80. do.

The LTC module of the third embodiment configured as described above has a plurality of ground vias 90 not only connecting the upper ground 20 and the lower ground 30, but in a plane in which the upper microstrip line 50 is formed. By selectively connecting to the upper ground via connecting line 70 or the lower ground via connecting line 80 formed on the plane on which the lower microstrip line 60 is formed, the groundable portion is increased. Accordingly, there is an advantage that the loss of the signal can be reduced.

In addition, a plurality of ground vias 90 connect the upper ground 20 and the lower ground 30, and according to the size ratio of the diameter of the upper slit 20h and the diameter of the lower slit 30h, the upper microstrip line ( 50) and the ratio of the width of the lower microstrip line 60, there is an advantage that can reduce the radiation and loss of the signal.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

1 is a plan view showing a conventional MT module.

Figure 2 is a cross-sectional view A-A showing a conventional MT module.

Figure 3 is a B-B cross-sectional view showing a conventional MT module.

Figure 4 is a plan view showing another conventional MT module.

Figure 5 is a cross-sectional view A-A showing another conventional LC module.

Figure 6 is a B-B cross-sectional view showing another conventional MT module.

7 is a plan view of the MT module of the first embodiment according to the present invention.

8 is a cross-sectional view A-A of the MT module of the first embodiment according to the present invention;

9 is a sectional view taken along the line B-B of the MT module of the first embodiment according to the present invention;

10 is a schematic perspective view of the MT module of the first embodiment according to the present invention;

Figure 11 is a plan view of the MT module of the second embodiment according to the present invention.

12 is a sectional view taken along the line A-A of the MT module of the second embodiment according to the present invention;

Fig. 13 is a sectional view taken along line B-B of the MT module of the second embodiment of the present invention.

14 is a schematic perspective view of the MT module of the second embodiment according to the present invention;

15 is a plan view of the MT module of the third embodiment according to the present invention;

16 is a sectional view taken along the line A-A of the MT module of the third embodiment of the present invention;

Fig. 17 is a sectional view taken along line B-B of the LTCC module of the third embodiment according to the present invention.

18 is a schematic perspective view of an LTC module of a third embodiment according to the present invention;

<Explanation of symbols for the main parts of the drawings>

10: power plan

10h: anode slit

20: upper ground

20h: Upper slit

30: Lower ground

30h: Lower slit

40: Signal Via

50: upper microstrip line

60: lower microstrip line

70: upper ground via connection line

80: lower ground via connection line

90: ground via

Claims (12)

A power plan in which anode slits are formed; An upper ground formed on a parallel surface having a predetermined distance from an upper surface of the power plan and having an upper slit formed thereon; A lower ground formed on a parallel surface having a predetermined distance from a lower surface of the power plan and having a lower slit formed thereon; A signal via an upper end extending through the upper slit and a lower end extending through the lower slit; An upper microstrip line extending horizontally in one direction from an upper end of the signal via; A lower microstrip line extending horizontally from the lower end of the signal via in the other direction; An upper ground via connection line spaced apart from the upper microstrip line on a plane on which the upper microstrip line is formed; A lower ground via connection line spaced apart from the lower microstrip line on a plane on which the lower microstrip line is formed; And The plurality of ground vias connected to at least the upper ground and the lower ground, and selectively connected to the upper ground via connection line or the lower ground via connection line. The method of claim 1, The plurality of ground vias may be circularly arranged at the same angle around the signal vias. The method of claim 1, Ground vias at positions corresponding to upper microstrip lines among the plurality of ground vias are connected to the upper ground, lower ground and lower ground via connection lines, and grounds at positions corresponding to lower microstrip lines among the plurality of ground vias. Via is connected to the upper ground, the lower ground, the upper ground via connection line, the MT module. The method of claim 3, Among the plurality of ground vias, the ground vias except for the ground vias corresponding to the upper microstrip line or the lower microstrip line may be connected to the upper ground, lower ground, upper ground via connection line, and lower ground via connection line. TC module characterized by the above. The method of claim 1, In the case where the width of the upper microstrip line is formed wider than the width of the lower microstrip line, the diameter of the upper slit is formed larger than the diameter of the lower slit module. The method of claim 1, When the width of the lower microstrip line is formed to be wider than the width of the upper microstrip line, the lower slit diameter of the LC module, characterized in that formed larger than the diameter of the upper slit. The method of claim 1, The upper ground via connection line and the lower ground via connection line, the LC module, characterized in that the semi-circular ring shape facing each other with respect to the signal via. A power plan in which anode slits are formed; An upper ground formed on a parallel surface having a predetermined distance from an upper surface of the power plan and having an upper slit formed thereon; A lower ground formed on a parallel surface having a predetermined distance from a lower surface of the power plan and having a lower slit formed thereon; A signal via an upper end extending through the upper slit and a lower end extending through the lower slit; An upper microstrip line extending horizontally in one direction from an upper end of the signal via; A lower microstrip line extending horizontally from the lower end of the signal via in the other direction; And An MT module comprising: a plurality of ground vias connected to the upper ground and the lower ground. The method of claim 8, The plurality of ground vias may be circularly arranged at the same angle around the signal vias. The method of claim 8, In the case where the width of the upper microstrip line is formed wider than the width of the lower microstrip line, the diameter of the upper slit is formed larger than the diameter of the lower slit module. The method of claim 8, When the width of the lower microstrip line is formed to be wider than the width of the upper microstrip line, the lower slit diameter of the LC module, characterized in that formed larger than the diameter of the upper slit. The method of claim 8, The upper ground via connection line and the lower ground via connection line, the LC module, characterized in that the semi-circular ring shape facing each other with respect to the signal via.

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