JP2018110469A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device able to suppress the height.SOLUTION: The semiconductor device has a power module with a module terminal to be electrically connected to the power semiconductor, a cooler for cooling the power module, a second fastening member that connects the module terminal with the external terminal by way of being tightened via the first fastening member. The module terminal and the external terminal are sandwiched between the first fastening member and the second fastening member, and the second fastening member is provided on the side of cooler against the surface along the cooling surface.SELECTED DRAWING: Figure 1B

Description

  The present invention relates to a semiconductor device.

  A semiconductor module including a semiconductor terminal and having at least a pair of semiconductor terminals; a capacitor having at least a pair of capacitor terminals electrically connected to the semiconductor terminals; and a cooler for cooling the semiconductor module. There is disclosed a power conversion device that includes the semiconductor terminal and the capacitor terminal that are in direct contact with each other and thermally contacted and fixed to the cooling device (Patent Literature). 1). A screw hole is formed in the fixed part of the cooler, and an opening is formed in each of the capacitor terminal and the semiconductor terminal. The fixing portion is provided on the semiconductor module side with respect to the surface along the contact surface between the heat sink of the semiconductor module and the cooler. The capacitor terminal and the semiconductor terminal are placed on top of the fixed part of the cooler, and an insulating screw as a fastening member is inserted so as to pass through the opening of the capacitor terminal and the semiconductor terminal. By screwing into the screw hole of the fixing part, the semiconductor terminal and the capacitor terminal are fastened and both are fixed to the cooler.

JP 2010-252460 A

  However, in the prior art, in order to fix the semiconductor terminal and the capacitor terminal to the fixed portion by the fastening member, the power conversion device has a height obtained by adding not only the height of the fastening member but also the height of the fixed portion to the upper portion of the fixed portion. Therefore, there is a problem that the height of the power conversion device is increased.

  The present invention is to provide a semiconductor device capable of suppressing the height.

  The present invention provides a power module having a module terminal electrically connected to a power semiconductor, a cooler for cooling the power module, and a second connecting the module terminal and the external terminal by being tightened by a first fastening member. The module terminal and the external terminal are sandwiched between the first fastening member and the second fastening member, and the second fastening member is a cooler with respect to the surface along the cooling surface. The problem is solved by being provided on the side.

  According to the present invention, the height of the semiconductor device can be suppressed.

FIG. 1A is a top view of the semiconductor device according to the first embodiment. 1B is a cross-sectional view of the semiconductor device along the line IB-IB in FIG. 1A. FIG. 2 is a cross-sectional view showing Modification 1 of the semiconductor device according to the first embodiment. FIG. 3 is a cross-sectional view illustrating Modification Example 2 of the semiconductor device according to the first embodiment. FIG. 4A is a top view of the semiconductor device according to the second embodiment. 4B is a cross-sectional view of the semiconductor device taken along line IVB-IVB in FIG. 4A. FIG. 5 is a bottom view of the semiconductor device for explaining the relationship between the support position and the seal position on the XY plane. FIG. 6A is a top view of a semiconductor device according to a comparative example. 6B is a cross-sectional view of the semiconductor device taken along line VIB-VIB in FIG. 6A. FIG. 7A is a top view of the semiconductor device according to the third embodiment. FIG. 7B is a cross-sectional view of the semiconductor device along the line VIIB-VIIB in FIG. 7A. FIG. 8 is a cross-sectional view of a semiconductor device showing Modification Example 1 of the semiconductor device according to the third embodiment. FIG. 9 is a cross-sectional view of a semiconductor device showing Modification Example 2 of the semiconductor device according to the third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
The semiconductor device according to the present embodiment is used as a power conversion device such as an inverter circuit. The power conversion device converts power from a power source such as a battery and outputs the converted power to a load such as a motor. The power conversion device is used as a part of a drive system of a vehicle such as an electric vehicle or a hybrid vehicle. Note that the semiconductor device according to the present embodiment is not limited to the power conversion device, and may be used in other devices, or may be a part of other devices. The power conversion device is not limited to a vehicle drive system, and may be used as a part of another system.

  1A is a top view of the semiconductor device 100 according to the present embodiment, and FIG. 1B is a cross-sectional view of the semiconductor device 100 taken along line IB-IB in FIG. 1A. The top view of the semiconductor device 100 is a plan view of the semiconductor device 100 viewed from the positive Z-axis direction in FIG. 1B. As shown in FIGS. 1A and 1B, the semiconductor device 100 includes a power module 20, a cooler 40, and a cooler cover 42. An insulating member 61 having thermal conductivity is provided between the power module 20 and the cooler 40, and insulation between the power module 20 and the cooler 40 is ensured by the insulating member 61. For example, a ceramic substrate is used for the insulating member 61. In the following description, the same direction as the axis of the first fastening member 51 described later is taken as the Z axis, and the height of the semiconductor device 100 is defined by the position of the Z axis.

  The power module 20 includes an inverter circuit composed of a power semiconductor 21 and the like. The inverter circuit is a circuit that converts DC power of a battery (not shown) provided outside the power module 20 and supplies AC power to a motor (not shown). The power semiconductor 21 is a semiconductor switch (transistor) such as a MOSFET or IGBT. For the power semiconductor 21, a semiconductor element containing SiC, GaN, or the like is used. In the present embodiment, SiC is used for the power semiconductor 21.

  The power module 20 is disposed in the positive Z-axis direction with respect to the cooler 40 and is cooled by the cooler 40 from the negative Z-axis direction. The power module 20 is formed in a rectangular parallelepiped shape, and has an upper surface, a lower surface, and a side surface. The power module 20 has a lower surface cooled from the negative direction of the Z-axis by the cooler 40 as the cooled surface 20A. The cooled surface 20A is a surface parallel to the XY plane.

  The power module 20 has a conductive module terminal 22 for connection to a smoothing capacitor (not shown). The module terminal 22 is disposed on the lower surface side (cooled surface A side) of the power module 20, and extends along the cooled surface 20A from the inner side to the outer side (X-axis negative direction) of the power module 20. The module terminal 22 is formed in a plate shape (linear shape) and has at least an upper surface and a lower surface. The upper surface and the lower surface of the module terminal 22 are surfaces parallel to the XY plane. The upper surface of the module terminal 22 is a surface on which the power semiconductor 21 is mounted, and the lower surface of the module terminal 22 is a surface on the cooled surface 20A side. For example, a bus bar is used for the module terminal 22. In the present embodiment, the inverter circuit composed of the power semiconductor 21 and the like is mounted on the upper surface of the module terminal 22. The inverter circuit is not limited to being mounted on the module terminal 22. For example, the inverter circuit is mounted on a circuit board (not shown), and the circuit board and the module terminal 22 are electrically connected. Also good. In this case, the circuit board and the module terminal 22 are electrically connected by, for example, wire bonding.

  The module terminal 22 is fastened to the capacitor terminal 31 of the smoothing capacitor outside the power module 20 by the first fastening member 51 and the second fastening member 52. The capacitor terminal 31 is formed in a plate shape (linear shape), and has at least an upper surface and a lower surface, like the module terminal 22. The capacitor terminal 31 shown in FIGS. 1A and 1B is one conductive terminal of a pair of terminals of the smoothing capacitor. The external device is not limited to a smoothing capacitor, and may be another electronic component, or a terminal of another electronic component and the module terminal 22 may be fastened.

  The cooler 40 is a cooling device that cools the power module 20. The cooler 40 has a cooling surface 40A that receives heat generated by the power module 20 from the positive direction of the Z-axis. The cooling surface 40A is a surface parallel to the XY plane. The cooler 40 is disposed in the negative Z-axis direction with respect to the surface to be cooled 20 </ b> A of the power module 20 so as to face the power module 20. More specifically, the cooler 40 is disposed with respect to the power module 20 so that the cooling surface 40A faces the cooled surface 20A of the power module 20.

  The cooled surface 20A and the cooling surface 40A are in thermal contact. The term “thermally contacting” means that heat exchange is possible between the cooled surface 20A and the cooling surface 40A, and the insulating member having thermal conductivity between the cooled surface 20A and the cooling surface 40A. Including the case of interposing. In the present embodiment, the insulating member 61 is provided between the power module 20 and the cooler 40 as described above. Specifically, the insulating member 61 is provided between the cooled surface 20A and the cooling surface 40A in parallel with the XY plane and has a thickness in the Z-axis direction. The device that is in thermal contact with the cooler 40 is not limited to the power module 20 and may be a cooler cover 42 that houses the cooler 40.

  The cooler 40 has a refrigerant 41, and the refrigerant 41 is provided on the opposite side (Z-axis negative direction) to the cooling surface 40A. For example, during operation of the inverter circuit, heat generated during switching of the power semiconductor 21 is radiated by the refrigerant 41 through the cooled surface 20A and the cooling surface 40A. Thereby, the cooler 40 can prevent the temperature of the power module 20 from rising. Examples of the refrigerant 41 include a liquid such as cooling water and a gas such as a refrigerant gas. In the present embodiment, cooling water is used for the refrigerant 41.

  The cooler cover 42 is a cover that houses the cooler 40. The cooler cover 42 is formed in a rectangular parallelepiped shape. As shown in FIG. 1A, the cooler cover 42 not only covers the power module 20, but also extends from the inside of the power module 20 to the outside of the module terminal 22, and between the module terminal 22 and the capacitor terminal 31. It is provided in a size that covers the fastening part. In the present embodiment, the cooler cover 42 is an insulating cover having thermal conductivity, and the cooler cover 42 is in thermal contact with the cooler 40 and the refrigerant 41. Therefore, the parts and the like that are in contact with the cooler cover 42 are cooled by heat exchange with the cooler 40. Thereby, the cooler 40 cools the object in contact with the cooler cover 42 even when the cooler 40 is not in direct contact with the cooler 40 and is in contact with the cooler cover 42. For example, as shown in FIG. 1B, when the second fastening member 52 is embedded so as to be in thermal contact with the cooler cover 42, the second fastening member 52 is inserted into the cooler via the cooler cover 42. Cooled by 40.

  Next, the deterioration of the smoothing capacitor due to the heat generated by the power module 20 will be described.

  The power module 20 is electrically connected to the smoothing capacitor when the module terminal 22 and the capacitor terminal 31 are fastened. Since the module terminal 22 is electrically connected to the power semiconductor 21, heat generated in the power module 20, for example, heat generated by the switching operation of the power semiconductor 21 is transmitted to the module terminal 22. In particular, when an inverter circuit composed of SiC IGBTs performs a power conversion operation, the amount of heat generated in the power module 20 increases because the switching operation is fast. The heat generated by the power module 20 is transmitted to the smoothing capacitor via the module terminal 22 and the capacitor terminal 31, and the temperature of the smoothing capacitor rises. Therefore, the heat generated by the power module 20 causes the smoothing capacitor to deteriorate.

  In order to prevent the temperature rise that causes such deterioration of the smoothing capacitor, in addition to cooling the power module 20 itself, cooling the module terminal 22 and the capacitor terminal 31 is a problem in the power converter. . In the present embodiment, the second fastening member 52 is disposed at a position to be described later, so that the second fastening member 52 is cooled, and as a result, heat is prevented from being transmitted to the capacitor terminal 31, and the smoothing capacitor Can be prevented.

  Next, fastening of the power module 20 and the smoothing capacitor will be described.

  For fastening the module terminal 22 and the capacitor terminal 31, a first fastening member 51 and a second fastening member 52 are used as two fastening members. An insertion hole through which the first fastening member 51 is inserted is provided at the end of the module terminal 22 and the end of the capacitor terminal 31. An insulating film is stretched on the inner side wall of each insertion hole. For example, even if a metallic fastening member is inserted through the insertion hole, the module terminal 22 and the capacitor terminal 31 are insulated from the fastening member. Is done. In the present embodiment, a metal bolt is used for the first fastening member 51, and a metal nut is used for the second fastening member 52.

  The module terminal 22 and the capacitor terminal 31 are disposed so as to overlap each other between the first fastening member 51 and the second fastening member 52. The first fastening member 51 is inserted through a portion (insertion hole) in which the insertion hole of the module terminal 22 and the insertion hole of the capacitor terminal 31 are overlapped in the negative direction from the positive direction of the Z axis. When the first fastening member 51 fastens the second fastening member 52, the module terminal 22 and the capacitor terminal 31 are sandwiched between the first fastening member 51 and the second fastening member 52. In the present embodiment, the module terminal 22 and the capacitor terminal 31 overlap so that the module terminal 22 is positioned in the positive direction of the Z axis with respect to the capacitor terminal 31. When the two terminals are fastened, the upper surface of the module terminal 22 is in contact with the lower surface of the capacitor terminal 31, the lower surface of the module terminal 22 is in thermal contact with the second fastening member 52, and the upper surface of the capacitor terminal 31 is It is in thermal contact with the first fastening member 51. In addition, the 1st fastening member 51 and the 2nd fastening member 52 are not restricted to a volt | bolt and a nut, Other screw components or another fastening member may be sufficient.

  The second fastening member 52 is embedded in the cooler cover 42 so as to be in thermal contact with the cooler cover 42. Since the cooler cover 42 is an insulating cover, insulation between the second fastening member 52 and the cooler cover 42 is ensured. In addition, the second fastening member 52 fastens the module terminal 22 and the capacitor terminal 31 together, and fixes the two terminals to the cooler cover 42. As a specific arrangement of the second fastening member 52, the second fastening member 52 is located on the cooler 40 side (Z axis) with respect to a surface (surface parallel to the XY plane) along the surface to be cooled 20 </ b> A of the power module 20. (Negative direction). For example, as shown in FIG. 1B, by disposing a part of the second fastening member 52 so as to be embedded in the cooler cover 42, the second fastening member 52 is placed on the surface along the surface to be cooled 20 </ b> A. Can be provided on the cooler 40 side.

  Here, the height of the position where the module terminal 22 and the capacitor terminal 31 are fastened (hereinafter referred to as the fastening position) will be described. The fastening position is, for example, a position where the upper surface of the module terminal 22 or the surface along the lower surface of the capacitor terminal 31 intersects with the axis of the first fastening member 51 in the fastening state. In FIG. 1B, the fastening position P (x, z) indicates a position on the X axis and the Z axis on the XZ plane. In the following description, the position of the fastening position P on the X axis is P (x), and the position of the fastening position P on the Z axis is P (z). Similarly, the fastening position P on the XY plane is indicated by P (x, y), and the position of the fastening position P on the Y axis is P (y). The height of the fastening position P will be described as a position on the Z axis, that is, P (z).

  The module terminal 22 and the capacitor terminal 31 are sandwiched between the first fastening member 51 and the second fastening member 52. Therefore, the fastening position P (z) becomes higher as the height of the second fastening member 52 becomes higher.

The height of the fastening position P (z) of the present embodiment will be described using an example. As shown in FIG. 1B, the fastening position P (z) in the case where the second fastening member 52 is disposed and the power module 20 side (Z-axis positive direction) with respect to the surface along the surface to be cooled 20A, for example, The fastening positions P (z ^′ ) (not shown) when the two fastening members 52 are arranged are compared. In this case, since the position on the Z axis of the second fastening member 52 shown in FIG. 1B is provided on the cooler 40 side with respect to the surface along the surface to be cooled 20A, the fastening position P (z) is It becomes lower than the fastening position P (z ^′ ). Further, the first fastening member 51 has a head necessary for rotating the first fastening member 51. When the position of the second fastening member 52 on the Z-axis is increased, the head of the first fastening member 51 may be higher than the power module 20. As a result, in order to fasten the module terminal 22 and the capacitor terminal 31, the height of the semiconductor device 100 is required, and the height of the semiconductor device 100 cannot be suppressed.

  On the other hand, in the present embodiment, as shown in FIG. 1B, the second fastening member 52 is on the cooler 40 side (Z-axis negative direction) with respect to the surface along the surface to be cooled 20A (flat surface along the XY plane). Therefore, the fastening position P (z) between the module terminal 22 and the capacitor terminal 31 can be lowered. Thereby, in order to fasten the module terminal 22 and the capacitor terminal 31, the height of the semiconductor device 100 is not required and the height of the semiconductor device 100 can be suppressed. Further, since the second fastening member 52 is embedded in the cooler cover 42, the second fastening member 52 is cooled by the cooler 40 through the cooler cover 42. Therefore, the module terminal 22 that comes into contact with the second fastening member 52 is cooled via the second fastening member 52. Thereby, the temperature rise of the capacitor | condenser terminal 31 fastened with the module terminal 22 can be prevented, and deterioration of a smoothing capacitor can be prevented.

  As described above, the semiconductor device 100 according to the present embodiment includes the power semiconductor 21 and the power module 20 having the module terminals 22 that are electrically connected to the power semiconductor 21 and extend from the inside of the module to the outside. A cooler 40 having a cooling surface 40A in thermal contact with the cooled surface 20A of the module 20 and disposed opposite to the power module 20 is provided. In addition, the semiconductor device 100 includes a second fastening member 52 that connects the module terminal 22 and the capacitor terminal 31 by being fastened by the first fastening member 51. The module terminal 22 and the capacitor terminal 31 are sandwiched between the first fastening member 51 and the second fastening member 52, and the second fastening member 52 is a surface along the cooled surface 20 </ b> A of the power module 20. Is provided on the cooler 40 side. Thereby, since the fastening position P (z) between the module terminal 22 and the capacitor terminal 31 can be lowered, the height of the semiconductor device 100 can be suppressed.

  In addition, the semiconductor device 100 according to the present embodiment includes an insulating cooler cover 42 that houses the cooler 40, and the second fastening member 52 is embedded in the cooler cover 42. Thereby, since the heat transmitted to the second fastening member 52 is radiated by the cooler 40 via the cooler cover 42, the module terminal 22 that is in thermal contact with the second fastening member 52 can be cooled. . Therefore, it is possible to suppress the heat generated by the power module 20 from being transmitted to the capacitor terminal 31 and to prevent the temperature of the smoothing capacitor from rising. As a result, deterioration of the smoothing capacitor can be prevented.

  Furthermore, the semiconductor device 100 according to the present embodiment may be modified as shown in FIGS.

  FIG. 2 is a cross-sectional view showing Modification 1 of the semiconductor device 100 according to the present embodiment. FIG. 3 is a cross-sectional view showing a second modification of the semiconductor device 100 according to the present embodiment. 2 and 3 are the same as the top view of FIG. 1A, the top views corresponding to FIGS. 2 and 3 are omitted.

  As shown in FIG. 2, the semiconductor device 100 differs from the first embodiment described above in the materials of the cooler cover 42 a and the first fastening member 51 a, and the arrangement of the second fastening member 52 and the insulating member 61. May be different semiconductor devices.

  In the first modification, the first fastening member 51a is an insulating bolt. Thereby, it is not necessary to provide an insulating film on the inner side walls of the insertion holes of the module terminal 22 and the capacitor terminal 31, and a short circuit between the first fastening member 51a, the module terminal 22 and the capacitor terminal 31 can be prevented. .

  In the first modification, the cooler cover 42a is a conductive cover having high thermal conductivity. Since the cooler cover 42 in the first embodiment is an insulating cover, the cooler cover 42 a has higher thermal conductivity than the cooler cover 42. The parts that come into contact with the cooler cover 42 a are cooled more than the parts that come into contact with the cooler cover 42. Examples of the highly heat conductive material include aluminum or an alloy thereof.

  Furthermore, in the modification 1, the 2nd fastening member 52 is embed | buried under the cooler cover 42a, and is further provided in the cooler 40 side (Z-axis negative direction) compared with 1st Embodiment mentioned above. Specifically, the second fastening member 52 is provided in a state where the entire second fastening member 52 is buried in the cooler cover 42a. On the other hand, in the first embodiment described above, a part of the second fastening member 52 is provided in a buried state.

  In the first modification, the insulating member 61 is not only between the power module 20 and the cooler 40 but also between the module terminal 22 and the cooler cover 42a outside the power module 20 (X-axis negative direction). Is also provided. Therefore, the module terminal 22 is in thermal contact with the cooler 40 via the insulating member 61 inside the power module 20 (X-axis positive direction), and the insulating member 61 outside the power module 20 (X-axis negative direction). It contacts with the cooler cover 42a through. In the first modification, the module terminal 22 is cooled by the cooler 40 even outside the power module 20. Therefore, the module terminal 22 is cooled by the cooler 40 via the insulating member 61 as compared with the first embodiment described above. Area increases. As a result, the heat generated by the power module 20 is cooled by the module terminal 22 and is not easily transmitted to the capacitor terminal 31. Further, since the insulating member 61 is provided between the module terminal 22 and the cooler cover 42a, it is possible to ensure insulation between the module terminal 22 and the cooler cover 42a.

  As described above, in the first modification, the insulating member 61 is provided between the power module 20 and the cooler 40, is also provided between the module terminal 22 and the cooler cover 42a, and the second fastening member 52 is provided. Are embedded in the cooler cover 42a, and the first fastening member 51 is an insulating fastening member. Furthermore, unlike the first embodiment described above, the cooler cover 42a is formed of a conductive cover. As a result, the heat generated by the power module 20 is cooled by the module terminal 22 and is not easily transmitted to the capacitor terminal 31. Moreover, while preventing the short circuit with the 1st fastening member 51, the module terminal 22, the capacitor | condenser terminal 31, and the cooler 40, the thermal conductivity of the cooler cover 42a can be improved, The transmitted heat can be further cooled by the cooler 40. Therefore, the heat generated by the power module 20 is not easily transmitted to the capacitor terminal 31, and the temperature rise of the capacitor terminal 31 can be further suppressed. As a result, deterioration of the smoothing capacitor can be further prevented.

  Further, the semiconductor device 100 may be a semiconductor device provided with a spacer 62 as compared to the above-described modification 1 as in the modification 2 illustrated in FIG. 3.

In the second modification, the spacer 62 is a member for adjusting the height of the capacitor terminal 31 and is provided between the module terminal 22 and the capacitor terminal 31. Similar to the first embodiment described above, the second fastening member 52 is provided closer to the cooler 40 than the surface to be cooled 20A, and the entire second fastening member 52 is buried in the cooler cover 42a. Yes. Therefore, it is possible to conclude the position ^P'' the module terminal 22 and the capacitor terminal 31 ^(z'') low, it is possible to insert a spacer 62 as in the second modification.

<< Second Embodiment >>
Next, the semiconductor device 200 according to the second embodiment will be described. 4A is a top view of the semiconductor device 200 according to the present embodiment, and FIG. 4B is a cross-sectional view of the semiconductor device 200 taken along the line IVB-IVB in FIG. 4A. The top view of the semiconductor device 200 is a plan view of the semiconductor device 200 as viewed from the positive Z-axis direction in FIG. 4B. This embodiment differs from the first embodiment described above in that a support body 70 is provided. Other configurations are the same as those in the first embodiment and the first modification described above, and the description thereof is incorporated.

  The support body 70 integrally supports the power module 20 and the cooler 40 as shown in FIG. 4B. The support body 70 is formed in a rectangular parallelepiped shape. The support 70 has high thermal conductivity and insulation. The support body 70 is provided on the opposite side (Z-axis negative direction) to the side where the power module 20 is provided (Z-axis positive direction) with respect to the cooler cover 42.

  The support body 70 is provided with a support material 92 at a place where the cooler cover 42 is supported. The support body 70 supports not only the cooler 40 but also the power module 20 disposed in the positive Z-axis direction of the cooler 40 by supporting the cooler cover 42 that houses the cooler 40.

  The support member 92 has an insertion hole through which the support bolt 81 is inserted. At the position where the support member 92 is provided, the support bolt 81 and the support nut 82 embedded in the support body 70 are fastened. The cooler cover 42 and the support body 70 are connected by the support bolt 81 passing through the support material 92 from the positive direction of the Z-axis to the negative direction and tightening the support nut 82. Since the support body 70 has insulation, the insulation between the support bolt 81 and the support nut 82 and the support body 70 is ensured. Note that the cooler 40 is not provided in the positive direction of the support member 92 in the Z-axis. The position where the support member 92 is provided on the XY plane will be described later.

  In the present embodiment, the cooler cover 42 has a rectangular parallelepiped shape, and has an upper surface (a surface parallel to the XY plane) in the Z-axis positive direction and a lower surface parallel to the upper surface in the Z-axis negative direction. The upper surface of the cooler cover 42 includes a cooling surface 40A. On the lower surface 42B of the cooler cover 42, the support material 92 described above and a seal material 91 described later are provided.

  Further, the support body 70 has a flow path pipe 71 through which the refrigerant 41 of the cooler 40 flows, and the flow path pipe 71 is inserted into the upper surface 70A of the support body 70 and the lower surface 42B of the cooler cover 42. Each hole is provided. The flow path pipe 71 is connected to the cooler 40 through the two insertion holes from the negative direction on the Z axis toward the positive direction. When the flow path pipe 71 is connected to the cooler 40, the refrigerant flowing through the flow path pipe 71 is supplied to the cooler 40, and the refrigerant 41 is supplied from the flow path pipe 71.

  The seal material 91 is provided between the upper surface 70 </ b> A of the support 70 and the lower surface 42 </ b> B of the cooler cover 42 and around the flow path pipe 71. The sealing material 91 is in contact with the upper surface 70A of the support 70 and the lower surface 42B of the cooler cover 42, and prevents the refrigerant 41 from leaking out of the cooler cover 42 or the support 70.

In the following description, the position of the support member 92, for example, the center of the support member 92 will be referred to as a support position _PA0 . Further, the position of the seal material 91, for example, the center of the flow path pipe 71 passing through the inside of the seal material 91 is set as a seal position P _B0 . It should be noted that the position where the module terminal 22 and the capacitor terminal 31 are fastened, for example, the position where the upper surface of the module terminal 22 or the surface along the lower surface of the capacitor terminal 31 intersects the axis of the first fastening member 51 is the fastening position. _{Let PC0} . In FIG. 4B, the support position P _A0 (x _A0 , z _A0 ) indicates the position of the support member 92 on the X axis and the Z axis on the XZ plane. The seal position P _B0 (x _B0 , z _B0 ) indicates the position of the seal material 91 on the X axis and the Z axis on the XZ plane. Further, the fastening position P _C0 (x _C0 , z _C0 ) indicates a position where the module terminal 22 and the capacitor terminal 31 are fastened on the X axis and the Z axis on the XZ plane.

Next, the positional relationship on the XZ plane of the support position P _A0 , the seal position P _B0 , and the fastening position P _C0 will be described with reference to FIG. 4B.

First, the X-axis direction will be described. The support material 92 is provided in the negative direction of the X axis relative to the seal material 91, and the support position P _A0 (x _A0 ) is positioned in the negative direction of the X axis relative to the seal position P _B0 (x _B0 ). Further, the fastening position P _C0 (x _C0 ) is located between the support position P _A0 (x _A0 ) and the seal position P _B0 (x _B0 ) (x _B0 > x _C0 > x _A0 ).

Subsequently, the Z-axis direction will be described. In the present embodiment, the support material 92 and the seal material 91 are respectively provided on the lower surface 42B of the cooler cover 42, and the support position P _A0 (z _A0 ) is substantially the same height as the seal position P _B0 (z _B0 ). That's it. The cooler 40 is provided immediately above the seal position P _B0 (Z-axis positive direction), and the fastening position P _C0 (z _c0 ) is not provided. Further, the module terminal 22 and the capacitor terminal 31 are arranged in the positive direction of the Z axis with respect to the cooler cover 42, and the fastening position P _C0 (z _c0 ) is the support position P _A0 (z _A0 ) and the seal position P _B0. Higher than (z _B0 ) (z _c0 > z _A0 , z _B0 ).

Next, the positional relationship on the XY plane of the support position P _A0 , the seal position P _B0 , and the fastening position P _C0 will be described.

In the present embodiment, the support position P _A0 and the seal position P _B0 are provided at positions related to each other on the XY plane. Further, the seal position P _B0 and the fastening position _{PC 0} are also provided at positions related to each other on the XY plane.

First, the positional relationship between the support position P _A0 and the seal position P _{B0 on} the XY plane will be described with reference to FIG. FIG. 5 is a bottom view of the semiconductor device 200 for explaining the positional relationship of the support position P _A0 and the seal position P _{B0 on} the XY plane. The bottom view of the semiconductor device 200 is a plan view of the semiconductor device 200 viewed from the negative Z-axis direction in FIG. 4B.

In FIG. 5, the support position P _A0 (x _A0 , y _A0 ) indicates the position of the support material 92 on the X axis and the Y axis on the XY plane. Further, the seal position P _B0 (x _B0 , y _B0 ) indicates the position of the seal material 91 on the X axis and the Y axis on the XY plane. Furthermore, the fastening position P _C0 (x _C0 , y _C0 ) indicates a position where the module terminal 22 and the capacitor terminal 31 are fastened on the X axis and the Y axis on the XY plane.

As shown in FIG. 5, the support position P _A0 (x _A0 , y _A0 ) is located in the outer peripheral region R ₁ on the lower surface 42B of the cooler cover 42. For example, for a rectangular region R _{40 in} which the cooler 40 is provided in the Z-axis positive direction, a region expanded by a predetermined distance D _{x1 in} the X-axis direction and a predetermined distance D _y1 in the Y-axis direction Assuming that the installation area R ₂ (including the area R ₄₀ ), the outer peripheral area R ₁ is an area obtained by removing the installation area R ₂ from the entire area R ₄₂ B of the lower surface 42 B. In FIG. 5, the outer peripheral area R ₁ is an area indicated by a right-downward oblique line, and the installation area R ₂ is an area indicated by a downward-leftward oblique line. The predetermined distance _{D x1} and the predetermined distance _{D y1,} for example, in the XY plane, as the head or the support nut 82 of the supporting bolt 81 and the installation region _{R 2} do not overlap, the support bolt 81 The diameter of the head or the diameter of the supporting nut 82 can be determined.

In the present embodiment, as shown in FIG. 5, the lower surface 42B of the cooler cover 42 is provided with three support positions in addition to the support positions P _A0 (x _A0 , y _A0 ). Are located at the four corners of the lower surface 42B of the cooler cover 42. In other words, the support 70 is connected to the cooler cover 42 in the support position of the four locations located in the outer peripheral region R _1, and supports the power module 20 and a condenser 40. The support positions of the four places may be provided on the outer peripheral region R _1, it is not limited to the four corners of the cooler cover 42. Further, the support positions are not limited to four locations, and may be provided as many as necessary to support the power module 20 and the cooler 40.

Next, the pressure applied to the sealing material 91 from the cooler cover 42 in the installation region R2 will be described. In the present embodiment, as described above, the support body 70 is connected to the cooler cover 42 at each of the four support positions, and the support bolt 81 tightens the support nut 82 at each of the four support positions. The force should be similar. In this case, a region inside the region surrounded by the supporting position of the four positions, for example, in the installation area R _2, the pressure against the upper surface 70A applied (Z-axis negative direction) of the support 70 from the cooler cover 42, greater than the pressure in the outer peripheral region R _1. Therefore, when providing the sealing member 91 in the installation region R _2, as compared with the case of providing the seal material 91 in the outer peripheral region R _1, the sealing member 91, a large pressure from the cooler cover 42 is applied. This is because the support body 70 is connected to the cooler cover 42 at the four support positions, and therefore the cooler in the region inside the region surrounded by the four support positions is more than the region outside the region. This is because the pressure applied from the cover 42 toward the upper surface 70A of the support 70 is large.

