KR20090065474A - 비-표면 구성요소들의 삽입에 적절한 고 열전도성 물질로 인쇄회로기판을 제조하는 방법 - Google Patents
비-표면 구성요소들의 삽입에 적절한 고 열전도성 물질로 인쇄회로기판을 제조하는 방법 Download PDFInfo
- Publication number
- KR20090065474A KR20090065474A KR1020080128878A KR20080128878A KR20090065474A KR 20090065474 A KR20090065474 A KR 20090065474A KR 1020080128878 A KR1020080128878 A KR 1020080128878A KR 20080128878 A KR20080128878 A KR 20080128878A KR 20090065474 A KR20090065474 A KR 20090065474A
- Authority
- KR
- South Korea
- Prior art keywords
- drill
- holes
- metal
- hole
- printed circuit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 title claims description 9
- 238000003780 insertion Methods 0.000 title claims description 6
- 230000037431 insertion Effects 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims abstract description 9
- 239000007924 injection Substances 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 10
- 238000013461 design Methods 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000025 natural resin Substances 0.000 abstract description 10
- 239000004020 conductor Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000393496 Electra Species 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
- B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES200703342A ES2334193B1 (es) | 2007-12-17 | 2007-12-17 | Procedimiento de fabricacion de placas de circuito impreso con materiales base de alta conductibilidad termica aptas para la insercion de componentes no superficiales. |
| ESP200703342 | 2007-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090065474A true KR20090065474A (ko) | 2009-06-22 |
Family
ID=40806491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080128878A KR20090065474A (ko) | 2007-12-17 | 2008-12-17 | 비-표면 구성요소들의 삽입에 적절한 고 열전도성 물질로 인쇄회로기판을 제조하는 방법 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20090065474A (es) |
| CN (1) | CN101466202A (es) |
| ES (1) | ES2334193B1 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9357652B2 (en) | 2014-03-14 | 2016-05-31 | Samsung Electronics Co., Ltd. | Method of manufacturing circuit board and semiconductor package |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9723722B2 (en) * | 2015-03-25 | 2017-08-01 | Camtek Ltd. | Selective solder mask printing on a printed circuit board (PCB) |
| FR3060255B1 (fr) * | 2016-12-12 | 2019-07-19 | Institut Vedecom | Procede d’integration de puces de puissance parallelisable et modules electroniques de puissance |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445952A (en) * | 1981-11-03 | 1984-05-01 | Trw Inc. | Apparatus and method for filling holes in a circuit board |
| US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
| JPH05206615A (ja) * | 1992-01-27 | 1993-08-13 | Hitachi Chem Co Ltd | 金属芯入り印刷配線板の製造方法 |
-
2007
- 2007-12-17 ES ES200703342A patent/ES2334193B1/es active Active
-
2008
- 2008-12-17 KR KR1020080128878A patent/KR20090065474A/ko not_active Application Discontinuation
- 2008-12-17 CN CNA2008101906319A patent/CN101466202A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9357652B2 (en) | 2014-03-14 | 2016-05-31 | Samsung Electronics Co., Ltd. | Method of manufacturing circuit board and semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2334193B1 (es) | 2011-01-17 |
| ES2334193A1 (es) | 2010-03-05 |
| CN101466202A (zh) | 2009-06-24 |
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| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |