KR20090062139A - Heat sink device for a igbt module - Google Patents

Heat sink device for a igbt module Download PDF

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Publication number
KR20090062139A
KR20090062139A KR1020070129250A KR20070129250A KR20090062139A KR 20090062139 A KR20090062139 A KR 20090062139A KR 1020070129250 A KR1020070129250 A KR 1020070129250A KR 20070129250 A KR20070129250 A KR 20070129250A KR 20090062139 A KR20090062139 A KR 20090062139A
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South Korea
Prior art keywords
heat
heat dissipation
igbt module
fins
radiating
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KR1020070129250A
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Korean (ko)
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이윤희
전덕수
심일보
문전오
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현대자동차주식회사
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Priority to KR1020070129250A priority Critical patent/KR20090062139A/en
Publication of KR20090062139A publication Critical patent/KR20090062139A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink for an IGBT(Insulated Gate Bipolar Transistor) module is provided to improve durability and thermal conductivity by welding two outermost heat-radiating fins to a heat-radiating plate. A heat sink for an IGBT module includes a cover(20), a heat-radiating plate(30), and a plurality of vertical heat-radiating fins(40). The cover is installed on a top part of an IGBT module(10) in order to protect a PCB(11). Both ends of a longitudinal direction of the cover are opened in order to emit a heat. The heat-radiating plate is installed in a bottom part of the IGBT module. A plurality of vertical heat-radiating fins is arranged in a bottom surface of the heat-radiating plate with a fixed interval. Thickness of two outermost heat-radiating fins(41) is larger than thickness of an inner side heat-radiating fin(42). Two outermost heat-radiating fins are welded to the heat-radiating plate. The heat-radiating plate and the heat-radiating fins are made of aluminum.

Description

아이지비티 모듈용 발열장치{Heat Sink Device for a IGBT Module}Heat Sink Device for a IGBT Module

본 발명은 열전도율 및 내구성이 우수한 IGBT 모듈용 발열장치에 관한 것이다.The present invention relates to a heat generator for an IGBT module excellent in thermal conductivity and durability.

IGBT, 즉 절연게이트 양극성 트랜지스터(Insulated Gate Bipolar Transistor)는, 전기 흐름을 막거나 통하게 하는 스위칭 기능을 빠르게 수행할 수 있도록 구성된 고전력 스위칭용 반도체를 말한다.IGBTs, or Insulated Gate Bipolar Transistors, are high-power switching semiconductors configured to quickly perform switching functions that block or allow electrical flow.

이러한 IGBT 모듈은 차량의 엔진이나 성능 시험, 또는 동력전달 시험에 사용되는 차대 동력전달장치(Dynamometer)의 전력 제어반에 사용되는데, 엔진 및 차량동력전달 시험과정에서 차량의 가속 및 감속 제어 시, 토오크 변화량에 따라 전력 제어반에 대전류가 흐르게 되고, 전류 변화량의 증가로 인하여 IGBT 모듈에 상당히 많은 열이 발생하여, IGBT 전력 제어 부품이 소손되는 문제가 발생한다.The IGBT module is used in the power control panel of the dynamometer used for the engine or performance test of the vehicle, or the power transmission test. The amount of torque change during the acceleration and deceleration control of the vehicle during the engine and vehicle power transmission test. As a result, a large current flows through the power control panel, and a considerable amount of heat is generated in the IGBT module due to an increase in the amount of current change, causing a problem that the IGBT power control component is burned out.

본 발명은 열전도율 및 내구성이 우수한 IGBT 모듈용 발열장치를 제공함을 목적으로 한다.An object of the present invention is to provide a heat generator for an IGBT module excellent in thermal conductivity and durability.

상기의 목적을 달성하기 위한 본 발명에 따른 IGBT 모듈용 발열장치는, IGBT 모듈의 상부에 PCB 기판의 보호를 위한 커버가 설치되며, IGBT 모듈의 하부에 방열판이 설치되고, 방열판의 하면에는 다수의 수직 방열핀이 일정 간격으로 다수 배열되되, 2개의 최외곽 측 방열핀은 내측 방열핀 보다 두께가 두꺼우며 방열판에 용접 고정되는 것을 특징으로 한다.The heating device for the IGBT module according to the present invention for achieving the above object, a cover for protecting the PCB substrate is installed on the upper portion of the IGBT module, a heat sink is installed on the lower portion of the IGBT module, a plurality of the lower surface of the heat sink A plurality of vertical heat dissipation fins are arranged at regular intervals, and the two outermost heat dissipation fins are thicker than the inner heat dissipation fins and are welded to the heat dissipation plate.

바람직하게는, 상기 2개의 최외곽 측 방열핀은 내측 방열핀 여러 장을 용접하여 구성되며, 상기 방열판과 방열핀은 알루미늄 재질이며 2개의 최외곽 측 방열핀은 방열판에 알루미늄 용접된다.Preferably, the two outermost heat dissipation fins are constructed by welding a plurality of inner heat dissipation fins, wherein the heat dissipation fin and the heat dissipation fin are aluminum and two outermost heat dissipation fins are aluminum welded to the heat dissipation fin.

또한 바람직하게는, 상기 커버는 방열을 위해 길이방향 양단이 개방된다.Also preferably, the cover is open at both ends in the longitudinal direction for heat dissipation.

상술한 바와 같은 구조로 이루어진 IGBT 모듈용 발열장치에 따르면, 2개의 최외곽 측 방열핀이 방열판에 알루미늄 용접되므로 열전도율 및 내구성이 우수할 뿐만 아니라, 본드 접착된 내측 방열핀의 성능이 저하되더라도 최소한 2개의 최외곽 측 방열핀에 의한 방열이 가능하므로 IGBT 전력 제어 부품이 소손을 방지할 수 있게 된다.According to the heating device for the IGBT module having the structure as described above, since the two outermost heat radiation fins are aluminum-welded to the heat sink, not only the thermal conductivity and durability are excellent, but also the performance of the bond-bonded inner heat radiation fins is reduced, at least two maximum. The heat dissipation by the outer heatsink fins allows the IGBT power control components to prevent burnout.

이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 IGBT 모듈용 발열장치에 대하여 살펴본다.Hereinafter, with reference to the accompanying drawings looks at with respect to the heating device for the IGBT module according to an embodiment of the present invention.

도 1에서 보듯이, 방열장치는 PCB기판(11)을 갖는 IGBT 모듈(10)의 상부에 커버(20)가 설치되며, IGBT 모듈(10)의 하부에 다수의 수직 방열핀(40)을 갖는 방열판(30)이 설치된 구조를 갖는다. 게이트 컨트롤을 위한 PCB 기판(11)과 IGBT 모듈(10)은 통상적인 것이므로 이들에 대한 설명은 생략된다.As shown in Figure 1, the heat dissipation device is a heat sink having a cover 20 is installed on the upper portion of the IGBT module 10 having a PCB substrate 11, a plurality of vertical heat dissipation fins 40 in the lower portion of the IGBT module 10 30 has a structure provided. Since the PCB substrate 11 and the IGBT module 10 for the gate control are conventional, description thereof is omitted.

커버(20)는 IGBT 모듈(10)에의 장착을 위한 양측 플랜지부(22)를 가지며, 길이방향 양단이 개방(21)된 사각 프레임 구조를 갖는다. 개방부(21)는 커버(20) 내측에 배치되는 PCB 기판(11)으로부터의 열방출이 원활하게 이루어지도록 하기 위한 것으로, PCB 기판(11)과 커버(20) 간에는 일정 정도의 이격된 공간이 필요하다.The cover 20 has both flange portions 22 for mounting to the IGBT module 10 and has a rectangular frame structure in which both ends in the longitudinal direction are open 21. The opening 21 is for smooth heat dissipation from the PCB substrate 11 disposed inside the cover 20, and a predetermined space is provided between the PCB substrate 11 and the cover 20. need.

방열판(30)은 IGBT 모듈(10)의 하면에 밀착 고정되어 IGBT 모듈(10)에서 발생되는 열을 빼앗아 자체 발산시킴과 아울러 수직 방열핀(40)으로 전달한다. 이러한 방열판(30)은 열전도가 우수한 알루미늄 재질로 구성된다.The heat sink 30 is tightly fixed to the bottom surface of the IGBT module 10 to take heat generated from the IGBT module 10 and dissipate itself and transfer it to the vertical heat dissipation fin 40. The heat sink 30 is made of an aluminum material having excellent thermal conductivity.

수직 방열핀(40)은 방열판(30)의 하면에 일정 간격으로 다수 배열된다. 방열판(30)의 하면에는 방열핀(40)의 설치를 위한 슬롯(미도시)이 다수 형성되며, 각 방열핀(40)은 슬롯에 끼워져 본드 접착 또는 용접된다.The plurality of vertical heat dissipation fins 40 are arranged at a predetermined interval on the bottom surface of the heat dissipation plate 30. A plurality of slots (not shown) for installing the heat dissipation fin 40 are formed on the bottom surface of the heat dissipation plate 30, and each heat dissipation fin 40 is inserted into the slot and bonded or welded thereto.

한편, 방열핀(40)은 2개의 최외곽 측 방열핀(41)과 내측 방열핀(42)으로 구성된다. 2개의 최외곽 측 방열핀(41)은 내측 방열핀(42) 보다 두께가 두꺼우며 방열판(30)에 알루미늄 용접되며, 내측 방열핀(42)은 본드로 접착된다. 두꺼운 2개의 최외곽 측 방열핀(41)으로 인해 열전도성 및 내구성이 향상되며, 본드 접착된 내측 방열핀의 성능이 저하되더라도 최소한 2개의 최외곽 방열핀(41)에 의해 최소한의 방열 기능을 유지할 수 있게 된다. 이들 방열핀(40)은 열전도성이 우수한 알루미늄 재질로 이루어진다.Meanwhile, the heat dissipation fin 40 is composed of two outermost heat dissipation fins 41 and an inner heat dissipation fin 42. The two outermost heat dissipation fins 41 are thicker than the inner heat dissipation fins 42 and are aluminum welded to the heat dissipation plate 30, and the inner heat dissipation fins 42 are bonded to the bond. Due to the thick outermost heat radiation fins 41, the thermal conductivity and durability are improved, and even if the performance of the bonded inner heat radiation fins is degraded, the minimum heat dissipation function can be maintained by the at least two outermost heat radiation fins 41. . These heat dissipation fins 40 are made of aluminum with excellent thermal conductivity.

도 1은 본 발명의 실시예에 따른 IGBT 모듈용 발열장치의 조립도이다.1 is an assembly view of a heating device for an IGBT module according to an embodiment of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10: IGBT 모듈 11: PCB 기판10: IGBT Module 11: PCB Board

20: 커버 21: 개방부20: cover 21: opening

22: 플랜지부 30: 방열판22: flange portion 30: heat sink

40: 방열핀40: heat sink fin

Claims (4)

PCB 기판(11)이 장착된 IGBT 모듈(10)용 발열장치로서,As a heat generator for the IGBT module 10 is equipped with a PCB substrate 11, IGBT 모듈(10)의 상부에 PCB 기판(11)의 보호를 위한 커버(20)가 설치되며, IGBT 모듈(10)의 하부에 방열판(30)이 설치되고, 방열판(30)의 하면에는 다수의 수직 방열핀(40)이 일정 간격으로 다수 배열되되, 2개의 최외곽 측 방열핀(41)은 내측 방열핀(42) 보다 두께가 두꺼우며 방열판(30)에 용접 고정되는 것을 특징으로 하는 IGBT 모듈용 발열장치.A cover 20 for protecting the PCB substrate 11 is installed on the upper part of the IGBT module 10, a heat sink 30 is installed on the lower part of the IGBT module 10, and a plurality of heat sinks are provided on the bottom surface of the heat sink 30. A plurality of vertical heat dissipation fins 40 are arranged at regular intervals, the two outermost heat dissipation fins 41 are thicker than the inner heat dissipation fins 42 and welded to the heat dissipation plate 30, characterized in that the heating device for the IGBT module . 청구항 1에 있어서, 상기 2개의 최외곽 측 방열핀(41)은 내측 방열핀(42) 여러 장을 용접하여 구성된 것을 특징으로 하는 IGBT 모듈용 발열장치.The heating device for an IGBT module according to claim 1, wherein the two outermost heat dissipation fins (41) are formed by welding several sheets of inner heat dissipation fins (42). 청구항 2에 있어서, 상기 방열판(30)과 방열핀(40)은 알루미늄 재질이며, 2개의 최외곽 측 방열핀(40)은 방열판(30)에 알루미늄 용접되는 것을 특징으로 하는 IGBT 모듈용 발열장치.The heat dissipation device according to claim 2, wherein the heat dissipation plate (30) and the heat dissipation fin (40) are made of aluminum, and the two outermost heat dissipation fins (40) are aluminum welded to the heat dissipation plate (30). 청구항 1에 있어서, 상기 커버(20)는 방열을 위해 길이방향 양단이 개방된 것을 특징으로 하는 IGBT 모듈용 발열장치.The heating device according to claim 1, wherein both ends of the cover (20) are opened in the longitudinal direction for heat dissipation.
KR1020070129250A 2007-12-12 2007-12-12 Heat sink device for a igbt module KR20090062139A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102538035A (en) * 2012-02-08 2012-07-04 冯健满 Module type induction cooker
WO2013033601A3 (en) * 2011-09-02 2013-04-25 Wolverine Tube, Inc. Enhanced clad metal base plate
US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
KR20200023851A (en) 2018-08-27 2020-03-06 엘지전자 주식회사 Heat dissipation device of power semiconductor module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
WO2013033601A3 (en) * 2011-09-02 2013-04-25 Wolverine Tube, Inc. Enhanced clad metal base plate
CN102538035A (en) * 2012-02-08 2012-07-04 冯健满 Module type induction cooker
KR20200023851A (en) 2018-08-27 2020-03-06 엘지전자 주식회사 Heat dissipation device of power semiconductor module

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