In this embodiment, the sealing member 91 is provided in the installation area _{R 2,} i.e., sealing position _{P B0 (x B0, y B0} ) is positioned in the installation region _{R 2.} Thereby, the sealing material 91 receives a large pressure from the cooler cover 42, and the refrigerant 41 can be prevented from leaking from the cooler cover 42 or the support body 70.

Next, the positional relationship on the XZ plane between the seal position P _B0 and the fastening position P _C0 will be described using a comparative example shown in FIGS. 6A and 6B.

6A is a top view of the semiconductor device 210 according to the comparative example, and FIG. 6B is a cross-sectional view of the semiconductor device 210 taken along the line VIB-VIB of FIG. 6A. The top view of the semiconductor device 210 is a plan view of the semiconductor device 210 viewed from the positive Z-axis direction in FIG. 6B. In the semiconductor device 210 according to the comparative example, the seal position P _B0 ^′ and the fastening position P _C0 ^′ are different from the present embodiment. Other configurations are the same as those of the present embodiment, and the description thereof is incorporated.

In the comparative example, as shown in FIG. 6B, unlike the present embodiment, the cooler 40 is not provided immediately above the seal position P _B0 ^′ (Z-axis positive direction). On the X axis, the seal position P _B0 ^′ (x _B0 ^′ ) is provided with a predetermined distance D _x2 from the fastening position P _C0 ^′ (x _C0 ) (x _B0 ^′ −x _C0 = D _x2 ).

Flow path pipe 71, ^'from the sealing position _{P ^B0'} sealing position _{P B0} through just above the, connected to the cooler 40. Therefore, the region of the cooler cover 42 immediately above the seal position P _B0 ^′ is occupied by the flow path pipe 71. For example, when the predetermined distance D _x2 is equal to or _smaller than a predetermined value, that is, when the seal position P _B0 ^′ (x _B0 ^′ ) and the fastening position P _C0 ^′ (x _C0 ) are close to each other on the X axis, The region of the cooler cover 42 immediately above the position P _B0 ^′ is occupied by the flow path pipe 71, and the second fastening member 52 cannot be embedded in the region.

As shown in FIG. 6B, the second fastening member 52 is provided on the power module 20 side (Z-axis positive direction) with respect to the surface along the surface to be cooled 20A (surface parallel to the XY plane). For example, when the module terminal 22 and the capacitor terminal 31 are provided immediately above the sealing material 211, the fastening position P _C0 ^′ is positioned immediately above the sealing position P _B0 ^′ , as shown in FIG. 6B. Therefore, on the Z-axis, the fastening position P _C0 ^′ (z _C0 ^′ ) according to the comparative example is higher than the fastening position P _C0 (z _C0 ) according to the present embodiment (z _C0 ^′ > z _C0 ). . For this reason, in order to fasten the module terminal 22 and the capacitor terminal 31, the semiconductor device 210 needs to have a height, and the semiconductor device 210 according to the comparative example cannot suppress the height.

On the other hand, in the present embodiment, as shown in FIGS. 4A and 4B, the cooler 40 is provided immediately above the seal position P _B0 (Z-axis positive direction), and the fastening position P _C0 is not provided. . Accordingly, the second fastening member 52 can be embedded in the cooler cover 42 immediately below the fastening position _PC0 . Therefore, the fastening position P _C0 (z _C0 ) can be lowered on the Z axis, and the height of the semiconductor device 200 can be suppressed.

As described above, in this embodiment, the semiconductor device 200 includes the flow path pipe 71 through which the refrigerant 41 of the cooler 40 flows, and includes the support 70 that supports the power module 20 and the cooler 40. Thereby, when connecting the cooler 40 and the support body 70, it is possible to prevent the refrigerant 41 from leaking out of the cooler cover 42 or the support body 70 only by sealing the seal position P _B0 with the sealing material 91. As a result, the sealing work is reduced and the assembly of the cooler 40 and the support 70 becomes easy.

In the present embodiment, the cooler cover 42 has an upper surface and a lower surface, and the upper surface is a surface including the cooling surface 40A. The support position _PA0 is located in the outer peripheral region R1 where the cooler 40 is not disposed directly above the lower surface of the cooler cover 42. Further, the seal position P _B0 is located in an installation region R2 that is an inner region from the outer peripheral region R1. Engaged position P _C is provided in addition to just above the sealing position P _B0 of the upper surface of the cooler cover 42. Thereby, while preventing the refrigerant | coolant 41 from leaking out from the cooler cover 42 or the support body 70, the height of the semiconductor device 200 can be suppressed.

«Third embodiment»
Next, a semiconductor device 300 according to the third embodiment will be described. 7A is a top view of the semiconductor device 300 according to the present embodiment, and FIG. 7B is a cross-sectional view of the semiconductor device 300 taken along the line VIIB-VIIB in FIG. 7A. The top view of the semiconductor device 300 is a plan view of the semiconductor device 300 viewed from the positive Z-axis direction in FIG. 7B. In the present embodiment, the support 170 is different from the second embodiment described above. Further, in the present embodiment, the second embodiment described above, the support position P _A1 of the support member 92, a fastening position P _C1 for fastening the module terminals 22 and the capacitor terminal 31 are different. Other configurations are the same as those of the second embodiment described above, and the description thereof is incorporated.

  As shown in FIG. 7B, the support 170 has a shape that covers the lower surface 42B (surface parallel to the XY plane) and the side surface (surface parallel to the YZ plane) of the cooler cover 42. In the present embodiment, the cooler cover 42 has a side surface, and a support 170 is provided outside the side surface of the cooler cover 42 (X-axis negative direction). Further, the support 170 has a fastening surface 170A substantially the same as a surface (a surface parallel to the XY plane) along the surface to be cooled 20A outside the side surface of the cooler cover 42.

Engaged position _{P C1} is provided on the fastening surface 170A of the support member 170. In the present embodiment, unlike the first embodiment and the second embodiment described above, the module terminal 22 and the capacitor terminal 31 are fastened by the support 170. The second fastening member 52 is embedded in the support body 170. The module terminal 22 is provided on the upper side (Z-axis direction) of the fastening surface 170A and is in contact with the fastening surface 170A.

Next, the positional relationship on the XZ plane of the support position P _A1 , the seal position P _B0 , and the fastening position P _C1 will be described with reference to FIG. 7B.

The X axis direction will be described. The first fastening member 51 and the second fastening member 52 are provided on the upper side (Z-axis positive direction) of the fastening surface 170A, and the fastening position P _C1 (x _C1 ) is the support position P _A1 (x _A0 ) and It is located in the negative direction of the X axis from the seal position P _B0 (x _B0 ). The support position P _A1 (x _A0 ) is located between the seal position P _B0 (x _B0 ) and the fastening position P _C1 (x _C1 ) (x _B0 > x _A1 > x _C1 ). Note that the positional relationship among the support position P _A1 , the seal position P _B0 , and the fastening position P _{C1 in} the Z-axis direction is the same as that in the second embodiment described above, and a description thereof will be omitted.

The support 170 has high thermal conductivity and insulation. Since the passage pipe 71 passes through the support 170, the second fastening member 52 is cooled by the refrigerant 41 flowing through the passage pipe 71. Further, the portion of the module terminal 22 that is in contact with the fastening surface 170 </ b> A is also cooled by the refrigerant 41. Therefore, in this embodiment, not only the 2nd fastening member 52 but the part which contacts the fastening surface 170A among the module terminals 22 can be cooled, and the cooling effect with respect to the module terminal 22 can be made high. The second fastening member 52 is embedded in the support 170, and the fastening position P _C1 (z _C0 ) is the same as the fastening position P _C0 (z _C0 ) according to the second embodiment on the Z axis. It is height. Therefore, similarly to the second embodiment, the height of the semiconductor device 300 can be suppressed.

As described above, in this embodiment, the cooler cover 42 has side surfaces in addition to the upper surface and the lower surface, and the support 170 has a shape that covers the lower surface and the side surfaces of the cooler cover 42. The support 170 has a fastening surface 170A that is substantially the same as the surface along the surface to be cooled 20A. The fastening surface 170A, fastening position _{P C1} is provided with the first fastening member 51 second fastening member 52 for fastening the second fastening member 52 is embedded in the support 170. Thereby, the fastening position P _C1 (z _C0 ) between the module terminal 22 and the capacitor terminal 31 can be lowered, and the cooling effect on the module terminal 22 can be increased. As a result, the height of the semiconductor device 300 can be suppressed and deterioration of the smoothing capacitor can be prevented.

  The semiconductor device 300 according to the present embodiment may be modified as shown in FIGS.

  FIG. 8 is a cross-sectional view showing Modification 1 of the semiconductor device 300 according to the present embodiment. FIG. 9 is a cross-sectional view showing a second modification of the semiconductor device 300 according to the present embodiment.

  As illustrated in FIG. 8, the semiconductor device 300 may be a semiconductor device in which the capacitor terminal 31 a is provided at a different position from the module terminal 22 in the third embodiment described above.

  In the first modification, the capacitor terminal 31a is embedded in the support 170 and is disposed below the module terminal 22 (Z-axis negative direction). Specifically, all of the capacitor terminals 31a are disposed below the fastening surface 170A of the support 170 so as to be buried in the support 170 (Z-axis negative direction). The module terminal 22 and the capacitor terminal 31a overlap so that the capacitor terminal 31a is located in the negative Z-axis direction with respect to the module terminal 22. When the two terminals are fastened, the lower surface of the module terminal 22 is in contact with the upper surface of the capacitor terminal 31a, the upper surface of the module terminal 22 is in contact with the first fastening member 51, and the lower surface of the capacitor terminal 31a is in the second state. It is in thermal contact with the fastening member 52 and the support 170.

  The support body 170 has the flow path pipe 71 through which the refrigerant 41 flows, similarly to the third embodiment described above. In Modification 1, since all of the capacitor terminal 31 a is embedded in the support 170, the heat of the capacitor terminal 31 a is radiated by the refrigerant 41 through the support 170, and the capacitor terminal 31 a flows through the flow path pipe 71. Cooled by the refrigerant 41.

  Here, the degree of cooling of the refrigerant 41 with respect to the capacitor terminal 31 according to the third embodiment described above is compared with the degree of cooling of the refrigerant 41 with respect to the capacitor terminal 31a according to the first modification.

  In the third embodiment described above, the capacitor terminal 31 is arranged so as to overlap the positive direction of the Z axis of the module terminal 22, and the capacitor terminal 31 is not entirely buried in the support 170. Therefore, the module terminal 22, the insulating member 61, and the cooler cover 42 are interposed between the capacitor terminal 31 and the refrigerant 41 of the cooler 40, and the heat of the capacitor terminal 31 is transferred to the module terminal 22, the insulating member 61, The heat is radiated by the refrigerant 41 of the cooler 40 through the cooler cover 42.

  On the other hand, in Modification 1, only the support 170 is interposed between the capacitor terminal 31 a and the cooler 40, and the heat of the capacitor terminal 31 a is radiated by the refrigerant 41 only through the support 170. Thereby, the capacitor terminal 31a which concerns on the modification 1 is cooled more than the capacitor terminal 31 which concerns on 3rd Embodiment mentioned above, and can improve a cooling effect.

Next, with regard to the height of the fastening position, the fastening position P _C0 (z _C0 ) according to the third embodiment described above is compared with the fastening position P _C2 (z _C2 ) according to the first modification.

In Modification 1, all of the capacitor terminals 31a are embedded in the support 170, but the module terminals 22 are arranged on the inner side of the power module 20 along the cooled surface 20A and the fastening surface 170A, as in the third embodiment. It extends from the outside to the outside. In the first modification, the fastening position P _C2 (z _C2 ) is a position where the lower surface of the module terminal 22 or the surface along the upper surface of the capacitor terminal 31 a intersects the axis of the first fastening member 51. In other words, with the module terminal 22 as the center, the fastening position P _C2 (z _C2 ) according to Modification 1 is located on the surface along the upper surface of the module terminal 22, whereas the fastening position P according to the above-described third embodiment. _C0 (z _C0 ) is located on the surface along the lower surface of the module terminal 22. That is, the fastening position P _C2 (z _C2 ) according to Modification 1 is lower than the fastening position P _C0 (z _C0 ) according to the third embodiment (z _C2 <z _C0 ).

Furthermore, as shown in FIG. 9, the semiconductor device 300 may be a semiconductor device in which the position where the flow path pipe 71 a passes in the support 170 is different from that in the second embodiment described above. Further, the fastening position _{PC3 at} which the module terminal 22 and the capacitor terminal 31 are fastened is provided at a position where the power module 20 and the cooler 40 are supported so as to also serve as the support position _{PA0 in the} third embodiment. Good.

  In the second modification, the flow path pipe 71 a is provided so as to pass near the second fastening member 52 in the support body 170. The vicinity of the second fastening member 52 is within a predetermined distance from the second fastening member 52. For example, the predetermined distance is a distance at which the refrigerant 41 flowing through the flow path pipe 71 a can cool the second fastening member 52.

Specifically, an example shown in FIG. 9 will be described. The channel pipe 71a is provided such that the distance between the center of the channel pipe 71a and the lower surface of the second fastening member 52 is a predetermined distance _Dz3 . When the predetermined distance _Dz3 is shorter than a predetermined value, the second fastening member 52 is effectively cooled by the flow path pipe 71a. On the other hand, when the predetermined distance _Dz3 is longer than the predetermined value, the second fastening member 52 is not effectively cooled by the flow path pipe 71a, and the cooling of the flow path pipe 71a with respect to the second fastening member 52 is performed. The effect is weakened. In the second modification, the predetermined distance D _z3 is shorter than the predetermined value, so that the flow path pipe 71a can effectively cool the second fastening member 52.

Next, the fastening position _PC3 in Modification 2 will be described.

In the second modification, the fastening position _PC3 is provided at a position where the power module 20 and the cooler 40 are supported so as to serve as the support position _{PA0 in the} third embodiment described above. For example, as shown in FIG. 9, on the X axis, the fastening position P _C3 (x _C3 ) is located at a predetermined distance D _x3 from the seal position P _B0 (x _B0 ) (x _C3 −x _B0 = D _x3 ). When the predetermined distance D _x3 is shorter than the predetermined value, the support 170 stabilizes the power module 20 and the cooler 40 by the first fastening member 51 and the second fastening member 52 at the fastening position _PC3 . Can be supported. On the other hand, if the predetermined distance _{D x3} is greater than a predetermined value, the first fastening member 51 and the second fastening member 52 in the engaged position _{P C3,} the support 170 is fastened position _{P C3} power module 20 In addition, the cooler 40 cannot be stably supported. In this case, it is necessary to support the power module 20 and the cooler 40 by providing the support position _PA0 in Embodiment 3 described above. In the second modification, the predetermined distance D _x3 is shorter than the predetermined value, so that the support 170 can stably support the power module 20 and the cooler 40. Thereby, the power module 20 and the cooler 40 can be stably supported without providing the support bolt 81 and the support nut 82. Therefore, the cost can be reduced by deleting the number of parts, and the assembly can be facilitated.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the first modification of the third embodiment described above, the capacitor terminal 31a is exemplified as being embedded in the support 170. However, the present invention is not limited to this configuration, and is applied to a case where no support is provided. Also good. For example, in the first embodiment described above, the capacitor terminal 31 may be embedded in the cooler cover 42. Thereby, the capacitor terminal 31 is embedded in the cooler cover 42 together with the second fastening member 52, and the fastening position P (z) between the module terminal 22 and the capacitor terminal 31 can be further lowered.

The capacitor terminal 31 corresponds to the external terminal of the present invention, the support position P _A0 corresponds to the first connection position of the present invention, the seal position P _B0 corresponds to the second connection position of the present invention, and is fastened. The position _PC0 corresponds to the third connection position of the present invention.

DESCRIPTION OF SYMBOLS 20 ... Power module 21 ... Power semiconductor 22 ... Module terminal 31 ... Capacitor terminal 40 ... Cooler 41 ... Refrigerant 42 ... Cooler cover 51 ... First fastening Member 52 ... Second fastening member 61 ... Insulating member 100 ... Semiconductor device

Claims (10)

A power module having a module terminal electrically connected to the power semiconductor and extending from the inside of the module to the outside; and
A cooler that has a cooling surface that is in thermal contact with the surface to be cooled of the power module, and is disposed to face the power module;
A second fastening member that connects the module terminal and the external terminal by being tightened by a first fastening member;
The module terminal and the external terminal are sandwiched between the first fastening member and the second fastening member,
The second fastening member is a semiconductor device provided on the cooler side with respect to a surface along the surface to be cooled. An insulating cooler cover that houses the cooler;
The semiconductor device according to claim 1, wherein the second fastening member is embedded in the cooler cover. A conductive cooler cover for housing the cooler;
An insulation member provided between the power module and the cooler and provided between the module terminal and the cooler cover;
The second fastening member is embedded in the cooler cover;
The semiconductor device according to claim 1, wherein the first fastening member is an insulating fastening member. The semiconductor device according to any one of claims 1 to 3, further comprising a support body that has a flow path pipe through which a refrigerant of the cooler flows and supports the cooler and the power module. The support is an insulating support;
The semiconductor device according to claim 4, wherein the second fastening member is embedded in the support. The semiconductor device according to claim 5, wherein the external terminal is embedded in the support. The semiconductor device according to claim 5, wherein the flow path pipe passes in the vicinity of the second fastening member. The semiconductor device according to claim 4, wherein the second fastening member is embedded in the support and is provided at a position that supports the power module and the cooler. A cooler cover that houses the cooler, and
The cooler cover has at least an upper surface and a lower surface;
The upper surface is a surface including the cooling surface,
The cooler cover is connected to the support at a first connection position;
The cooler is connected to the support at a second connection position through which the flow path pipe passes,
The module terminal is connected to the external terminal at a third connection position;
The first connection position is provided in an outer peripheral region where the cooler is not disposed immediately above the lower surface of the cooler cover,
The second connection position is provided in a region inside the outer peripheral region of the lower surface of the cooler cover,
The semiconductor device according to claim 4, wherein the third connection position is provided at a position other than directly above the second connection position on the upper surface of the cooler cover. A cooler cover that houses the cooler, and
The cooler cover has at least an upper surface, a side surface, and a lower surface,
The upper surface is a surface including the cooling surface,
The support has a shape that covers the lower surface and the side surface of the cooler cover, and has a fastening surface that is substantially the same as the surface along the cooling surface outside at least the side surface,
The cooler cover is connected to the support at a first connection position;
The cooler is connected to the support at a second connection position through which the flow path pipe passes,
The module terminal is connected to the external terminal at a third connection position;
The first connection position is provided in an outer peripheral region where the cooler is not disposed immediately above the lower surface of the cooler cover,
The second connection position is provided in a region inside the outer peripheral region of the lower surface of the cooler cover,
The semiconductor device according to claim 4, wherein the third connection position is provided on the fastening surface of the support.

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